SST34HF1682D-70-4E-L1PE - Silicon Storage Technology, Inc.

S71256-00-000 3/04

The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. Intel is a registered trademark of Intel Corporation.

CSF and ComboMemory are trademarks of Silicon Storage Technology, Inc.

These specifications are subject to change without notice.

Advance Information

FEATURES:

• Flash Organization: 1M x16 or 2M x8

• Dual-Bank Architecture for Concurrent

Read/W rite Ope rat ion

– 16 Mbit: 4 Mbit + 12 Mbit

• (P)SRAM Organization:

– 2 Mbit: 128K x16 or 256K x8

– 4 Mbit: 256K x16 or 512K x8

– 8 Mbit: 512K x16 or 1024K x8

• Single 2.7-3.3V Read and Write Operations

• Superior Reliability

– Endurance: 100,000 Cycles (typical)

– Greater than 100 years Data Retention

• Low Power Consumption:

– Active Current: 25 mA (typical)

– Standby Current: 20 µA (typical)

• Hardware Sector Protection (WP#)

– Protects 4 outer most sectors (4 KWord) in the

larger bank by holding WP# low and unprotects

by holding WP# high

• Hardware Reset Pin (RST#)

– Resets the internal state machine to reading

data array

• Byte Selection for Flash (CIOF pin)

– Selects 8-bit or 16-bit mode

• Sector-Erase Capability

– Uniform 2 KWord sectors

• Block-Erase Capability

– Uniform 32 KWord blocks

• Read Access Time

– Flash: 70 ns

– (P)SRAM: 70 ns

• Erase-Suspend / Erase-Resume Capabilities

• Security ID Feature

– SST: 128 bits

– User: 128 bits

• Latched Address and Data

• Fast Erase and Word-/Byte-Program (typical):

– Sector-Erase Time: 18 ms

– Block-Erase Time: 18 ms

– Chip-Erase Time: 35 ms

– Word-Program Time: 7 µs

• Automatic Write Timing

– Internal VPP Generation

• End-of-Write Detection

– Toggle Bit

– Data# Polling

– Ready/Busy# pin

• CMOS I/O Compatibility

• JEDEC Standard Command Set

• Packages Available

– 56-ball LFBGA (8mm x 10mm)

– 62-ball LFBGA (8mm x 10mm)

PRODUCT DESCRIPTION

The SST34HF16x2C/D/S ComboMemory devices inte-

grate either a 1M x16 or 2M x8 CMOS flash memory bank

with eit her a 12 8K x 16/ 256K x8, 25 6K x 16/ 512 x8, or 512 K

x16/1024K x8 CMOS SRAM or pseud o SRAM (PSRAM)

memory bank in a multi-chip package (MCP). These

devices are fabricated using SST’s proprietary, high-perfor-

mance CMOS SuperFlash technology incorporating the

split-gate cell design and thick-oxide tunneling injector to

attain better reliability and manufacturability compared with

alternate approaches. The SST34HF16x2C/D/S devices

are ideal for applications such as cellular phones, GPS

devices, PDAs, and other portable electronic devices in a

low power and small form f actor system.

The SST34HF16x2C/D/S feature dual flash memory bank

arch itecture a llowi ng f or concurr ent oper ations between the

two flash memory banks and the (P)SRAM. The devices

can read data from either bank while an Erase or Program

operation is in progr ess in the opposite bank. The two flash

memory banks are partitioned into 4 Mbit and 12 Mbit with

top sector protection options f or storing boot code , program

code, configuration/parameter data and user data.

The S upe r Flas h te ch no logy pr ovides fi xed Erase an d P r o-

gram times, in depen dent o f the num ber of Erase/ Pro gram

cycles that have occurred. Therefore, the system software

or hardware does not ha v e to be modified or de-rated as is

nec essary with al tern ativ e flas h techno logies , whose E rase

and Pr ogram tim es inc rease with accumul ated Erase/Pr o-

gram cycles. The SST34HF16x2C/D/S devices offer a

guaranteed endurance of 10,000 cycles. Data retention is

rated at greater than 100 years. With high performance

Word-Program, the flash memory banks provide a typical

Word-Program time of 7 µsec. The entire flash memory

bank can be erased and progr ammed w ord-b y-word in typ-

icall y 4 secon ds for the SS T34HF16x2C /D/S, w hen usin g

interface features such as Toggle Bit, Data# P olling, or RY/

BY# to indicate the completion of Program operation. To

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

SST34HF16x2x16Mb CSF + 2/4/8 Mb SRAM (x16) MCP ComboMemory

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

protect against inadvertent flash write, the

SST34HF16x2C/D/S devices contain on-chip hardware

and softw are data protection schemes.

The flas h and (P)SRAM operate as two independent mem-

or y banks wi th respec tive bank enable signa ls. The mem-

ory bank selection is done b y two bank enab le signals. The

(P)SRAM bank enable signals, BES1# and BES2, select

the (P)SRAM bank (BES1# and BES2 are NC for

SST34HF1602C). The flash memory bank enable signal,

BEF#, has to be used with Softw are Data Protection (SDP)

command sequence when cont rolling the Erase and Pro-

gram operations in the flash memory bank. The memory

banks are superimposed in the same memory address

space where they share common address lines, data lines,

WE# and OE# which minimize power consumption and

area.

Designed, manufactured, and tested for applications requir-

ing low power and small for m factor, the SST34HF16x2C/

D/S are offered in both commercial and e xtended temper a-

tures and a small footprint package to meet board space

constraint requirements. See Figures 3 and 4 for pin

assignments.

Device Operatio n

The SST34HF16x2C/D/S uses BES1#, BES2 and BEF#

to control operation of either the flash or the (P)SRAM

memory bank. When BEF# is low, the flash bank is acti-

v ated f o r Read , Prog ram or Era se oper atio n. When BES1#

is low , and BES2 is high the (P)SRAM is activ ated f or Read

and Write operation. BEF# and BES1# cannot be at low

le v el, an d BES2 can not be at high le v el at th e same tim e. If

all bank enable signals are asserted, bus contention

will result and the device may suffer permane nt dam-

age. All address , data, and control lines ar e shared by flash

and (P)SRAM memory banks which minimizes power con-

sumption and loading. The device goes into standby when

BEF# and BES1# bank enables are raised to VIHC (Log ic

High) or when BEF# is high and BES2 is low .

Concurrent Read/Write Operation

Dual bank architecture of SST34HF16x2C/D/S devices

allows the Concurrent Read/Write operation whereby the

user can r ead from one ban k while programm ing or eras-

ing in the other bank. This operation can be used when the

user n eeds to read syste m cod e in one ba nk whil e upda t-

ing data in the other bank. See Figures 1 and 2 for dual-

bank memory organization.

Note: For the purposes of this tabl e, write means to Block-, Sector,

or Chip-Erase, or Word-/Byte-Program as applicable to the

appropriate bank.

Flash Read Operation

The Read operation of the SST34HF16x2C/D/S is con-

trolle d by BEF# and OE#, bo th have to be low for the sys-

tem to obtain data from the outputs. BEF# is used for

device selection. When BEF# is high, the chip is dese-

lected and only standby power is consumed. OE# is the

output control and is used to gate data from the output pins.

The data b us is in high impedance state when either BEF#

or OE# is high. Refer to the Read cycle timing diagram for

further details (Figure 8).

CONCURRENT READ/WRITE STATES

Flash

(P)SRAMBank 1 Bank 2

Read Write No Operation

Write Read No Operation

Write No Op eration Read

No Operation Write Read

Write No Op eration Write

No Operation Write Write

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Flash Word-/Byte-Program Operation

These devices are programmed on a word-by-word or

byte-by-by te basis depending on the state of the CIOF pin.

Before programming, one must ensure that the sector

which is being prog rammed is fully erased.

The Progr am operation is accomplished in three steps:

1. Software Data Protection is initiated using the

three-byte load sequence.

2. Word address and word data are loaded.

During the Word-Program operation, the

addresses are latched on the falling edge of either

BEF# or WE#, whichever occurs last. The data is

latch ed on t he r i si ng edg e of either BE F# or W E# ,

whichever occurs first.

3. The internal Program operation is initiated after

the r isin g ed ge o f th e fourth WE# or BE F#, wh ic h-

ever occurs first. The Program operation, once ini-

tiated, will be completed typically within 7 µs.

