FINAL Am27X400 Advanced Micro Devices 4 Megabit (524,288 x 8-Bit/262,144 x 16-Bit) CMOS ExpressROM Device 10% power supply tolerance High noise immunity Low power dissipation -- 100 A maximum CMOS standby current Available in Plastic Dual In-Line Package (PDIP) and Plastic Leaded Chip Carrier (PLCC) Latch-up protected to 100 mA from -1 V to VCC +1 V Versatile features for simple interfacing -- Both CMOS and TTL input/output compatibility -- Two line control functions As an OTP EPROM alternative: -- Factory optimized programming -- Fully tested and guaranteed As a Mask ROM alternative: -- Shorter leadtime -- Lower volume per code Fast access time -- 120 ns Single +5 V power supply Compatible with JEDEC-approved EPROM pinout GENERAL DESCRIPTION The Am27X400 is a factory programmed and tested OTP EPROM. It is programmed after packaging prior to final test. Every device is rigorously tested under AC and DC operating conditions to your stable code. It is organized as 524,288 by 8 bits/262,144 by 16 bits and is available in plastic dual in-line (PDIP) as well as plastic leaded chip carrier (PLCC) packages. ExpressROM devices provide a board-ready memory solution for medium to high volume codes with short leadtimes. This offers manufacturers a cost-effective and flexible alternative to OTP EPROMs and mask programmed ROMs. Access times as fast as 120 ns allow operation with high-performance microprocessors with reduced WAIT states. The Am27X400 offers separate Output Enable (OE) and Chip Enable (CE) controls, thus eliminating bus contention in a multiple bus microprocessor system. AMD's CMOS process technology provides high speed, low power, and high noise immunity. Typical power consumption is only 150 mW in active mode, and 100 W in standby mode. BLOCK DIAGRAM Data Outputs DQ0-DQ15 VCC VSS OE BYTE CE A0-A17 Address Inputs, AB Output Enable Chip Enable Output Buffers Y Decoder Y Gating X Decoder 4,194,304-Bit Cell Matrix 17344A-1 Publication# 17344 Rev. A Issue Date: July 1993 Amendment /0 4-95 AMD PRODUCT SELECTOR GUIDE Family Part No Am27X400 Ordering Part No: VCC 5% -125 VCC 10% -255 -120 -150 -200 Max Access Time (ns) 120 150 200 CE (E) Access (ns) 120 150 200 250 OE (G) Access (ns) 50 65 75 100 CONNECTION DIAGRAMS Top View PDIP 250 34 A1 8 33 A14 A15 A0 9 32 A16 CE(E) 10 31 BYTE/VPP VSS 11 30 OE(G) 12 29 VSS DQ15/AB DQ0 13 28 DQ7 DQ8 14 27 DQ14 DQ1 15 26 DQ6 DQ9 16 25 DQ13 DQ2 17 24 DQ5 DQ10 18 23 DQ12 DQ3 19 22 DQ4 DQ11 20 21 VCC A11 7 7 39 A12 A3 8 38 A13 A2 9 37 A14 A1 10 36 A15 A0 11 35 A16 CE (E) 12 34 BYTE/VPP VSS 13 33 VSS OE 14 32 DQ15/AB DQ0 15 31 DQ7 DQ8 16 30 DQ14 DQ1 17 29 DQ6 18 19 20 21 22 23 24 25 26 27 28 DQ5 A2 A4 DQ13 A13 A9 35 A10 6 1 44 43 42 41 40 DQ12 A3 A8 A12 NC 36 3 2 VCC 5 5 4 DQ4 A4 6 NC A11 A18 37 NC 4 DQ11 A5 A17 A9 A10 A7 38 DQ3 3 DQ10 39 A6 A6 A8 DQ2 40 2 DQ9 1 A7 A5 PLCC A17 17344A-3 17344A-2 Note: 1. JEDEC nomenclature is in parentheses. PIN DESIGNATIONS AB A0-A17 BYTE CE (E) DQ0-DQ15 DU NC OE (G) VCC VPP VSS 4-96 = = = = = = = = = = = LOGIC SYMBOL Address Input (BYTE Mode) Address Inputs Byte/Word Switch Chip Enable Input Data Inputs/Outputs No External Connection (Do Not Use) No Internal Connection Output Enable Input VCC Supply Voltage Program Supply Voltage Ground Am27X400 16 AB 18 DQ0-DQ15 A0-A17 CE (E) BYTE OE (G) 17344A-4 AMD ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The ordering number (Valid Combination) is formed by a combination of: AM27X400 -120 C J XXXXX e. CODE DESIGNATION Assigned