○Product structure：Silicon monolithic integrated circuit ○This product is not designed with protecti on agains t radioact i ve rays.
1/19
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･14･001
28.Jul.2014 Rev.003
500mA Variable / Fixed Output
LDO Regulat or s
BDxxIA5WEFJ
●
General Description
BDxxIA5WEFJ se ri es devices are LDO regulators with an output current of 0.5A. The output accuracy is ±1% of the output
voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage
device can be varied from 0.8 to 4.5V using external resistors. Various fixed output voltage devices that do not use external
resistors are also available. It can be used for a wide range of digital appliance applications. It has a small package type:
HTSOP-J8 (4.90mm x 6.00mm x 1.00mm). These devices have built in over current protection to protect the device when
output is shorted, 0µA shutdown mode and thermal shutdown circuit to protect the device during over load conditions.
These LDO regulators are usable with ceramic capacitors that enable a smaller layout and longer life.
●
Features
■ +/-1% output voltage accuracy
■ Built-in Over Current Protection circuit (OCP)
■ Built-in Thermal Shut Down circuit (TSD)
■ Zero µA Shutdown mode
●
Key Specifications
Input Power Supply Voltage range: 2.4V to 5.5V
Output voltage range(Variable ty pe): 0.8V to 4.5V
Output voltage(Fixed type):
1.0V/1.2V/1.5V/1.8V/2.5V/3.0V/3.3V
Output current: 0.5A (Max.)
Shutdown current: 0μA (Typ.)
Operating temperature range: -25℃ to +85℃
●
Ty pical Application Circuit
●
Package (Typ.) (Typ.) (Max.)
HTSOP-J8 4.90mm x 6.00mm x 1.00mm
HTSOP-J8
R
1
VO
VCC
EN
GND
FIN
R
2
FB
C
OUT
C
IN
C
IN
,C
OUT
: Ceramic Capacitor
VO
VCC
EN
GND
FIN
VO_S
C
OUT
C
IN
C
IN
,C
OUT
: Ceramic Capacitor
Output voltage variable type
Output voltage fixed type
2/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Ordering Information
B D x x I A 5 W E F J - E 2
Part
Number
Output
voltage
00 : Variable
10:1.0V
12:1.2V
15:1.5V
18:1.8V
25:2.5V
30:3.0V
33:3.3V
Input
voltage
range
I:7V
Output
current
A5:0.5A
Shutdown
mode
“W”:included
Package
EFJ :HTSOP-J8
Packaging and forming specification
E2:Emboss tape reel
3/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Block Diagram
BD00IA5WEFJ(Variable output voltage type)
●
Pin Configuration
●
Pin Description
Pin No.
Pin name
Pin Function
1 VO Output pin
2
FB
Feedback pin
3 GND GND pin
4
N.C.
No Connect (Connect to GND or leave OPEN)
5 EN Enable pin
6
N.C.
No Connect (Connect to GND or leave OPEN)
7 N.C. No Connect (Connect to GND or leave OPEN)
8
VCC
Input pin
Reverse FIN Substrate(Connect to GND)
TOP VIEW
V
O
FB
GND
N.C.
N.C.
N.C.
EN
V
CC
Fig.1 Block Diagram
GND
EN
TSD
OCP
SOFT
START
VO
V
CC
FB
4/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Block Diagram
BDxxIA5WEFJ(Fixed output voltage type)
●
Pin Configuration
●
Pin Description
Pin No.
Pin name
Pin Function
1
V
O
Output pin
2
VO_S
Output voltage monitor pin
3 GND GND pin
4
N.C.
No Connect (Connect to GND or leave OPEN)
5
EN
Enable pin
6
N.C.
No Connect (Connect to GND or leave OPEN)
7
N.C.
No Connect (Connect to GND or leave OPEN)
8
VCC
Input pin
Reverse FIN Substrate(Connect to GND)
TOP VIEW
VO
V
O_S
GND
N.C.
N.C.
N.C.
EN
V
CC
GND
EN
TSD
OCP
SOFT
START
VO
V
CC
V
O_S
Fig.2 Block Diagram
5/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Abso lu te Maxi mum R atin g s (Ta=25℃)
Parameter Symbol Ratings Unit
Power supply voltage VCC 7.0 *1 V
EN voltage VEN 7.0 V
Power dissipation HTSOP-J8 Pd *2 2110 *2 mW
Operating Temperature Range Topr -25 to +85 ℃
Storage Temperature Range Tstg -55 to +150 ℃
Junction Tempera t ure Tjmax +150 ℃
*1 Not to exceed Pd
*2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
● Recommended Operating Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
Min. Max.