See Fi gures 9 and 10 for WE# and B E F # control led Pro-

gram operation timing diagrams and Figure 22 for flow-

charts. Dur ing th e Pro gram operatio n, the on ly valid rea ds

are Data# Polling and Toggle Bit. During the internal Pro-

gr am ope rat ion , the host is fr ee to p erform a ddit ion al t asks .

Any comman ds issued dur ing an inter nal Pro gram ope ra-

tion are ignored.

Flash Sector- (Block-) Erase Operation

These devices offer both Sector-Erase and Block-Erase

operations . These oper ations allow the system to erase the

devices on a sector-by-sector (or block-by-block) basis.

The sector architectur e is based on a unif orm sector size of

2 KWord. The Block-Erase mode is based on a uniform

block size of 32 KWord. The Sector -Erase operation is initi-

ated by executing a six-byte command sequence with a

Sector -Erase com mand (30 H) and s ector addr ess (S A) in

the last b us cycle. The Bloc k-Erase operation is initiated b y

executing a six-byte command sequence with Block-Erase

command (50H) and block address (BA) in the last bus

cycl e. The sec tor or block addr ess is latch ed on th e falling

edge of the sixth WE# pul se, whi le the co mmand (30 H or

50H) is latche d on t he r isin g edge of the sixth WE# p uls e.

The internal Erase operation begins after the sixth WE#

pulse. Any com mands is sued dur ing the Block- or Sec tor-

Erase operation are ignored except Erase-Suspend and

Erase-Resume. See Figures 14 and 15 for timing wave-

forms.

Flash Chip-Erase Operation

The SST3 4HF16x 2C/D/S provide a Chip-E rase operation ,

which allows the us er to erase all sec tors/blocks to the “1”

state. This is useful when the device must be quickly

erased.

The Chip-Erase operation is initiated by executing a six-

byte command sequence with Chip-Erase command (10H)

at address 5555H in the last byte sequence. The Erase

operation begins with the rising edge of the sixth WE# or

BEF#, whichever occur s first. During th e Erase ope ration,

the only valid read is Toggle Bits or Data# Polling. See

Table 7 for the command sequence, Figure 13 for timing

diagram, and Figure 26 for the flowchar t. Any commands

issued d uring t he Ch ip -Erase op e r at ion are ign o red . Wh en

WP# is low, any attempt to Chip-Erase will be ignored.

Flash Erase-Suspend/-Resume Operations

The Erase-Suspend operation temporarily suspends a

Sector- or Block-Erase operation thus allowing data to be

read from any memor y loca tion, or program dat a into any

sector /block that i s not sus pended for an Eras e operation .

The operation is e xecuted by issuing a one-byte command

sequence with Erase-Suspend command (B0H). The

device automatically enters read mode within 20 µs after

the Erase-Suspend command had been issued. Valid data

can be read from any sector or block that is not suspended

from an Erase operation. Reading at address location

within er ase-suspended sectors/blocks will output DQ2 tog-

gling and DQ6 at “1”. While in Erase-Suspend mode, a

Word-/Byte-Program operation is allowed except for the

sector or block selected for Erase-Suspend. To resume

Sector-Erase or Block-Erase operation which has been

suspended, the system must issue an Erase-Resume

command. The oper ation is ex ecuted b y issuing a one-byte

comm and se quence wi th Eras e Resum e comm and (3 0H)

at any address in the one-b yte sequence.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Flash Write Operation Status Detection

The SST34HF16x2C/D/S provide one hardware and two

software m eans to d etect th e completion of a Write (Pro-

gram or Erase) cycle, in order to optimize the system

Write cycle time. The hardware detection uses the

Ready/Busy# (RY/BY#) pin. The software detection

includes two status bits: Data# Polling (DQ7) and Toggle

Bit (DQ6). The End-of-Write detection mode is enabled

after the rising edge of WE#, which initiates the internal

Prog ram or Erase ope ra tion.

The actual completion of the nonvolatile write is asynchro-

nous with the system; theref ore, either a Ready /B usy# (R Y/

BY#), Data# P olling (DQ7) or Toggle Bit (DQ6) read ma y be

simultan eous with the comp letion o f the Wri te cy cle. If this

occurs, the system may possibly get an erroneous result,

i.e., valid data may appear to conflict with either DQ7 or

DQ6. In order to prevent spurious rejection, if an erroneous

result occurs, the software routine should include a loop to

read the accessed location an additional two (2) times. If

both reads are valid, then the device has completed the

Write cy cle, ot herwi se the reje ction i s va lid.

Ready/ Busy# (RY/BY#)

The SST34HF16x2C/D/S include a Ready/Busy# (RY/

BY#) output signal. R Y/BY# is an open drain output pin that

indicates whether an Erase or Program operation is in

progress. S ince RY/BY# is an open drain output, it allows

several devices to be tied in parallel to VDD via an exter nal

pull-up resistor. After the rising edge of the final WE# pulse

in the command sequence, the RY/BY# status is valid.

When RY/BY# is actively pulled low, it indicates that an

Erase or P rogram opera tion i s in pr ogress. Wh en RY/BY#

is high (Ready), the devices may be read or left in standby

mode.

Byt e/W ord (CI OF)

The device includes a CIOF pin to control whether the

de vi ce da ta I /O pi ns oper at e x8 o r x16. If the CIOF pin is at

logic “1” (VIH) the device is in x16 data configuration: all

data I/0 pi ns DQ0-DQ15 are active and con t rol le d by BEF#

and OE#.

If the CIOF pin is at logi c “0”, the device is in x8 data config-

uration: only data I/O pins DQ0-DQ7 are active and con-

trolled by BEF# and OE#. The remaining data pins DQ8-

DQ14 are at Hi-Z, while pin DQ15 is used as the address

input A-1 for the Least Significant Bit of the address bus.

Flash Data# Polling (DQ7)

When the de vices are in an internal Program operation, any

attempt to read DQ7 will produce the complement of the

true da ta. Once the Program operation i s completed, DQ7

will produce true data. During internal Erase operation, an y

attempt to read DQ7 will produce a ‘0’. Once the internal

Erase operation is completed, DQ 7 wi ll produce a ‘1’. The

Data# Polling is valid after the rising edge of f ourth WE# (or

BEF#) p u lse for Program ope ration . For Sector -, B lock-, or

Chip-Erase, the Data# Polling is valid after the rising edge

of sixth WE# (or BEF#) pulse . See Figure 11 for Data# P oll-

ing (DQ7) timing diagram and Figure 23 f or a flowchart.

Toggle Bits (DQ6 and DQ2)

During the internal Program or Erase operation, any con-

secutive attempts to read DQ6 wil l pr od uc e a lt ernat in g “1 ” s

and “0”s, i.e., togg li ng between 1 and 0. Wh en t he inte rnal

Program or Erase op eration is compl eted, the DQ6 bit will

stop toggling. The device is then ready for the next opera-

tion. The toggle bit is v alid after the rising edge of the f ourth

WE# (or BEF#) pulse for Program operations. For Sector-,

Block-, or Chip-Erase, the toggle bit (DQ6) is valid after the

rising edge of sixth WE# (or BEF#) pulse. DQ6 w ill be set to

“1” if a Read operation is attempted on an Erase-sus-

pended Se ctor/Blo ck. If Program ope ration is initiate d in a

sector/b loc k not selected in Erase-Suspend mode, DQ6 will

toggle.

An addi tio na l To ggl e B i t is available on DQ 2, which can be

used in conjunction with DQ6 to ch eck w het he r a pa rticular

sector is being actively erased or erase-suspended. Tab le 1

shows detailed status bit inf ormation. The Toggle Bit (DQ2)

is valid after the rising edge of the last WE# (or BEF#)

pulse of a Write operation. See Figure 12 for Toggle Bit tim-

ing diag ram an d Figu re 23 f or a fl owc hart.

Note: DQ7, DQ6, and DQ2 require a valid address when reading

status inf ormation.

