-0-
No. STSE-CC5151A
<Cat.No.051031>
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NSSB426CT
NICHIA CORPORATION
-1-
Nichia STSE-CC5151A
<Cat.No.051031>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings (Ta=25°C)
Item Symbol Absolute Maximum Rating Unit
Forward Current IF 30 mA
Pulse Forward Current IFP 100 mA
Reverse Voltage VR 5 V
Power Dissipation PD 120 mW
Operating Temperature Topr -30 ~ + 85 °C
Storage Temperature Tstg -40 ~ +100 °C
Soldering Temperature Tsld Reflow Soldering : 260°C for 10sec.
Hand Soldering : 350°C for 3sec.
IFP Conditions : Pulse Width 10msec. and Duty 1/10
(2) Initial Electrical/Optical Characteristics (Ta=25°C)
Item Symbol Condition Typ. Max. Unit
Forward Voltage VF IF=20[mA] (3.6) 4.0 V
Reverse Current IR VR= 5[V] - 50 µA
Luminous Intensity Iv IF=20[mA] (156) - mcd
(3) Ranking (Ta=25°C)
Item Symbol Condition Min. Max. Unit
Rank T Iv IF=20[mA] 150 213 mcd
Rank S Iv IF=20[mA] 104 150 mcd
Luminous Intensity
Rank R Iv IF=20[mA] 75 104 mcd
Luminous Intensity Measurement allowance is ± 10%.
Color Rank (I
F=20mA,Ta=25°C)
Rank W
x 0.139 0.129 0.113 0.134 0.145 0.152
y 0.035 0.050 0.080 0.105 0.072 0.056
Color Coordinates Measurement allowance is ± 0.01.
One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
<
= <
=
-2-
Nichia STSE-CC5151A
<Cat.No.051031>
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package : Heat-Resistant Polymer
Package Upper Surface Color : Black
Encapsulating Resin : Epoxy Resin (Diffused)
Resin Color : Blue (Diffused)
Electrodes : Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
 - U
- Year ( 4 for 2004, 5 for 2005 )
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )
 - Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Intensity
-3-
Nichia STSE-CC5151A
<Cat.No.051031>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Standard
Test Method
Test Conditions
Note
Number of
Damaged
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
2 times 0/100
Thermal Shock JEITA ED-4701
300 307
0°C ~ 100°C
15sec. 15sec.
100 cycles 0/100
Temperature Cycle
JEITA ED-4701
100 105
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
100 cycles 0/100
Moisture Resistance Cyclic JEITA ED-4701
200 203
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
10 cycles 0/100
High Temperature Storage JEITA ED-4701
200 201
Ta=100°C 1000 hrs. 0/100
Temperature Humidity
Storage
JEITA ED-4701
100 103
Ta=60°C, RH=90%
1000 hrs. 0/100
Low Temperature Storage JEITA ED-4701
200 202
Ta=-40°C 1000 hrs. 0/100
Steady State Operating Life
Ta=25°C, IF=30mA 1000 hrs. 0/100
Steady State Operating Life
of High Humidity Heat
60°C, RH=90%, IF=20mA 500 hrs. 0/100
Steady State Operating Life
of Low Temperature
Ta=-30°C, IF=20mA 1000 hrs. 0/100
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol
Test Conditions Min. Max.
Forward Voltage VF IF=20mA - U.S.L.*) 1.1
Reverse Current IR VR=5V - U.S.L.*) 2.0
Luminous Intensity IV IF=20mA L.S.L.**) 0.7 -
*) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level
-4-
Nichia STSE-CC5151A-1
<Cat.No.060915>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof
bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are silver plated copper alloy. The silver surface may be affected by
environments which contain corrosive substances. Please avoid conditions which may cause the LED
to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering
operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
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0.8
2.8
1.0 1.8
1.8
4.6
1.0 1.0
Nichia STSE-CC5151A-2
<Cat.No.061109>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering Hand Soldering
Lead Solder Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
120 ~ 150°C
120 sec. Max.
240°C Ma x .
10 sec. Max.
refer to
Tem perature - profile 1.
180 ~ 200°C
120 sec. Max.
260°C Ma x .
10 sec. Max.
refer to
Tem perature - profile 2.
(N2 reflow is recom mended.)
Temperature
Soldering time
350°C Ma x .
3 sec. Max.
(one time only)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the following conditions shown to the under figure.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(Unit : mm)
60sec.Max.
Above 220°C
120sec.Max.
Pre-heating
260°C Max.
10sec. Max.
1~ 5°C / sec.
1~ 5°C / sec. 180 ~ 200°C
60sec.Max.
Above 200°C
120sec.Max.
Pre-heating
240°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec. 120 ~ 150°C
<1 : Lead Solder> <2 : Lead-free Solder>
-6-
Nichia STSE-CC5151A-1
<Cat.No.060915>
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(7) Others
· NSSB426C complies with RoHS Directive.
· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating
when using the LEDs with matrix drive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
Nichia STSE-CC5151A
<Cat.No.051031>
-7-
½Color Coordinates Measurement allowance is ± 0.01.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
x
y
ICI Chromaticity Diagram
500
510
520
530
540
550
460
480
470
630
610
620
490
560
570
580
590
600
W
Ambient Temperature Ta (°C)Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Allowable Forward Current IF(mA)
Relative Luminosity (a.u.) Relative Luminosity (a.u.)
Forward Current IFP (mA)
Allowable Forward Current IFP (mA)
Ambient Temperature vs.
Allowable Forward Current
Ambient Temperature vs.
