1
Motorola Optoelectronics Device Data
!
# "!"!
This device consists of a gallium arsenide infrared emitting diode optically coupled
to a r andom phase triac driver circuit and a p ower triac. It is capable of driving a l oad
of up to 2 amps (rms) directly, on line voltages from 20 to 280 volts AC (rms).
•Provides Normally Open Solid State AC Output with 2 Amp Rating
•70 Amp Single Cycle Surge Capability
•Phase Controllable
•High Input-Output Isolation of 3750 vac (rms)
•Static dv/dt Rating of 400 Volts/µs Guaranteed
•2 Amp Pilot Duty Rating Per UL508
W
117 (Overload Test)
and
W
118 (Endurance Test) [File No. 129224]
•CSA Approved [File No. CA77170-1]. VDE Approval in Process.
•Exceeds NEMA 2-230 and IEEE472 Noise Immunity Test Requirements
(See Figure 17)
DEVICE RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
INPUT LED
Forward Current — Maximum Continuous IF50 mA
Forward Current — Maximum Peak
(PW = 100µs, 120 pps) IF(pk) 1.0 A
Reverse Voltage — Maximum VR6.0 V
OUTPUT TRIAC
Output Terminal Voltage — Maximum Transient (1) VDRM 600 V(pk)
Operating Voltage Range — Maximum Continuous
(f = 47–63 Hz) VT20 to 280 Vac(rms)
On-State Current Range
(Free Air, Power Factor ≥ 0.3) IT(rms) 0.03 to 2.0 A
Non-Repetitive Single Cycle Surge Current —
Maximum Peak (t = 16.7 ms) ITSM 70 A
Main Terminal Fusing Current (t = 8.3 ms) I2T 26 A2sec
Load Power Factor Range PF 0.3 to 1.0 —
Junction Temperature Range TJ– 40 to 125 °C
TOTAL DEVICE
Input-Output Isolation Voltage — Maximum (2)
47–63 Hz, 1 sec Duration VISO 3750 Vac(rms)
Thermal Resistance — Power Triac Junction to
Case (See Figure 18) RθJC 8.0 °C/W
Ambient Operating Temperature Range Toper – 40 to +100 °C
Storage Temperature Range Tstg – 40 to +150 °C
Lead Soldering Temperature — Maximum
(1/16″ From Case, 10 sec Duration) TL260 °C
1. Test voltages must be applied within dv/dt rating.
2. Input-Output isolation voltage, VISO, is an internal device dielectric breakdown rating.
(2)For this test, pins 2, 3 and the heat tab are common, and pins 7 and 9 are common.
POWER OPTO is a trademark of Motorola, Inc.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by MOC2R60–10/D
SEMICONDUCTOR TECHNICAL DATA
DEVICE SCHEMATIC
OPTOISOLATOR
2 AMPS
RANDOM–PHASE
TRIAC OUTPUT
600 VOLTS
1, 4, 5, 6, 8. NO PIN
2. LED CATHODE
3. LED ANODE
7. MAIN TERMINAL 2
9. MAIN TERMINAL 1
7
9
3
2
CASE 417-02
Style 2
PLASTIC PACKAGE
CASE 417A-02
Style 1
PLASTIC PACKAGE
CASE 417B-01
Style 1
PLASTIC PACKAGE
2379
*Motorola Preferred Devices
Motorola, Inc. 1995
REV 1
2 Motorola Optoelectronics Device Data
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
INPUT LED
Forward Voltage (IF = 10 mA) VF1.00 1.17 1.50 V
Reverse Leakage Current (VR = 6.0 V) IR— 1.0 100 µA
Capacitance C — 18 — pF
OUTPUT TRIAC
Off-State Leakage, Either Direction
(IF = 0, VDRM = 400 V) IDRM(1) — 0.25 100 µA
Critical Rate of Rise of Off-State Voltage (Static)
(Vin = 400 vac(pk)) (1) (2) dv/dt(s) 400 — — V/µs
Holding Current, Either Direction (IF = 0, VD = 12 V, IT = 200 mA) IH— 10 — mA
COUPLED
LED Trigger Current Required to Latch Output MOC2R60-10
Either Direction (Main Terminal Voltage = 2.0 V) (3) (4) MOC2R60-15 IFT(on) — 7.0
12 10
15 mA
On-State Voltage, Either Direction (IF = Rated IFT(on), ITM = 2.0 A) VTM — 0.96 1.3 V
Commutating dv/dt (Rated VDRM, IT = 30 mA – 2.0 A(rms),
TA = – 40 + 100°C, f = 60 Hz) (2) dv/dt (c) 5.0 — — V/µS
Common-mode Input-Output dv/dt (2) dv/dt(cm) — 40,000 — V/µS
Input-Output Capacitance (V = 0, f = 1.0 MHz) CISO — 1.3 — pF
Isolation Resistance (VI-O = 500 V) RISO 1012 1014 —Ω
1. Per EIA/NARM standard RS–443, with VP = 200 V, which is the instantaneous peak of the maximum operating voltage.
2. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D.