TABLE 1: WRITE OPERATION STATUS

Status DQ7DQ6DQ2RY/BY#

Normal

Operation Standard

Program DQ7# Toggle No Toggle 0

Standard

Erase 0 Toggle Toggle 0

Erase-

Suspend

Mode

Read From

Erase

Suspended

Sector/Block

1 1 Toggle 1

Read From

Non-Erase

Suspended

Sector/Block

Data Data Data 1

Program DQ7# Toggle N/A 0

T1.0 1256

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Data Protection

The SST3 4HF1 6x 2C/D/S provide both har d ware an d so ft-

ware features to protect nonvolatile data from inadvertent

writes.

Hardware Data Protection

Noise/Glitch Protection: A WE# or BEF# pulse of less than

5 ns will not initiate a Write cycle.

VDD Power Up/Down Detection: The Write operation is

inhibited when VDD is less than 1.5V.

Write Inhibit M ode: Forcing OE# low, BEF# high, or WE#

high will in hi bit t he Write operation . T hi s prevents inadvert-

ent w rites durin g pow er-u p or po wer- dow n.

Hardware Block Protection

The SST34HF16x2C/D/S pr ovide a hardware b lock pr otec-

tion which protects the outermost 8 KWord in Bank 1. The

block is protected when WP# is held low. See Figures 1

and 2 f o r Bloc k-Pr otec tion lo cation.

A user can disable block protection by driving WP# high

thus allowing erase or program of data into the protected

sectors. WP# must be held high prior to issuing the write

command and remain stable until after the entire Write

operation has completed.

Hardware Reset (RST# )

The RST# pin provides a hardware method of resetting the

device to read array data. When the RST# pin is held low

for at least TRP, any in-progress operation will terminate and

return to Read mode (see Figure 19). When no internal

Program/Erase operation is in progress, a minimum period

of TRHR is required after RST# is driven high before a valid

Read can take place (see Figu re 18).

The Erase oper ation that has been interrupted needs to be

reinitiated after the dev ice resumes normal operation mode

to ensure data integrity. See Figures 1 8 and 19 for timing

diagrams.

Software Data Protection (SDP)

The SST34HF16x2C/D/S provide the JEDEC standard

Software Data Protection scheme for all data alteration

operations, i.e., Program and Erase. Any Program opera-

tion req ui res th e in cl us i on o f the th re e-byte se qu enc e. Th e

three-byte load sequence is used to initiate the Program

operation, providing optimal protection from inadvertent

Write operations, e.g., during the system power-up or

po w e r-d own. Any Er as e ope r at i on req ui re s th e in cl usi o n of

six-byte sequence. The SST34HF16x2C/D/S are shipped

with the Software Data Protection permanently enabled.

See Table 7 f or the spec ific softw are command codes. Dur-

ing SDP command sequence, inv alid commands will abort

the device to Read mode within TRC. The contents of DQ15-

DQ8 are “Don’t Care” during any SDP command

sequence.

Security ID

The SST34HF16x2C/D/S devices offer a 256-bit Security

ID spac e. The Secur e ID spa ce is divid ed into two 128-bi t

segments—one factory programmed segment and one

user programmed segment. The first segment is pro-

grammed and locked at SST with a unique, 128-bit num-

ber. The user segment is left un-programmed for the

customer to program as desired. To program the user seg-

ment of the S ecur ity ID, the user must use the Sec ur ity ID

Word-Program command. End-of-Write status is checked

by reading the toggle bits. Data# Polling is not used for

Security ID End-of-Write detection. Once programming is

complete , the Sec ID should be locked using the User-Sec-

ID-Program-Lock-Out. This disables any future corruption

of this space. Note that regardless of whether or not the

Sec ID is locked, neither Sec ID segment can be erased.

The Secure ID space can be queried by ex ecuting a three-

byte command sequence with Query-Sec-ID command

(88H) at ad dress 5555H in th e last byte sequenc e. To exit

this mode, the Exit-Sec-ID command should be executed.

Refer to Tab le 7 for more details.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Product Identifica tion

The Product Identification mode identifies the de vice as the

SST34HF16x2C/D/S and manufacturer as SST. This

mode may be accessed by software operations only. The

hardware de vice ID Read operation, which is typically used

by programmers cannot be used on this de vice because of

the shar ed lines be tween flash and (P)SRA M in the mult i-

chip package. There fore, appl icatio n of high volt age to pi n

A9 may damage this device. Users may use the software

Product Identification operation to identify the part (i.e.,

using t he device I D) whe n usi ng mult ip le ma nufact urers in

the same socket. For details, see Tables 4 and 7 for soft-

ware operation, Figure 16 for the Software ID Entry and

Read timing diagram and Figure 24 for the ID Entry com-

mand sequence flowchart.

Note: BK = Bank Address (A19-A18)

Product Identification Mode Exit

In order to return to the standard Read mode, the Software

Produc t Ident ificati on mode must be exited. Exit is acco m-

plished by issuing the Software ID Exit command

sequence, which returns the device to the Read mode.

This command ma y also be used to reset the device to the

Read mode after any inadvertent transient condition that

apparently causes the device to behave abnormally, e.g.,

not read correctly. Please note that the Software ID Exit

command is ignored during an internal Program or Erase

operatio n. See Ta ble 7 for software co mmand code s, Fig-

ure 17 f or timing wav ef orm and Figure 24 f or a flowchart.

(P)SRAM Operation

With BES1# low, BES2 and BEF# high, the

SST34HF16x2C/D/S operate as either 128K x16, 256K

x16, or 5 12 K x1 6 CMOS (P)S RA M, wi th f ul ly s ta tic ope ra-

tion requiring no external clocks or timing strobes. The

SST34HF16x2C/D/S (P)SRAM is mapped into the first 512

KWord address space. When BES1#, BEF # are high an d

BES2 is low, all memory banks are deselected and the

device enters standby. Read and Write cycle times are

equal. The control si gnals UBS# and LBS# provide access

to the upper data byte and lower data byte (UBS# and

LBS# si gna ls ar e NC for SST341 6x 2S pa rts) . See Table 4

f or x16 (P)S RAM Read and Write data byte contr ol modes

of operation. See Table 5 for x8 SRAM Read and Write

data byte control modes of operation.

(P)SRAM Read

The (P)SRAM Read operatio n of the SST34HF16x2C/D/S

is cont r olled by OE # an d B ES1# , bo th h ave to be low with

WE# and BES2 high f or the system to obtain data from the

outputs. BES1# and BES2 are used for (P)SRAM bank

selection. OE# is the output control and is used to gate

data from the output pins. The data bus is in high imped-

ance state when OE# is high. Refer to the Read cycle tim-

ing diag ram, Figur e 5, f or further det ails .

(P)SRAM Write

The (P)SRAM Write operation of the SST34HF16x2C/D/S

is controlled by WE# and BES1#, both have to be low,

BES2 must be high for the system to write to the (P)SRAM.

Duri ng the Word-Writ e operation, the ad dresses and data

are referenced to the rising edge of either BES1#, WE#, or

the falling edge of BES2 whichever occurs first. The write

time is measured from the last falling edge of BES#1 or

WE# or the r ising ed ge of BES2 to th e first ris ing edge of

BES1#, or WE# or the falling e dge of BES2. R efer to the

Write cycle timing diagrams, Figures 6 and 7, for further

details.

