WJA1001 +5V Active-Bias InGaP HBT Gain Block Product Features 50 - 3000 MHz 19 dB Gain @ 900MHz +20 dBm P1dB @ 900MHz +45 dBm OIP3 @ 900MHz +5V Single Supply Low current draw (100 mA) Unconditionally stable Internally matched to 50 Robust 1000V ESD, Class 1C Lead-free/green/RoHS-compliant SOT-89 package Applications GSM, PCS, CDMA, WCDMA WiMAX, WiBro Repeaters, BTS Transceivers RFID Product Description The WJA1001 is a cascadable gain block that offers high linearity in a low-cost surface-mount package. At 900 MHz, the WJA1001 typically provides 19 dB gain, +45 dBm OIP3, and +20 dBm P1dB. The device is housed in a leadfree/green/RoHS-compliant SOT-89 SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering. Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current GND 4 The WJA1001 consists of a Darlington-pair amplifier using a high reliability InGaP/GaAs HBT process technology. The amplifier has been optimized internally to offer very high linearity performance at 1 GHz while drawing very low current. The MMIC amplifier is internally matched to 50 and only requires DC-blocking capacitors and a bias inductor for operation. An internal active bias is designed to enable stable performance over temperature and allow for operation directly from a +5V supply voltage. 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 The broadband amplifier can be directly applied to various current and next generation wireless technologies such as GSM, CDMA, W-CDMA, WiBro, and WiMAX. The WJA1001 is ideal for general purpose applications such as LO buffering or amplification and pre-driver stages within the 50 to 3000 MHz frequency range. Specifications (1) Parameter Functional Diagram Typical Performance (3) Units Min MHz MHz dB dB dB dBm dBm dB V mA 50 Typ Max Parameter Units 3000 Frequency S21 900 19 12 14 +19.7 +44.5 5.4 5.0 100 S11 S22 Typical MHz dB 200 19.6 500 19.2 900 18.5 1900 16.7 2100 16.4 dB dB -13 -22 -15 -20 -18 -15 -30 -11 -26 -12 Output P1dB dBm +20.4 +20.3 +19.7 +19.2 +18.1 Output IP3 (2) dBm +39.7 +39 +44 +34 +34 Noise Figure dB 4.8 5.0 5.4 6.1 6.4 3. Listed typical performance parameters measured on evaluation board. 1. Test conditions: 25 C, Supply Voltage = +5 V, 50 System. S-parameters and 3OIP measured at device pins. All other specifications measured on evaluation board. 2. 3OIP measured with two tones at an output power of +8 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Storage Temperature Supply Voltage Input Power jc (junction to paddle) Maximum Junction Temperature Rating -55 to +150 C +6.5 V +24 dBm 80.6 C / W 150 C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. WJA1001 WJA1001-PCB Description +5V Active Bias InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Package) 50 - 3000 MHz Fully Assembled Eval. Board Standard tape / reel size = 1000 pieces on a 7 reel Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 4 January 2008 WJA1001 +5V Active-Bias InGaP HBT Gain Block Typical Evaluation Board RF Performance Supply Bias = +5V, Icc = 100 mA Gain vs. Frequency NF vs. Frequency Return Loss vs. Frequency 25 10 0 -5 20 15 10 -15 6 NF (dB) Gain (dB) S11, S22 (dB) 8 -10 -20 4 -25 5 -40C +25C -30 +85C S11 0 1000 2000 Frequency (MHz) 0 3000 1000 2000 Frequency (MHz) 3000 OIP3 vs. Vcc 40 40 OIP3 (dBm) OIP3 (dBm) 45 35 30 -40C +25C +85C 25 2 4 6 8 Output Power per tone (dBm) 10 12 0 1000 2000 Frequency (MHz) 3000 20 12 0 1000 