3. All devices are guaranteed to trigger at an IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between
3. the device’s maximum IFT(on) limit and the Maximum Rating of 50 mA.
4. Current–limiting resistor required in series with LED.
1.40
0.80
– 40 – 20 20 40 80 120
100
80
60
40
20
0
Figure 1. Maximum Allowable Forward LED
Current versus Ambient Temperature
TA, AMBIENT TEMPERATURE (
°
C)
Figure 2. LED Forward Voltage
versus LED Forward Current
2.00
1.80
1.60
1.00
1IF, FORWARD CURRENT (mA)
10 100 1000
0 60 100
1.20
TYPICAL CHARACTERISTICS
IF, FORWARD LED CURRENT (mA)
V ,
FFORWARD VOLTAGE (V)
25
°
C
100
°
C
Pulse Only
Pulse or DC
TA = –40
°
C
3
Motorola Optoelectronics Device Data
1.20
0.60
2.20
1.40
1.60
0.80
ITM, INSTANTANEOUS ON-STATE CURRENT (A)
0.1 1.0
2.00
1.80
1.00
0.03
Pulse or DC
Pulse
Only
TJ = 25
°
C
0.01
– 40 – 20 0 20 80 120
100
10
1.0
0.1
Figure 3. Forward LED Trigger Current
versus Ambient Temperature
TA, AMBIENT TEMPERATURE (
°
C)
60 10040
20
IT, MAIN TERMINAL CURRENT (A)
Figure 4. Maximum Allowable On-State RMS Output
Current (Free Air) versus Ambient Temperature
0.01 0.1 1 10
120
100
80
60
40
0
2.5
2.0
1.0
0.5
0.0
Figure 5. On-State Voltage Drop versus
Output Terminal Current
IT, MAIN TERMINAL CURRENT (A)
0.01 0.1 1.0 10
1.5
Figure 6. Power Dissipation
versus Main Terminal Current
TA, AMBIENT TEMPERATURE (
°
C)
1.2
0.0
– 40 0 20 6040 120
1.60
1.50
1.40
1.30
1.20
1.10
0.80
Figure 7. Junction Temperature versus Main
Terminal RMS Current (Free Air) Figure 8. Leakage with LED Off versus
Ambient Temperature
2.4
2.0
1.6
0.8
TA, AMBIENT TEMPERATURE (
°
C)
1.00
0.90
– 20 80 100
0.4
– 40 0 20 6040 120– 20 80 100
Mean
Maximum
IIFT, FORWARD TRIGGER CURRENT
IT, TERMINAL CURRENT (A)
VTM, MAIN TERMINAL VOLTAGE (V)
PD, POWER DISSIPATION (WATTS)
TJ, JUNCTION TEMPERATURE ( C)
°
IDRM, LEAKAGE CURRENT (NORMALIZED)
100
°
C
Normalized to
TA = 25
°
C
Worst Case Unit
Normalized to
TA = 25
°
C
TA = 25
°
C
4 Motorola Optoelectronics Device Data
1.40
0.00
2.00
1.80
1.60
1.20
– 40 TA, AMBIENT TEMPERATURE (
°
C)
– 20 0 + 25 + 40 + 60
1.00
+ 80
0.60
0.80
0.40
0.20
Figure 9. Holding Current versus
Ambient Temperature
1000
(V/ S)dv dt
µ
40
TA, AMBIENT TEMPERATURE (
°
C)
Figure 10. dv/dt versus Ambient Temperature
10
0
– 40 – 20 0 20 80 12060 100
100
/
+ 100
IH, HOLDING CURRENT (mA)
Static
Normalized
at 25
°
C
Commutating
IT = 30 mA – 2A(RMS)
F = 60 Hz
Phase Control Considerations
LED Trigger Current versus PW (normalized)
The Random Phase POWER OPTO Isolators are designed
to be phase controllable. They may be triggered at any phase
angle within the AC sine wave. Phase control may be accom-
plished by an AC line zero cross detector and a variable pulse
delay generator which is synchronized to the zero cross de-
tector. The same task can be accomplished by a microproces-
sor which is synchronized to the AC zero crossing. The phase
controlled trigger current may be a very short pulse which
saves energy delivered to the input LED. LED trigger pulse
currents shorter than 100 µs must have an increased ampli-
tude as shown on Figure 11. This graph shows the dependen-
cy of the trigger current IFT versus the pulse width t (PW). The
reason f or the I FT dependency on the pulse width c an be seen
on the chart delay t(d) versus the LED trigger current.
IFT in the graph IFT versus (PW) is normalized in respect to
the minimum specified IFT for static condition, which is speci-
fied in the device characteristic. The normalized IFT has to be
multiplied with the devices guaranteed static trigger current.
Example:
Guaranteed IFT = 10 mA, Trigger pulse width PW = 3 µs
IFT (pulsed) = 10 mA x 5 = 50 mA
Minimum LED Off Time in Phase Control Applications
In phase control applications one intends to be able to con-
trol each AC sine half wave from 0 to 180 degrees. T urn on at
zero degrees means full power, and turn on at 180 degrees
means zero power. This is not quite possible in reality be-
cause triac driver and triac have a fixed turn on time when
activated at zero degrees. At a phase control angle close to
180 degrees the turn on pulse at the trailing edge of the AC
sine wave must be limited to end 200 µs before AC zero
cross as shown in Figure 12. This assures that the device
has time to switch off. Shorter times may cause loss off con-
trol at the following half cycle.
Figure 11. LED Current Required to Trigger
versus LED Pulse Width
PWin, LED TRIGGER PULSE WIDTH (
µ
s)
1
25
20
15
10
5
02 5 10 20 50 100
NORMALIZED TO:
PWin
≥
100
µ
s
IFT, NORMALIZED LED TRIGGER CURRENT
Figure 12. Minimum Time for LED Turn-Off to
Zero Cross of AC Trailing Edge
AC SINE
0
°
180
°
LED PW
LED CURRENT
LED TURN OFF MIN 200
µ
s
5
Motorola Optoelectronics Device Data
Figure 13. Delay Time, t(d), and Fall Time, t(f),
versus LED Trigger Current
IFT, LED TRIGGER CURRENT (mA)
100
0.110 20 30 40 50 60
10
t(delay) AND t(fall) ( s)
µ
1
t(d)
t(f)
t(delay), t(f) versus IFT
The POWER OPTO Isolators turn on switching speed con-
sists of a turn on delay time t(d) and a fall time t(f). Figure 13
shows that the delay time depends on the LED trigger cur-
rent, while the actual trigger transition time t(f) stays constant
with about one micro second.
The delay time is important in very short pulsed operation
because it demands a higher trigger current at very short trig-
ger pulses. This dependency is shown in the graph IFT ver-
sus LED PW.
The turn on transition time t(f) combined with the power
triacs turn on time is important to the power dissipation of this
device.
SCOPE
IFT
VTM
t(d) t(f)
ZERO CROSS
DETECTOR
EXT. SYNC
Vout
FUNCTION
GENERATOR
PHASE CTRL.
PW CTRL.
PERIOD CTRL.
Vo AMPL. CTRL.
IFT
VTM
10 k
Ω
DU
T
100
Ω
ISOL. TRANSF.
A
C
115
VAC
Figure 14. Switching Time Test Circuit
Figure 15. Typical Application Circuit
VCC
Load
MOV
R2
C1
R1
MOC2R60 Select the value of R1 according to the following formulas:
(1) R1 = (VCC – VF) / Max. IFT (on) per spec.
(2) R1 = (VCC – VF) / 0.050
Typical values for C1 and R2 are 0.01 µF and 39 Ω,
respectively. You may adjust these values for specific
applications. The maximum recommended value of C1 is
0.022 µF. See application note AN1048 for additional
information on component values.
The MOV may or may not be needed depending upon the
characteristics of the applied AC line voltage. For
applications where line spikes may exceed the 600 volts
rating of the MOC2R60, an MOV is required.
6 Motorola Optoelectronics Device Data
0.315” min
[8 mm min]
Figure 16. PC Board Layout Recommendations
Thermal measurements
of RθJC are referenced to
the point on the heat tab
indicated with an ‘X’.
Measurements should be
taken with device orientated
along its vertical axis.
Use care to maintain the minimum spacings as
shown. Safety and regulatory requirements dictate
a minimum of 8.0 mm between the closest points
between input and output conducting paths,
Pins 3 and 7. Also, 0.070 inches distance is
required between the two output Pins, 7 and 9.
Keep pad sizes on Pins 7 and 9 as large as possible for
optimal performance.
Figure 17. Test Circuit for Conducted Noise Tests
0.070” MIN
Each device, when installed in the circuit
shown in Figure 17, shall be capable of
passing the following conducted noise tests:
Figure 18. Approximate Thermal Circuit Model
•IEEE 472 (2.5 KV)
•Lamp Dimmer (NEMA Part DC33,
w
3.4.2.1)
•NEMA ICS 2-230.45 Showering Arc
•MIL-STD-461A CS01, CS02 and CS06
TC
T
JTST
A
T
A
TC
T
J
{ }
Junction
Temperature of
MOC2R60 . . .
