Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3~4 Rating and characteristic curves........................................................ 5~6 Pinning information........................................................................... 7 Suggested solder pad layout............................................................. 7 Packing information.......................................................................... 8 Reel packing.................................................................................... 9 Suggested thermal profiles for soldering processes............................. 9 High reliability test capabilities........................................................... 10 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 500mW Surface Mount Zener Diodes - 2.0V-100V Package outline Features * Silicon epitaxial planar chip structure. * Wide zener reverse voltage range 2.0V to 100V. * Small package size for high density applications. * Glass hermetically sealed package. * Ideally suited for automated assembly processes. * 5% tolerance of Zener voltage for suffix "C" ex: ZMM55C2V0-H * 2% tolerance of Zener voltage for suffix "B" ex: ZMM55B2V0-H * Lead-free parts meet environmental standards of SOD-80 .146(3.7) .130(3.3) SOLDERABLE ENDS .019(.48) .011(.28) MIL-STD-19500 /228 .063(1.6) .055(1.4) Mechanical data * Case : Glass Mini-MELF / SOD-80 * Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 * Polarity : Indicated by cathode band * Mounting Position : Any * Weight : Approximated 0.03 gram Dimensions in inches and (millimeters) Maximum ratings (at T =25 C unless otherwise noted) o A PARAMETER Forward voltage CONDITIONS I F = 200 mA DC Symbol MIN. TYP. MAX. UNIT VF 1.50 V Power Dissipation PD 500 mW Operating temperature TJ Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 T STG Page 2 -55 -65 +175 o C +175 o C Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C2V0 THRU ZMM55C100 Electrical characteristics (at T =25 C unless otherwise noted) o A Zener voltage Test current Zener impedance Leakage current V Z @ I ZT I ZT Z ZT @ I ZT Z ZK @ I ZK I ZK IR VR Part No. Min. Nom. Max. mA ()Max ()Max mA (uA)Max Volts ZMM55C2V0 1.9 2.0 2.1 5.0 100 600 1.0 150 1.0 ZMM55C2V2 2.1 2.2 2.3 5.0 100 600 1.0 150 1.0 ZMM55C2V4 2.2 2.4 2.6 5.0 85 600 1.0 50 1.0 ZMM55C2V7 2.5 2.7 2.9 5.0 85 600 1.0 10 1.0 ZMM55C3V0 2.8 3.0 3.2 5.0 85 600 1.0 4.0 1.0 ZMM55C3V3 3.1 3.3 3.5 5.0 85 600 1.0 2.0 1.0 ZMM55C3V6 3.4 3.6 3.8 5.0 85 600 1.0 2.0 1.0 ZMM55C3V9 3.7 3.9 4.1 5.0 85 600 1.0 2.0 1.0 ZMM55C4V3 4.0 4.3 4.6 5.0 75 600 1.0 1.0 1.0 ZMM55C4V7 4.4 4.7 5.0 5.0 60 600 1.0 0.5 1.0 ZMM55C5V1 4.8 5.1 5.4 5.0 35 550 1.0 0.1 1.0 ZMM55C5V6 5.2 5.6 6.0 5.0 25 450 1.0 0.1 1.0 ZMM55C6V2 5.8 6.2 6.6 5.0 10 200 1.0 0.1 2.0 ZMM55C6V8 6.4 6.8 7.2 5.0 8 150 1.0 0.1 3.0 ZMM55C7V5 7.0 7.5 7.9 5.0 7 50 1.0 0.1 5.0 ZMM55C8V2 7.7 8.2 8.7 5.0 7 50 1.0 0.1 6.2 ZMM55C9V1 8.5 9.1 9.6 5.0 10 50 1.0 0.1 6.8 ZMM55C10 9.4 10 10.6 5.0 15 70 1.0 0.1 7.5 ZMM55C11 10.4 11 11.6 5.0 20 70 1.0 0.1 8.2 ZMM55C12 11.4 12 12.7 5.0 20 90 1.0 0.1 9.1 ZMM55C13 12.4 13 14.1 5.0 