ST7570 S-FSK power line networking system-on-chip Features Fully integrated narrow-band power line networking system-on-chip High performing PHY processor with embedded turn-key firmware for spread frequency shift keying (S-FSK) modulation: - Programmable bit rate up to 2.4 Kbps (@ 50 Hz) - 1 Hz step programmable carriers up to 148.5 kHz - Signal to noise ratio estimation - Received signal strength indication Protocol engine embedding: - IEC61334-5-1 PHY and MAC layers - Alarm management 6&1&0. XX , PITCH Applications Smart metering applications Street lighting control Command and control networking On chip peripherals: - Host controller UART interface Description Fully integrated analog front end: - ADC and DAC - PGA with automatic gain control for high receiving sensitivity - High linearity modulated signal generation The ST7570 is a powerful power line networking system-on-chip. It combines a high-performance PHY processor core and a protocol controller core with a fully integrated analog front end (AFE) and line driver. Fully integrated single-ended power amplifier for line driving - Up to 1 A rms, 14 V p-p output - Configurable Active filtering topology - Very high linearity - Embedded temperature sensor - Current control feature Table 1. Device summary Order codes Package ST7570 8 to 18 V power amplifier supply 3.3 V or 5 V digital I/O supply Integrated 5 V and 1.8 V linear regulators for AFE and digital core supply Mains zero crossing synchronization Suitable for EN50065 and FCC part 15 compliant applications VFQFPN48 package with exposed pad -40 C to +85 C temperature range May 2010 The ST7570 features allow the most costeffective, single-chip power line communication solution based on IEC61334-5-1 S-FSK standard. Packaging Tube VFQFPN48 ST7570TR Doc ID 17526 Rev 1 Tape and reel 1/27 www.st.com 27 Contents ST7570 Contents 1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Analog front end (AFE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 Reception path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.2 Transmission path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.3 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.4 Current and voltage control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.5 Thermal shutdown and temperature control . . . . . . . . . . . . . . . . . . . . . . . 17 5.6 Zero-crossing PLL and delay compensation . . . . . . . . . . . . . . . . . . . . . . 17 6 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.1 9 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Physical layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9.1 S-FSK principles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9.2 Bit timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9.3 Frame structure at physical level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 9.4 Frame timing and time-slot synchronization . . . . . . . . . . . . . . . . . . . . . . . 23 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Doc ID 17526 Rev 1 ST7570 1 Device overview Device overview Realized using a multi-power technology with state-of-the-art VLSI CMOS lithography, the ST7570 is based on dual digital core architecture (a PHY processor engine and a protocol controller core) to guarantee outstanding communication performance with a high level of flexibility and programmability. The on-chip analog front end, featuring analog to digital and digital to analog conversion and automatic gain control, plus the integrated power amplifier delivering up to 1Arms output current, makes the ST7570 the first complete system-on-chip for power line communication. Line coupling network design is also simplified, leading to a very low cost BOM. Safe and performing operations are guaranteed while keeping power consumption and distortion levels very low, thus making ST7570 an ideal platform for the most stringent application requirements and regulatory standards compliance. Figure 1. Block diagram 0! ?). #, 0!?). 