Input power supply voltage VCC 2.4 5.5 V
EN voltage VEN 0.0 5.5 V
Output voltage setting range VO 0.8 4.5 V
Output current IO 0.0 0.5 A
● Electrical Characteristics (U nles s otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Circuit current at shutdown mode ISD - 0 5 µA VEN=0V, OFF mode
Bias current ICC - 250 500 µA
Line regulation Reg.I -1 - 1 % VCC =( VO+0.6V )→5.5V
Load regulation Reg IO -1.5 - 1.5 % IO=0→0.5A
Minimum dropout voltage1 VCO1 - 0.1 0.15 V VCC =3.3V, IO =125mA
Minimum dropout voltage2 VCO2 - 0.2 0.30 V VCC =3.3V, IO =250mA
Minimum dropout voltage3 VCO3 - 0.3 0.45 V VCC =3.3V, IO =375mA
Minimum dropout voltage4 VCO4 - 0.4 0.60 V VCC =3.3V, IO =500mA
Output reference voltage(Variable type) VFB 0.792 0.800 0.808 V IO=0A
Output voltage(Fixed type) VO Vo×0.99 Vo Vo×1.01 V IO=0A
EN Low voltage VEN _Low 0 - 0.8 V
EN High voltage VEN _High 2.4 - 5.5 V
EN Bias current IEN 1 3 9 µA
6/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
Fig.5
Input sequence 1
Co=1µF
●
Typical Performance Curves
(Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
Fig.3
Transient Response (0→0.5A)
Co=1µF
Fig.4
Transient Response (0.5→0A)
Co=1µF
Fig.6
OFF sequence 1
Co=1µF
V
O
V
O
I
O
I
O
V
EN
V
EN
V
CC
V
CC
V
O
VO
10/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
Fig.22
Minimum dropout Volta ge 2
(VCC=2.4V, Ta=25℃)
Fig.20
IO-ICC
Fig.21
PSRR(IO=0mA)
I
O
[A]
0.01
0.10
1.00
10.00
0 0.1 0.2 0.3 0.4 0.5
Io [A ]
ESR [Ω]
Safety area
Fig.19
ESR Condencer
12/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Power dissipation
◎HTSOP-J8
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85℃.
2. Chip junction temperature (Tj) can be no higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×W
＜Reference values＞
θj-a：HTSOP-J8 153.2℃/W
113.6℃/W
59.2℃/W
33.3
℃
/W
1-layer substrate (copper foil density 0mm×0mm)
2-layer substrate (copper foil density 15mm×15mm)
2-layer substrate (copper foil density 70mm×70mm)
4-layer substrate (copper foil density 70mm×70mm)
Substrate siz e: 70mm×70mm×1.6mm (substrate with thermal via)
Most of the heat loss that occurs in the BDxxIA5WEFJ series is generated from the output Pch FET. Power loss is
determined by the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as
the output current conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in
mind that heat dissipation may vary substantially depending on the substrate employed (due to the power package
incorpora ted in the BDxxIA5WEFJ series) make certai n to factor conditions such as substrate size into the thermal design.
Power consumption [W] = Input voltage (VCC) – Output voltage (VO) ×IO (Ave)
Example) Where VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A,
Power consumption [W] = 3.3V – 2.5V ×0.1A
=0.08[W]
Measurement conditio
n: mounted on a ROHM
board,
Substrate siz e: 70m m × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Gr ound
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil are :0mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil are :15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil are :70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil are :70mm×70mm）
θj-a=33.3℃/W
Power Dissipation :Pd [W]
0 25 50 75 100 125 150
0
2.0
3.0
4.0
①0.50W
周囲温度:Ta [℃]
1.0
①0.50W
②0.82W
③1.10W
④2.11W
⑤3.76W
Ambient Temperature :Ta [℃]
13/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Input-to-Output Capacitor
It is recommended that a c apac i to r (over 1uF) is placed near pins between the input pin and GND as well as the output pin
and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the
actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.
For additional details, please check wi th the manufacturer, and select the best cer amic capacitor for your applic ati on.
●
Equivalent Series Resistance ESR (Output Capacitor)
To prevent oscillations, please attach a capacitor between
VO and GND. Capacitors usually have ESR (Equivalent
Series Resistance). Operation will be stable in the ESR-IO
range shown to the right. Ceramic, tantalum and
electrolytic Capacitors have different ESR values, so
please ensure that you are using a capacitor that operates
in the stable operating region shown on the right. Finally,
please evaluate in the actual application.
