FUJITSU MICROELECTRONICS
DATA SHEET
Copyright©2006-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2009.6
Spread Spectrum Clock Generator
MB88152A
MB88152A-100/101/102/110/111/112
■DESCRIPTION
MB88152A is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary
radiation noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with
the internal modulator. It corresponds to both of the center spread which modulates input frequency as Middle
Centered and down spread which modulates so as not to exceed input frequency.
■FEATURES
• Input frequency : 16.6 MHz to 134 MHz
• Output frequency : 16.6 MHz to 134 MHz
• Modulation rate : ± 0.5%, ± 1.5% (Center spread), − 1.0%, − 3.0% (Down spread)
• Equipped with oscillation circuit: Range of oscillation 16.6 MHz to 48 MHz
• Modulation clock output Duty : 40% to 60%
• Modulation clock Cycle-Cycle Jitter : Less than 100 ps
• Low current consumption by CMOS process : 5.0 mA (24 MHz : Typ-sample, no load)
• Power supply voltage : 3.3 V ± 0.3 V
• Operating temperature : − 40 °C to +85 °C
• Package : SOP 8-pin
DS04-29125-3E
MB88152A
2DS04-29125-3E
■PRODUCT LINE-UP
MB88152A has three kinds of input frequency, and two kinds of modulation type (center/down spread), total six line-
ups.
■PIN ASSIGNMENT
■PIN DESCRIPTION
Product Input/Output FrequencyModulation type Modulation enable pin
MB88152A-100 16.6 MHz to 134 MHz
Down spread
No
MB88152A-101 16.6 MHz to 67 MHz Yes
MB88152A-102 40 MHz to 134 MHz
MB88152A-110 16.6 MHz to 134 MHz
Center spread
No
MB88152A-111 16.6 MHz to 67 MHz Yes
MB88152A-112 40 MHz to 134 MHz
Pin name I/O Pin no. Description
XIN I 1 Crystal resonator connection pin/clock input pin
XOUT O 2 Crystal resonator connection pin
VSS ⎯3GND pin
SEL I 4 Modulation rate setting pin
CKOUT O 5 Modulated clock output pin
VDD ⎯6 Power supply voltage pin
FREQ/FREQ0 I 7 Frequency setting pin
XENS/FREQ1 I 8 Modulation enable setting pin/frequency setting pin
1
2
3
4
8
7
6
5
XIN
XOUT
V
SS
SEL
XENS
FREQ
V
DD
CKOUT
1
2
3
4
8
7
6
5
XIN
XOUT
V
SS
SEL
FREQ1
FREQ0
V
DD
CKOUT
MB88152A-101
MB88152A-102
MB88152A-111
MB88152A-112
MB88152A-100
MB88152A-110
FPT-8P-M02 FPT-8P-M02
TOP VIEW
MB88152A
DS04-29125-3E 3
■I/O CIRCUIT TYPE
Note : For XIN and XOUT pins, refer to “■OSCILLATION CIRCUIT”.
Pin Circuit type Remarks
SEL
FREQ
FREQ0
FREQ1
XENS
CMOS hysteresis input
CKOUT • CMOS output
•I
OL = 4 mA
MB88152A
4DS04-29125-3E
■HANDLING DEVICES
Preventing Latch-up
A latch-up can occur if , on this device, (a) a voltage higher than VDD or a voltage lo w er than VSS is applied to an
input or output pin or (b) a v oltage higher than the rating is applied betw een V DD and VSS pins . The latch-up, if it
occurs, significantly increases the power supply current and may cause thermal destruction of an element. When
you use this device, be very careful not to exceed the maximum rating.
Handling unused pins
Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or
pull-down resistor.
Unused output pin should be opened.
The attention when the external clock is used
Input the clock to XIN pin, and XOUT pin should be opened when you use the external clock.
Please pay attention so that an overshoot and an undershoot do not occur to an input clock of XIN pin.