TABLE 2: PRODUCT IDENTIFICATION

ADDRESS DATA

Manufacturer’s ID BK000 0H 00BFH

Device ID

SST34HF16x2C/D/S BK0001H 734AH

T2.0 1256

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

1256 B1.0

SuperFlash Memory

(Bank 1)

I/O Buffers

SuperFlash Memory

(Bank 2)

2 / 4 / 8 Mbit

SRAM or PSRAM

AMS1- A0

SA5

DQ15/A-1 - DQ0

Notes: 1. AMS = Most significant address

2. For LS package only: WE# = WEF# and/or WES#

OE# = OEF# and/or OES#

3. For SST34FH16x2S, LBS# and UBS# are No Connect.

4. For SST34HF1602C, BES1#, BES2, SA, LBS#, and UBS# are No Connect

5. Additional Address for x8 SRAM

Control

Logic

RST#

BEF#

WP#

LBS#3

UBS#3

WE#2

OE#2

BES1#4

BES24

RY/BY#

Address

Buffers

Address

Buffers

FUNCTIONAL BLOCK DIAGRAM

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 1: SST34HF16X2C/D, CONCURRENT SUPERFLASH DUAL-BANK MEMORY ORGANIZATION

Top Block Protection; 32 KWord Blocks; 2 KWord Sectors

FFFFFH

FE000H

FDFFFH

F8000H

Block 31

F7FFFH

F0000H Block 30

EFFFFH

E8000H Block 29

E7FFFH

E0000H Block 28

DFFFFH

D8000H Block 27

D7FFFH

D0000H Block 26

CFFFFH

C8000H Block 25

C7FFFH

C0000H Block 24

BFFFFH

B8000H Block 23

B7FFFH

B0000H Block 22

AFFFFH

A8000H Block 21

A7FFFH

A0000H Block 20

9FFFFH

98000H Block 19

97FFFH

90000H Block 18

8FFFFH

88000H Block 17

87FFFH

80000H Block 16

7FFFFH

78000H Block 15

77FFFH

70000H Block 14

6FFFFH

68000H Block 13

67FFFH

60000H Block 12

5FFFFH

58000H Block 11

57FFFH

50000H Block 10

4FFFFH

48000H Block 9

47FFFH

40000H Block 8

Bank 2

3FFFFH

38000H Block 7

37FFFH

30000H Block 6

2FFFFH

28000H Block 5

27FFFH

20000H Block 4

1FFFFH

18000H Block 3

17FFFH

10000H Block 2

0FFFFH

08000H Block 1

07FFFH

00000H Block 0

Bank 1

8 KWord Block Protection

(4 - 2 KWord Sectors)

1256 F01.0

Note: The address input range in x16 mode (BYTE#=VIH) is A19-A0

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 2: SST34HF16X2S, 2M X8 CONCURRENT SUPERFLASH DUAL-BANK MEMORY ORGANIZATION

Top Block Protection; 64 KByte Blocks; 4 KByte Sectors

Block 31

Block 30

Block 29

Block 28

Block 27

Block 26

Block 25

Block 24

Block 23

Block 22

Block 21

Block 20

Block 19

Block 18

Block 17

Block 16

Block 15

Block 14

Block 13

Block 12

Block 11

Block 10

Block 9

Block 8

Bank 2

Block 7

Block 6

Block 5

Block 4

Block 3

Block 2

Block 1

Block 0

Bank 1

16 KByte Block Protection

(4 - 4 KByte Sectors)

1256 F01b.0

1FBFFFH

1F0000H

1FFFFFH

1FC000H

1EFFFFH

1E0000H

1DFFFFH

1D0000H

1CFFFFH

1C0000H

1BFFFFH

1B0000H

1AFFFFH

1A0000H

19FFFFH

190000H

18FFFFH

180000H

17FFFFH

170000H

16FFFFH

160000H

15FFFFH

150000H

14FFFFH

140000H

13FFFFH

130000H

12FFFFH

120000H

11FFFFH

110000H

10FFFFH

100000H

0FFFFFH

0F0000H

0EFFFFH

0E0000H

0DFFFFH

0D0000H

0CFFFFH

0C0000H

0BFFFFH

0B0000H

0AFFFFH

0A0000H

09FFFFH

090000H

08FFFFH

080000H

07FFFFH

070000H

06FFFFH

060000H

05FFFFH

050000H

04FFFFH

040000H

03FFFFH

030000H

02FFFFH

020000H

01FFFFH

010000H

00FFFFH

000000H

Note: The address input range in x8 mode (BYTE#=VIL) is A19-A-1

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 3: PIN ASSIGNMENTS FOR 56- BALL LFBGA (8MM X 10MM)

FIGURE 4: PIN ASSIGNMENTS FOR 62- BALL LFBGA (8MM X 10MM)

1256 56-lfbga P1a.0

A11

WE#

WP#

LBS#

A15

A12

A19

BES2

RST#

UBS#

A13

RY/BY#

A18

A14

A10

A17

A16

DQ6

DQ1

VSS

CIOF

NOTE*

DQ13

DQ4

DQ3

DQ9

OE#

BEF#

VSS

DQ7

DQ12

VDDS

VDDF

DQ10

DQ0

BES1#

DQ14

DQ5

DQ11

DQ2

DQ8

A B C D E F G H

TOP VIEW (balls facing down)

Note* = DQ15/A-1

1256 56-lfbga P1b.0

A11

WE#

WP#

A15

A12

A19

BES2

RST#

A13

RY/BY#

A18

A14

A10

A17

A16

DQ6

DQ1

VSS

CIOF

NOTE*

DQ13

DQ4

DQ3

DQ9

OE#

BEF#

VSS

DQ7

DQ12

VDDS

VDDF

DQ10

DQ0

BES1#

DQ14

DQ5

DQ11

DQ2

DQ8

A B C D E F G H

TOP VIEW (balls facing down)

Note* = DQ15/A-1

SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D SST34HF1622S / SST34HF1 642 S

Note: 1. F or SST34HF1602C, VDDS, SA, BES2, and BES1# are No Connect.

1256 62-lfbga P2.0

A16

WEF#

VSSS

WP#

LBS#

A18

A11

RY/BY#

RST#

UBS#

A17

A15

A10

A19

OES#

A14

DQ11

A13

DQ15

DQ13

DQ12

DQ9

BEF#

A12

WES#

DQ6

BES2

DQ10

DQ8

VSSF

DQ14

DQ4

VDDS

DQ2

DQ0

OEF#

DQ7

DQ5

VDDF

DQ3

DQ1

BES1#

A B C D E F G H J K

TOP VIEW (balls facing down)

Note: 1. For SST34HF1602C , VSSS, VDDS, WES#, BES2, OES#, UBS#, LBS#, and BES1# are No Connect .

SST34HF16x2C/D

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 3: PIN DESCRIPTION

Symbol Pin Name Functions

AMS1 to A0Address Inputs To provide flash address, A19-A0.

To provi de (P)SRAM add res s , A MS-A0

SA SRAM x8 Address To provide additional address for x8 SRAM

DQ14-DQ0Data Inputs/Outputs To output data during Read cycles and receive input data during Write cycles.

Data is internally latch ed during a flash Erase/ Program cycle . The outpu ts are in

tri-state when OE# is high or BES1# is high or BES2 is low and BEF# is high.

DQ15/A-1 Data Inpu t/O utp ut

and LBS Address DQ15 is used as data I/O pin when in x16 mode (CIOF = “1”)

A-1 is used as the LBS address pin when in x8 mode (CIOF = “0”)

BEF# Flash Memory Bank Enable To activate the Flash memory bank when BEF# is low

BES1# (P)SRAM Memory Bank Enable To activate the (P)SRAM memory bank when BES1# is low

BES2 (P)SRAM Memory Bank Enable To activate the (P)SRAM memory bank when BES2 is high

OEF#2Output Enable To gate the data output buffers for Flash2 only

OES#2Output Enable To gate the data output buffers for SRAM2 only

WEF#2Write Enable To control the Write operations for Flash2 only

WES#2Write Enable To control the Write operations for SRAM2 only

OE# Output Enable To gate the data output buffers

WE# Write Enable To control the Write operations

CIOF Byte Selection for Flash When low, select Byte mode. When high, select Word mode.

UBS# Upper Byte Control ((P)SRAM) To enable DQ15-DQ8

LBS# Lower Byte Control ((P)SRAM) To enable DQ7-DQ0

WP# Write Protect To protect and unprotect the top 8 KWord (4 sectors) from Erase or Program

operation

RST# Reset To Reset and return the device to Read mode

RY/BY# Ready/Busy# To output the status of a Program or Erase Operation

RY/BY# is a open dr ai n outpu t, so a 10K Ω - 100KΩ pull-up resistor i s requi red to

allow RY/BY# to transition high indicating the device is ready to read.

