ZXTD**M832EV ZXM***M832EV MPPSTM Miniature Package Power Solutions COMBINATION DUAL DIE MLP EVALUATION BOARD THERMAL SPECIFICATION SHEET EVALUATION BOARD DIAGRAM DEVICE PIN CONNECTIONS 1 PD = 1.4W 3 4 5 6 Dual Transistor C1 B1 2 E1 B2 E2 C2 Dual MOSFET D1 S1 G1 S2 G2 D2 Note: Designers needing to evaluate electrical performance using the thermal evaluation boards must be aware that the device(s) pass the the datasheet limits but the resistance paths of the PCB contribute significant series resistance. This should be taken into account when measuring higher current VCE(sat) , VBE(sat) and VBE(on) parameters. RECOMMENDED FOOTPRINT 3mm x 2mm MLP (underside view) 3mm x 2mm (Dual die) MLP all dimensions are in max millimetres SHORTFORM TABLES (see page 3) ISSUE 1 - SEPTEMBER 2002 1 ZXTD**M832EV ZXM***M832EV PD & THERMAL DATA PARAMETER SYMBOL LIMIT UNIT Power Dissipation at TA=25C Power Dissipation at TA=25C (a)(f) Linear Derating Factor PD 1.5 12 W mW/C Power Dissipation at TA=25C (b)(f) Linear Derating Factor PD 2.45 19.6 W mW/C Power Dissipation at TA=25C (c)(f) Linear Derating Factor PD 1 8 W mW/C Power Dissipation at TA=25C (d)(f) Linear Derating Factor PD 1.13 9 W mW/C Power Dissipation at TA=25C (d)(g) Linear Derating Factor PD 1.7 13.6 W mW/C Power Dissipation at TA=25C (e)(g) Linear Derating Factor PD 3 24 W mW/C Operating and Storage Temperature Range T j :T stg -55 to +150 C THERMAL RESISTANCE Junction to Ambient (a)(f) R JA 83.3 C/W Junction to Ambient (b)(f) R JA 51 C/W Junction to Ambient (c)(f) R JA 125 C/W Junction to Ambient (d)(f) R JA 111 C/W Junction to Ambient (d)(g) R JA 73.5 C/W Junction to Ambient (e)(g) R JA 41.7 C/W Notes (a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with minimal lead connections only. (d) For a dual device surface mounted on 10 sq cm single sided 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (f) For a dual device with one active die. (g) For dual device with 2 active die running at equal power. (i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper 1 oz weight, 1mm wide tracks and one half of the device active is Rth = 250C/W giving a power rating of Ptot = 500mW. ISSUE 1 - SEPTEMBER 2002 2 ZXTD**M832EV ZXM***M832EV Notes ISSUE 1 - SEPTEMBER 2002 3 ZXTD**M832EV ZXM***M832EV SHORTFORM TABLE (Transistor) Dual Transistor Device Type #ZXTDAM832EV #ZXTDBM832EV #ZXTDCM832EV #ZXTD1M832EV #ZXTD2M832EV #ZXTD3M832EV V CEO Part Polarity Code V DAA DBB DCC D11 D22 D33 NPN & NPN PNP & PNP 15 20 50 IC Combination Dual A Device Type 4.5 4.5 4 -12 -20 -40 -4 -3.5 -3 Part Code #ZXTDA1M832EV DA1 #ZXTDB2M832EV DB2 #ZXTDC3M832EV DC3 #ZXTDE4M832EV DE4 Polarity V CEO IC V A NPN 15 4.5 PNP -12 -4 NPN 20 4.5 PNP -20 -3.5 NPN 50 4 PNP -40 -3 NPN 80 3.5 PNP -70 -2.5 SHORTFORM TABLE (MOSFET) Dual Transistor Device Type Part Polarity Code BV DSS ID Combination Dual V A Device Type #ZXMN2AM832EV DNA N-Channel #ZXMN3AM832EV DNB N-Channel #ZXMP62M832EV DPA P-Channel 20 30 -20 Part Code 2.9 2.9 #ZXMC3AM832EV -1.3 C01 Polarity BV DSS ID V A N-Channel 30 2.9 P-Channel -30 -2.1 # Prefix is an internal ordering requirement only. (c) Zetex plc 2002 Americas Asia Pacific Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY11788 Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com USA Telephone: (631) 360 2222 Fax: (631) 360 8222 usa.sales@zetex.com Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 uk.sales@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 1 - SEPTEMBER 2002 4 SCMPPSTMEV