MAX14676B
Maxim Integrated. All rights reserved. Page 1/5
RELIABI LITY REPO R T
FOR
MAX14676BEWO+T
WAFER LEVEL DEVICES
September 18, 2014
MAXIM INTEGRATED
160 RIO ROBLES
SAN JOSE, CA 95134
Ap proved by
Eric Wright
Quality Assurance
Reliability Engineering
MAX14676B
Maxim Integrated. All rights reserved. Page 2/5
Conclusion
The MAX1 4676BEWO+T successfully meets the quality and reliability standards required of all Maxim Integrated products. In addition,
Maxim Integrated's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim Integrated's quality
and reliability standards.
Table of Conte n ts
I. ........Device Description IV. .......Die Information
II. ........Manufacturing Information V. ........Quality Assurance Information
III. .......Packaging Information VI. .......Reliability Evaluation
.....Attachments
I. Device Description
A. General
The MAX14676B/C are battery charge management solutions ideal for low-power wearable applications. These devices include a linear battery
charger with a smart power selector, ModelGauge™ fuel gauge, and several power optimized peripherals. They feature an ultra-low power buck
regulator with a quiescent current of 900nA (typical) and 74% efficiency with 10ìA output. The battery charger features a smart power selector
operation allowing operation with dead battery. It limits input current based on a register setting. If the charger power source is unable to supply the
entire system load, the smart power control circuit will supplement the system load with current from the battery. The MAX14676C embeds a Maxim
proprietary ModelGauge fuel gauge to provide an accurate estimate of the available capacity for rechargeable lithium batteries. The MAX14676B/C
includes a synchronous high-efficiency step-down converter. The device features a fixed-frequency PWM mode for tighter regulation and a burst mode
for increased efficiency during light-load operation. The MAX14676B/C have a boost regulator and three programmable current sinks that can be used
to drive a variety of LED configurations. The boost converter is controlled independently from the current sinks, and they can be also used separately.
The MAX14676B/C features a power switch controller that allows the device to be turned on and off. This controller also provides a delayed reset
signal and voltage sequencing. These devices are available in a 42-bump, 0.5mm pitch, 3.497mm x 3.118mm WLP package.
MAX14676B
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II. Manufacturing Information
A. Descrip tion/Funct ion: Wear able Charge Management Solution
B. Process: S18
C. Number of Device Transistors: 184056
D. Fabrication Location: USA
E. Assembly Location: USA
F. Date of Initial Production: September 4, 2014
III. Packaging Information
A. Package Type: 42-bump WLP
B. Lead Frame: N/A
C. Lead Finish: N/A
D. Die Attach: None
E. Bondwire: N/A (N/A mi l dia.)
F. Mold Material: None
G. Assembly Diagram: #05-9000-5389
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-C Level 1
J. Sing le Layer Theta Ja: N/A°C/W
K. Single Layer Theta Jc: N/A°C/W
L. Multi Layer Theta Ja: 36°C/W
M. Multi Layer Theta Jc: N/A°C/W
IV. Die Information
A. Dimensions: 124.0157 X 138.9763 mils
B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect: Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization: None
E. Minimum Metal Width: 0.23 microns (as drawn)
F. Minimum Metal Spacing: 0.23 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric: SiO2
I. Die Separation Method: Wafer Saw
MAX14676B
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V. Quality Assurance Information
A. Quality Assurance Contacts: Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% for all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= 1 =
1.83 (Chi square value for MTTF upper l imit)
MTTF
192 x 4340 x 48 x 2
= 22.9 x 10-9
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated
performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at
http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the S18 Process results in a FIT Rate of 0.05 @
25°C and 0.93 @ 55°C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot TAUM1A012A, D/C 1425)
The AL69-1 die type has bee n found to have all pins able to withstand an HBM transient pulse of +/-1500V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250mA and overvoltage
per JEDEC JESD78.
MAX14676B
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Table 1
Reliability Evaluation Test Results
MAX14676BEWO+T
TEST ITEM TEST CONDITION FAILURE
IDENTIFICATION SAMPLE SIZE NUMBER OF COMMENTS
FAILURES
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
DC Parameters 48 0 TAOW5Q002E, D/C 1345
& functionality
Note 1: Life Test Data may represent plastic DIP qualification lots.