4HERMAL -ANAGEMENT 0! ?/54 0! ,INE $RIVER 48?/54 /. #()0 -EMORIES /UTPUT #URRENT #ONTROL /. #()0 -EMORIES 7!4 #($/' 4)-%23 '!). $!# "0& 48 !&% 0ROTOCOL #ONTROLLER #42, 4?2%1 5!24 $$3 0(9 0ROCESSOR 28$ 48$ "2 28?). !$# 0'! "2 "0& 02%3,/4:#43")4 28 !&% 6## 6 0OWER -ANAGEMENT 6$$)/ 6 :ERO #ROSSING $ETECTION 6##! 6 6$$ 6 :#?).?! :#?).?$ #LOCK -ANAGEMENT 6$$?0,, 6 8). 8/54 !-V Doc ID 17526 Rev 1 3/27 Pin connection Pin connection Z^Zs s 'E Z^Zs Z^Zs Z^Zs Z^Zs Z Z dZY /E Pin out top view 'E E 'E Z^Zs d< E dK E d/ s/K Z^dE sZ's s WKhd y/E s^^ yKhd s dD^ > dZ^dE W/E s/K W/E dyKhd Zy/E s^^ s/K /E WZ^>Kdd^/d s sW>> 'E dy Zy s^^ Figure 2. Z^Zs 2 ST7570 !-V 4/27 Doc ID 17526 Rev 1 ST7570 Pin connection 2.1 Pin description Table 2. Pin description Pin Name Type Reset state Pull-up 1 TXD Digital output High Z Disabled 2 RXD Digital input High Z Disabled UART data in 3 VDDIO Power - 4 TRSTN Digital input Input Enabled System JTAG interface reset (active low) 5 TMS Digital input Input Enabled System JTAG interface mode select 6 GND Power - - 7 TCK Digital input High Z Disabled 8 TDO Digital output High Z Disabled System JTAG interface data out 9 TDI Digital input Input Enabled System JTAG interface data in 10 RESETN Digital input Input Disabled System reset (active low) 11 VDD Power - - 1.8 V digital supply 12 XIN Analog - - Crystal oscillator input / external clock input 13 XOUT Analog - - Crystal oscillator output (if external clock supplied on XIN, XOUT must be left floating) 14 GND Power - - Digital ground 15 VSSA Power - - Analog ground 16 VDD_PLL Power - - 1.8 V PLL supply voltage (connect to VDD) 17 VCCA Power - - 5 V analog supply / internal regulator output Externally accessible for filtering purposes only 18 ZC_IN_A Analog input - - Analog zero-crossing input 19 RX_IN Analog input - - Reception analog input 20 TX_OUT Analog output - - Transmission analog output 21 PA_IN+ Analog input - - Power amplifier Non-inverting input 22 PA_IN- Analog input - - Power amplifier Inverting input 23 CL Analog input - - Current limit sense input 24 VCC Power - - Power supply 25 VSS Power - - Power ground 26 PA_OUT Analog output - - Power amplifier output 27 VDD_REG_1V8 Power - - 1.8 V digital supply / internal regulator output Externally accessible for filtering purposes only - Description UART data out External pull-up to VDDIO required 3.3 V - 5 V I/O supply Digital ground System JTAG interface clock. External pull-up to VDDIO required Doc ID 17526 Rev 1 5/27 Pin connection Table 2. ST7570 Pin description (continued) Pin Name Type 28 VDDIO Power - - 3.3 V - 5 V I/O supply 29 NC - - - Not used, leave floating 30 NC - - - Not used, leave floating 31 RESERVED6 - - - Pull up to VDDIO 32 NC - - - Not used, leave floating 33 GND Power - - Digital ground 34 VDDIO Power - - 3.3 V - 5 V I/O supply 35 VSSA Power - - Analog ground 36 PRESLOT /ZC/TS/BIT Digital output High Z Slot synchronization (PRESLOT), zero-crossing (ZC), timeslot (TS) and bit synchronization (BIT). Disabled If this signals are not used, this pin can be left floating. 37 ZC_IN_D Digital input High Z Disabled 38 T_REQ Digital input High Z Disabled UART communication control line 39 BR1 Digital input High Z 40 BR0 Digital input High Z Disabled UART baud rate selection Disabled (sampled after each reset event) see Table 3 41 RESERVED0 - - - Connect to GND 42 RESERVED1 - - - Pull up to VDDIO 43 RESERVED2 - - - Pull up to VDDIO 44 RESERVED3 - - - Pull up to VDDIO 45 GND Power - - Digital ground 46 VDD Power - - 1.8 V digital supply 47 RESERVED4 - - - Connect to VDDIO 48 RESERVED5 - - - Pull up to VDDIO Table 3. 