Output Chip With Additional Heatsink
R
θ
JC
R
θ
CA
R
θ
SA
R
θ
CS
R
θ
JC
No Additional Heatsink
Ambient Air
Temperature
Heat Flow
Z Load
= Rated IF
F
I 0.022
µ
F
10
Ω
150 V
MOV
AC
Supply
Noise
Source
2
Device Under Test
3 7 9
Terms in the model signify:
TA = Ambient temperature
TS= Optional additional
heat sink temperature
TC = Case temperature
TJ = Junction temperature
PD = Power dissipation
RθSA = Thermal resistance, heat sink to ambient
RθCA = Thermal resistance, case to ambient
RθCS = Thermal resistance, heat sink to case
RθJC = Thermal resistance, junction to case
Values for thermal resistance components are: RθCA = 36°C/W/in maximum
RθJC = 8.0°C/W maximum
The design of any additional heatsink will determine the values of RθSA and RθCS.
TC – TA = PD (RθCA)
= PD (RθJC) + RθSA), where PD = Power Dissipation in Watts.
X
7
Motorola Optoelectronics Device Data
PACKAGE DIMENSIONS
CASE 417–02
PLASTIC
STANDARD HEAT TAB
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 2:
PIN 2. LED CATHODE
3. LED ANODE
7. TRIAC MT
9. TRIAC MT
2 973
–A–
L
V
G
4 PLD
N
K
P
S
–T–
SEATING
PLANE
–B–
M
A
M
0.13 (0.005) B M
T
H
J
E
C
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.965 1.005 24.51 25.53
B0.416 0.436 10.57 11.07
C0.170 0.190 4.32 4.83
D0.025 0.035 0.64 0.89
E0.040 0.060 1.02 1.52
G0.400 BSC 10.16 BSC
H0.040 0.060 1.02 1.52
J0.012 0.018 0.30 0.46
K0.134 0.154 3.40 3.91
L0.200 BSC 5.08 BSC
N0.190 0.210 4.83 5.33
P0.023 0.043 0.58 1.09
S0.695 0.715 17.65 18.16
V0.100 BSC 2.54 BSC
CASE 417A–02
PLASTIC
FLUSH MOUNT HEAT TAB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 2. LED CATHODE
3. LED ANODE
7. TRIAC MT
9. TRIAC MT
2 973
–A–
LV G
4 PLD
N
K
P
S
–T–
SEATING
PLANE
–B–
M
A
M
0.13 (0.005) B M
T
H
J
E
C
UW
YQ
R
RADIUSZ
X
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.965 1.005 24.51 25.53
B0.416 0.436 10.57 11.07
C0.170 0.190 4.32 4.83
D0.025 0.035 0.64 0.89
E0.040 0.060 1.02 1.52
G0.400 BSC 10.16 BSC
H0.040 0.060 1.02 1.52
J0.012 0.018 0.30 0.46
K0.134 0.154 3.40 3.91
L0.200 BSC 5.08 BSC
N0.190 0.210 4.83 5.33
P0.023 0.043 0.58 1.09
Q0.057 0.067 1.45 1.70
R0.734 0.754 18.64 19.15
S0.840 0.870 21.34 22.10
U0.593 0.613 15.06 15.57
V0.100 BSC 2.54 BSC
W0.074 0.094 1.88 2.39
X0.265 0.295 6.73 7.49
Y0.079 0.089 2.01 2.26
Z0.026 0.036 0.66 0.91
ORDER “F” SUFFIX
HEAT TAB OPTION
(EX: MOC2R60–10F)
8 Motorola Optoelectronics Device Data
PACKAGE DIMENSIONS — CONTINUED
CASE 417B–01
PLASTIC
CUT HEAT TAB
ISSUE O
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.965 1.005 24.51 25.53
INCHES
B0.416 0.436 10.57 11.07
C0.170 0.190 4.32 4.83
D0.025 0.035 0.64 0.89
E0.040 0.060 1.02 1.52
G0.400 BSC 10.16 BSC
H0.040 0.060 1.02 1.52
J0.012 0.060 0.30 0.46
K0.134 0.154 3.40 3.91
L0.200 BSC 5.08 BSC
N0.190 0.210 4.83 5.33
P0.023 0.043 0.58 1.09
S0.439 0.529 11.15 13.44
V0.100 BSC 2.54 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 2. LED CATHODE
3. LED ANODE
7. TRIAC MT
9. TRIAC MT
B0.13 (0.005) MT A M M
9
K
4 PL
P
S
VL
D
H
72 3
N
J
CE
–A–
–B–
–T–
SEATING
PLANE
G
ORDER “C” SUFFIX
HEAT TAB OPTION
(EX: MOC2R60–10C)
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “T ypicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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