LM160, LM360
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SNOSBJ4C –MAY 1999–REVISED MARCH 2013
LM160/LM360 High Speed Differential Comparator
Check for Samples: LM160,LM360
1FEATURES DESCRIPTION
The LM160/LM360 is a very high speed differential
2• Ensured high speed: 20 ns max input, complementary TTL output voltage comparator
• Tight delay matching on both outputs with improved characteristics over the
• Complementary TTL outputs μA760/μA760C, for which it is a pin-for-pin
replacement. The device has been optimized for
• High input impedance greater speed, input impedance and fan-out, and
• Low speed variation with overdrive variation lower input offset voltage. Typically delay varies only
• Fan-out of 4 3 ns for overdrive variations of 5 mV to 400 mV.
• Low input offset voltage Complementary outputs having minimum skew are
• Series 74 TTL compatible provided. Applications involve high speed analog to
digital convertors and zero-crossing detectors in disk
file systems.
CONNECTION DIAGRAMS
TO-99 Package SOIC or PDIP Package
Figure 1. Package Number LMC0008C (1) Figure 2. Package Number D0008A or P0008E
(1) Also available in SMD# 5962-8767401
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
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Absolute Maximum Ratings (1) (2)
Positive Supply Voltage +8V
Negative Supply Voltage −8V
Peak Output Current 20 mA
Differential Input Voltage ±5V
Input Voltage V+≥VIN ≥V−
ESD Tolerance (3) 1600V
Operating Temperature LM160 −55°C to +125°C
Range LM360 0°C to +70°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
Soldering Information
PDIP Package Soldering (10 seconds) 260°C
SOIC Package Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) The device may be damaged if used beyond the maximum ratings.
(2) Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.
(3) Human body model, 1.5 kΩin series with 100 pF.
2Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
LM160, LM360
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SNOSBJ4C –MAY 1999–REVISED MARCH 2013
Electrical Characteristics
(TMIN ≤TA≤TMAX)Parameter Conditions Min Typ Max Units
Operating Conditions
Supply Voltage VCC+4.5 5 6.5 V
Supply Voltage VCC−−4.5 −5−6.5 V
Input Offset Voltage RS≤200Ω2 5 mV
Input Offset Current 0.5 3 μA
Input Bias Current 5 20 μA
Output Resistance (Either Output) VOUT = VOH 100 Ω
Response Time TA= 25°C, VS= ±5V (1) (2) 13 25 ns
TA= 25°C, VS= ±5V (3) (2) 12 20 ns
TA= 25°C, VS= ±5V (4) (2) 14 ns
Response Time Difference between Outputs
(tpd of +VIN1)−(tpd of −VIN2) TA= 25°C (1) (2) 2 ns
(tpd of +VIN2)−(tpd of −VIN1) TA= 25°C (1) (2) 2 ns
(tpd of +VIN1)−(tpd of +VIN2) TA= 25°C (1) (2) 2 ns
(tpd of −VIN1)−(tpd of −VIN2) TA= 25°C (1) (2) 2 ns
Input Resistance f = 1 MHz 17 kΩ
Input Capacitance f = 1 MHz 3 pF
Average Temperature Coefficient of RS= 50Ω8μV/°C
Input Offset Voltage
Average Temperature Coefficient of 7 nA/°C
Input Offset Current
Common Mode Input Voltage Range VS= ±6.5V ±4 ±4.5 V
Differential Input Voltage Range ±5 V
Output High Voltage (Either Output) IOUT =−320 μA, VS= ±4.5V 2.4 3 V
Output Low Voltage (Either Output) ISINK = 6.4 mA 0.25 0.4 V
Positive Supply Current VS= ±6.5V 18 32 mA
Negative Supply Current VS= ±6.5V −9−16 mA
(1) Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output.
(2) Measurements are made in AC Test Circuit, Fanout = 1
(3) Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output.
(4) Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic
threshold.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM160 LM360
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics Input Current
vs
Ambient
Offset Voltage Temperature
Supply Current
vs
Ambient
Input Characteristics Temperature
Delay of Output 1 With
Propagation Delay vs Respect to Output 2 vs
Ambient Temperature Ambient Temperature
4Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
LM160, LM360
SNOSBJ4C –MAY 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (March 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM160 LM360
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM360M ACTIVE SOIC D 8 95 Non-RoHS &
Non-Green Call TI Call TI 0 to 70 LM
360M
LM360M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM
360M
LM360MX ACTIVE SOIC D 8 2500 Non-RoHS &
Non-Green Call TI Call TI 0 to 70 LM
360M
LM360MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM
360M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM360MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM360MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM360MX SOIC D 8 2500 367.0 367.0 35.0
LM360MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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