2000 Frequency (MHz) 3000 12 4.7 5.2 100 90 80 14 +85C 5.1 110 16 +25C 5.2 Icc vs. Vcc 18 16 5.1 Frequency = 900MHz, T = 25C Icc (mA) 18 4.9 5 Supply Voltage (V) 120 P1dB (dBm) 20 -40C 4.8 Frequency = 900MHz, T = 25C 22 14 25 4.7 P1dB vs. Vcc P1dB vs. Frequency 22 3000 Frequency = 900MHz, T = 25C 45 30 25 2000 Frequency (MHz) 35 30 +85C 1000 Pout = 8dBm/tone 35 0 0 OIP3 vs. Frequency Frequency = 900MHz, T = 25C 40 +25C 0 OIP3 vs. Output Power 45 OIP3 (dBm) -40C -35 0 P1dB (dBm) 2 S22 70 4.8 4.9 5 Supply Voltage (V) 5.1 5.2 60 4.7 4.8 4.9 5 Supply Voltage (V) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 4 January 2008 WJA1001 +5V Active-Bias InGaP HBT Gain Block Vcc =+5.00V Icc = 100 mA Application Circuit R4 0 C3 Bypass Capacitor L1 RF Choke RF IN RF OUT WJA1001 C1 Blocking Capacitor R1 0 R2 0 C2 Blocking Capacitor Recommended Component Values (1) Ref. Name Value / Type L1 470 nH ferrite core wire wound inductor (2) C1, C2 1000 pF NPO chip capacitor C3 0.018 F chip capacitor R1, R2, R4 0 (3) C4, C5, C6, Do Not Place (3) R3, R5, R6, R7, R8 1. 2. 3. Size 0805 0603 0603 0603 The listed values are contained on the evaluation board to achieve optimal broadband performance For lower cost and performance (500 - 2000 MHz) option use 39 nH ceramic core wire wound inductor. Place holders for the 0 resistors and "Do Not Place" references are not needed for final design. Typical Device Data S-Parameters (Vdevice = +5 V, ICC = 100 mA, T = 25 C, calibrated to device leads) Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) 10 -16.19 -74.53 22.52 170.02 -25.75 50 -13.73 -150.31 20.24 167.55 -23.34 100 -13.40 -165.59 19.82 167.74 -23.16 200 -13.27 -173.49 19.60 162.77 -23.09 400 -12.67 -178.71 19.50 149.81 -23.01 600 -12.13 177.74 19.35 136.50 -22.97 800 -11.99 172.41 19.15 122.68 -22.90 1000 -12.07 163.93 18.99 109.45 -22.85 1200 -12.02 152.87 18.73 94.83 -22.84 1400 -11.71 142.18 18.33 81.54 -22.75 1600 -11.76 132.89 18.10 67.63 -22.81 1800 -12.61 125.70 17.71 53.78 -22.66 2000 -14.95 116.23 17.35 40.27 -22.75 2200 -18.89 100.16 16.88 26.53 -22.71 2400 -24.73 70.36 16.27 12.71 -22.78 2600 -32.51 32.55 15.76 -1.15 -22.67 2800 -28.92 -123.80 15.14 -14.50 -22.65 3000 -18.69 -139.28 14.31 -28.11 -22.55 3200 -13.74 -143.12 13.44 -41.58 -22.62 3400 -10.86 -145.10 12.37 -53.94 -22.64 3600 -9.38 -150.89 11.40 -65.62 -22.59 3800 -8.61 -162.51 10.54 -76.54 -22.46 4000 -7.74 -178.88 9.54 -88.57 -22.15 S12 (ang) 12.97 6.00 2.19 -1.09 -4.76 -8.79 -12.46 -16.03 -19.42 -23.24 -27.41 -30.65 -35.01 -38.53 -41.54 -45.93 -49.54 -53.67 -57.98 -61.93 -65.84 -69.00 -73.94 S22 (dB) -11.35 -17.22 -18.78 -19.05 -18.29 -17.08 -15.70 -13.92 -12.73 -11.59 -10.74 -9.99 -9.15 -8.48 -8.13 -8.09 -8.09 -7.84 -7.43 -7.02 -6.80 -6.67 -6.65 S22 (ang) -37.50 -110.83 -136.33 -148.58 -151.10 -151.78 -150.91 -151.81 -157.08 -165.19 -173.87 179.93 175.81 171.38 165.83 157.59 148.86 140.92 135.57 130.30 126.09 121.50 116.69 Device S-parameters are available for Download from the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 4 January 2008 WJA1001 +5V Active-Bias InGaP HBT Gain Block Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The WJA1001 will be marked with an "A1001" designator with an alphanumeric lot code marked below the part designator. A1001 XXXX-X Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1C Passes 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 4 January 2008