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Thermopad®
Standard
Thermopad®
TVA
Planar
Triple
Wrap
Single
Wrap
Gold
Planar
Wire
Bond
Gold
MTVA
Planar
Triple
Wrap
Single
Wrap
Gold
Planar
Wire
Bond
Gold
MTVA Standard Thermopad®
EMC Technologys MTVA Thermopads are microwave absorbtive
attenuators which offer a smaller physical size with increased
frequency range. The series operates DC to 18 GHz. The MTVA
version of the Thermopad also offers wire bondable terminals for use
with alternative high frequency attachment methods and space
applications. This product is available with various metallization
styles and plating options including RoHS compliant lead free silver
over nickel plating, 60/40 low temperature solder plating or 60/40
solder fused finish for easy reflow processing.
General Specification
Size 0.060 x 0.075
(1.52mm x
1.91mm)
Impedance 50 Ohms
Frequency Range DC to 18 GHz
Attenuation
Accuracy +/-0.5 dB
TCA Tolerance +/-0.001
VSWR (Typical) 1.30 @ 1 GHz
Power Rating 200 mWatts
Power derating 100% to 125 °C
derates to 0% @ 150 °C
Operating
Temperature -55 °C to 150 °C
Material Specification
Product Options
VIEW ALL MTVAs
Quick Help:
Do you need a higher frequency Thermopad?●
Select a lower frequency Thermopad made for telecom applications.●
Do you need a higher power Thermopad?●
Do you need a coaxial Thermopad?●
Do you require a 75 ohm Thermopad?●
Select a high reliability MTVA Thermopad.●
Do you need a fixed attenuator in this same package size?●
Avnet Electronics
Avnet Electronics is an
approved EMC Technology
distributor for North
America. Avnet stocks the
entire line of EMC
Technology components
allowing for reduced
minimum order quantities,
quick delivery and value
added services.
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
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Go
CTVA
Planar
Triple
Wrap
HTVA
Gold
Planar
KTVA
Coax TVA
High Reliability
Thermopad®
HRTVA
Planar
Triple
Wrap
Single
Wrap
Gold
Planar
Wire Bond
Gold
HRMTVA
Planar
Triple
Wrap
Single
Wrap
Gold
Planar
Wire Bond
Gold
Substrate Aluminia
Resistive
material Thick film
Terminal
material
Thick film,
Nickel Barrier
with Solder Plate
or no lead Silver
Finish
Ordering Information
MTVA 03 00 N 07 W3 S
Series
MTVA Nominal
Atten.
1=1dB
2=2dB
3=3dB
4=4dB
5=5dB
6=6dB
7=7dB
8=8dB
Test Code
00=Standard TCA Slope
N=Neg. TCA
dB/dB/°C
03=.003
04=.004
05=.005
06=.006
07=.007
08=.008
09=.009
Metallization
Blank=Planar
W3=Triple Wrap
W1=Single Wrap
G=Planar Gold
WB1=Wire Bond
Plating
Blank=60/40
(Solder Plated)
S=60/40
(Solder Fused)
F=Silver
(Lead Free)
(S or F not
available on
WB1 or G)
Metallization and Plating Options
Planar (Blank or No Code): means topside tin/lead metallization on the input/output & ground pads.
This chip device should be mounted in a flip chip style and is pick & place compatible. Planar offers
the best RF performance and lowest cost.
Single Wrap (W1): indicates tin/lead metallization is used on the input/output pads and wraps around
the ground pad with full backside metallization.
Triple Wrap (W3): indicates tin/lead metallization wraps around on the input/output and ground pads.
Triple wrap metallization permits inspectable solder fillets. This chip device should be mounted in a
flip chip method and is well suited for hand soldering.
Planar Gold (G): means topside wire bond thick film gold is used on the input/output & ground pads.
This chip device should be mounted film side up and wire or ribbon bonds used to make contact to the
input/output & ground pads.
Wire Bond Gold (WB1): indicates wire bond gold metallization is used on the input/output pads and
wraps around the ground pad with full backside gold metallization.
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
http://www.emct.com/microwavepassivecomponents-s17.html (2 of 6) [21/12/2004 02:41:38 ?]
Attenuators
Standard
Attenuators
TS03
Planar
Triple
Wrap
Single
Wrap
TS04
Planar
TS05
Planar
Triple
Wrap
Single
Wrap
Gold
Planar
Wire Bond
Gold
TS93
Triple Tab
TS95
Triple Tab
TT3
Planar
Triple
Wrap
Gold
Planar
Plating Option (Blank or No Code): 60/40 Solder Plated (60% Sn/40% Pb) low temperature tin/lead
is used.
Plating Option (S): 60/40 Solder Fused (60% Sn / 40% Pb) low temperature tin/lead solder fused. No
additional solder is required when using solder reflow methods.
Plating Option (F): No lead silver (Pure Ag) is used. Components meet RoHS compliance.
Customer Service
Need a customized part or assembly?
Need a sample?
Need a quote?
Request our catalog?
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
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TT5
Planar
Triple
Wrap
Gold
Planar
HPCA
Single
Wrap
Triple
Wrap
High Reliability
Attenuators
HR03
Planar
Triple
Wrap
Single
Wrap
HR05
Planar
Triple
Wrap
Single
Wrap
Planar
Gold
Wire Bond
Gold
HR5
Planar
Triple
Wrap
Gold
Planar
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
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HR93
Triple Tab
HR95
Triple Tab
Terminations
Chip
Terminations
SMT
Surface
Mount
CT High
Power
SC Low
Power
SC High
Reliability
Pill
Terminations
Smart Load®
PST-01
PST-02
PST-04
PST-06
Legacy Products
Rod Resistors
Coaxial
Attenuators
Coaxial
Terminations
Flange
Attenuators
54XX
55XX
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
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Stripline
Termination
811X
812X
823X and
827X
841X and
842X
843X and
847X
844X
845X
846X
848X
Specialty
Flush Mount
Terminations
Flange
Terminations
Flange
Resistors
Site Map
EMC Technology - MTVA - EMC Technologys MTVA Thermopads are microwave absorbtive atte...ow temperature solder plating or 60/40 solder fused finish for easy reflow processing.
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