6/27 Reset state Pull-up Description Digital zero-crossing input. Pull up to VDDIO if not used UART baud rate selection BR1 BR0 Baud rate 0 0 9600 0 1 19200 1 0 38400 1 1 57600 Doc ID 17526 Rev 1 ST7570 Maximum ratings 3 Maximum ratings 3.1 Absolute maximum ratings Figure 3. Absolute maximum ratings Value Symbol Parameter VCC VSSA-GND VDDIO Max Power supply voltage -0.3 20 V Voltage between VSSA and GND -0.3 0.3 V I/O supply voltage -0.3 5.5 V VI Digital input voltage GND-0.3 VDDIO+0.3 V VO Digital output voltage GND-0.3 VDDIO+0.3 V V(PA_IN) PA inputs voltage range VSS-0.3 VCC+0.3 V V(PA_OUT) PA_OUT voltage range VSS-0.3 VCC+0.3 V RX_IN voltage range -(VCCA+0.3) VCC+0.3 V V(ZC_IN_A) ZC_IN_A voltage range -(VCCA+0.3) VCCA+0.3 V(TX_OUT, CL) TX_OUT, CL voltage range VSSA-0.3 VCCA+0.3 V XIN voltage range GND-0.3 VDDIO+0.3 V V(RX_IN) V(XIN) V I(PA_OUT) Power amplifier output non-repetitive peak current 5 A peak I(PA_OUT) Power amplifier output non-repetitive rms current 1.4 A rms Tamb Operating ambient temperature -40 85 C Tstg Storage temperature -50 150 C Maximum withstanding voltage range Test condition: CDF-AEC-Q100-002 "Human Body Model" Acceptance criteria: "Normal Performance" -2 +2 kV Value Unit V(ESD) 3.2 Unit Min Thermal data Table 4. Symbol Thermal characteristics Parameter RthJA1 Maximum thermal resistance junction-ambient steady state (1) 50 C/W RthJA2 (2) 42 C/W Maximum thermal resistance junction-ambient steady state 1. Mounted on a 2-side + vias PCB with a ground dissipating area on the bottom side. 2. Same conditions as in Note 1, with maximum transmission duration limited to 100 s. Doc ID 17526 Rev 1 7/27 Electrical characteristics TA = -40 to +85C, TJ < 125C, VCC = 18 V unless otherwise specified. Table 5. Electrical characteristics Symbol Parameter Note Min. Typ. Max. Unit 8 13 18 V Power supply VCC Power supply voltage Doc ID 17526 Rev 1 I(VCC) RX Power supply current - Rx mode VCCA externally supplied 0.35 0.5 mA I(VCC) TX Power supply current - Tx mode, no load VCCA externally supplied 22 30 mA VCC UVLO_TL VCC under voltage lock out low threshold 6.1 6.5 6.95 V VCC UVLO_TH VCC under voltage lock out high threshold 6.8 7.2 7.5 V 250 (1) 700 VCC UVLO_HYST VCC under voltage lock out hysteresis I(VCCA) RX Analog supply current - Rx mode I(VCCA) TX Analog supply current - Tx mode I(VDD) I(VDD) RESET V(TX_OUT) =5 V p-p, No load mV 5 6 mA 8 10 mA Digital core supply current 35 mA Digital core supply current in RESET state 8 mA VDD_PLL PLL supply voltage VDD V I(VDD_PLL) PLL supply current 0.4 mA VDDIO Digital I/O supply voltage Externally supplied -10% 3.3 or 5 +10% V VDDIO UVLO_TL VDDIO under voltage lock out low threshold 2.25 2.4 2.6 V VDDIO UVLO_TH VDDIO under voltage lock out high threshold 2.45 2.65 2.8 V VDDIO UVLO_HYST VDDIO under voltage lock out hysteresis 250 Electrical characteristics 8/27 4 mV ST7570 Electrical characteristics (continued) Symbol Parameter Note Min. Typ. Max. Unit ST7570 Table 5. Analog front end Power amplifier V(PA_OUT) BIAS Power amplifier output bias voltage - Rx mode GBWP Power amplifier gain-bandwidth product I(PA_OUT) MAX Power amplifier maximum output current V(PA_OUT) TOL Power amplifier output tolerance VCC/2 100 Doc ID 17526 Rev 1 Power amplifier output 2nd harmonic distortion V(PA_OUT) HD3 Power amplifier output 3rd harmonic distortion V(PA_OUT) THD Power amplifier output total harmonic distortion V(PA_OUT) HD2 Power amplifier output 2nd harmonic distortion V(PA_OUT) HD3 Power amplifier output 3rd harmonic distortion V(PA_OUT) THD Power amplifier output total harmonic distortion -3% VCC=13 V, V(PA_OUT) = 7 V p-p (typ), V(PA_OUT) BIAS = VCC/2, RLOAD=50 See Figure 3 -68 dBc 0.1 % -70 dBc -60 dBc 0.2 % 10 pF 10 pF 50 Hz 100 dB 1 kHz 93 dB 100 kHz 70 dB 2.35 V VCC=18 V, V(PA_OUT) = 14 V p-p (typ), V(PA_OUT) BIAS = VCC/2, RLOAD=50 See Figure 3 