157
© 2009 Littelfuse, Inc.
Specications are subject to change without notice.
Radial Lead Fuses
382 Series
TR5® > Time-Lag > 382 Series
Please refer to www.littelfuse.com/series/382.html for current information.
382 Series
Materials
#BTF$BQ#SPXO5IFSNPQMBTUJD
1PMZBNJEF1"6-7
3PVOE1JOT$PQQFS5JOQMBUFE
Lead Pull Strength 10 N (EN 60068-2-21)
Solderability $õT8BWF
$õT4PMEFSJOH*SPO
Soldering Heat
Resistance
$T*&$
$T4PMEFSJOH*SPO
Product Characteristics
Operating Temperature $UP$DPOTJEFSEFSBUJOH
Climatic Category $UP$EBZT
&/
Stock Conditions
+10ºC to +60ºC
3)õZFBSMZBWFSBHFXJUIPVU
EFXNBYJNVNWBMVFGPS
EBZTo
Vibration Resistance
DZDMFTBUNJOFBDI
(EN 60068-2-6)
)[BUNNBNQMJUVEF
)[BUHBDDFMFSBUJPO
Dimensions
8.5
0.5 min
max. 8L
0.6
5.08
1 +0.1
)PMFTJO1$#
-POH-FBET-NN
4IPSU-FBET-NN
Part Numbering System
Packaging
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
%FQFOETPO'MVY"DUJWBUJPO5FNQFSBUVSF 5ZQJDBM*OEVTUSZ3FDPNNFOEBUJPO
5FNQFSBUVSF.JOJNVN 100° C
5FNQFSBUVSF.BYJNVN 150° C
1SFIFBU5JNF TFDPOET
Solder Pot Temperature: 260° $.BYJNVN
Solder Dwell Time: TFDPOET
Recommended Hand-Solder Parameters:
4PMEFS*SPO5FNQFSBUVSF¡$¡$
)FBUJOH5JNFTFDPOETNBY
Note: These devices are not recommended for IR or
Convection Reow process.
Recommended Process Parameters:
Packaging Option Packaging Specication Quantity Quantity &
Packaging Code Taping Width
382 Series
5BQF"NNPQBDL N/A 0000 N/A
4IPSU-FBET N/A 0410 N/A
4IPSU-FBET N/A 200 0430 N/A
0000382 xxxx
Packaging Code
Amp Code
Series
0000 Tape/Ammopack (1,000 pcs.)
0410 Short Leads - Bulk (1,000 pcs.)
0430 Short Leads - Bulk (200 pcs.)
Refer to Amp Code column of
Electrical Characteristics Table