INTEGRATED CIRCUITS DATA SHEET TDA7056A 3 W BTL mono audio output amplifier with DC volume control Product specificiation July 1994 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A FEATURES GENERAL DESCRIPTION * DC volume control The TDA7056A is a mono BTL output amplifier with DC volume control. It is designed for use in TV and monitors, but also suitable for battery-fed portable recorders and radios. * Few external components * Mute mode * Thermal protection * Short-circuit proof Missing Current Limiter (MCL) * No switch-on and off clicks A MCL protection circuits is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended). * Good overall stability * Low power consumption * Low HF radiation * ESD protected on all pins. QUICK REFERENCE DATA SYMBOL PARAMETER VP positive supply voltage range PO output power Gv voltage gain CONDITIONS MIN. RL = 16 ; VP = 12 V TYP. MAX. UNIT 4.5 - 18 V 3 3.5 - W 34.5 35.5 36.5 dB gain control range 75 80 - dB IP total quiescent current VP = 12 V; RL = - 8 16 mA THD total harmonic distortion VP = 0.5 W - 0.3 1 % ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA7056A 9 SIL plastic SOT110(1) Note 1. SOT110-1. July 1994 2 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A VP handbook, full pagewidth 2 n.c. n.c. positive input DC volume control 1 TDA7056A 9 I + i 6 I - i 8 positive output 3 5 STABILIZER Vref negative output TEMPERATURE PROTECTION 4 7 MGA072 - 1 power ground signal ground Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION n.c. 1 not connected VP 2 positive supply voltage VI 3 voltage input GND1 4 signal ground VC 5 DC volume control OUT+ 6 positive output GND2 7 power ground OUT- 8 n.c. 9 handbook, halfpage n.c. 1 VP 2 VI 3 GND1 4 VC 5 negative output OUT+ 6 not connected GND2 7 OUT- 8 n.c. 9 TDA7056A MGA071 Fig.2 Pin configuration. July 1994 3 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control FUNCTIONAL DESCRIPTION TDA7056A Thus, a reduced power supply and smaller capacitors can be used which results in cost savings. The TDA7056A is a mono BTL output amplifier with DC volume control, designed for use in TV and monitor but also suitable for battery-fed portable recorders and radios. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power. In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitor to keep the offset voltage low. The maximum gain of the amplifier is fixed at 35.5 dB. The DC volume control stage has a logarithmic control characteristic. In the TDA7056A the DC volume stage is integrated into the input stage so that coupling capacitors are not required and a low offset voltage is maintained. The total gain can be controlled from 35.5 dB to -44 dB. At the same time the minimum supply voltage remains low. If the DC volume control voltage is below 0.3 V, the device switches to the mute mode. The BTL principle offers the following advantages: The amplifier is short-circuit proof to ground, VP and across the load. A thermal protection circuit is also implemented. If the crystal temperature rises above +150 C the gain will be reduced, thereby reducing the output power. Special attention is given to switch-on and off clicks, low HF radiation and a good overall stability. * lower peak value of the supply current * the frequency of the ripple on the supply voltage is twice the signal frequency LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage range - 18 V IORM repetitive peak output current - 1.25 A IOSM non repetitive peak output current - 1.5 A Ptot total power dissipation - 9 W Tamb operating ambient temperature range Tcase < 60 C -40 +85 C Tstg storage temperature range -55 +150 C Tvj virtual junction temperature - +150 C Tsc short-circuit time - 1 hr V3 input voltage pin 3 - 8 V V5 input voltage pin 5 - 8 V THERMAL RESISTANCE SYMBOL PARAMETER THERMAL RESISTANCE Rth j-a from junction to ambient in free air 55 K/W Rth j-c from junction to case 10 K/W Note to the thermal resistance VP = 12 V; RL = 16 ; The maximum sine-wave dissipation is = 1.8 W. The Rth vj-a of the package is 55 K/W; Tamb (max) = 150 - 55 x 1.8 = 51 C July 1994 4 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A CHARACTERISTICS VP = 12 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.6) SYMBOL PARAMETER VP positive supply voltage range IP total quiescent current CONDITIONS MIN. TYP. MAX. UNIT 4.5 - 18 V VP = 12 V; RL = ; note 1 - 8 16 mA THD = 10%; RL = 16 3 3.5 - W THD = 10%; RL = 8 - 5.2 - W PO = 0.5 W - 0.3 1 % 34.5 35.5 36.5 dB Maximum gain (V5 = 1.4 V) PO output power THD total harmonic distortion Gv voltage gain VI input signal handling V5 = 0.8 V;THD < 1% 0.5 0.65 - V Vno(rms) noise output voltage (RMS value) f = 500 kHz; note 2 - 210 - V B bandwidth at -1 dB - 20 Hz to 300 kHz - SVRR supply voltage ripple rejection note 3 38 46 - dB |Voff| DC output offset voltage - 0 150 mV ZI input impedance pin 3 15 20 25 k - -44 - dB note 4 - 20 30 V V5 0.3 V; VI = 600 mV - - 30 V 75 80 - dB 60 70 80 A Minimum gain (V5 = 0.5 V) Gv voltage gain Vno(rms) noise output voltage (RMS value) Mute position VO output voltage in mute position DC volume control gain control range I5 control current V5 = 0 V Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and bandwidth = 5 kHz. 3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail. 4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted. July 1994 5 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A MGA075 MGA076 - 1 1000 handbook, halfpage handbook,40 halfpage gain V noise (V) 800 (dB) 20 0 600 - 20 400 - 40 200 - 60 0 - 80 0 0.4 0.8 1.2 1.6 0 2.0 V5 (V) MGA077 - 1 100 I5 (A) 60 20 - 20 - 60 - 100 0.8 1.2 1.6 2.0 V5 (V) Fig.5 Control current as a function of DC volume control. July 1994 1.2 2.0 1.6 Fig.4 Noise output voltage as a function of DC volume control. handbook, halfpage 0.4 0.8 V5 (V) Fig.3 Gain as a function of DC volume control. 0 0.4 6 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A APPLICATION INFORMATION (1) VP handbook, full pagewidth 100 nF 220 F 2 1 n.c. 9 n.c. 0.47 F positive input TDA7056A I + i 6 3 5 R L = 16 I - i 8 5 k RS STABILIZER Vref TEMPERATURE PROTECTION DC volume control 4 7 MGA073 - 1 ground (1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2. Fig.6 Test and application diagram. handbook, halfpage 5 100 k MGA074 volume control Fig.7 Application using a potentiometer for volume control; Gv = 30 dB. July 1994 7 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control TDA7056A PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q A2 P1 P A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 2.54 3.9 3.4 2.75 2.50 3.4 3.2 1.75 1.55 15.1 14.9 4.4 4.2 5.9 5.7 0.25 1 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-02-25 03-03-12 SOT110-1 July 1994 EUROPEAN PROJECTION 8 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with DC volume control SOLDERING TDA7056A with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet PRODUCT STATUS(2) DEFINITION Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS (including negligence), warranty, breach of contract or any other legal theory. Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 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No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. July 1994 TDA7056A 10 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands RM5/02/pp11 Date of release: July 1994