Page 1
Formosa MS
1
2
2
2
2
3~4
5~6
7
7
8
9
9
10
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
ZMM55C(B)2V0 THRU ZMM55C(B)100
Features
Silicon epitaxial planar chip structure.
Wide zener reverse voltage range 2.0V to 100V.
Small package size for high density applications.
• Glass hermetically sealed package.
Ideally suited for automated assembly processes.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
•
•
•
•
•
• 5% tolerance of Zener voltage for suffix "C" ex: ZMM55C2V0-H
• 2% tolerance of Zener voltage for suffix "B" ex: ZMM55B2V0-H
Mechanical data
Case : Glass Mini-MELF / SOD-80
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.03 gram
•
Package outline
Page 2
500mW Surface Mount Zener
Diodes - 2.0V-100V
PARAMETER CONDITIONS Symbol
VF
PD
MIN. TYP. MAX.
1.50
500
UNIT
V
mW
Storage temperature
Operating temperature
TSTG
TJ-55
-65
+175
+175 oC
oC
o
Maximum ratings (at T =25 C unless otherwise noted)
A
Forward voltage
Power Dissipation
I = 200 mA DC
F
Formosa MS
ZMM55C(B)2V0 THRU ZMM55C(B)100
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
Dimensions in inches and (millimeters)
SOD-80
.063(1.6)
.055(1.4)
.146(3.7)
.130(3.3) .019(.48)
.011(.28)
SOLDERABLE
ENDS
Page 3
o
Electrical characteristics (at T =25 C unless otherwise noted)
A
Zener
voltage
Test
current
Zener
impedance
Leakage
current
Note : 5% tolerance of Zener voltage
mA
IZT Z @ I
ZT ZT
Max.
V @ I
Z ZT
mA
IZK IR
Volts
VR
Z @ I
ZK ZK
3.3
2.4
3.6
3.9
4.3
2.7
4.7
3.0
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.0
85
85
85
85
85
85
75
60
35
25
10
8
7
7
10
15
20
20
26
30
40
50
55
55
80
80
80
80
80
90
90
110
125
135
150
200
450
50
10
4.0
2.0
2.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
5.0
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
600
600
600
600
600
600
600
600
550
450
200
150
50
50
50
70
70
90
110
110
170
170
220
220
220
220
220
220
220
500
600
700
700
1000
1000
1000
5000
Part No.
ZMM55C4V3
ZMM55C2V4
ZMM55C4V7
ZMM55C2V7
ZMM55C5V1
ZMM55C3V0
ZMM55C3V3
ZMM55C5V6
ZMM55C3V6
ZMM55C6V2
ZMM55C3V9
ZMM55C6V8
ZMM55C7V5
ZMM55C8V2
ZMM55C9V1
ZMM55C10
ZMM55C11
ZMM55C12
ZMM55C13
ZMM55C15
ZMM55C16
ZMM55C18
ZMM55C20
ZMM55C22
ZMM55C24
ZMM55C27
ZMM55C30
ZMM55C33
ZMM55C36
ZMM55C39
ZMM55C43
ZMM55C47
ZMM55C51
ZMM55C56
43
47
51
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.1
33
36
39
ZMM55C62
ZMM55C68
ZMM55C100
62
68
100
43
47
51
75
56
2.0 5.0 100 1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
150 1.0600
ZMM55C2V0
2.2 5.0 100 150 1.0600
ZMM55C2V2
1.0 450 0.15000 0.1
ZMM55C91 91 68
2.5 300 0.12000
ZMM55C82 82 62
2.5 250 0.11500
ZMM55C75 75 56
Formosa MS
ZMM55C2V0 THRU ZMM55C100
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
3.5
2.6
3.8
4.1
4.6
2.9
5.0
3.2
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
35
38
41
46
50
54
66
72
105
60
2.1
2.3
96
86
79
3.1
2.2
3.4
3.7
4.0
2.5
4.4
2.8
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
31
34
37
40
44
48
58
64
95
52
1.9
2.1
86
78
70
Nom.Min.
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
(uA)Max
(Ω)Max (Ω)Max
Page 4
o
Electrical characteristics (at T =25 C unless otherwise noted)
A
Zener
voltage
Test
current
Zener
impedance
Leakage
current
Note : 2% tolerance of Zener voltage
mA
IZT Z @ I
ZT ZT
Max.