by AMD d. TEMPERATURE RANGE C = Commercial (0C to +70C) I = Industrial (-40C to +85C) c. PACKAGE TYPE P = 40-Pin Plastic Dual In-Line Package (PD 040) J = 44-Pin Rectangular Plastic Leaded Chip Carrier (PL 044) b. SPEED OPTION See Product Selector Guide and Valid Combinations a. DEVICE NUMBER/DESCRIPTION Am27X400 4 Megabit (524,288 x 8-Bit/262,144 x 16-Bit) CMOS ExpressROM Device Valid Combinations AM27X400-120 AM27X400-125 AM27X400-150 AM27X400-200 AM27X400-255 PC, JC, PI, JI Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. Am27X400 4-97 AMD FUNCTIONAL DESCRIPTION Read Mode Output OR-Tieing The Am27X400 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC-tOE. Byte Mode The user has the option of reading data in either 16-bit words or 8-bit bytes under control of the BYTE input. With the BYTE input HIGH, inputs A0-A17 will address 256K words of 16-bit data. When the BYTE input is LOW, AB functions as the least significant address input and 512K bytes of data can be accessed. The 8 bits of data will appear on DQ0-DQ7. Standby Mode The Am27X400 has a CMOS standby mode which reduces the maximum VCC current to 100 A. It is placed in CMOS-standby when CE is at VCC 0.3 V. The Am27X400 also has a TTL-standby mode which reduces the maximum VCC current to 1.0 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. To accommodate multiple memory connections, a twoline control function is provided to allow for: Low memory power dissipation Assurance that output bus contention will not occur It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. System Applications During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 F ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and VSS to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on ExpressROM device arrays, a 4.7 F bulk electrolytic capacitor should be used between VCC and VSS for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. MODE SELECT TABLE CE OE VPP Outputs VIL VIL X DOUT Output Disable VIL VIH X Hi-Z Standby (TTL) VIH X X Hi-Z VCC 0.3 V X X Hi-Z Mode Read Standby (CMOS) Pins Note: 1. X = Either VIH or VIL 4-98 Am27X400 AMD ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Storage Temperature OTP Products . . . . . . . . . . . . . . . -65C to +125C All Other Products . . . . . . . . . . . . -65C to +150C Commercial (C) Devices Ambient Temperature (TA) . . . . . . . 0C to +70C Ambient Temperature with Power Applied . . . . . . . . . . . . . -55C to +125C Voltage with Respect to VSS All pins except VCC . . . . . . . -0.6 V to VCC + 0.6 V VCC . . . . . . . . . . . . . . . . . . . . . . . -0.6 V to +7.0 V Note: 1. Minimum DC voltage on input or I/O pins is -0.5 V. During transitions, the inputs may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC voltage on input and I/O pins is VCC + 0.5 V which may overshoot to VCC + 2.0 V for periods up to 20 ns. Industrial (I) Devices Ambient Temperature (TA) . . . . . -40C to +85C Supply Read Voltages VCC for Am27X400-XX5 . . . . . +4.75 V to +5.25 V VCC for Am27X400-XX0 . . . . . +4.50 V to +5.50 V Operating ranges define those limits between which the functionality of the device is guaranteed. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. Am27X400 4-99 AMD DC CHARACTERISTICS over operating range unless otherwise specified (Notes 1, 2 and 4) Parameter Symbol Parameter Description Test Conditions Min 2.4 VOH Output HIGH Voltage IOH = -400 A VOL Output LOW Voltage IOL = 2.1 mA VIH Input HIGH Voltage VIL Input LOW Voltage ILI Input Load Current ILO Max Unit V 0.45 V 2.0 VCC + 0.5 V -0.5 +0.8 V VIN = 0 V to +VCC 1.0 A Output Leakage Current VOUT = 0 V to +VCC 5.0 A ICC1 VCC Active Current (Note 3) CE = VIL, f = 5 MHz, IOUT = 0 mA 50 mA ICC2 VCC TTL Standby Current CE = VIH 1.0 mA ICC3 VCC CMOS Standby Current CE = VCC 0.3 V 100 A 35 30 30 28 Supply Current in mA Supply Current in mA Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. Caution: The Am27X400 must not be removed from (or inserted into) a socket when VCC or VPP is applied. 3. ICC1 is tested with OE = VIH to simulate open outputs. 4. Minimum DC Input Voltage is -0.5 V during transactions, the inputs may overshoot to -2.0 V for periods less than 20 ns. Maximum DC Voltage on output pins is VCC +0.5 V, which may overshoot to VCC +2.0 V for periods less than 20 ns. 25 20 15 1 2 3 4 5 6 7 8 9 10 24 22 -75 -50 -25 0 25 50 75 100 125 150 Temperature in C Frequency in MHz Figure 1. Typical Supply Current vs. Frequency VCC = 5.5 V, T = 25C Figure 2. Typical Supply Current vs. Temperature VCC = 5.5 V, f = 5 MHz 17344A-5 4-100 26 Am27X400 17344A-6 AMD CAPACITANCE PD 040 Parameter Symbol Parameter Description Test Conditions CIN Input Capacitance COUT Output Capacitance PL 044 Typ Max Typ Max Unit VIN = 0 V 6 8 9 11 pF VOUT = 0 V 9 11 13 15 pF Notes: 1. This parameter is only sampled and not 100% tested. 2. TA = +25C, f = 1 MHz. SWITCHING CHARACTERISTICS over operating range unless otherwise specified (Notes 1, 3 and 4) Parameter Symbols JEDEC Standard tAVQV tRCC Am27X400 Parameter Description Test Conditions -125 -120 -150 -200 -255 Unit Address to Output Delay CE = OE = VIL Min Max - 120 - 150 - 200 - 250 ns tELQV tCE Chip Enable to Output Delay OE = VIL Min Max - 120 - 150 - 200 - 250 ns tGLQV tOE Output Enable to Output Delay CE = VIL Min Max - 50 - 55 - 60 - 75 ns Chip Enable HIGH or Output Enable HIGH, whichever comes first, to Output Float Min Max 0 30 0 30 0 40 0 60 ns Output Hold from Addresses, CE, or OE, whichever occurred first Min Max 0 - 0 - 0 - 0 - ns tEHQZ tGHQZ tDF (Note 2) tAXQX tOH Notes: 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. This parameter is only sampled and not 100% tested. 3. Caution: The Am27X400 must not be removed from (or inserted into) a socket or board when VPP or VCC is applied. 4. Output Load: 1 TTL gate and CL = 100 pF Input Rise and Fall Times: 20 ns Input Pulse Levels: 0.45 V to 2.4 V Timing Measurement Reference Level: 0.8 V and 2 V for inputs and outputs Am27X400 4-101 AMD SWITCHING TEST CIRCUIT 2.7 k Device Under Test +5.0 V CL Diodes = IN3064 or Equivalent 6.2 k 17344A-7 CL = 100 pF including jig capacitance SWITCHING TEST WAVEFORM 2.4 V 2.0 V 2.0 V Test Points 0.8 V 0.8 V 0.45 V Input Output 17344A-8 AC Testing: Inputs are driven at 2.4 V for a Logic "1" and 0.45 V for a Logic "0". Input pulse rise and fall times are 20 ns. 4-102 Am27X400 AMD KEY TO SWITCHING WAVEFORMS WAVEFORM INPUTS OUTPUTS Must be Steady Will be Steady May Change from H to L Will be Changing from H to L May Change from L to H Will be Changing from L to H Don't Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is HighImpedance "Off" State KS000010 SWITCHING WAVEFORMS 2.4 Addresses 0.45 2.0 0.8 2.0 0.8 Addresses Valid CE tCE OE Output High Z tOE tACC (Note 1) tOH Valid Output Notes: tDF (Note 2) High Z 17344A-9 1. OE may be delayed up to tACC-tOE after the falling edge of the addresses without impact on tACC. 2. tDF is specified from OE or CE, whichever occurs first. Am27X400 4-103