LM4549BVHX /NOPB - TEXAS INSTRUMENTS

SFH 4248

1Version 1.4 | 2018-06-20

Produktdatenblatt | Version 1.1

www.osram-os.com

SFH 4248

Power TOPLED® Lens

High Power Infrared Emitter (940 nm)

Applications

—CCTV Surveillance

—Gaming, Amusement, Gambling

—Gesture Recognition

—Industrial Automation (Machine controls, Light

barriers, Vision controls)

—Safety systems and CCTV

—White Goods

Features:

—Package: Epoxy, di󰘯use

—Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.

—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

—High Power Infrared LED

—Short switching times

—Half angle: ± 15°

—High forward current allowed at high temperature

Ordering Information

Type Radiant intensity 1) Radiant intensity 1) Ordering Code

typ.

IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms

IeIe

SFH 4248-Z 40 ... 200 mW/sr 100 mW/sr Q65110A7518

SFH 4248-VAW 63 ... 200 mW/sr 100 mW/sr Q65111A4123

SFH 4248

2Version 1.4 | 2018-06-20

Maximum Ratings

TA = 25 °C

Parameter Symbol Values

Operating temperature Top min.

max.

-40 °C

100 °C

Storage temperature Tstg min.

max.

-40 °C

100 °C

Reverse voltage 2) VRmax. 12 V

Forward current IFmax. 100 mA

Surge current

tp ≤ 100 µs; D = 0

IFSM max. 1 A

Power consumption Ptot max. 180 mW

ESD withstand voltage

acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD max. 2 kV

SFH 4248

3Version 1.4 | 2018-06-20

Characteristics

IF = 100 mA; tp = 20 ms; TA = 25 °C

Parameter Symbol Values

Peak wavelength

peak typ. 950 nm

Centroid wavelength

centroid typ. 940 nm

Spectral bandwidth at 50% Irel,max

∆λ

typ. 42 nm

Half angle

typ. 15 °

Dimensions of active chip area L x W typ. 0.3 x 0.3

mm x mm

Rise time (10% / 90%)

IF = 100 mA; RL = 50 Ω

trtyp. 12 ns

Fall time (10% / 90%)

IF = 100 mA; RL = 50 Ω

tftyp. 12 ns

Forward voltage VFtyp.

max.

1.5 V

1.8 V

Forward voltage

IF = 1 A; tp = 100 µs

VFtyp.

max.

2.3 V

3 V

Reverse current 2)

VR = 5 V

IRmax.

typ.

10 µA

0.01 µA

Total radiant 󰘱ux 3)

etyp. 65 mW

Radiant intensity 1)

IF = 1 A; tp = 25 µs

Ietyp. 750 mW/sr

Temperature coe󰘲cient of brightness TCItyp. -0.5 % / K

Temperature coe󰘲cient of voltage TCVtyp. -1.3 mV / K

Temperature coe󰘲cient of wavelength TC

typ. 0.3 nm / K

Thermal resistance junction ambient real 4) RthJA max. 300 K / W

Thermal resistance junction solder point real 5) RthJS max. 140 K / W

SFH 4248

4Version 1.4 | 2018-06-20

Brightness Groups

TA = 25 °C

Group Radiant intensity Radiant intensity

IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms

min. max.

IeIe

U 40 mW/sr 80 mW/sr

V 63 mW/sr 125 mW/sr

AW 100 mW/sr 200 mW/sr

Only one group in one packing unit (variation lower 2:1).

800

0nm

OHF04134

100

rel

850 900 950

1025

Relative Spectral Emission 6), 7)

Irel = f (

); IF = 100 mA; tp = 20 ms

SFH 4248

5Version 1.4 | 2018-06-20

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚

OHL00021

50˚

60˚

70˚

80˚

90˚

100˚

0 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

Radiation Characteristics 6), 7)

Irel = f (

); TA = 25 °C

OHF03821

10-3

101

10-1

-2

10 1

10 2

10 3

1055

(100 mA)

Relative Radiant Intensity 6), 7)

Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs

OHF03822

-4

-1

-2

-3

0.5 1 1.5 2 2.5

Forward current 6), 7)

IF = f (VF); single pulse; tp = 100 µs

SFH 4248

6Version 1.4 | 2018-06-20

0.05

210-1-2-3-4-5 1010 1010 10

10 10s10

0.1

0.005

0.02

0.01

OHF05438

0.2

0.5

0.033

0.2

0.4

0.6

0.8

1.0

1.2

Permissible Pulse Handling Capability

IF = f (tp); duty cycle D = parameter; TA = 25°C

0˚C

OHL01716

100

120

20 40 60 80 120

Max. Permissible Forward Current

IF,max = f (TA); RthJA = 300 K / W

OHF05708

-5

-3-4

10 10

-1-2

10 10

10 10 s

0.5

0.2

0.1

0.01

0.05

0.02

0.005

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.1

Permissible Pulse Handling Capability

IF = f (tp); duty cycle D = parameter; TA = 85°C

SFH 4248

7Version 1.4 | 2018-06-20

Dimensional Drawing 8)

3.8 (0.150) max.