V @ I
Z ZT
mA
IZK IR
Volts
VR
Z @ I
ZK ZK
3.3
2.4
3.6
3.9
4.3
2.7
4.7
3.0
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.0
85
85
85
85
85
85
75
60
35
25
10
8
7
7
10
15
20
20
26
30
40
50
55
55
80
80
80
80
80
90
90
110
125
135
150
200
450
50
10
4.0
2.0
2.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
5.0
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
600
600
600
600
600
600
600
600
550
450
200
150
50
50
50
70
70
90
110
110
170
170
220
220
220
220
220
220
220
500
600
700
700
1000
1000
1000
5000
Part No.
ZMM55B4V3
ZMM55B2V4
ZMM55B4V7
ZMM55B2V7
ZMM55B5V1
ZMM55B3V0
ZMM55B3V3
ZMM55B5V6
ZMM55B3V6
ZMM55B6V2
ZMM55B3V9
ZMM55B6V8
ZMM55B7V5
ZMM55B8V2
ZMM55B9V1
ZMM55B10
ZMM55B11
ZMM55B12
ZMM55B13
ZMM55B15
ZMM55B16
ZMM55B18
ZMM55B20
ZMM55B22
ZMM55B24
ZMM55B27
ZMM55B30
ZMM55B33
ZMM55B36
ZMM55B39
ZMM55B43
ZMM55B47
ZMM55B51
ZMM55B56
43
47
51
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.1
33
36
39
ZMM55B62
ZMM55B68
ZMM55B100
62
68
100
43
47
51
75
56
2.0 5.0 100 1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
150 1.0600
ZMM55B2V0
2.2 5.0 100 150 1.0600
ZMM55B2V2
1.0 450 0.15000 0.1
ZMM55B91 91 68
2.5 300 0.12000
ZMM55B82 82 62
2.5 250 0.11500
ZMM55B75 75 56
Formosa MS
ZMM55B2V0 THRU ZMM55B100
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
3.37
2.45
3.67
3.98
4.39
2.75
4.79
3.06
5.20
5.71
6.32
6.94
7.65
8.36
9.28
10.2
11.2
12.2
13.3
15.3
16.3
18.4
20.4
22.4
24.5
27.5
30.6
33.7
36.7
39.8
43.9
47.9
52.0
63.2
69.4
102
57.1
2.04
2.24
92.8
83.6
76.5
3.23
2.35
3.53
3.82
4.21
2.65
4.61
2.94
5.00
5.49
6.08
6.66
7.35
8.04
8.92
9.8
10.8
11.8
12.7
14.7
15.7
17.6
19.6
21.6
23.5
26.5
29.4
32.3
35.3
38.2
42.1
46.1
50.0
60.8
66.6
98
54.9
1.96
2.12
89.2
80.4
73.5
Nom.Min.
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
(Ω)Max (Ω)Max (uA)Max
Page 5
TOTAL POWER DISSIPATION (mW)
RELATIVE VOLTAGE CHANGE
DIODE CAPACITANCE (pF)
VOLTAGE CHANGE (mV)
-4
TEMPERATURE COEFFICIENT (10 / K)
o
AMBIENT TEMPERATURE ( C)
o
JUNCTION TEMPERATURE ( C)
ZENER VOLTAGE (V)
ZENER VOLTAGE (V)
ZENER VOLTAGE (V)
FIG.1-TOTAL POWER DISSIPATION VS.
AMBIENT TEMPERATURE
FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE
VS. JUNCTION TEMPERATURE
FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE
o
UNDER OPERATING CONDITIONS AT T =25 C
A
FIG. 4-TEMPERATURE COEFFICIENT OF VZ
VS. Z-VOLTAGE
FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE
0
0
10
100
1000
5 10 15 20 25
-60
0.8
0
0.9
60
1.0
120
1.1
180
1.2
240
1.3
0
0
0
-5
0
5
10
15
10 20 30 40 50
50
100
150
200
5 10 15 20 25
-4
8 x 10 /K
I = 5mA
Z
I = 5mA
Z
-4
10 x 10 /K
-4
-4 x 10 /K
-4
-2 x 10 /K
0
-4
2 x 10 /K
-4
4 x 10 /K
-4
6 x 10 /K
Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100)
V = 2V
R
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
0
0
100
200
300
400
500
50 100 150 200 250
Page 6
ZENER CURRENT (mA)
THERMAL RESISTANCE FOR PULSE Cond. (K/W)
DIFFERENTIAL Z-RESISTANCE (ohm)
FORWARD CURRENT (mA)
ZENER CURRENT (mA)
ZENER VOLTAGE (V)
FORWARD VOLTAGE (V)
PULSE LENGTH (mS)
ZENER VOLTAGE (V)
ZENER VOLTAGE (V)
FIG. 6-FORWARD CURRENT
VS. FORWARD VOLTAGE
FIG. 8-Z-CURRENT VS. Z-VOLTAGE
FIG. 10-THERMAL RESPONSE
FIG. 7-Z-CURRENT VS. Z-VOLTAGE
FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE
0
0.001
15
0
0
0
0.1
1
0
1
0.01
0.1
1
10
100
0.2 0.4 0.6 0.8 1.0
10
20
30
40
50
20 25 30 35
10
100
1000
5 10 15 20 25
20
40
60
80
100
4 8 12 16 20
10
100
1000
1 10 100 1000
I = 1mA
Z
I = 5mA
Z
I = 10mA
Z
t / T= 0.05
p
t / T= 0.1
p
t / T= 0.2
p
t / T= 0.5
p
Single Pulse
t / T= 0.01
p
t / T= 0.02
p
P = 500mW
tot
P = 500mW
tot
Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
Pinning information
12
2
1
Pin1 cathode
Pin2 anode
Pin Simplified outline Symbol
Suggested solder pad layout
Dimensions in inches and (millimeters)
A
C
B
B
0.035 (0.90)
A
0.071 (1.80)
C
0.102 (2.60)
PACKAGE
SOD-80
Page 7
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Document ID Issued Date Revised Date Revision Page.