Power amplifier input capacitance CL_TH Current sense high threshold on CL pin Ratio between PA_OUT and CL output current. (3) (3) 80 9/27 Electrical characteristics CL_RATIO Power supply rejection ratio +3% dBc PA_IN- vs. VSS PSRR mA rms -71 PA_IN+ vs. VSS C(PA_IN) MHz 1000 (2) V(PA_OUT) HD2 V Electrical characteristics (continued) Symbol Parameter Note Min. Typ. Max. Unit Transmitter V(TX_OUT) BIAS Transmitter output bias voltage - Rx mode V(TX_OUT) MAX Transmitter output maximum voltage swing TX_GAIN TX_GAIN TOL R(TX_OUT) V(TX_OUT) HD2 VCCA/2 TX_GAIN = 31, No load Transmitter output digital gain range Transmitter output digital gain tolerance 4.8 31 -0.35 0.35 Transmitter output 2nd harmonic distortion Transmitter output 3rd harmonic distortion V(TX_OUT) THD Transmitter output Total harmonic distortion VCCA 0 Transmitter output resistance V(TX_OUT) HD3 4.95 V V(TX_OUT) = V(TX_OUT) MAX, no load V p-p dB Doc ID 17526 Rev 1 1 k -67 dBc -70 dBc 0.1 % 16 V p-p Electrical characteristics 10/27 Table 5. Receiver V(RX_IN) MAX Receiver input maximum voltage V(RX_IN) BIAS Receiver input bias voltage 2.5 V Z(RX_IN) Receiver input Impedance 10 k 45 dBV rms V(RX_IN) MIN Receiver input sensitivity VCC = 18 V Bit rate = 1200 bps @ 50 Hz, BER = 10-3, SNR = 20 dB (3) PGA_MIN PGA minimum gain -18 dB PGA_MAX PGA maximum gain 30 dB Oscillator V(XIN) V(XIN) TH f(XIN) f(XIN) TOL CL Oscillator input voltage threshold Clock frequency supplied externally 0.8 Crystal oscillator frequency External quartz crystal frequency tolerance 1.8 VDDIO V p-p 0.9 1 V 8 -150 External quartz crystal ESR value External quartz crystal load capacitance 16 MHz +150 ppm 100 20 pF ST7570 ESR Oscillator input voltage swing Electrical characteristics (continued) Symbol Parameter Note Min. Typ. Max. Unit fCLK_AFE Internal frequency of the analog front end 8 MHz fCLK_PROT_ctrl Internal frequency of the protocol Ctrl core 28 MHz 56 MHz fCLK_PHY_processor Internal frequency of the PHY processor core ST7570 Table 5. Temperature sensor Temperature threshold 1 (3) 63 70 77 C T_TH2 Temperature threshold 2 (3) 90 100 110 C T_TH3 Temperature threshold 3 (3) 112 125 138 C Temperature threshold 4 (3) 153 170 187 C 10 V p-p T_TH1 T_TH4 Zero crossing comparator Doc ID 17526 Rev 1 V(ZC_IN_A) MAX Zero crossing analog input voltage range V(ZC_IN_A) TL Zero crossing analog input low threshold -44 -32 -17 mV V(ZC_IN_A) TH Zero crossing analog input high threshold 26 41 56 mV V(ZC_IN_A) HYST Zero crossing analog input hysteresis 73 mV ZC_IN_D d.c. Zero crossing digital input duty cycle 50 % VDDIO = 3.3 V 66 k VDDIO = 5 V 41 k Digital section Digital I/O Internal pull-up resistors VIH High logic level input voltage 0.65*VDDIO VDDIO+0.3 V VIL Low logic level input voltage -0.3 0.35*VDDIO V VOH High logic level output voltage IOH= -4 mA VOL Low logic level output voltage IOL= 4 mA VDDIO-0.4 V 0.4 V 11/27 Electrical characteristics RPULL-UP Electrical characteristics (continued) Symbol Parameter Note Min. Typ. Max. Unit -1.5% 57600 +1.5% BAUD -1.5% 38400 +1.5% BAUD -1.5% 19200 +1.5% BAUD -1.5% 9600 +1.5% BAUD UART interface Baud rate Electrical characteristics 12/27 Table 5. Reset and power on tRESETN Minimum valid reset pulse duration 1 tSTARTUP Start-up time at power on or after a reset event 35 s 60 ms Doc ID 17526 Rev 1 1. Referred to TA = -40 C 2. This parameter does not include the tolerance of external components 3. Guaranteed by design ST7570 ST7570 Electrical characteristics Figure 4. Power amplifier test circuit Doc ID 17526 Rev 1 13/27 Analog front end (AFE) ST7570 5 Analog front end (AFE) 5.1 Reception path Figure 4 shows the block diagram of the ST7570 input receiving path. The main blocks are a wide input range analog programmable gain amplifier (PGA) and the analog to digital converter (ADC). Figure 5. reception path block diagram 5;$)( 5;B,1 3*$ $'& %3) !