Power supply pins
Please design connecting the pow er supply pin of this device b y as lo w impedance as possible from the current
supply source.
We recommend connecting electrolytic capacitor (about 10 μF) and the ceramic capacitor (about 0.01 μF) in
parallel between VSS and VDD pins near the device, as a bypass capacitor.
Oscillation Circuit
Noise near the XIN and XOUT pins may cause the device to malfunction. Design printed circuit boards so that
electric wiring of XIN or XOUT pin and resonator (or ceramic oscillator) do not intersect other wiring.
Design the printed circuit board that surrounds the XIN and XOUT pins with ground.
MB88152A
DS04-29125-3E 5
■BLOCK DIAGRAM
VDD
CKOUT
VSS
Rf = 1 MΩ
SEL
XOUT
XIN
FREQ/FREQ0
XENS/FREQ1
1
−
M
1
−
N
1
−
L
IDAC ICO
PLL block
Modulation rate setting
Frequency setting
Modulation enable /
Frequency setting
Reference clock
Clock output
Reference
clock
Phase
compare V/I
conversion Modulation
clock
output
Loop filter
Modulation logic
MB88152A PLL block
Modulation
rate setting/
Modulation
enable setting
Charge
pump
A glitchless IDAC (current output D/A converter) provides precise modulation, thereby
dramatically reducing EMI.
MB88152A
6DS04-29125-3E
■PIN SETTING
When changing the pin setting, the stabilization wait time for the modulation cloc k is required. The stabilization
wait time f or the modulation clock tak es the maximum v alue of Lock-Up time in “■ ELECTRICAL CHARA CTER-
ISTICS • AC characteristics Lock-Up time”.
Modulation enable setting
Note : MB88152A-100 and MB88152A-110 do not have XENS pin.
SEL modulation rate setting
Note : The modulation rate can be changed at the level of the terminal.
Frequency setting
Note : MB88152A-100 and MB88152A-110 do not have FREQ pin.
Frequency setting
Note : MB88152A-101, MB88152A-111, MB88152A-102 and MB88152A-112 have neither FREQ0 pin nor FREQ1
pin.
XENS Modulation
L Modulation MB88152A-101, MB88152A-102,
MB88152A-111, MB88152A-112
H No modulation
SEL Modulation rate Remarks
L
± 0.5%
MB88152A-110,
MB88152A-111,
MB88152A-112 Center spread
− 1.0%
MB88152A-100,
MB88152A-101,
MB88152A-102 Down spread
H
± 1.5%
MB88152A-110,
MB88152A-111,
MB88152A-112 Center spread
− 3.0%
MB88152A-100,
MB88152A-101,
MB88152A-102 Down spread
FREQ Frequency
L16.6 MHz to 40 MHz MB88152A-101, MB88152A-111
40 MHz to 80 MHz MB88152A-102, MB88152A-112
H33 MHz to 67 MHz MB88152A-101, MB88152A-111
66 MHz to 134 MHz MB88152A-102, MB88152A-112
FREQ1 FREQ0 Frequency
L L 16.6 MHz to 40 MHz
MB88152A-100, MB88152A-110
L H 33 MHz to 67 MHz
H L 40 MHz to 80 MHz
H H 66 MHz to 134 MHz
MB88152A
DS04-29125-3E 7
• Center spread
Spectrum is spread (modulated) by centering on the input frequency.
• Down spread
Spectrum is spread (modulated) below the input frequency.