DS-221704 2008/02/10 2011/08/04 B 10
Page 8
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Document ID Issued Date Revised Date Revision Page.
Packing information
P0
P1
E
B
d
F
W
P
A
D
D1
D2
W1
C
T
Item Tolerance SOD-80
Carrier width
Carrier length
Carrier depth
Sprocket hole
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Reel width
Overall tape thickness
Tape width
P0
P1
E
B
C
d
F
T
W
P
A
D
D1
D2
W1
Symbol
0.1
0.1
0.1
min
0.5
0.1
0.3
1.0
0.1
0.1
0.1
0.1
0.1
0.1
2.0
unit:mm
178.00
50.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
2.00
3.70
1.80
1.50
DS-221704 2008/02/10 2011/08/04 B 10
Page 9
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Document ID Issued Date Revised Date Revision Page.
Profile Feature Soldering Condition
Average ramp-up rate(TL to TP) <3 /sec
Preheat
o
-Temperature Min(Tsmin) 150 C
o
-Temperature Max(Tsmax) 200 C
-Time(min to max)(ts) 60~120sec
Tsmax to TL
o
-Ramp-upRate <3 C/sec
Time maintained above:
o
-Temperature(TL) 217 C
-Time(tL) 60~260sec
o o
Peak Temperature(TP) 255 C-0/+5 C
o
Time within 5 C of actual Peak
Temperature(tP)
o
Ramp-down Rate <6 C/sec
o
Time 25 C to Peak Temperature <6minutes
oC
3.Reflow soldering
10~30sec
1.Storage environment: Temperature=5 ~40 Humidity=55%±25%
2.Reflow soldering of surface-mount devices
o o
C C
Suggested thermal profiles for soldering processes
Critical Zone
TL to TP
TL
Tsmax
Tsmin
Ramp-up
Tp
tS
Preheat
o
t25 C to Peak
Time
25
TL
TP
Ramp-down
Temperature
DS-221704 2008/02/10 2011/08/04 B 10
Reel packing
SOD-80 7" 2500 4.0 25,000 183*183*123 178 382*262*387 200,000 9.6
PACKAGE REEL SIZE REEL
COMPONENT
SPACING BOX
INNER
BOX
REEL
DIA,
CARTON
SIZE CARTON
APPROX.
GROSS WEIGHT
(kg)(pcs)(m/m)(m/m)
(m/m)
(pcs)(m/m)
(pcs)
Page 10
Document ID Issued Date Revised Date Revision Page.
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
DS-221704 2008/02/10 2011/08/04 B 10
High reliability test capabilities
1. Solder Resistance
2. Solderability
3. High Temperature Reverse Bias
4. Pressure Cooker
5. Temperature Cycling
6. Thermal Shock
7. Humidity
8. High Temperature Storage Life
at 260 5 for 10 2sec.
immerse body into solder 1/16"±1/32"
O
at 245±5 C for 5 sec.
V =80% rate at T =175°C for 168 hrs.
R J
O
15P at T =121 C for 4 hrs.
SIG A
O O
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
O O
0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.
O
at T =85 C, RH=85% for 1000hrs.
A
O
at 175 C for 1000 hrs.
O
± C ± MIL-STD-750D
METHOD-2031
MIL-STD-202F
METHOD-208
MIL-STD-750D
METHOD-1038
JESD22-A102
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
MIL-STD-750D
METHOD-1021
MIL-STD-750D
METHOD-1031
Item Test Conditions Reference
