EVALUATION BOARD DIAGRAM
RECOMMENDED FOOTPRINT 3mm x 2mm MLP
(underside view)
SHORTFORM TABLES (see page 3)
ZXTD**M832EV
ZXM***M832EV
ISSUE 1 - SEPTEMBER 2002
1
MPPS™ Miniature Package Power Solutions
COMBINATION DUAL DIE MLP EVALUATION BOARD THERMAL
SPECIFICATION SHEET
all dimensions are in max millimetres
3mm x 2mm (Dual die) MLP
DEVICE PIN CONNECTIONS
123456
Dual Transistor C1 B1 E1 B2 E2 C2
Dual MOSFET D1 S1 G1 S2 G2 D2
PD= 1.4W
Note:
Designers needing to evaluate electrical performance using the thermal evaluation boards must be aware that the device(s) pass the the datasheet
limits but the resistance paths of the PCB contribute significant series resistance.
This should be taken into account when measuring higher current VCE(sat) , VBE(sat) and VBE(on) parameters.
ZXTD**M832EV
ZXM***M832EV
ISSUE 1 - SEPTEMBER 2002
2
PARAMETER SYMBOL LIMIT UNIT
Power Dissipation at TA=25°C
Power Dissipation at TA=25°C (a)(f)
Linear Derating Factor PD1.5
12 W
mW/°C
Power Dissipation at TA=25°C (b)(f)
Linear Derating Factor PD2.45
19.6 W
mW/°C
Power Dissipation at TA=25°C (c)(f)
Linear Derating Factor PD1
8W
mW/°C
Power Dissipation at TA=25°C (d)(f)
Linear Derating Factor PD1.13
9W
mW/°C
Power Dissipation at TA=25°C (d)(g)
Linear Derating Factor PD1.7
13.6 W
mW/°C
Power Dissipation at TA=25°C (e)(g)
Linear Derating Factor PD3
24 W
mW/°C
Operating and Storage Temperature Range Tj:Tstg -55 to +150 °C
THERMAL RESISTANCE
Junction to Ambient (a)(f) RθJA 83.3 °C/W
Junction to Ambient (b)(f) RθJA 51 °C/W
Junction to Ambient (c)(f) RθJA 125 °C/W
Junction to Ambient (d)(f) RθJA 111 °C/W
Junction to Ambient (d)(g) RθJA 73.5 °C/W
Junction to Ambient (e)(g) RθJA 41.7 °C/W
PD& THERMAL DATA
Notes
(a)Foradualdevicesurfacemountedon8sqcmsinglesided2ozcopperonFR4PCB,instillairconditionswithallexposedpadsattached.Thecopper
area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b)Measured at t<5 secsforadualdevice surface mounted on8sqcmsinglesided 2oz copper onFR4PCB,instill air conditions with all exposed pads
attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with minimal lead connections only.
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper onFR4 PCB, in still air conditions with all exposed pads attached attached.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(f) For a dual device with one active die.
(g) For dual device with 2 active die running at equal power.
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the
packagedimensionsdata.Thethermalresistanceforadualdevicemountedon1.5mm thick FR4 board using minimumcopper1ozweight,1mmwide
tracks and one half of the device active is Rth = 250°C/W giving a power rating of Ptot = 500mW.
Notes
ZXTD**M832EV
ZXM***M832EV
ISSUE 1 - SEPTEMBER 2002
3
ZXTD**M832EV
ZXM***M832EV
ISSUE 1 - SEPTEMBER 2002
4
Europe
Zetex plc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4422
Fax: (44) 161 622 4420
uk.sales@zetex.com
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY11788
USA
Telephone: (631) 360 2222
Fax: (631) 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza, Tower 1
Hing Fong Road
Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
Thispublication is issuedtoprovideoutlineinformation onlywhich(unlessagreedby the Companyinwriting)maynot be used,appliedorreproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
© Zetex plc 2002
SCMPPSTMEV
Dual Transistor
Device Type Part
Code Polarity VCEO
V
IC
A
Combination Dual
Device Type Part
Code Polarity VCEO
V
IC
A
#ZXTDAM832EV
#ZXTDBM832EV
#ZXTDCM832EV
DAA
DBB
DCC
NPN &
NPN
15
20
50
4.5
4.5
4
#ZXTDA1M832EV DA1 NPN 15 4.5
PNP -12 -4
#ZXTDB2M832EV DB2 NPN 20 4.5
PNP -20 -3.5
#ZXTD1M832EV
#ZXTD2M832EV
#ZXTD3M832EV
D11
D22
D33
PNP &
PNP
-12
-20
-40
-4
-3.5
-3
#ZXTDC3M832EV DC3 NPN 50 4
PNP -40 -3
#ZXTDE4M832EV DE4 NPN 80 3.5
PNP -70 -2.5
SHORTFORM TABLE (Transistor)
Dual Transistor
Device Type Part
Code Polarity BVDSS
V
ID
A
Combination Dual
Device Type Part
Code Polarity BVDSS
V
ID
A
#ZXMN2AM832EV
#ZXMN3AM832EV
#ZXMP62M832EV
DNA
DNB
DPA
N-Channel
N-Channel
P-Channel
20
30
-20
2.9
2.9
-1.3 #ZXMC3AM832EV C01 N-Channel 30 2.9
P-Channel -30 -2.1
SHORTFORM TABLE (MOSFET)
# Prefix is an internal ordering requirement only.
