CYStech Electronics Corp.
Spec. No. : C302S3-H
Issued Date : 2004.04.13
Revised Date :
Page No. : 1/4
BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification
Small Signal Schottky (double) diodes
BAT54S3/BAT54AS3
BAT54CS3/BAT54SS3
Description
Planar silicon Schottky barrier diodes encapsulated in a SOT-323 very small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
•Guard ring protected
•Low forward voltage drop
•Very small plastic SMD package
Applications
•Ultra high-speed switching
•Voltage clamping
•Protection circuits
•Blocking diodes
Pinning Outline
Description Pin
BAT54 BAT54A BAT54C BAT54S
1 A K1 A1 A1
2 NC K2 A2 K2
3 K A1,A2 K1,K2 K1,A1
2
3
1
N.C.
12
3
12
33
21
SOT-323
1 2
3
(1) BAT54
(3)BAT54C
(2)BAT54A
(4)BAT54S
Diode configuration and symbol
Marking:
Type Marking Code
BAT54 S3 L4
BAT54AS3 42
BAT54CS3 43
BAT54SS3 44
CYStech Electronics Corp.
Spec. No. : C302S3-H
Issued Date : 2004.04.13
Revised Date :
Page No. : 2/4
BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification
Absolute Maximum Ratings
Symbol Parameter Conditions Min Max Unit
Per diode
VR continuous reverse voltage - 30 V
IF continuous forward current - 200 mA
IFRM repetitive peak forward current tp≤1s, δ≤0.5 - 300 mA
IFSM non-repetitive peak forward current tp<10ms - 600 mA
Ptot total power dissipation (per package) Tamb≤25℃ - 200 mW
Tstg storage temperature -65 +150
℃
Tj junction temperature - 125
℃
Tamb operating ambient temperature -65 +125 ℃
Characteristics (Ta=25°C, unless otherwise specified)
Parameter Symbol Condition Min. Max. Unit
Reverse Breakdown Voltage VBR I
R=100µA 30 - V
VF(1) IF=0.1mA - 240 mV
VF(2) IF=1mA - 320 mV
VF(3) IF=10mA - 400 mV
VF(4) IF=30mA - 500 mV
Forward Voltage (Note 1)
VF(5) IF=100mA - 800 mV
Reverse Leakage Current (Note 2) IR V
R=25V - 2 µA
Diode Capacitance CD V
R=1V, f=1MHz - 10 pF
Reverse Recovery Time trr
when switched from IF= 10mA
to IR=10mA; RL=100Ω;
measured at IR=1mA
- 5 ns
Notes: 1.pulse test, tp=380µs, duty cycle<2%.
2.pulse test, tp=300µs, duty cycle<2%.
Thermal Characteristics
Symbol Parameter Conditions Value Unit
Rth j-a thermal resistance from junction to ambient note 1 625 K/W
Note 1 : Refer to SOT-323 standard mounting conditions.
CYStech Electronics Corp.
Spec. No. : C302S3-H
Issued Date : 2004.04.13
Revised Date :
Page No. : 3/4
BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification
Characteristic Curves
Forward Current & Forward Voltage
0
50
100
150
200
250
0 200 400 600 800 1000
Forward Voltage-V
F
(mV)
Forward Current-I
F
(mA)
Diode Capacitance & Reverse-Biased Voltage
1
10
100
0.1 1 10 100
Reverse Biased Voltage-VR (V)
Diode Capacitance-Cd (pF)
CYStech Electronics Corp.
Spec. No. : C302S3-H
Issued Date : 2004.04.13
Revised Date :
Page No. : 4/4
BAT54S3/BAT54AS3/BAT54CS3/BAT54SS3 CYStek Product Specification
SOT-323 Dimension
• BAT54 S3 : Single Diode (Marking Code L4) • BAT54AS3 : Common Anode. (Marking Code 42)
• BAT54CS3 : Common Cathode. (Marking Code 43) • BAT54SS3 : Series Connected. (Marking Code 44)
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max.
DIM Min. Max. Min. Max.
A 0.0315 0.0433 0.80 1.10 e1 0.0256 - 0.65 -
A1 0.0000 0.0039 0.00 0.10 He 0.0787 0.0886 2.00 2.25
bp 0.0118 0.0157 0.30 0.40 Lp 0.0059 0.0177 0.15 0.45
C 0.0039 0.0098 0.10 0.25 Q 0.0051 0.0091 0.13 0.23
D 0.0709 0.0866 1.80 2.20 v 0.0079 - 0.2 -
E 0.0453 0.0531 1.15 1.35 w 0.0079 - 0.2 -
e 0.0512 - 1.3 - θ - -
10° 0
°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Marking:
L4_
Diagram:
3-Lead SOT-323 Plastic
Surface Mounted Package.
CYStek Package Code: S3
XX
He
E
A
A1 Q
Lp
e1
e
bp
12
3
D
W B
v A
Z
detail Z
A
C
θ
01 2
scale
mm