Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 4 January 2008
WJA1001
+5V Active-Bias InGaP HBT Gain Block
Product Features
50 – 3000 MHz
19 dB Gain @ 900MHz
+20 dBm P1dB @ 900MHz
+45 dBm OIP3 @ 900MHz
+5V Single Supply
Low current draw (100 mA)
Unconditionally stable
Internally matched to 50
Robust 1000V ESD, Class 1C
Lead-free/green/RoHS-compliant
SOT-89 package
Applications
GSM, PCS, CDMA, WCDMA
WiMAX, WiBro
Repeaters, BTS Transceivers
RFID
Product Description
The WJA1001 is a cascadable gain block that offers high
linearity in a low-cost surface-mount package. At 900 MHz,
the WJA1001 typically provides 19 dB gain, +45 dBm OIP3,
and +20 dBm P1dB. The device is housed in a lead-
free/green/RoHS-compliant SOT-89 SMT package using a
NiPdAu plating to eliminate the possibility of tin whiskering.
The WJA1001 consists of a Darlington-pair amplifier using
a high reliability InGaP/GaAs HBT process technology.
The amplifier has been optimized internally to offer very
high linearity performance at 1 GHz while drawing very
low current. The MMIC amplifier is internally matched to
50 and only requires DC-blocking capacitors and a bias
inductor for operation. An internal active bias is designed
to enable stable performance over temperature and allow
for operation directly from a +5V supply voltage.
The broadband amplifier can be directly applied to various
current and next generation wireless technologies such as
GSM, CDMA, W-CDMA, WiBro, and WiMAX. The
WJA1001 is ideal for general purpose applications such as
LO buffering or amplification and pre-driver stages within
the 50 to 3000 MHz frequency range.
Functional Diagram
RF IN GND
RF OUT
GND
12 3
4
Function Pin No.
Input 1
Output/Bias 3
Ground 2, 4
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz 50 3000
Test Frequency MHz 900
Gain dB 19
Input Return Loss dB 12
Output Return Loss dB 14
Output P1dB dBm +19.7
Output IP3 (2) dBm +44.5
Noise Figure dB 5.4
Device Voltage V 5.0
Device Current mA 100
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 System. S-parameters and 3OIP measured at
device pins. All other specifications measured on evaluation board.
2. 3OIP measured with two tones at an output power of +8 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Storage Temperature -55 to +150 C
Supply Voltage +6.5 V
Input Power +24 dBm
θjc (junction to paddle) 80.6 C / W
Maximum Junction Temperature 150 C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (3)
Parameter Units Typical
Frequency MHz 200 500 900 1900 2100
S21 dB 19.6 19.2 18.5 16.7 16.4
S11 dB -13 -15 -18 -30 -26
S22 dB -22 -20 -15 -11 -12
Output P1dB dBm +20.4 +20.3 +19.7 +19.2 +18.1
Output IP3 (2) dBm +39.7 +39 +44 +34 +34
Noise Figure dB 4.8 5.0 5.4 6.1 6.4
3. Listed typical performance parameters measured on evaluation board.
Ordering Information
Part No. Description
WJA1001 +5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
WJA1001-PCB 50 3000 MHz Fully Assembled Eval. Board
Standard tape / reel size = 1000 pieces on a 7 reel
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 4 January 2008
WJA1001
+5V Active-Bias InGaP HBT Gain Block
Typical Evaluation Board RF Performance
Supply Bias = +5V, Icc = 100 mA
Gain vs. Frequency
0
5
10
15
20
25
0 1000 2000 3000
Frequency (MHz)
Gain (dB)
-40C +25C +85C
Return Loss vs. Frequency
-35
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000
Frequency (MHz)
S11, S22 (dB)
S11 S22
NF vs. Frequency
0
2
4
6
8
10
0 1000 2000 3000
Frequency (MHz)
NF (dB)
-40C +25C +85C
OIP3 vs. Output Power
Frequency = 900MHz, T = 25C
25
30
35
40
45
0 2 4 6 8 10 12
Output Power per tone (dBm)