−1.5% +1.5%
Radiation level
Input frequency
Frequency
Center spread example of ± 1.5% Modulation rate
3.0% modulation width
−3.0%
Radiation level
Input frequency
Frequency
Down spread example of − 3.0% Modulation rate
3.0% modulation width
MB88152A
8DS04-29125-3E
■ABSOLUTE MAXIMUM RATINGS
* : The parameter is based on VSS = 0.0 V.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Parameter Symbol Rating Unit
Min Max
Power supply voltage* VDD − 0.5 + 4.0 V
Input voltage* VIVSS − 0.5 VDD + 0.5 V
Output voltage* VOVSS − 0.5 VDD + 0.5 V
Storage temperature TST − 55 + 125 °C
Operation junction temperature TJ − 40 + 125 °C
Output current IO − 14 + 14 mA
Overshoot VIOVER ⎯VDD + 1.0 (tOVER ≤ 50 ns) V
Undershoot VIUNDER VSS − 1.0 (tUNDER ≤ 50 ns) ⎯V
VDD
VSS
Input pin
Overshoot/Undershoot
tUNDER ≤ 50 ns
tOVER ≤ 50 ns
VIOVER ≤ VDD + 1.0 V
VIUNDER ≤ VSS − 1.0 V
MB88152A
DS04-29125-3E 9
■RECOMMENDED OPERATING CONDITIONS (VSS = 0.0 V)
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
Parameter Symbol Pin Conditions Value Unit
Min Typ Max
Power supply voltage VDD VDD ⎯3.0 3.3 3.6 V
“H” level input voltage VIH
SEL,
FREQ/FREQ0,
XENS/FREQ1 ⎯VDD × 0.8 ⎯VDD + 0.3 V
XIN 16.6 MHz to 100 MHz VDD × 0.8 ⎯VDD + 0.3 V
100 MHz to 134 MHz VDD × 0.9 ⎯VDD + 0.3 V
“L” level input voltage VIL
SEL,
FREQ/FREQ0,
XENS/FREQ1 ⎯VSS ⎯VDD × 0.2 V
XIN 16.6 MHz to 100 MHz VSS ⎯VDD × 0.2 V
100 MHz to 134 MHz VSS ⎯VDD × 0.1 V
Input clock
duty cycle tDCI XIN 16.6 MHz to 100 MHz 40 50 60 %
100 MHz to 134 MHz 45 50 55
Input clock
slew rate SRIN XIN
Input frequency
40 MHz to 100 MHz 0.0475 ×
fin − 1.75 ⎯⎯
V/
ns
Input frequency
100 MHz to 134 MHz 3⎯⎯
Operating
temperature Ta ⎯⎯−40 ⎯ + 85 °C
Input clock duty cycle (tDCI = tb/ta)
MB88152A
10 DS04-29125-3E
trin tfin
XIN
Note : SRIN = (VDD × 0.80 − VDD × 0.20) /trin, SRIN = (VDD × 0.80 − VDD × 0.20) /tfin
VDD × 0.80
VDD × 0.20
Input clock slew rate (SRIN)
MB88152A
DS04-29125-3E 11
■ELECTRICAL CHARACTERISTICS
• DC Characteristics (Ta = −40 °C to + 85 °C, VDD = 3.3 V ± 0.3 V, VSS = 0.0 V)
Parameter Sym-
bol Pin Conditions Value Unit
Min Typ Max
Power supply current ICC VDD 24 MHz output
No load capacitance ⎯5.0 7.0 mA
Output voltage VOH CKOUT
“H” level output
IOH = − 4 mA VDD − 0.5 ⎯VDD V
VOL “L” level output
IOL = 4 mA VSS ⎯0.4 V
Output impedance ZOCKOUT 16.6 MHz to 134 MHz ⎯45 ⎯Ω
Input capacitance CIN
XIN,
SEL,
FREQ/
FREQ0,
XENS/
FREQ1
Ta = + 25 °C
VDD = VI = 0.0 V
f = 1 MHz ⎯⎯16 pF
Load capacitance CLCKOUT
16.6 MHz to 67 MHz ⎯⎯15
pF67 MHz to 100 MHz ⎯⎯10
100 MHz to 134 MHz ⎯⎯7
MB88152A
12 DS04-29125-3E
• AC Characteristics (Ta = −40 °C to + 85 °C, VDD = 3.3 V ± 0.3 V, VSS = 0.0 V)
Parameter Sym-
bol Pin Conditions Value Unit
Min Typ Max
Oscillation frequency fxXIN,
XOUT Fundamental oscillation 16.6 ⎯40 MHz
3rd over tone 40 ⎯48
Input frequency fin XIN
MB88152A-100/110 16.6 ⎯134
MHzMB88152A-101/111 16.6 ⎯67
MB88152A-102/112 40 ⎯134
Output frequency fOUT CKOUT
MB88152A-100/110 16.6 ⎯134
MHzMB88152A-101/111 16.6 ⎯67
MB88152A-102/112 40 ⎯134
Output slew rate SR CKOUT 0.4 V to 2.4 V
Load capacitance 15 pF 0.4 ⎯4.0 V/ns
Output clock duty cycle tDCC CKOUT 1.5 V 40 ⎯60 %
Modulation frequency
(Number of input clocks
per modulation)
fMOD
(nMOD) CKOUT
MB88152A-100/110
FREQ[1 : 0] = (00) fin/2640
(2640) fin/2280
(2280) fin/1920
(1920)
kHz
(clks)
MB88152A-100/110
FREQ[1 : 0] = (01) fin/4400
(4400) fin/3800
(3800) fin/3200
(3200)
MB88152A-100/110
FREQ[1 : 0] = (10) fin/5280
(5280) fin/4560
(4560) fin/3840
(3840)
MB88152A-100/110
FREQ[1 : 0] = (11) fin/8800
(8800) fin/7600
(7600) fin/6400
(6400)
MB88152A-101/111
FREQ = 0 fin/2640
(2640) fin/2280
(2280) fin/1920
(1920)
MB88152A-101/111
FREQ = 1 fin/4400
(4400) fin/3800
(3800) fin/3200
(3200)
MB88152A-102/112
FREQ = 0 fin/5280
(5280) fin/4560
(4560) fin/3840
(3840)
MB88152A-102/112
FREQ = 1 fin/8800
(8800) fin/7600
(7600) fin/6400
(6400)
Lock-Up time tLK CKOUT 16.6 MHz to 80 MHz ⎯25
ms
80 MHz to 134 MHz ⎯38
Cycle-cycle jitter tJC CKOUT No load capacitance,
Ta = + 25 °C,
VDD = 3.3 V ⎯⎯100 ps-
rms
MB88152A
DS04-29125-3E 13
<Definition of modulation frequency and number of input clocks per modulation>
MB88152A contains the modulation period to realize the efficient EMI reduction.
The modulation period fMOD depends on the input frequency and changes between fMOD (Min) and fMOD (Max) .
Furthermore, the average value of fMOD equals the typical value of the electrical characteristics.
t
f
MOD
(Min) f
MOD
(Max)
t
Modulation wave form
Clock count
nMOD (Max)
fout (Output frequency)
Clock count
nMOD (Min)
MB88152A
14 DS04-29125-3E
■OUTPUT CLOCK DUTY CYCLE (tDCC = tb/ta)
■INPUT FREQUENCY (fin = 1/tin)
■OUTPUT SLEW RATE (SR)
■CYCLE-CYCLE JITTER (tJC = | tn − tn + 1 |)
CKOUT
1.5 V
t
a
t
b
0.8 VDD
tin
XIN
2.4 V
0.4 V
tf
t
r
CKOUT
Note : SR = (2.4−0.4) /tr, SR = (2.4−0.4) /tf
tn+1tn
CKOUT
Note : Cycle-cycle jitter is defined the difference between a certain cycle and immediately after
(or, immediately before) .
MB88152A
DS04-29125-3E 15
■MODULATION WAVEFORM
fMOD
− 1.0 %
− 0.5 %
fMOD
− 1.5 %
+ 1.5 %
• ±1.5% modulation rate, Example of center spread
• −1.0% modulation rate, Example of down spread
CKOUT
output frequency
CKOUT
output frequency
Frequency at modulation OFF
Frequency at modulation OFF
Time
Time
MB88152A
16 DS04-29125-3E
■LOCK-UP TIME
If the setting pin is fixed at the “H” or “L” level, the maximum time after the power is turned on until the set clock
signal is output from CKOUT pin is (the stabilization wait time of input clock to XIN pin) + (the lock-up time “tLK”).
For the input clock stabilization time, check the characteristics of the resonator or oscillator used.
For modulation enable control using the XENS pin during normal operation, the set clock signal is output from
CKOUT pin at most the lock-up time (tLK) after the level at the XENS pin is determined.
Note : When the pin setting is changed, the CKOUT pin output clock stabilization time is required. Until the output
clock signal becomes stable, the output frequency, output clock duty cycle, modulation period, and cycle-
cycle jitter cannot be guaranteed. It is theref ore advisab le to perf orm processing such as cancelling a reset
of the device at the succeeding stage after the lock-up time.
3.0 V
VDD
XIN
Setting pin
SEL
FREQ1/XENS
FREQ0/FREQ
VIH
CKOUT
Internal clock
stabilization wait time
tLK
(lock-up time )
VIH VIL
XIN
XENS
CKOUT
tLK
(lock-up time ) tLK
(lock-up time )
MB88152A
DS04-29125-3E 17
■OSCILLATION CIRCUIT
The left side of figures below sho ws the connection ex ample about general resonator . The oscillation circuit has
the built-in feedbac k resistance (Rf). The v alue of capacity (C1 and C2) is required adjusting to the most suitab le
value of an individual resonator.
The right side of figures below shows the example of connecting for the 3rd over-tone resonator. The value of
capacity (C1, C2 and C3) and inductance (L1) is needed adjusting to the most suitable value of an individual
resonator. The most suitable value is different by individual resonator . Please refer to the resonator manufacturer
which you use for the most suitable v alue. When an external clock is used (the resonator is not used), input the
clock to XIN pin and do not connect anything with XOUT pin.
C1
Rf (1 MΩ)
C2C1
L1
Rf (1 MΩ)
C2C3
XIN Pin XOUT Pin XIN Pin XOUT Pin
MB88152A Internal
MB88152A External
Fundamental resonator 3rd over tone resonator
• When using an external clock
OPEN
Rf (1 MΩ)
Note : Note that a jitter characteristic of an input clock may cause an affect a cycle-cycle jitter
characteristic.
MB88152A LSI Internal
MB88152A LSI External
XOUT Pin
XIN Pin
External clock
• When using the resonator
MB88152A
18 DS04-29125-3E
■INTERCONNECTION CIRCUIT EXAMPLE
1
2
3
4
8
7
6
5
MB88152A
C1C2C4C3
R1
+
C1, C2 : Oscillation stabilization capacitance (refer to "■ OSCILLATION CIRCUIT”.)
C3 : Capacitor of 10 μF or higher
C4 : Capacitor about 0.01 μF (connect a capacitor of good high frequency
property (ex. laminated ceramic capacitor) to close to this device.)
R1 : Impedance matching resistor for board pattern
SEL
FREQ/FREQ0
XENS/FREQ1
MB88152A
DS04-29125-3E 19
■EXAMPLE CHARACTERISTICS
The condition of the examples of the character istics is shown as follows : Input frequency = 20 MHz (Output frequency =
20 MHz : Use for MB88152A-111)
Power-supply voltage = 3.3 V, None load capacity, Modulation rate = ±1.5% (center spread) .
Spectrum analyzer HP4396B is connected with CKOUT. The result of the measurement with, RBW = 1 kHz (ATT use for
−6 dB) .
CH B Spectrum 10 dB /REF 0 dBm
Avg
4
RBW# 1 kH
Z
VBW 1 kH
Z
ATT 6 dB
CENTER 20 MH
Z
SWP 2.505 s
SPAN 4 MH
Z
No modulation
−7.44 dBm
±1.5% modulation
−25.75 dBm
MB88152A
20 DS04-29125-3E
■ORDERING INFORMATION
Part number Input/Output
Frequency Modulation
type Modulation
enable pin Package Remarks
MB88152APNF-G-100-JNE1 16.6 MHz to 134 MHz Down spread No
8-pin plastic
SOP
(FPT-8P-M02)
MB88152APNF-G-101-JNE1 16.6 MHz to 67 MHz Down spread Yes
MB88152APNF-G-102-JNE1 40 MHz to 134 MHz Down spread Yes
MB88152APNF-G-110-JNE1 16.6 MHz to 134 MHz Center spread No
MB88152APNF-G-111-JNE1 16.6 MHz to 67 MHz Center spread Yes
MB88152APNF-G-112-JNE1 40 MHz to 134 MHz Center spread Yes
MB88152APNF-G-100-JNEFE1 16.6 MHz to 134 MHz Down spread No
8-pin plastic
SOP
(FPT-8P-M02)
Emboss
taping
(EF type)
MB88152APNF-G-101-JNEFE1 16.6 MHz to 67 MHz Down spread Yes
MB88152APNF-G-102-JNEFE1 40 MHz to 134 MHz Down spread Yes
MB88152APNF-G-110-JNEFE1 16.6 MHz to 134 MHz Center spread No
MB88152APNF-G-111-JNEFE1 16.6 MHz to 67 MHz Center spread Yes
MB88152APNF-G-112-JNEFE1 40 MHz to 134 MHz Center spread Yes
MB88152APNF-G-100-JNERE1 16.6 MHz to 134 MHz Down spread No
8-pin plastic
SOP
(FPT-8P-M02)
Emboss
taping
(ER type)
MB88152APNF-G-101-JNERE1 16.6 MHz to 67 MHz Down spread Yes
MB88152APNF-G-102-JNERE1 40 MHz to 134 MHz Down spread Yes
MB88152APNF-G-110-JNERE1 16.6 MHz to 134 MHz Center spread No
MB88152APNF-G-111-JNERE1 16.6 MHz to 67 MHz Center spread Yes
MB88152APNF-G-112-JNERE1 40 MHz to 134 MHz Center spread Yes
MB88152A
DS04-29125-3E 21
■PACKAGE DIMENSION
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
8-pin plastic SOP Lead pitch 1.27 mm
Package width
×
package length
3.9 × 5.05 mm
Lead shape Gullwing
Sealing method Plastic mold
Mounting height 1.75 mm MAX
Weight 0.06 g
8-pin plastic SOP
(FPT-8P-M02)
(FPT-8P-M02)
C
2002 FUJITSU LIMITED F08004S-c-4-7
1.27(.050)
3.90±0.30 6.00±0.40
.199 –.008
+.010
–0.20
+0.25
5.05
0.13(.005)
M
(.154±.012) (.236±.016)
0.10(.004)
14
58
0.44±0.08
(.017±.003)
–0.07
+0.03
0.22
.009 +.001
–.003
45
˚
0.40(.016) "A" 0~8
˚
0.25(.010)
(Mounting height)
Details of "A" part
1.55±0.20
(.061±.008)
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.15±0.10
(.006±.004)
(Stand off)
0.10(.004)
*1
*2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
©2002-2008 FUJITSU MICROELECTRONICS LIMITED F08004S-c-4-8
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
MB88152A
22 DS04-29125-3E
MEMO
MB88152A
DS04-29125-3E 23
MEMO
MB88152A
iFUJITSU MICROELECTRONICS LIMITED
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Shinjuku-ku, Tokyo 163-0722, Japan
Tel: +81-3-5322-3329
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Specifications are subject to change without notice. For further information please contact each office.
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The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS
or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or
other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to
the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear
facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon
system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of
the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department