26 110 1.0 0.1 10 ZMM55C15 13.8 15 15.6 5.0 30 110 1.0 0.1 11 ZMM55C16 15.3 16 17.1 5.0 40 170 1.0 0.1 12 ZMM55C18 16.8 18 19.1 5.0 50 170 1.0 0.1 13 ZMM55C20 18.8 20 21.2 5.0 55 220 1.0 0.1 15 ZMM55C22 20.8 22 23.3 5.0 55 220 1.0 0.1 16 ZMM55C24 22.8 24 25.6 5.0 80 220 1.0 0.1 18 ZMM55C27 25.1 27 28.9 5.0 80 220 1.0 0.1 20 ZMM55C30 28 30 32 5.0 80 220 1.0 0.1 22 ZMM55C33 31 33 35 5.0 80 220 1.0 0.1 24 ZMM55C36 34 36 38 5.0 80 220 1.0 0.1 27 ZMM55C39 37 39 41 2.5 90 500 1.0 0.1 30 ZMM55C43 40 43 46 2.5 90 600 0.5 0.1 33 ZMM55C47 44 47 50 2.5 110 700 0.5 0.1 36 ZMM55C51 48 51 54 2.5 125 700 0.5 0.1 39 ZMM55C56 52 56 60 2.5 135 1000 0.5 0.1 43 ZMM55C62 58 62 66 2.5 150 1000 0.5 0.1 47 ZMM55C68 64 68 72 2.5 200 1000 0.5 0.1 51 ZMM55C75 70 75 79 2.5 250 1500 0.5 0.1 56 ZMM55C82 78 82 86 2.5 300 2000 0.5 0.1 62 ZMM55C91 86 91 96 1.0 450 5000 0.1 0.1 68 ZMM55C100 95 100 105 1.0 450 5000 0.1 0.1 75 Note : 5% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55B2V0 THRU ZMM55B100 Electrical characteristics (at T =25 C unless otherwise noted) o A Zener voltage Test current Zener impedance V Z @ I ZT I ZT Z ZT @ I ZT ()Max Leakage current Part No. Z ZK @ I ZK I ZK IR VR Min. Nom. Max. mA ()Max mA (uA)Max Volts ZMM55B2V0 1.96 2.0 2.04 5.0 100 600 1.0 150 1.0 ZMM55B2V2 2.12 2.2 2.24 5.0 100 600 1.0 150 1.0 ZMM55B2V4 2.35 2.4 2.45 5.0 85 600 1.0 50 1.0 ZMM55B2V7 2.65 2.7 2.75 5.0 85 600 1.0 10 1.0 ZMM55B3V0 2.94 3.0 3.06 5.0 85 600 1.0 4.0 1.0 ZMM55B3V3 3.23 3.3 3.37 5.0 85 600 1.0 2.0 1.0 ZMM55B3V6 3.53 3.6 3.67 5.0 85 600 1.0 2.0 1.0 ZMM55B3V9 3.82 3.9 3.98 5.0 85 600 1.0 2.0 1.0 ZMM55B4V3 4.21 4.3 4.39 5.0 75 600 1.0 1.0 1.0 ZMM55B4V7 4.61 4.7 4.79 5.0 60 600 1.0 0.5 1.0 ZMM55B5V1 5.00 5.1 5.20 5.0 35 550 1.0 0.1 1.0 ZMM55B5V6 5.49 5.6 5.71 5.0 25 450 1.0 0.1 1.0 ZMM55B6V2 6.08 6.2 6.32 5.0 10 200 1.0 0.1 2.0 ZMM55B6V8 6.66 6.8 6.94 5.0 8 150 1.0 0.1 3.0 ZMM55B7V5 7.35 7.5 7.65 5.0 7 50 1.0 0.1 5.0 ZMM55B8V2 8.04 8.2 8.36 5.0 7 50 1.0 0.1 6.2 ZMM55B9V1 8.92 9.1 9.28 5.0 10 50 1.0 0.1 6.8 ZMM55B10 9.8 10 10.2 5.0 15 70 1.0 0.1 7.5 ZMM55B11 10.8 11 11.2 5.0 20 70 1.0 0.1 8.2 ZMM55B12 11.8 12 12.2 5.0 20 90 1.0 0.1 9.1 ZMM55B13 12.7 13 13.3 5.0 26 110 1.0 0.1 10 ZMM55B15 14.7 15 15.3 5.0 30 110 1.0 0.1 11 ZMM55B16 15.7 16 16.3 5.0 40 170 1.0 0.1 12 ZMM55B18 17.6 18 18.4 5.0 50 170 1.0 0.1 13 ZMM55B20 19.6 20 20.4 5.0 55 220 1.0 0.1 15 ZMM55B22 21.6 22 22.4 5.0 55 220 1.0 0.1 16 ZMM55B24 23.5 24 24.5 5.0 80 220 1.0 0.1 18 ZMM55B27 26.5 27 27.5 5.0 80 220 1.0 0.1 20 ZMM55B30 29.4 30 30.6 5.0 80 220 1.0 0.1 22 ZMM55B33 32.3 33 33.7 5.0 80 220 1.0 0.1 24 ZMM55B36 35.3 36 36.7 5.0 80 220 1.0 0.1 27 ZMM55B39 38.2 39 39.8 2.5 90 500 1.0 0.1 30 ZMM55B43 42.1 43 43.9 2.5 90 600 0.5 0.1 33 ZMM55B47 46.1 47 47.9 2.5 110 700 0.5 0.1 36 ZMM55B51 50.0 51 52.0 2.5 125 700 0.5 0.1 39 ZMM55B56 54.9 56 57.1 2.5 135 1000 0.5 0.1 43 ZMM55B62 60.8 62 63.2 2.5 150 1000 0.5 0.1 47 ZMM55B68 66.6 68 69.4 2.5 200 1000 0.5 0.1 51 ZMM55B75 73.5 75 76.5 2.5 250 1500 0.5 0.1 56 ZMM55B82 80.4 82 83.6 2.5 300 2000 0.5 0.1 62 ZMM55B91 89.2 91 92.8 1.0 450 5000 0.1 0.1 68 ZMM55B100 98 100 