RFBPF Series - 3225(1210) MULTILAYER CERAMIC BAND PASS FILTER 2.4 GHz ISM Band Working Frequency RFBPF3225150A0x series Page 1 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001 FEATURES 1. Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology 2. Reflow solderable 3. Miniatured Size 3.2 x 2.5 x 1.5 mm3 4. Low Insertion Loss 5. High attenuation on 2nd harmonic suppressed 6. Suitable for 2.45 GHz Working Frequency Operation APPLICATIONS 1. 2.4GHz ISM Band RF Application 2. Bluetooth, Wireless LAN, HomeRF CONSTRUCTION Fig 1. Outline of 2.4GHz Band Pass Filter DESCRIPTION Our new ceramic Band Pass Filter specified for 2.4 GHz ISM Band application, as shown in fig-1. Both of Wireless LAN IEEE 802.11b, and BluetoothTM typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements, this Band Pass Filter has been designed to a high suppression on 2nd harmonic as well as low insertion loss characteristics through our advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. This Band Pass Filter has a rectangular ceramic body with a tiny dimension of 3.2 x 2.5 x 1.5 mm3 future meet the SMT automation and miniaturization requirements on modern portable devices. DIMENSIONS Figure D Page 2 of 7 AS_2.4GHz 3225BPF_A0_05 Symbol Dimension L 3.20 0.20 mm W 2.50 0.20 mm T 1.50 0.10 mm A 0.40 0.20 mm B 0.60 0.20 mm C 0.70 0.20 mm D 0.20 0.15 mm Sep.-2001 SOLDER LAND PATTERN Figure L W2 B W1 A1 A B1 Symbol Dimension (mm) L 3.40 0.10 A 1.50 0.10 B 1.20 0.10 L1 2.80 0.10 A1 0.30 0.10 B1 0.90 0.10 W1 0.60 0.10 W2 0.50 0.10 0.40 0.10 L1 I/O Solder Pad Ground Solder Pad Ground Via Line width to be design to match 50 characteristic impedance, depending on PCB material and thickness. ELECTRICAL CHARACTERISTICS n RFBPF3225150A0x Series Item Specification 2450 50 MHz Frequency range (MHz) Insertion Loss 2.5 dB (max) VSWR 1.7 Ripple 0.6 dB 40 dB @ 1500 MHz ~ 1550 MHz 45 dB @ 1800 MHz ~ 1900 MHz Attenuation (min.) 30 dB @ 2100 MHz 15 dB @ 2200 MHz 30 dB @ 4800 ~ 5000 MHz *Note1: Rated power 5W MAX Page 3 of 7 *Note2: Maximum Input power: 10W for 5 minutes AS_2.4GHz 3225BPF_A0_05 Sep.-2001 RELIABILITY TEST n Mechanical performance Test item Solderability Test condition / Test method Solder temp. : 235 5C Immersion time: 2 1 sec Specification At least 95% of a surface of each terminal electrode must be covered by fresh solder. Solder: SN63 Resistance to soldering heat Solder: Sn63 No mechanical damage. Preheating temperature: 150 10C Ceramic surface shall not be exposed in the middle of the termination or on the terminated product edge by leaching. Solder Temperature: 260 5C Immersion time: 10 1 sec Measurement to be made after keeping at room temp. for 242 hrs. Drop Test Height : 75 cm No mechanical damage. Direction : 3 directions Samples shall satisfy electrical specification after test. Times : 3 times for each direction. n Environmental characteristics Test item Humidity (steady conditions) Test condition / Test method Specification Humidity:90% to 95% R.H. No mechanical damage. Tempertaure:402C Samples shall satisfy electrical specification after test. Time: 50024 hours. Measurement: After placing for 24 hours Minimum. Temperature cycle 1. 303 minutes at -40C3C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical specification after test. 3. 303 minutes at +853C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement after placing for 482 hrs min. High temperature Temperature: 85C2C No mechanical damage. Test duration: 24 hours Samples shall satisfy electrical specification after test. Measurement must be taken after subjection to the above conditions, followed by exposure in room environment for 1 to 2 hours. Low temperature Temperature: -40C3C No mechanical damage. Test duration: 24 hours Samples shall satisfy electrical specification after test. Measurement must be taken after subjection to the above conditions, followed by exposure in room environment for 1 to 2 hours. Page 4 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001 SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF RF device BPF 322515 0 Product Code Dimension code Unit of dimension BPF : Band Per 2 digits of 0 : 0.1 mm Pass Filter Length, Width, 1 : 1.0 mm Thickness : e.g. : A 0 - T Application Specification Packing A : 2.4GHZ ISM Code from 0 ~ 9 T : 7" Reeled dependent on G : 10" Reeled Band B : GSM 900/1800 Dual Band different electrical specification B : Bulk X : SFC product C : GSM 900 322515 = Length 32, Width 25, Thickness 15 D : GSM 1800 E : GPS F : W-CDMA G : PHS Page 5 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001 PACKAGING P1 P2 D P0 E F W B0 T A0 Plastic Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Ao Bo D T W 2.85 0.10 3.36 0.10 1.55 0.10 1.9 0.10 8.0 0.30 E F Po P1 P2 1.75 0.10 3.50 0.05 4.00 0.10 8.00 0.10 2.00 0.10 Reel dimensions B C A D Index 7" Reel Dimension (mm) A B C D 178 60.0 13.5 10.01.0 Taping Quantity: 2000 pieces per 7" reel Page 6 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001 CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of outgoing inspection, which can be confirmed. (2) Storage environment condition. n n n n n n n Page 7 of 7 Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40C Humidity : 30 to 70% relative humidity Don't keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. AS_2.4GHz 3225BPF_A0_05 Sep.-2001