VSSF2Ground Flash2 only

VSSS2Ground SRAM2 only

VSS Ground

VDDFPower Supply (Flash) 2.7-3.3V Power Supply to Flash only

VDDSPower Supply ((P)SRAM) 2.7-3.3V Power Supply to (P)SRAM only

NC No Connection Unconnected pins

T3.0 1256

1. AMS = Most Significant Address

AMS = A16 for SST34HF1622C/S, A17 for SST34HF1642C/D/S, and A18 for SST34HF1682D

2. LS package only

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 4: OPERATIONAL MODES SELECTION FOR X16 (P)SRAM

Mode BEF#1BES1#1,2 BES21,2 OE#2,3 WE#2,3 LBS#2UBS#2

DQ15-8

DQ7-0 CIOF = VIH CIOF = VIL

Full Standby VIH VIH X X X X X HIGH-Z HIGH-Z HIGH-Z

IL XXXX

Output Disable VIH VIL VIH VIH VIH X X HIGH-Z HIGH-Z HIGH-Z

VIL VIH XXV

IH VIH

VIL VIH XV

IH VIH X X HIGH-Z HIGH-Z HIGH-Z

Flash Read VIL VIH XV

IL VIH XXD

OUT DOUT DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Write VIL VIH X VIH VIL XXD

IN DIN DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Erase VIL VIH XV

IH VIL XX X X X

(P)SRAM Read VIH V

IL VIH VIL VIH VIL V

IL DOUT DOUT DOUT

VIH VIL HIGH-Z DOUT DOUT

VIL VIH DOUT HIGH-Z HIGH-Z

(P)SRAM W r ite VIH VIL VIH XV

IL VIL VIL DIN DIN DIN

VIH VIL HIGH-Z DIN DIN

VIL VIH DIN HIGH-Z HIGH-Z

Product

Identification4VIL VIH V

IL V

IL VIH X X Manufact urer’s ID5

Device ID5

T4.0 1256

1. Do not apply BEF# = VIL, BES1# = VIL and BES2 = VIH at the same time

2. X can be VIL or VIH, but no other value.

3. OE# = OEF# and OES#

WE# = WEF# and WES# for LS package only

4. Software mode only

5. With A19-A18 = VIL;SST Manufacturer’s ID = BFH, is read with A0=0,

SST34HF16x2C/D/S Device ID = 734AH, is read with A0=1

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 5: OPERATIONAL MODES SELECTION FOR X8 SRAM

Mode BEF#1BES1#1,2BES21,2 OE#2WE#2SA2

DQ15-8

DQ7-0 CIOF = VIH CIOF = VIL

Full Standby VIH VIH X X X X HIGH-Z HIGH-Z HIGH-Z

IL XXX

Output Disable VIH VIL VIH VIH VIH X HIGH-Z HIGH-Z HIGH-Z

VIL VIH XXV

VIL VIH XV

IH VIH X HIGH-Z HIGH-Z HIGH-Z

Flash Read VIL VIH XV

IL VIH XD

OUT DOUT DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Write VIL VIH X VIH VIL XD

IN DIN DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Erase VIL VIH XV

IH VIL XX X X

SRAM Read VIH V

IL VIH VIL VIH SA DOUT HIGH-Z HIGH-Z

SRAM Writ e VIH VIL VIH XV

IL SA DIN HIGH-Z HIGH-Z

Product

Identification3VIL VIH V

IL V

IL VIH X Manufacturer’s ID4

De vice ID4Manuf acturer’s ID4

Device ID4

T5.0 1256

1. Do not apply BEF# = VIL, BES1# = VIL and BES2 = VIH at the same time

2. X can be VIL or VIH, but no other value.

3. Software mode only

4. With A19-A18 = VIL;SST Manufacturer’s ID = BFH, is read with A0=0,

SST34HF16x2C/D/S Device ID = 734AH, is read with A0=1, for x8 A-1 will not be par t of the Device ID

TABLE 6: OPERATIONAL MODES SELECTION FOR 0 MBIT SRAM: SST3 4HF1602C

Mode BEF# OE#1,2

1. X can be VIL or VIH, but no other value.

2. OE# = OEF#, WE# = WEF#

WE#1,2

DQ15-8

DQ7-0 CIOF = VIH CIOF = VIL

Full Standby VIH X X HIGH-Z HIGH-Z HIGH-Z

Output Disable VIH VIH VIH HIGH-Z HIGH-Z HIGH-Z

VIL VIH VIH HIGH-Z HIGH-Z HIGH-Z

Flash Read VIL VIL VIH DOUT DOUT DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Write VIL VIH VIL DIN DIN DQ14-8 = HIGH-Z

DQ15 = A-1

Flash Erase VIL VIH VIL XXX

Product

Identification3

3. Software mode only

VIL VIL VIH Manu facturer’s ID4

Device ID4

4. With A19-A18 = VIL;SST Manufacturer’s ID = BFH, is read with A0=0,

SST34HF1602C Device ID = 734AH, is read with A0=1, f or x8 A-1 will not be part o f the Device ID

Manufacturer’s ID4

Device ID4

T6.0 1256

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 7: SOFTWARE COMMAND SEQUENCE

Command

Sequence 1st Bus

Write Cycle 2nd Bus

Write Cycle 3rd Bus

Write Cycle 4th Bus

Write Cycle 5th Bus

Write Cycle 6th Bus

Write Cycle

Addr1Data2Addr1Data2Addr1Data2Addr1Data2Addr1Data2Addr1Data2

Word-/Byte-Program 5555H AAH 2AAAH 55H 5555H A0H WA3Data

Sector-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SAX430H

Block-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H BAX450H

Chip-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H

Erase-Suspend XXXXH B0H

Erase-Resume XXXXH 30H

Query Sec ID 55555H AAH 2AAAH 55H 5555H 88H

User Security ID

Word-/Byte-Program 5555H AAH 2AAAH 55H 5555H A5H SIWA6Data

User Security ID

Program Lock-out75555H AAH 2AAAH 55H 5555H 85H XXH 0000H

Softw are ID Entry85555H AAH 2AAAH 55H BKX9

5555H 90H

Softw are ID Exit/

Sec ID Exit10,11 5555H AAH 2AAAH 55H 5555H F0H

Softw are ID Exit/

Sec ID Exit10,11 XXH F0H

T7.0 1256

1. Address format A14-A0 (Hex) , Addresses A19-A15 can be VIL or VIH, b ut no other value , f or th e command seque nce wh en in x16 mode.

When in x8 mode, Addresses A19-A15, Address A-1 and DQ14-DQ8 can be VIL or VIH, but no other value, for the command sequence.

2. DQ15-DQ8 can be VIL or VIH, but no other value, for the command sequence

3. WA = Program word/byte address

4. SAX for Sector-Erase; uses A19-A10 address lines

BAX for Block-Erase; uses A19-A15 address lines

5. F or SST34HF16x2C/D/S,

SST ID is read with A3 = 0 (Address range = 00000H to 00007H),

User ID is read with A3 = 1 (Address range = 00010H to 00017H).

Lock Status is read wi th A7-A0 = 000FFH. Unlocked: DQ3 = 1 / Locked: DQ3 = 0.

6. SIWA = User Security ID Program word/byte address

For SST34HF16x2C/D/S, valid Word-Addresses for User Sec ID are from C0010H-C0017H.

All 4 cycles of User Security ID Word-Program and Program Lock-out must be completed before going back to Read-Array mode.

7. The User Security ID Program Lock-out command must be executed in x16 mode (BYTE#=VIH).

8. The device does not remain in Software Product Identification mode if powered down.

9. A19 and A18 = VIL

10. Both Software ID Exi t operations are equivalent

11. If users never lock after programming, User Sec ID can be programmed over the previously unprogrammed bits (data=1) using the

User Sec ID mode again (the programmed “0” bits cannot be re versed to “1”).