OIP3 (dBm)
OIP3 vs. Frequency
Pout = 8dBm/tone
25
30
35
40
45
0 1000 2000 3000
Frequency (MHz)
OIP3 (dBm)
-40C +25C +85C
OIP3 vs. Vcc
Frequency = 900MHz, T = 25C
25
30
35
40
45
4.7 4.8 4.9 5 5.1 5.2
Supply Voltage (V)
OIP3 (dBm)
P1dB vs. Frequency
12
14
16
18
20
22
0 1000 2000 3000
Frequency (MHz)
P1dB (dBm)
-40C +25C +85C
P1dB vs. Vcc
Frequency = 900MHz, T = 25C
12
14
16
18
20
22
4.7 4.8 4.9 5 5.1 5.2
Supply Voltage (V)
P1dB (dBm)
Icc vs. Vcc
Frequency = 900MHz, T = 25C
60
70
80
90
100
110
120
4.7 4.8 4.9 5 5.1 5.2
Supply Voltage (V)
Icc (mA)
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 4 January 2008
WJA1001
+5V Active-Bias InGaP HBT Gain Block
Application Circuit
Recommended Component Values (1)
Ref. Name Value / Type Size
L1 470 nH ferrite core wire wound inductor (2) 0805
C1, C2 1000 pF NPO chip capacitor 0603
C3 0.018 F chip capacitor 0603
R1, R2, R4 0 (3) 0603
C4, C5, C6,
R3, R5, R6,
R7, R8
Do Not Place (3)
1. The listed values are contained on the evaluation board to achieve optimal broadband performance
2. For lower cost and performance (500 – 2000 MHz) option use 39 nH ceramic core wire wound inductor.
3. Place holders for the 0 resistors and “Do Not Place” references are not needed for final design.
Typical Device Data
S-Parameters (Vdevice = +5 V, ICC = 100 mA, T = 25 C, calibrated to device leads)
Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
10 -16.19 -74.53 22.52 170.02 -25.75 12.97 -11.35 -37.50
50 -13.73 -150.31 20.24 167.55 -23.34 6.00 -17.22 -110.83
100 -13.40 -165.59 19.82 167.74 -23.16 2.19 -18.78 -136.33
200 -13.27 -173.49 19.60 162.77 -23.09 -1.09 -19.05 -148.58
400 -12.67 -178.71 19.50 149.81 -23.01 -4.76 -18.29 -151.10
600 -12.13 177.74 19.35 136.50 -22.97 -8.79 -17.08 -151.78
800 -11.99 172.41 19.15 122.68 -22.90 -12.46 -15.70 -150.91
1000 -12.07 163.93 18.99 109.45 -22.85 -16.03 -13.92 -151.81
1200 -12.02 152.87 18.73 94.83 -22.84 -19.42 -12.73 -157.08
1400 -11.71 142.18 18.33 81.54 -22.75 -23.24 -11.59 -165.19
1600 -11.76 132.89 18.10 67.63 -22.81 -27.41 -10.74 -173.87
1800 -12.61 125.70 17.71 53.78 -22.66 -30.65 -9.99 179.93
2000 -14.95 116.23 17.35 40.27 -22.75 -35.01 -9.15 175.81
2200 -18.89 100.16 16.88 26.53 -22.71 -38.53 -8.48 171.38
2400 -24.73 70.36 16.27 12.71 -22.78 -41.54 -8.13 165.83
2600 -32.51 32.55 15.76 -1.15 -22.67 -45.93 -8.09 157.59
2800 -28.92 -123.80 15.14 -14.50 -22.65 -49.54 -8.09 148.86
3000 -18.69 -139.28 14.31 -28.11 -22.55 -53.67 -7.84 140.92
3200 -13.74 -143.12 13.44 -41.58 -22.62 -57.98 -7.43 135.57
3400 -10.86 -145.10 12.37 -53.94 -22.64 -61.93 -7.02 130.30
3600 -9.38 -150.89 11.40 -65.62 -22.59 -65.84 -6.80 126.09
3800 -8.61 -162.51 10.54 -76.54 -22.46 -69.00 -6.67 121.50
4000 -7.74 -178.88 9.54 -88.57 -22.15 -73.94 -6.65 116.69
Device S-parameters are available for Download from the website at: http://www.wj.com
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
Bypass
Capacitor
R4
0
RF IN
C2
Blocking
Vcc =+5.00V
Icc = 100 mA
WJA1001
R1
0 R2
0
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 4 January 2008
WJA1001
+5V Active-Bias InGaP HBT Gain Block
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded
(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The WJA1001 will be marked with an “A1001”
designator with an alphanumeric lot code
marked below the part designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value: Passes 1000V min.
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value: Passes 1000V min.
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
A1001
XXXX
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X