Relative Luminosity
Ambient Temperature vs.
Forward Voltage
Forward Voltage VF(V)
Duty Ratio (%)
Forward Current vs.
Relative Luminosity
Forward Current IFP (mA)
Forward Voltage VF(V)
Forward Voltage vs.
Forward Current
Duty Ratio vs.
Allowable Forward Current
200
100
50
20
10
5
1
2.5 3.0 3.5 4.0 4.5 5.0
3.5
3.0
2.5
1.5
1.0
0.5
0
2.0
200
100
50
20
10
30
1 5 10 20 10050
5.4
4.6
4.2
3.4
3.0
2.6
3.8
5.0
020 608010040-40 -20
2.0
1.0
0.5
0.2 020 608010040-40 -20
40
30
20
0
10
60 80 10040020
0 204060 10012080
Ta=25°C Ta=25°C Ta=25°C
IFP=5mA
IFP=20mA
IFP=60mA IFP=20mA
N
Nichia STSE-CC5151A
<Cat.No.051031>
CHARACTERISTICS
Model NSSB426C
NICHIA CORPORATION Title
No. 050922545221
-8-
Ta=25°C
IF=20mA
Y-Y
X-X
Y-Y
X-X
Dominant Wavelength D(nm)
λ
Dominant Wavelength D(nm)
Directivity
Radiation Angle
0° 10° 20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.5
0
Spectrum
Forward Current vs.
Chromaticity Coordinate (λD)
Ambient Temperature vs.
Dominant Wavelength
Forward Current vs.
Dominant Wavelength
y
Relative Emission Intensity (a.u.)
Forward Current IFP (mA) Ambient Temperature Ta (°C)
xx Wavelength λ (nm)
Relative Luminosity (a.u.)
0°30° 0.590° 60° 1.0
λ
0.13
0.11
0.09
0.07
0.05
0.03
0.10 0.12 0.14 0.16 0.18 0.20
1.2
1.0
0.8
0.4
0.2
0
0.6
350 400 450 500 600 650550
474
473
472
470
469
466
471
468
467
15102010050
476
472
470
464
474
468
466
020 608010040-40 -20
1mA(473nm)
5mA(472nm)
20mA(470nm)
100mA(467nm)
50mA(468nm)
Ta=25°C
Ta=25°C
Ta=25°C
IF=20mA
IFP=20mA Ta=25°C
IFP=20mA
Nichia STSE-CC5151A
<Cat.No.051031>
CHARACTERISTICS
Model NSSB426C
NICHIA CORPORATION Title
No. 050922545231
-9-
1 ± 0.20.75 ± 0.2
3 ± 0.2
3 ± 0.2
(2.6)
(R 0.8)
(2.6)
(0.8)
1.8 ± 0.3
(0.4)
Cathode mark
C 0.5
A
K
(1.2)0.85 ± 0.3
Anode
Cathode
NC
NC
: Black
ITEM MATERIALS
PACKAGE Heat-Resistant Polymer
PACKAGE UPPER SURFACE COLOR Black
ENCAPSULATING RESIN Epoxy Resin (Diffused)
RESIN COLOR Blue (Diffused)
ELECTRODES Ag Plating Copper Alloy
15/1
Nichia STSE-CC5151A
<Cat.No.051031>
-10-
Unit
mm
NICHIA CORPORATION
N
o.
TAPING DIMENSIONS
050922545241
Title
Model
N
xSB426C
Allow
Scale
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
2,000pcs/Reel
Taping part
1.75±0.1
4±0.1
4±0.1
2±0.05
3.5±0.05
(2.75)
Cathode mark
0.25±0.05
2±0.1
3.15±0.1
Label
Reel part 11.4±1
9±0.3
φ 13
±0.2
φ 21
±0.8
3.15±0.1
XXXX LED
TYPE NxSx426CT
LOT XXXXXX-U
QTY pcs
φ 1+0.25
-0
8+0.3
-0.1
φ 1.5+0.1
-0
φ 180+0
-3
φ 60+1
-0
Reel End of tape
No LEDs No LEDs
Top cover
tape
LEDs mounting part
Embossed carrier tape
Pull direction
Reel Lead Min.400mm
Reel Lead Min.160mm
Reel Lead Min.40mm (No LEDs) (No LEDs is more than 40)
Nichia STSE-CC5151A
<Cat.No.051031>
-11-
Unit
mm
NICHIA CORPORATION
N
o.
TAPING DIMENSIONS
050324538351
Title
Model
N
xSx426CT
Allow
Scale
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Label
XXXX LED
TYPE NxSx426xT
LOT xxxxxx-U
QTY PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
N
ICHIA
Seal
Moisture proof foil bag
ichia LED
Reel
Moisture
absorbent material
Label
XXXX LED
TYPE NxSx426xT
RANK U
QTY PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
N
ICHIA
The box is partitioned with the
cardboard.
Packing unit
Reel/bag Quantity/bag (pcs)
Moisture proof foil bag 1reel 2,000 MAX.
Cardboard box Dimensions (mm) Reel/box Quantity/box (pcs)
Cardboard box S 291¯237¯120¯8t 7reel MAX. 14,000 MAX.
Cardboard box M 259¯247¯243¯5t 15reel MAX. 30,000 MAX.
Cardboard box L 444¯262¯259¯8t 30reel MAX. 60,000 MAX.
-13-
-12-
NICHIA CORPORATION
N
o.
PACKING
050922545401
Title
Model NxSx426xT
Nichia STSE-CC5151A
<Cat.No.051031>