For SST34HF16x2C/D/S, valid Word-Addresses for User Sec ID are from C0010H-C0017H.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum

Stress Ratings” may caus e per manent d amage to the device. This is a stres s rating only and funct ional operatio n

of the device at these conditions or conditions greater than those defined in the operational sections of this data

sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)

Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +125°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD1+0.3V

Transient Voltage (<20 ns) on Any Pin to Ground Potential. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD1+1.0V

Pac kage Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Output Short Circuit Cur rent2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

1. VDD = VDDF and VDDS

2. Outputs shorted for no more than one second. No more than one output shorted at a time.

OPERATING RANGE

Range Ambient Temp VDD

Commercial 0°C to +70°C 2.7-3.3V

Extended -20°C to +85°C 2.7-3.3V

AC CONDITIONS OF TEST

Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns

Output Load . . . . . . . . . . . . . . . . . . . . CL = 30 pF

See Figures 20 and 21

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 8: DC OPERATING CHARACTERISTICS (VDD = VDDF AND VDDS = 2.7-3.3V)

Symbol Parameter

Limits

Test ConditionsMin Max Units

IDD1Active VDD Current Address input = VILT/VIHT, at f=1/TRC Min,

VDD=VDD Max, all DQs open

Read OE#=VIL, WE#=VIH

Flash 35 mA BEF#=VIL, BES1#=VIH, or BES2=VIL

(P)SRAM 30 mA BEF#=VIH, BES1#=VIL , BES2=VIH

Concurrent Operation 60 mA BEF#=VIH, BES1#=VIL , BES2=VIH

Write2WE#=VIL

Flash 40 mA BEF#=VIL, BES1#=VIH, or BES2=VIL, OE#=VIH

(P)SRAM 30 mA BEF#=VIH, BES1#=VIL , BES2=VIH

ISB Standby VDD Current SRAM

PSRAM 30

85 µA

µA VDD = VDD Max, BEF#=BES1#=VIHC, BES2=VILC

IRT Reset VDD Current 30 µA RST#=GND

ILI Input Leakage Current 1 µA VIN=GND to VDD, VDD=VDD Max

ILIW Input Leakage Current

on WP# pin and RST# pin 10 µA WP#=GND to VDD, VDD=VDD Max

RST#=GND to VDD, VDD=VDD Max

ILO Output Leakage Current 10 µA VOUT=GND to VDD, VDD=VDD Max

VIL Input Low Voltage 0.8 V VDD=VDD Min

VILC Input Low Voltage (CMOS) 0.3 V VDD=VDD Max

VIH Input High Voltage 0.7 VDD VV

DD=VDD Max

VIHC Input High Voltage (CMOS) VDD-0.3 V VDD=VDD Ma x

VOLF Flash Output Low Voltage 0.2 V IOL=100 µA, VDD=VDD Min

VOHF Flash Output High Voltage VDD-0.2 V IOH=-100 µA, VDD=VDD Min

VOLS (P)SRAM Output Low Voltage 0.4 V IOL =1 mA , VDD=VDD Min

VOHS (P)SRAM Output High Voltage 2.2 V IOH =-500 µA, VDD=VDD Min

T8.0 1256

1. Address input = VILT/VIHT, VDD=VDD Max (See Figure 20)

2. IDD active while Erase or Program is in progress.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 9: RECOMMENDED SYSTEM POWER-UP TIMINGS

Symbol Parameter Minimum Units

TPU-READ1Power-up to Read Operation 100 µs

TPU-WRITE1Power-up to Write Operation 100 µs

T9.0 1256

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

TABLE 10: CAPACITANCE (Ta = 25°C, f=1 Mhz, other pins open)

Parameter Description Test Condition Maximum

CI/O1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

I/O Pin Capacitance VI/O = 0V 20 pF

CIN1Input Capacitance VIN = 0V 16 pF

T10.0 1256

TABLE 11: FLASH RELIABILITY CHARACTERISTICS

Symbol Parameter Minimum Specification Units Test Method

NEND1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

Endurance 10,000 Cycles JEDEC Standard A117

TDR1Data Retention 100 Years JEDEC Standard A103

ILTH1Latch Up 100 + IDD mA JEDEC Standard 78

T11.0 1256

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

AC CHARACTERISTICS

TABLE 12: (P)SRAM READ CYCLE TIMING PARAMETERS

Min Max Units

TRCS Read Cycl e Time 70 ns

TAAS Address Access Time 70 ns

TBES Bank Enable Access Time 70 ns

TOES Output Enable Access Time 35 ns

TBYES UBS#, LBS# Access Time 70 ns

TBLZS1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

BES# to Active Output 0 ns

TOLZS1Output Enable to Active Output 0 ns

TBYLZS1UBS#, LBS# to Active Out put 0 ns

TBHZS1BES# to High-Z Output 25 ns

TOHZS1Output Disable to High-Z Output 25 ns

TBYHZS1U BS#, LBS# to High-Z Output 35 ns

TOHS Output Hold from Address Change 10 ns

T12.0 1256

TABLE 13: (P)SRAM WRITE CYCLE TIMING PARAMETERS

Symbol Parameter Min Max Units

TWCS Write Cycle Time 70 ns

TBWS Bank Enable to End-of-Write 60 ns

TAWS Address Valid to End-of-Write 60 ns

TASTS Address Set-up Time 0 ns

TWPS Write Pulse Width 60 ns

TWRS Write Recovery Time 0 ns

TBYWS UBS#, LBS# to En d-of-Write 60 ns

TODWS Output Disable from WE# Low 30 ns

TOEWS Output Enable from WE# High 0 ns

TDSS Data Set-up Time 30 ns

TDHS Data Hold from Write Time 0 ns

T13.0 1256

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

TABLE 14: FLASH READ CYCLE TIMING PARAMETERS VDD = 2.7-3.3V

Symbol Parameter Min Max Units

TRC Read Cycle Time 70 ns

TCE Chip Enable Access Time 70 ns

TAA Address Access Time 70 ns

TOE Output Enable Access Time 35 ns

TCLZ1BEF# Low to Active Output 0 ns

TOLZ1OE# Low to Active Output 0 ns

TCHZ1BEF# High to High-Z Output 20 ns

TOHZ1OE# High to Hi gh-Z Output 20 ns

TOH1Output Hold from Address Change 0 ns

TRP1RST# Pulse Width 500 ns

TRHR1RST# High Before R ead 50 ns

TRY1,2 RST# Pin Low to Re ad 20 µs

T14.0 1256

1. This parameter is measured only for initial qualification and after the design or pr ocess change that could affect this parameter.

2. This parameter appl ies to Sector-Erase, Block-Erase and Program operations. This parameter does not apply to Chip-Erase.

TABLE 15: FLASH PROGRAM/ERASE CYCLE TIMING PARAMETERS

Symbol Parameter Min Max Units

TBP Word-Program Time 10 µs

TAS Address Setup Time 0 ns

TAH Address Hold Time 40 ns

TCS WE# and BEF# Setup Time 0 ns

TCH WE# and BEF# Hold Time 0 ns

TOES OE# Hi gh Setup Ti me 0 ns

TOEH OE# High Hold Time 10 ns

TCP BEF# Pulse Width 40 ns

TWP WE# Pulse Width 40 ns

TWPH1

1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.

WE# Pulse Width High 30 ns

TCPH1 BEF# Pulse Width High 30 ns

TDS Data Setup Time 30 ns

TDH1Data Hold Time 0 ns

TIDA1Software ID Access and Exit Time 150 ns

TES Erase-Sus pe nd Lat enc y 20 µs

TBY1,2

2. This parameter appl ies to Sector-Erase, Block-Erase, and Program operations.

This parameter does not apply to Chip-Erase operations.

RY/BY# Delay Time 90 ns

TBR1Bus# Recovery Time 1µs

TSE Sector-Erase 25 ms

TBE Block-Erase 25 ms

TSCE Chip-Erase 50 ms

T15.0 125 6

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 5: (P)SRAM READ CYCLE TIMING DIAGRAM

FIGURE 6: (P)SRAM WRITE CYCLE TIMING DIAGRAM (WE# CONTROLLED)1

ADDRESSES AMSS-0

DQ15-0

UBS#, LBS#

OE#

BES1#

BES2

TRCS

TAAS

TBES

TOES

TBLZS

TOLZS

TBYES

TBYLZS TBYHZS

DATA VALID

TOHZS

TBHZS

TOHS

1256 F04.0

TBES

Note: AMSS = Most Si gnificant Address

AMSS = A16 for SST34HF1622C/S, A17 for SST34HF1622C/D/S, and A18 for SST34HF1682D

For SST34HF16x2S, LBS# and UBS# are No Connect and in x8 mode, the additional SRAM address is SA.

TAWS

ADDRESSES AMSS3-0

BES1#

BES2

WE#

UBS#, LBS#

TWPS TWRS

TWCS

TASTS

TBWS

TBYWS

TODWS TOEWS

TDSS TDHS

1256 F05.0

NOTE 2

DQ15-8, DQ7-0 VALID DATA IN

Note: 1. If OE# is High during the Write cycle, the outputs will remain at high impedance.

2. If BES1# goes Low or BES2 goes high coincident with or after WE# goes Low, the output will remain at high impedance.

If BES1# goes High or BES2 goes low coincident with or before WE# goes High, the output will remain at high impedance.

Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied.

3. AMSS = Most Significant SRAM Address

AMSS = A16 for SST34HF1622C/S, A17 for SST34HF1622C/D/S, and A18 for SST34HF1682D

For SST34HF16x2S, LBS# and UBS# are No Connect and in x8 mode, the additional SRAM address is SA.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 7: (P)SRAM WRITE CYCLE TIMING DIAGRAM (UBS#, LBS# CONTROLLED)1 X16 (P)SRAM ONLY

ADDRESSES AMSS3-0

WE#

BES1#

BES2

TBWS

TAWS

TWCS

TWPS TWRS

TASTS TBYWS

DQ15-8, DQ7-0 VALID DATA IN

NOTE 2 NOTE 2

TDSS TDHS

UBS#, LBS#

1256 F06.0

Note: 1. If OE# is High duri ng the Write cycle, the outputs will remain at high impedance.

2. Because DIN signals may be in the output state at this time, input signals of reverse polarity must not be applied.

3. AMSS = Most Significant SRAM Address

AMSS = A16 for SST34HF1622C, A17 for SST34HF162 2C/D, and A18 for SST34HF1682D

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 8: FLASH READ CYCLE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = ADDRESS INPUT)

FIGURE 9: FLASH WE# CONTROLLED WORD-PROGRAM CYCLE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = ADDRESS INPUT)

1256 F07.0

ADDRESS A19-0

DQ15-0

WE#

OE#

BEF#

TCE

TRC TAA

TOE

TOLZ

VIH

HIGH-Z TCLZ TOH

TCHZ

HIGH-Z

DATA VALIDDATA VALID

TOHZ

1256 F08.0

ADDRESS A19-0

DQ15-0

TDH

WPH

TDS

TWP

TAH

TAS

TCH

TCS TBY

BEF#

RY/BY#

5555 2AAA 5555 ADDR

XXAA XX55 XXA0 DATA

WORD

(ADDR/DATA)

OE#

WE#

TBR

TBP

Note: X can be VIL or VIH, but no other value.

VALID

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 10: FLASH BEF# CONTROLLED WORD-PROGRAM CYCLE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = ADDRESS INPUT)

FIGURE 11: FLASH DATA# POLLING TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = ADDRESS INPUT)

VALID

1256 F09.0

ADDRESS A19-0

DQ15-0

TDH

CPH

TDS

TCP

TAH

TAS

TCH

TCS

WE#

5555 2AAA 5555 ADDR

XXAA XX55 XXA0 DATA

WORD

(ADDR/DATA)

OE#

BEF#

TBP

TBY

RY/BY# TBR

Note: X can be VIL or VIH, but no other value.

1256 F10.0

ADDRESS A19-0

DQ7DATA DATA# DATA# DATA

WE#

OE#

BEF#

TOEH

TOE

TCE

TOES

RY/BY#

TBY

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 12: FLASH TOGGLE BIT TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = DON’T CARE)

FIGURE 13: FLASH WE# CONTROLLED CHIP-ERASE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = DON’T CARE)

1256 F11.0

ADDRESS A19-0

DQ6

WE#

OE#

BEF#

TOE

TOEH

TCE

TWO READ CYCLES

WITH SAME OUTPUTS

VALID DATA

TBR

VALID

TBR

1256 F12.0

ADDRESS A19-0

DQ15-0

WE#

5555 2AAA 2AAA5555 5555

XX55 XX10XX55XXAA XX80 XXAA

5555

OE#

BEF#

SIX-BYTE CODE FOR CHIP-ERASE

TSCE

TWP

TBY

RY/BY#

Note: This device also supports BEF# controlled Chip-Er ase operation.

The WE# and BEF# signals are interchangeable as long as minimum timings are meet. (See Table 15.)

X can be VIL or VIH, but no other value.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 14: FLASH WE# CONTROLLED BLOCK-ERASE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = DON’T CARE)

FIGURE 15: FLASH WE# CONTROLLED SECTOR-ERASE TIMING DIAGRAM FOR WORD MODE

(FOR BYTE MODE A-1 = DON’T CARE)

1256 F13.0

ADDRESS A19-0

DQ15-0

WE#

5555 2AAA 2AAA5555 5555

XX55 XX50XX55XXAA XX80 XXAA

BAX

OE#

BEF#

SIX-BYTE CODE FOR BLOCK-ERASE

TWP

TBY

RY/BY#

VALID

TBR

TBE

Note: This device also supports BEF# controlled Block-Erase operation.

The WE# and BEF# signals are interchangeable as long as minimum timings are meet. (See Table 15.)

BAX = Block Address

X can be VIL or VIH, but no other value.

1256 F14.0

ADDRESS A19-0

DQ15-0

WE#

5555 2AAA 2AAA5555 5555

XX55 XX30XX55XXAA XX80 XXAA

SAX

OE#

BEF#

SIX-BYTE CODE FOR SECTOR-ERASE

TWP

TBY

RY/BY#

VALID

TBR

TSE

Note: This device also suppor t s BEF# cont rolled Secto r-Erase operation.

The WE# and BEF# signals are interchangeable as long as minim um timings are meet. (See Table 15.)

SAX = Sector Address

X can be VIL or VIH, but no other value.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 16: FLASH SOFTWARE ID ENTRY AND READ FOR WORD MODE

(FOR BYTE MODE A-1 = 0)

FIGURE 17: FLASH SOFTWARE ID EXIT FOR WORD MODE

(FOR BYTE MODE A-1 = 0)

1256 F15.0

ADDRESS A14-0

TIDA

DQ15-0

WE#

5555 2AAA 5555 0000 0001

OE#

BEF#

Three-Byte Sequence For Software ID Entry

TWP

TWPH TAA

00BF Device ID

XX55XXAA XX90

Note: X can be VIL or VIH, b ut no other value .

Devi ce ID - 734AH for SST34HF16x2C/DS

1256 F16.0

ADDRESS A14-0

DQ15-0

TIDA

TWP

TWHP

WE#

5555 2AAA 5555

Three-Byte Sequence for Software ID Exit and Reset

OE#

BEF#

XXAA XX55 XXF0

Note: X can be VIL or VIH, but no other value

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 18: RST# TIMING (WHEN NO INTERNAL OPERATION IS IN PROGRESS)

FIGURE 19: RST# TIMING (DURING SECTOR- OR BLOCK-ERASE OPERATION)

1256 F17.0

RY/BY#

RST#

BEF#/OE#

TRP

TRHR

1256 F18.0

RY/BY#

BEF#

OE#

TRP

TRY

TBR

RST#

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 20: AC I NPUT/OUTPUT REFERENCE WAVEFORMS

FIGURE 21: A TEST LOAD EXAMPLE

1256 F19.0

REFERENCE POINTS OUTPUTINPUT VIT

VIHT

VILT

VOT

A C test inputs are driven at VIHT (0.9 VDD) for a l ogic “1” and VILT (0.1 VDD) fo r a logic “0 ”. Measurem ent ref e rence point s

f or inputs and outputs are VIT (0.5 VDD) and V OT (0.5 VDD). Input rise and f all times (10% ↔ 90%) are <5 ns.

Note: VIT - VINPUT Test

VOT - VOUTPUT Test

VIHT - VINPUT HIGH Test

VILT - VINPUT LOW Test

1256 F20.0

TO TESTER

TO DUT

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 22: WORD-PROGRAM ALGORITHM

1256 F21.0

Start

Load data: XXAAH

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XXA0H

Address: 5555H

Load Word

Address/Word

Data

Wait for end of

Program (TBP,

Data# Polling

bit, or Toggle bit

operation)

Program

Completed

Note: X can be VIL or VIH, but no other value.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 23: WAIT OPTIONS

1256 F22.0

Wait TBP,

TSCE, TSE

or TBE

Program/Erase

Initiated

Internal Timer Toggle Bit

Ye s

Program/Erase

Completed

Does DQ6

match?

Read same

word

Data# Polling

Program/Erase

Completed

Program/Erase

Completed

Read word

Is DQ7 =

true data?