ESR – I
O
characteristics
DC Bias Voltage [V]
Cer amic capacitor capacity – DC bias characteristics
(Character i sti cs example)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
0
1
2
3
4
Rated Voltage：10V
B1 characteristics
Rated Voltage：4V
X6S characteristics
Capacitance Change [%]
Rated Voltage:10V
F characteristics
Rated Voltage：6.3V
B characteristics
B characteristics
Rated Voltage：10V
0.01
0.10
1.00
10.00
0
0.1
0.2
0.3
0.4
0.5
Io [A]
ESR [Ω]
Safety area
C
O
=1uF
14/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Evaluation Board Circuit
●
Evaluation Board Parts List
Designation Value Part No. Company Designation Value Part No. Company
R1 16kΩ MCR01PZPZF1602 ROHM C4
‐
‐
‐
R2 7.5kΩ MCR01PZPZF7501 ROHM C5 1μF CM105B105K16A KYOCERA
R3
‐
‐
‐
C6
‐
‐
‐
R4
‐
‐
‐
C7
‐
‐
‐
R5
‐
‐
‐
C8
‐
‐
‐
R6
‐
‐
‐
C9
‐
‐
‐
C1 1μF CM105B105K16A KYOCERA C10
‐
‐
‐
C2
‐
‐
U1
‐
BD00IA5WEFJ ROHM
C3
‐
‐
U2
‐
‐
‐
●
Board Lay ou t
PCB layout considerations:
・Input capacitor CIN connected to VCC (Vin) should be pla ce d as cl ose to VCC(VIN) pin as possible.
Output capacitor COUT also should be placed as clos e to IC pin as poss ible. In case the part is connected to inner layer
GND plane, please use several through holes.
・FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as
possible. Please take care of this during layout.
・Please make GND pattern wide enough to handle thermal dissipation.
・For output voltage setting
Output voltage can be set by FB pin voltage (0.800V typ.) and external resistance R1, R2.
(The use of resistors with R1+R2=1k to 90k is recommended)
V
O
EN
GND
(
V
CC
V
IN
)
CIN
R
1
R
2
C
OUT
N.C
GND
FB
N.C
N.C.
V
O
2
Vo
C7
3
4
7
5
U1
8
C1
C2
C3
R1
R2
C6
C5
1
V
CC
6
EN
GND
SW1
EN
FIN
Vcc
VO = VFB× R1+R2
R2
15/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
I/O Equivalent Circuits (Output Voltage Vairable type)
8pin(VCC) / 1pin(VO) 2pin(FB) 5pin(EN)
●
I/O Equivalent Circuits
(Output Voltage Fixed type)
2pin(FB)
8pin(VCC)
1pn(V
O
)
5
pin
(
EN
)
520kΩ
480kΩ
8pin(V
CC
) / 1pin(V
O
)
2pin(V
O_S
)
5pin(EN)
8pin(V
CC
)
1pin(VO)
2pin(VO_S)
5pin(EN)
520kΩ
480kΩ
16/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., c an
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using el ect rol yti c c apaci tors in
a circu it, note that capacitance values are reduced at low temperatures and ov er time.
(4) GND voltage
The potential of the GND pin must be minimum potential under all operating condit ion s.
(5) Thermal design
Use a thermal design that a llows for a sufficient margin in l ight of the power dissipation (Pd) in actual operati ng conditions.
(6) Off-leakage at high temperature.
Off-leakage at high temperature may increase because of manufacturing variations.
Design should consider the typical & worst cases shown below.
(7) Inter-pin shorts and mountin g error s
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection err or or if pins ar e short ed toget h er.
(8) Actions in stron g electromagn etic fie ld
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdow n circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
TSD ON Temperature[℃] (typ.) Hy steresi s Temper atur e [℃] (typ.)
BdxxIA5WEFJ 175 15
Ta-Ileak
0
0.1
0.2
0.3
0.4
0.5
25 50 75 100 125 150
Temperature (℃)
Ileak (mA)
typ
worst
17/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
(11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
(12) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N juncti on operates as a paras iti c diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
(13) Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wi ring pattern of any external components, either.
Resistor
Transistor (NPN)
N
N
N
P+
P+
P
P substrate
GND
Parasitic elem ent
Pin A
N
N
P+
P
+
P
P substrate
GND
Parasitic elem ent
Pin B C B
E
N
GND
Pin A
Parasitic
element
Pin B
Other adjacent elements
E
B C
GND
Parasitic
element
18/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Physical Dimension Tape and Reel Information
●
Marking Diagram
xx
Product Name
00
BD00IA5WEFJ
10
BD10IA5WEFJ
12
BD12IA5WEFJ
15
BD15IA5WEFJ
18
BD18IA5WEFJ
25
BD25IA5WEFJ
30
BD30IA5WEFJ
33
BD33IA5WEFJ
HTSOP-J8(TOP VIEW)
xxIA5W
Part Number Marking
LOT Number
1PIN MARK
19/19
BDxxIA5WEFJ
Datasheet
TSZ02201-0R6R0A600440-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001
28.Jul.2014 Rev.003
●
Revision History
Date Revision Changes
9.Jul.2012
001
New Release
21.Dec.2012
002
The description was modified.
28.Jul.2014
003
Characteristic data change
Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specifi ed range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specificati on
Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damag es, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and sol dered connections may deteriorate if the Products are store d in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier ba g. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industr y waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under an y intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of m ass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
