Page 1 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
RFBPF Series – 3225(1210)
MULTILAYER CERAMIC BAND PASS FILTER
2.4 GHz ISM Band Working Frequency
RFBPF3225150A0x series
Page 2 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
FEATURES
1. Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology
2. Reflow solderable
3. Miniatured Size 3.2 x 2.5 x 1.5 mm3
4. Low Insertion Loss
5. High attenuation on 2nd harmonic suppressed
6. Suitable for 2.45 GHz Working Frequency Operation
APPLICATIONS
1. 2.4GHz ISM Band RF Application
2. Bluetooth, Wireless LAN, HomeRF
CONSTRUCTION
Fig 1. Outline of 2.4GHz Band Pass Filter
DESCRIPTION
Our new ceramic Band Pass Filter specified for 2.4 GHz ISM Band application, as
shown in fig-1. Both of Wireless LAN IEEE 802.11b, and BluetoothTM typically located on this unlicensed frequency band
which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements, this Band
Pass Filter has been designed to a high suppression on 2nd harmonic as well as low insertion loss characteristics through
our advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM
Simulation Skill.
This Band Pass Filter has a rectangular ceramic body with a tiny dimension of 3.2 x 2.5 x 1.5 mm3 future meet the SMT
automation and miniaturization requirements on modern portable devices.
DIMENSIONS
Figure Symbol Dimension
L 3.20 ± 0.20 mm
W 2.50 ± 0.20 mm
T 1.50 ± 0.10 mm
A 0.40 ± 0.20 mm
B 0.60 ± 0.20 mm
C 0.70 ± 0.20 mm
D 0.20 ± 0.15 mm
D
Page 3 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
SOLDER LAND PATTERN Figure Symbol Dimension (mm)
L 3.40 ± 0.10
A 1.50 ± 0.10
B 1.20 ± 0.10
L1 2.80 ± 0.10
A1 0.30 ± 0.10
B1 0.90 ± 0.10
W1 0.60 ± 0.10
W2 0.50 ± 0.10
Line width to be design to match 50
Ω
characteristic impedance,
depending on PCB material and thickness. Φ 0.40 ± 0.10
ELECTRICAL CHARACTERISTICS
n RFBPF3225150A0x Series
Item Specification
Frequency range (MHz) 2450 ± 50 MHz
Insertion Loss 2.5 dB (max)
VSWR 1.7
Ripple 0.6 dB
Attenuation (min.)
40 dB @ 1500 MHz ~ 1550 MHz
45 dB @ 1800 MHz ~ 1900 MHz
30 dB @ 2100 MHz
15 dB @ 2200 MHz
30 dB @ 4800 ~ 5000 MHz
*Note1: Rated power 5W MAX *Note2: Maximum Input power: 10W for 5 minutes
I/O Solder Pad Ground Solder Pad Ground Via
L
W2
W1
B1
A1
L1
B
A
I/O Solder Pad Ground Solder Pad Ground ViaI/O Solder PadI/O Solder Pad Ground Solder PadGround Solder Pad Ground ViaGround Via
L
W2
W1
B1
A1
L1
B
A
Page 4 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
RELIABILITY TEST
n Mechanical performance
Test item Test condition / Test method Specification
Solderability Solder temp. : 235 ± 5°C
Immersion time: 2 ± 1 sec
Solder: SN63
At least 95% of a surface of
each terminal electrode must
be covered by fresh solder.
Resistance to soldering heat Solder: Sn63
Preheating temperature: 150 ± 10°C
Solder Temperature: 260 ± 5°C
Immersion time: 10 ± 1 sec
Measurement to be made after keeping at room
temp. for 24±2 hrs.
No mechanical damage.
Ceramic surface shall not be
exposed in the middle of the
termination or on the
terminated product edge by
leaching.
Drop Test Height : 75 cm
Direction : 3 directions
Times : 3 times for each direction.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
n Environmental characteristics
Test item Test condition / Test method Specification
Humidity (steady conditions) Humidity:90% to 95% R.H.
Tempertaure:40±2°C
Time: 500±24 hours.
Measurement: After placing for 24 hours Minimum.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Temperature cycle 1. 30±3 minutes at -40°C±3°C,
2. 10~15 minutes at room temperature,
3. 30±3 minutes at +85°±3°C,
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement after placing for 48±2 hrs min.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
High temperature Temperature: 85°C±2°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Low temperature Temperature: -40°C±3°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Page 5 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
BPF
322515
0
A
0 -
T
RF device
Product
Code
BPF : Band
Pass Filter
Dimension
code
Per 2 digits of
Length, Width,
Thickness :
e.g. :
322515 = Length
32, Width 25,
Thickness 15
Unit of
dimension
0 : 0.1 mm
1 : 1.0 mm
Application
A : 2.4GHZ ISM
Band
B : GSM 900/1800
Dual Band
C : GSM 900
D : GSM 1800
E : GPS
F : W-CDMA
G : PHS
Specification
Code from 0 ~ 9
dependent on
different electrical
specification
Packing
T : 7” Reeled
G : 10” Reeled
B : Bulk
X : SFC product
Page 6 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
PACKAGING
Plastic Tape specifications (unit :mm)
Index Ao Bo ΦD T W
Dimension (mm) 2.85 ± 0.10 3.36 ± 0.10 1.55 ± 0.10 1.9 ± 0.10 8.0 ± 0.30
Index E F Po P1 P2
Dimension (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10
Reel dimensions
AB
C
D
Taping Quantity: 2000 pieces per 7” reel
Index A B C D
7” Reel Dimension (mm) Φ178 Φ60.0 Φ13.5 10.0±1.0
B0
P0
P2
P1
A0
T
W
F
E
ΦD
B0
P0
P2
P1
A0
T
W
F
E
ΦD
Page 7 of 7 AS_2.4GHz 3225BPF_A0_05 Sep.-2001
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of outgoing inspection, which can be
confirmed.
(2) Storage environment condition.
n Products should be storage in the warehouse on the following conditions.
n Temperature : -10 to +40°C
n Humidity : 30 to 70% relative humidity
n Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
n Products should be storage on the palette for the prevention of the influence from humidity, dust and son
on.
n Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
n Products should be storage under the airtight packaged condition.