Read DQ7

Program/Erase

Initiated

Program/Erase

Initiated

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 24: SOFTWARE PRODUCT ID COMMAND FLOWCHARTS

1256 F23.0

Load data: XXAAH

Address: 5555H

Software Product ID Entry

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX90H

Address: 5555H

Wait TIDA

Read Software ID

Load data: XXAAH

Address: 5555H

Software ID Exit

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XXF0H

Address: 5555H

Wait TIDA

Return to normal

operation

Note: X can be VIL or VIH, but no other value.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 25: SOFTWARE SEC ID COMMAND FLOWCHARTS

1256 F24.0

Sec ID Exit

Command Sequence

Load data: XXF0H

Address: XXH

Return to normal

operation

Wait TIDA

X can be VIL or VIH, but no other value

Load data: XXAAH

Address: 5555H

Sec ID Query Entry

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX88H

Address: 5555H

Wait TIDA

Read Sec ID

Load data: XXAAH

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XXF0H

Address: 5555H

Wait TIDA

Return to normal

operation

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

FIGURE 26: ERASE COMMAND SEQUENCE

1256 F25.0

Load data: XXAAH

Address: 5555H

Chip-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX10H

Address: 5555H

Load data: XXAAH

Address: 5555H

Wait TSCE

Chip erased

to FFFFH

Load data: XXAAH

Address: 5555H

Sector-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX30H

Address: SAX

Load data: XXAAH

Address: 5555H

Wait TSE

Sector erased

to FFFFH

Load data: XXAAH

Address: 5555H

Block-Erase

Command Sequence

Load data: XX55H

Address: 2AAAH

Load data: XX80H

Address: 5555H

Load data: XX55H

Address: 2AAAH

Load data: XX50H

Address: BAX

Load data: XXAAH

Address: 5555H

Wait TBE

Block erased

to FFFFH

Note: X can be VIL or VIH, but no other value.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

PRODUCT ORDERING INFORMATION

Package Attribute

E = non-Pb

Package Modifier

P = 56 balls

S = 62 balls

Pac kage Type

L1 = LFB GA (8mm x 10 mm x 1.4 mm, 0.45 mm ball siz e)

L = LFBGA (8mm x 10mm x 1.4mm, 0.40mm ball size)

B1 = TFBGA (8mm x 10mm x 1.2mm, 0.45mm ball size)

Temperature Range

C = Commercial = 0°C to +70°C

E = Extended = -20°C to +85°C

Minimum Endurance

4 =10,00 0 cycles

Read Access Speed

70 = 70 ns

Version

C = x16 Mbit SRAM

D = x16 Mbit PSRAM

S = x8 Mbit SRAM

Bank Split

2 = 4 Mbit + 12 Mbit

SRAM Density

0 = No SRAM

2 = 2 Mbit

4 = 4 Mbit

8 = 8 Mbit

Flash Density

16 = 16 Mbit

Voltage

H = 2.7-3.3V

Product Series

34 = Concurrent SuperFlash + SRAM ComboMemory

Device Speed Suffix1 Suffix2

SST34HF16x2X-XXX -XX-XXXX

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

Valid combinations for SST34HF1602C

SST34HF1602C-70-4C-L1P SST34HF1602C-70-4C-LS SST34HF1602C-70-4C-B1P

SST34HF1602C-70-4C-L1PE SST34HF1602C-70-4C-LSE SST34HF1602C-70-4C-B1PE

SST34HF1602C-70-4E-L1P SST34HF1602C-70-4E-LS SST34HF1602C-70-4E-B1P

SST34HF1602C-70-4E-L1PE SST34HF1602C-70-4E-LSE SST34HF1602C-70-4E-B1PE

Valid combinations for SST34HF1622C

SST34HF1622C-70-4C-L1P SST34HF1622C-70-4C-LS

SST34HF1622C-70-4C-L1PE SST34HF1622C-70-4C-LSE

SST34HF1622C-70-4E-L1P SST34HF1622C-70-4E-LS

SST34HF1622C-70-4E-L1PE SST34HF1622C-70-4E-LSE

Valid combinations for SST34HF1622S

SST34HF1622S-70-4C-L1P

SST34HF1622S-70-4C-L1PE

SST34HF1622S-70-4E-L1P

SST34HF1622S-70-4E-L1PE

Valid combinations for SST34HF1642C

SST34HF1642C-70-4C-L1P SST34HF1642C-70-4C-LS

SST34HF1642C-70-4C-L1PE SST34HF1642C-70-4C-LSE

SST34HF1642C-70-4E-L1P SST34HF1642C-70-4E-LS

SST34HF1642C-70-4E-L1PE SST34HF1642C-70-4E-LSE

Valid combinations for SST34HF1642D

SST34HF1642D-70-4C-L1P SST34HF1642D-70-4C-LS

SST34HF1642D-70-4C-L1PE SST34HF1642D-70-4C-LSE

SST34HF1642D-70-4E-L1P SST34HF1642D-70-4E-LS

SST34HF1642D-70-4E-L1PE SST34HF1642D-70-4E-LSE

Valid combinations for SST34HF1642S

SST34HF1642S-70-4C-L1P

SST34HF1642S-70-4C-L1PE

SST34HF1642S-70-4E-L1P

SST34HF1642S-70-4E-L1PE

Valid combinations for SST34HF1682D

SST34HF1682D-70-4C-L1P SST34HF1682D-70-4C-LS

SST34HF1682D-70-4C-L1PE SST34HF1682D-70-4C-LSE

SST34HF1682D-70-4E-L1P SST34HF1682D-70-4E-LS

SST34HF1682D-70-4E-L1PE SST34HF1682D-70-4E-LSE

Note: Va lid combinations are those products in mass production or will be in mass production. Consult your SST sales

representative to confirm av ailability of valid combinations and to determine availability of new combinations.

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

PACKAGING DIAGRAMS

56-BALL LOW-PROFILE, FINE-PITCH B ALL GRID ARRAY (LFBGA) 8MM X 10MM

SST PACKAGE CODE: L1P

A1 CORNER

H G F E D C B A

A B C D E F G H

BOTTOM VIEW

TOP VIEW

SIDE VIEW

SEATING PLANE 0.35 ± 0.05

1.30 ± 0.10

0.12

8.00 ± 0.20

0.45 ± 0.05

(56X)

A1 CORNER

10.00 ± 0.20

0.80

5.60

0.80

5.60

56-lfbga-L1P-8x10-450mic-3

Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210,

this specific package is not registered.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. The actual shape of the corners may be slightly different than as portrayed in the drawing.

1mm

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

62-BALL LOW-PROFILE, FINE-PITCH B ALL GRID ARRAY (LFBGA) 8MM X 10MM

SST PACKAGE CODE: LS

A1 CORNER

K J H G F E D C B A

A B C D E F G H J K

BOTTOM VIEW

TOP VIEW

8.00 ± 0.20

0.40 ± 0.05

(62X)

A1 CORNER

10.00 ± 0.20

0.80

5.60

0.80

7.20

62-lfbga-LS-8x10-400mic-3

Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210,

this specific package is not registered.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. The actual shape of the corners may be slightly different than as portrayed in the drawing.

1mm

SIDE VIEW

SEATING PLANE 0.32 ± 0.05

1.30 ± 0.10

0.12

Advance Information

16 Mbit Concurrent SuperFlash + 2/4/8 Mbit SRAM ComboMemory

SST34HF1602C / SST34HF1622C / SST34HF1642C

SST34HF1642D / SST34HF1682D / SST34HF1622S / SST34HF1642S

56-BALL THIN-PROFILE, FINE-PITCH BALL GRID ARRAY (TFBGA) 8MM X 10MM

SST PACKAGE CODE: B1P

TABLE 16: REVISION HISTORY

Number Description Date

00 •Initial Release Mar 2004

1.2 max

H G F E D C B A

A B C D E F G H

BOTTOM VIEWTOP VIEW

SIDE VIEW

SEATING PLANE

0.35 ± 0.05

0.12

8.00 ± 0.20

0.45 ± 0.05

(56X)

10.00 ± 0.20

0.80

5.60

0.80

5.60

56-tfbga-B1P-8x10-450mic-1

Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210, this specific package is not registered.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. Ball opening size is 0.38 mm (± 0.05 mm)

1mm

A1 CORNER A1 CORNER

Silicon Stor age Technology, Inc. • 1171 Sonor a Court • Sunnyvale , CA 940 86 • Telephone 408-73 5-91 10 • Fax 408-735-90 36