ø2.55 (0.100)

0.13 (0.005)

0.18 (0.007)

0.1 (0.004) typ

1.1 (0.043)

0.5 (0.020)

2.6 (0.102)

3.4 (0.134)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

3.0 (0.118)

3.7 (0.146)

3.3 (0.130)

4˚±1

GPLY6127

0.4 (0.016)

0.6 (0.024)

0.9 (0.035)

0.7 (0.028)

1.7 (0.067)

2.1 (0.083)

0.6 (0.024)

0.8 (0.031)

ø2.60 (0.102)

Package marking

(2.4) (0.095)

Approximate Weight: 37.0 mg

Package marking: Cathode

Pin Description

1 Cathode

2 Anode

3 Anode

4 Anode

SFH 4248

8Version 1.4 | 2018-06-20

Recommended Solder Pad 8)

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E

OHA04525

100

150

200

250

300

50 100 150 200 250 300

˚C

240 ˚C

217 ˚C

245 ˚C

25 ˚C

SFH 4248

9Version 1.4 | 2018-06-20

Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C

2 3 K/s

Time tS

TSmin to TSmax

tS60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL217 °C

Time above liquidus temperature tL80 100 s

Peak temperature TP245 250 °C

Time within 5 °C of the speci󰘰ed peak

temperature TP - 5 K

tP10 20 30 s

Ramp-down rate*

TP to 100 °C

3 4 K/s

Time

25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range

Taping 8)

SFH 4248

10 Version 1.4 | 2018-06-20

Tape and Reel 9)

Direction of unreeling

OHAY0324

Label

Leader:

Trailer:

13.0

Direction of unreeling

±0.25

min. 160 mm *

min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D

Reel dimensions [mm]

A W Nmin W1W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000

SFH 4248

11 Version 1.4 | 2018-06-20

Barcode-Product-Label (BPL)

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

Dry Packing Process and Materials 8)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately after

bag opening.

Discard if circles overrun.

Avoid metal contact.

WET

Do not eat.

Comparator

check dot

parts still adequately dry.

examine units, if necessary

15%

10%

bake units

If wet,

change desiccant

If wet,

Humidity Indicator

MIL-I-8835

If wet,

Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

SFH 4248

12 Version 1.4 | 2018-06-20

Transportation Packing and Materials 8)

OHA02044

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

4 5

(Q)QTY:2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18

DEMY

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY:

2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18

DEMY

OSRAM

Packing

Sealing label

Barcode label

Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

Barcode label

Dimensions of transportation box in mm

Width Length Height

195 ± 5 mm 195 ± 5 mm 30 ± 5 mm

SFH 4248

13 Version 1.4 | 2018-06-20

Notes

The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of

lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED speci󰘰ed in this

data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-

sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the

eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light

sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light

sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-

tion, annoyance, visual impairment, and even accidents, depending on the situation.

For further application related informations please visit www.osram-os.com/appnotes

SFH 4248

14 Version 1.4 | 2018-06-20

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language word-

ings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may

contain dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please 󰘰nd the latest version in the OSRAM OS Webside.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest

sales o󰘲ce.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For

packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to

invoice you for any costs incurred.

Product safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant

component or for the application in medical devices.

In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety

devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales

partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-

nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.

SFH 4248

15 Version 1.4 | 2018-06-20

Glossary

1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr

2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-

tion is not allowed.

3) Total radiant 󰘱ux: Measured with integrating sphere.

4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each

5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.

metal block)

6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data

or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures. These do not nec-

essarily correspond to the actual parameters of each single product, which could di󰘯er from the typical

data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical

improvements, these typ. data will be changed without any further notice.

7) Testing temperature: TA = 25°C

8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and

dimensions are speci󰘰ed in mm.

9) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.

SFH 4248

16 Version 1.4 | 2018-06-20

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg