2001 Microchip Technology Inc. DS11187E-page 1
MCP100/101
FEATURES
• Holds microcontroller in reset until supply voltage
reaches stable operating level
• Resets microc on troller during pow e r loss
• Precision monitoring of 3V, 3.3V and 5V systems
• 7 volt a ge trip poi nt s avai lab le
• Active low RESET pin (MCP100/101) or active
high RESET (DSTEMP)
• Push-pull output
• Holds RESET/RESET for 350 ms (typical)
• RESET/RESET to VDD = 1.0V
• Accur acy of ± 125 mV for 5V syst ems and ± 75 mV
for 3V systems over temperature
•45 µA typical operating current
• Temperature range:
- Industrial (I): -40°C to +85°C
DESCRIPTION
The Microchip Technology Inc. MCP100/101 is a volt-
age supervisory device designed to keep a microcon-
troller in reset until the system voltage has reached the
proper level and stabilized. It also operates as protec-
tion f rom brown-out conditions wh en the supply voltage
drops below a safe operating level. Both devices are
available with a choice of seven different trip voltages
and both have push-pull outputs. The MCP100/101 has
a low active RESET pin and the DSTEMP has a high
active RESET pin. The MCP100/101 will assert the
RESET/RESET signal whenever the voltage on the
VDD pin is below the trip-point voltage.
PACKAGES
BLOCK DIAGRAM
VSS
VDD
RST
VSS
VDD
VSS
VDD
TO-92 with ‘D’ Bondout
TO-92 with ‘H’ Bondout
SOT-23-3
RST
or
RST
RST
or
RST
RST
or
Bandgap
Reference
Delay
Circuit Output
Driver RESET
VDD
+
-
Comparator
RESET
or
Microcontroller Supervisory Circuit with Push-Pull Output
MCP100/101
DS11187E-page 2 2001 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maximum Ratings*
VDD........................................................................7.0V
All inputs and outputs w.r.t. VSS .....-0.6V to VDD +1.0V
Storage temperature ..........................-65°C to +150°C
Ambient temp. with powe r appli ed.....-65°C to +125°C
ESD protection on all pins ..................................... ≥ 2 kV
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the devi ce at those or any other c onditions ab ove those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
DC AND AC CHARACTERISTICS
All param eters apply at the specifie d
temp and voltage ranges unless
otherwise noted.
VDD= 1.0 - 5.5V
Industrial (I): -40°C to +85°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Operati ng Voltage Range VDD 1.0 —5.5 V
VDD Va lue to RESET/RESET VDDMIN 1.0 —— V
Operati ng Curren t IDD —45 60 µAVDD = 5.5V (no load)
VDD Trip Point MCP10X-270
MCP10X-300
MCP10X-315
MCP10X-450
MCP10X-460
MCP10X-475
MCP10X-485
VTRIP 2.55
2.85
3.0
4.25
4.35
4.50
4.60
2.625
2.925
3.075
4.375
4.475
4.625
4.725
2.7
3.0
3.15
4.50
4.60
4.75
4.85
V
RESET Low Level
Output Voltage
(MCP100)
MCP100-270
MCP100-300
MCP100-315
VOL ——0.4 V IOL = 3.2 mA,
VDD = VTRIPMIN
MCP100-450
MCP100-460
MCP100-475
MCP100-485
——0.6 IOL = 8.5 mA,
VDD = VTRIPMIN
RESET High Leve l
Output Voltage
(MCP100)
MCP100-XXX
(All VTRIP Points) VOH VDD-0.7 —— VIOH = 3 mA,
VDD > VTRIPMAX
RESET Low Level
Output Voltage
(MCP101)
MCP101-270
MCP101-300
MCP101-315
VOL ——0.4 V IOL = 3.2 mA,
VDD > VTRIPMAX
MCP101-450
MCP101-460
MCP101-475
MCP101-485
——0.6 IOL = 8.5 mA,
VDD > VTRIPMAX
RESET High lev el
Output Voltage
(MCP101)
MCP101-XXX
(All VTRIP Points) VOH VDD-0.7 —— VIOH = 3 mA,
VDD = VTRIPMIN
Threshold Hysteresis VHYS —50 —mV
VDD Detect to RESET/RESET
Inactive tRPU 150 350 700 ms
VDD Detect to RESET/RESET tRPD —10 —µsVDD ramped from
VTRIPMAX + 250 mV down to
VTRIPMIN - 250 mV
2001 Microchip Technology Inc. DS11187E-page 3
MCP100/101
Figure 1-1: MCP100/101 Timing Diagram
VDD
RESET VOH
tRPU
VTRIP
tRPD
VOL
RESET
(MCP100)
(MCP101)
VOL
MCP100/101
DS11187E-page 4 2001 Microchip Technology Inc.
2.0 APPLICATIONS INFORMATION
2.1 The Need for Supervisory Circuits
For many of t oday’s microcontroller applications, care
must be taken to prevent low power conditions that
can cause many different system problems. The most
common causes are brown-out conditions where the
system supply dr ops belo w the operatin g level mome n-
ta rily , and the second, is w hen a slowly de caying power
supply causes the microcontroller to begin executing
instructions without enough voltage to sustain SRAM
and producing indeterminate results.
Figure 2-1: Typical Application
2.2 Negative Going VDD Transients
Many s ystem desi gners im plementi ng POR circuit s ar e
concerned about the minimum pulse width required
to cause a reset. Figure 2-2 shows typical transient
duration vs. reset comparator overdrive for which the
MCP100/101 will not generate a reset pulse. It shows
that the farther below the trip point the transient pulse
goes, the duration of the pulse required to cause a
reset gets shorter. A 0.1 µF bypass cap mounted as
close as possible to the VDD pin provides additional
transient immunity.
Figure 2-2: Typical Transient Respo nse
Microcontroller
MCLR
VSS
RST
MCP100
or
RESET
VSS
VDD
VDD
Bypass
Capacitor
VDD
TIME
SUPPLY VOLTAGE
0
0
5V VTRIPMAX
VTRIPMIN
Transient
Duration
(VTRIPMIN - VDD)
0123
VTRIP - VDD (V)
10
8
6
4
2
0
TRANSIENT DURATION (
µ
S)
45
TA = +25°C
Transients above the
curve will caus e a reset
Transients below
the curve will NOT
cause a reset
2001 Microchip Technology Inc. DS11187E-page 5
MCP100/101
2.3 Effect of Temperature on Timeout
Period (tRPU)
The timeout period (tRPU) determines how long the
device remains in the reset condition. This is controlle d
by an internal RC timer and is effected by both VDD
and temperature. The graph shown in Figure 2-3
shows typical response for different VDD values and
temperatures.
Figure 2-3: Typical tRPU vs. Temperature
Figure 2-4: IDD vs. Temperature
Figure 2-5: Normalized V TRIP vs. Temperature
Figure 2-6: VOL vs. IOL
-40 -20 20 60
TEMPERATURE (°C)
600
500
400
300
200
100
TIMEOUT PERIOD (tRPU) (ms )
80 100040
700
VDD = 5V
VDD = 4V
VDD = 3V
VDD = 6V
-40 -20 20 60
TEMPERATURE (°C)
50
40
30
20
10
0
OPERATING CURRENT (mA)
80 100040
60
VDD = 5V
VDD = 3V
VDD = 4V
VDD = 5.5V
-40 -20 20 60
TEMPERATURE (°C)
1.000
0.998
0.996
0.994
0.992
0.997
NORMALIZED THRESHOLD* (V TRIP
)
80 100040
1.002
*Multiply value at 25°C by this
factor to determine the value at
temperature
02 6 10
500
400
300
200
100
0
VOL (mV)
1248
600
700
800
14 16 18 20
VDD = 4.5V
VDD = 2.5V
TA = +25°C
IOL (mA)
VDD = 3.5V
VDD = 1.5V
MCP100/101
DS11187E-page 6 2001 Microchip Technology Inc.
Figure 2-7: Normalized IOL vs. Temperature
Figure 2-8: VDD - VOH vs. IOH
Figure 2-9: Normalized VOH vs. Temperature
-40 -20 20 60
TEMPERATURE (°C)
1.2
1.1
1.00
0.9
0.8
0.7
NORMALIZED IOL*
80 100040
1.3
*Multiply value at 25°C by this
factor to determine the value at
temperature
02 6 10
500
400
300
200
100
0
VDD - VOH (mV)
48
600
700
800 VDD = 3.5V
VDD = 5V
VDD = 2.5V
TA = +25°C
IOH (mA)
-40 -20 20 60
TEMPERATURE (°C)
1.06
1.04
1.00
0.98
0.96
0.94
NORMALIZED V OH*
80 100040
1.08
0.88
0.90
0.92
1.02
*Multiply value at 25°C by this
factor to determine the value at
temperature
VDD = 4.5V
IOH = 8.5mA
VDD = 3V
IOH = 3.2mA
2001 Microchip Technology Inc. DS11187E-page 7
MCP100/101
3.0 PACKAGING INFORMATION
3.1 Package Marking Information
3-Lead Plastic Transistor Outline (TO-92) Example:
3-Lead Plastic Small Outline Transistor (SOT23) Example:
Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanum eri c trac eab ili ty code
Note: In the even t the full Micro chip part numbe r cannot be marke d on one line, it will
be carrie d over to the next line thus limi ting the nu mber of ava ilable ch aracters
for customer specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
For OT P mark ing beyond this, c ert ain price ad ders a ppl y. Please c heck with your M icr ochip Sales Of fice.
For QTP devices, any special marking adders are included in QTP price.
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP100
XXXXXX
XXXXXX
YWWNNN
XXNN RKNN
SOT23 PARTS LABELING:
The table below identifies the first 2 characters (XX) in the 4-character field
(XXNN) for marking of the 3-Lead SOT23 package.
Mark Part Number Mark Part Number
QJ MCP100T-270I/TT RJ MCP101T-270I/TT
QK MCP100T-300I/TT RK MCP101T-300I/TT
QL MCP100T-315I/TT RL MCP101T-315I/TT
QM MCP100T-450I/TT RM MCP101T-450I/TT
QN MCP100T-460I/TT RN MCP101T-460I/TT
QO MCP100T-475I/TT RO MCP101T-475I/TT
QP MCP100T-485I/TT RP MCP101T-485I/TT
MCP100/101
DS11187E-page 8 2001 Microchip Technology Inc.
3.2 Package Detail Inform ation
3-Lead Plastic Transistor Outline (TO) (TO-92)
432432
β
Mold Draft Angle Bottom 654654
α
0.560.480.41.022.019.016BLead Width 0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius 4.954.644.32.195.183.170DOverall Len gth 4.954.714.45.195.186.175E1Overall Width 3.943.623.30.155.143.130ABottom to Package Flat 1.27.050
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mit s MILLIMETERSINCHES*Units
R
n
1
3
α
p
L
B
A
c
β
1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
2001 Microchip Technology Inc. DS11187E-page 9
MCP100/101
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004
c
Lead Thickness 10501050
φ
Foot Angle 0.550.450.35.022.018.014LFoot Length 3.042.922.80.120.115.110DOverall Length 1.401.301.20.055.051.047
E1
Molded Package Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff §1.020.950.88.040.037.035A2Molded Package Thickness 1.121.010.89.044.040.035AOverall Height 1.92.076
p1
Outside lead pitch (basic) 0.96.038
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mit s MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
MCP100/101
DS11187E-page 10 2001 Microchip Technology Inc.
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2001 Microchip Technology Inc. DS11187E-page 11
MCP100/101
READER RESPONSE
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DS11187E
MCP100/101
MCP100/101
DS11187E-page 12 2001 Microchip Technology Inc.
NOTES:
2001 Microchip Technology Inc. DS11187E-page 13
MCP100/101
NOTES:
MCP100/101
DS11187E-page 14 2001 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or to obtain information (e.g., on pricing or delivery), please refer to the factory or the listed sales offi ces .
Sales and Support
PART NO. X/XX
PackageTemperature
Range
Device
Device: MCP100/101:Supervisor circuit with active low RESET
output
MCP100/101T:Supervisor circuit with active low RESET
output (tape & reel)
DSTEMP: Supervisor circuit with active high RESET
output
DSTEMPT: Supervisor circuit with active high RESET
output (tape & reel)
RESET/RESET VTRIP
Voltage: 270 = 2.55 ≤ VTRIP ≤ 2.70
300 = 2.85 ≤ VTRIP ≤ 3.00
315 = 3.00 ≤ VTRIP ≤ 3.15
450 = 4.25 ≤ VTRIP ≤ 4.50
460 = 4.35 ≤ VTRIP ≤ 4.60
475 = 4.50 ≤ VTRIP ≤ 4.75
485 = 4.60 ≤ VTRIP ≤ 4.85
Bondout Opt ion:
(TO-92 Only) D = D Bond Option (see bond option chart)
H = H Bond Option
Temperature Range: I = -40°C to +85°C (only offered in I)
Package: TO = TO-92 (3-lead) [offered in bags only]
TT = SOT-23 (3-lead) [offered in tape & reel only]
Examples:
a) MCP100/101–270DI/TO = Vtrip range of
2.55V - 2.70V, Bonding Option D, Industrial
Te m p ., TO- 9 2 package
b) MCP100/101T–450I/TT = Vtrip range of
4.25V - 4.50V, Industrial Temp., SOT-23
package
c) DSTEMP–270HI/T O = Vtrip range of 2.55V -
2.70V, Bonding Option H, Industrial Temp.,
TO-92 package
d) DSTEMPT–315I/TT = Vtrip range of 3.00V -
3.15V, Industrial Temp., SOT-23 package
VSS
VDD
RST VSS
VDD
VSS
VDD
TO-92 with
‘D’ Bondout TO-92 with
‘H’ Bondout
SOT-23-3
RST
or
RST
RST
or
RST
RST
or
X
Bondout
Option
X
RESET/
RESET
VTRIP
Voltage
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determi ne if an errata sheet exists for a particular device, please contact one of the following:
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Please specify which device, revision of silicon and Data S heet (include Literature #) you are using.
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2001 Microchip Technology Inc. DS11187E-page 15
MCP100/101
“All rights reserved. Copyright © 2001, Microchip
Technology Incorporated, USA. Information contained
in this publication regardin g device applicatio ns and the
like is intended through suggestion only and may be
superse ded by updates . No repr esent ati on or warrant y
is given and no liabil ity is assume d by Microchip
Technology Incorporated with respect to the accuracy
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© 2001, M icr oc hip Technology Inco rpo rate d, Prin ted in
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DS11187E-page 16
2001 Microchip Technology Inc.
All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 2/01 Printed on recycled paper.
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No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Hong Kong
Microchip Asia Pacific
RM 2101, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaiso n Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Intl. Inc.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku -Ku, Yok oha ma -shi
Kanaga wa, 222 -0 033 , Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC (continued)
Korea
Microc hip Technology Ko rea
168-1, Young bo Bld g. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Ko re a
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Midd le Ro ad
#07-02 Prime Centre
Singapore, 188980
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan
Microc hip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Denmark ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Arizona Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trap u
Batiment A - ler Et age
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Germany
Analog Product Sales
Lochhamer Strasse 13
D-82152 Martinsried, Germany
Tel: 49-89-895650-0 Fax: 49-89-895650-22
Italy
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berksh ire, E ngla nd RG 41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
01/30/01