102 1.0 450 5000 0.1 0.1 75 Note : 2% tolerance of Zener voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100) FIG.1-TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE o UNDER OPERATING CONDITIONS AT T A =25 C 1000 400 VOLTAGE CHANGE (mV) TOTAL POWER DISSIPATION (mW) 500 300 200 100 0 0 50 100 10 0 250 200 150 I Z = 5mA 100 0 5 o 15 20 25 ZENER VOLTAGE (V) FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE VS. JUNCTION TEMPERATURE FIG. 4-TEMPERATURE COEFFICIENT OF VZ VS. Z-VOLTAGE 15 -4 TEMPERATURE COEFFICIENT (10 / K) 1.3 RELATIVE VOLTAGE CHANGE 10 AMBIENT TEMPERATURE ( C) 1.2 -4 10 x 10 /K -4 8 x 10 /K -4 6 x 10 /K 1.1 -4 4 x 10 /K -4 2 x 10 /K 0 -4 -2 x 10 /K -4 -4 x 10 /K 1.0 0.9 0.8 10 I Z = 5mA 5 0 -5 -60 0 60 120 180 240 0 o JUNCTION TEMPERATURE ( C) 10 20 30 40 50 ZENER VOLTAGE (V) FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE DIODE CAPACITANCE (pF) 200 150 V R = 2V 100 50 0 0 5 10 15 20 25 ZENER VOLTAGE (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100) FIG. 7-Z-CURRENT VS. Z-VOLTAGE 100 50 10 40 ZENER CURRENT (mA) FORWARD CURRENT (mA) FIG. 6-FORWARD CURRENT VS. FORWARD VOLTAGE 1 0.1 P tot = 500mW 30 20 10 0.01 0.001 0 0 0.2 0.4 0.6 0.8 1.0 15 25 30 35 ZENER VOLTAGE (V) FIG. 8-Z-CURRENT VS. Z-VOLTAGE FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE 1000 DIFFERENTIAL Z-RESISTANCE (ohm) 100 80 P tot = 500mW 60 40 20 0 I Z = 1mA 100 I Z = 5mA 10 I Z = 10mA 1 0 4 8 12 16 20 0 5 ZENER VOLTAGE (V) 10 15 20 25 ZENER VOLTAGE (V) FIG. 10-THERMAL RESPONSE THERMAL RESISTANCE FOR PULSE Cond. (K/W) ZENER CURRENT (mA) 20 FORWARD VOLTAGE (V) 1000 t p / T= 0.5 100 t p / T= 0.2 Single Pulse t p / T= 0.01 10 t p / T= 0.1 t p / T= 0.02 t p / T= 0.05 1 0.1 1 10 100 1000 PULSE LENGTH (mS) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-80 0.071 (1.80) 0.035 (0.90) 0.102 (2.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 2.00 3.70 1.80 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 178.00 50.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Item SOD-80 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 8 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 Reel packing PACKAGE REEL SIZE 7" SOD-80 REEL (pcs) COMPONENT SPACING (m/m) 4.0 2500 BOX (pcs) 25,000 INNER BOX (m/m) 183*183*123 REEL DIA, (m/m) 178 CARTON SIZE (m/m) CARTON (pcs) 382*262*387 200,000 APPROX. GROSS WEIGHT (kg) 9.6 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 9 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10 Formosa MS GLASS MINI-MELF Zener Diode ZMM55C(B)2V0 THRU ZMM55C(B)100 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 5 C for 10 2sec. immerse body into solder 1/16"1/32" MIL-STD-750D METHOD-2031 2. Solderability at 2455 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=175C for 168 hrs. MIL-STD-750D METHOD-1038 4. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 5. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 6. Thermal Shock 7. Humidity 8. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 10 Document ID Issued Date Revised Date Revision Page. DS-221704 2008/02/10 2011/08/04 B 10