-V The PGA is controlled by an embedded loop algorithm, adapting the PGA gain to amplify or attenuate the input signal according to the input voltage range for the ADC. The PGA gain ranges from -18 dB up to 30 dB, with steps of 6 dB (typ.), as described in Table 5. Table 6. 5.2 PGA gain table PGA code PGA gain (typ) [dB] RX_IN max range [V p-p] 0 -18 16 1 -12 8 2 -6 4 3 0 2 4 6 1 5 12 0.500 6 18 0.250 7 24 0.125 8 30 0.0625 Transmission path Figure 5 shows the transmission path block diagram. it is mainly based on a digital to analog converter (DAC), capable to generate a linear signal up to its full scale output. A gain control block before the DAC gives the possibility to scale down the output signal to match the desired transmission level. 14/27 Doc ID 17526 Rev 1 ST7570 Analog front end (AFE) Figure 6. Transmission path block diagram 7;$)( 7;B287 '$& *DLQ &RQWURO %3) 7;B*$,1 !-V The amplitude of the transmitted signal can be set on a 32-step logarithmic scale through the TX_GAIN parameter, introducing an attenuation ranging from 0 dB (typ.), corresponding to the TX_OUT full range, down to -31 dB (typ.). The attenuation set by the TX_GAIN parameter can be calculated using the formula of Equation 1: Equation 1 Output attenuation A [dB] vs. TX GAIN A[dB] = (TX _ GAIN - 31) + TX _ GAINTOL 5.3 Power amplifier The integrated power amplifier is characterized by very high linearity, required to be compliant with the different international regulations (CENELEC, FCC etc.) limiting the spurious conducted emissions on the mains, and a current capability of 1 A rms that allows the amplifier driving even very low impedance points of the network. All the pins of the power amplifier are accessible, making it possible to build an active filter network to increase the linearity of the output signal. Doc ID 17526 Rev 1 15/27 Analog front end (AFE) 5.4 ST7570 Current and voltage control The power amplifier output current sensing is performed by mirroring a fraction of the output current and making it flow through a resistor RCL connected between the CL pin and VSS. The following relationship can be established between V(CL) and I(PA_OUT): Equation 2 V(CL) vs. I(PA_OUT) V(CL ) = R CL I(PA _ OUT ) CL _ RATIO The voltage level V(CL) is compared with the internal threshold CL_TH. When the V(CL) exceeds the CL_TH level, the V(TX_OUT) voltage is decreased by one TX_GAIN step at a time until V(CL) goes below the CL_TH threshold. The current sense circuit is depicted in Figure 6. Figure 7. PA_OUT current sense circuit 9&& , 3$B287 3$ , &/ , 3$B287 &/B5$7,2 &/ 5&/ !-V The RCL value to get the desired output current limit I(PA_OUT)LIM can be calculated according to Equation 3: Equation 3 RCL calculation RCL = CL _ TH I(PA _ OUT )LIM / CL _ RATIO Note that I(PA_OUT)LIM is expressed as peak current, so the corresponding rms current value shall be calculated according to the transmitted signal waveform. The RCL value to get 1 A rms output current limit, calculated with typical values for CL_TH and CL_RATIO parameters, is indicated in Table 7. Table 7. Parameter RCL 16/27 CL resistor typical values Description Resistor value for I(PA_OUT) MAX = 1 A rms (1.41 A peak) Doc ID 17526 Rev 1 Value Unit 133 ST7570 5.5 Analog front end (AFE) Thermal shutdown and temperature control The ST7570 performs an automatic shutdown of the power amplifier circuitry when the internal temperature exceeds T_TH4. After a thermal shutdown event, the temperature must get below T_TH3 before the ST7570 power amplifier comes back to operation. Moreover, a digital thermometer is embedded to identify the internal temperature among four zones, as indicated in Table 8. Table 8. 5.6 Temperature zones Temperature zone Temperature value 1 T < T_TH1 2 T_TH1 < T < T_TH2 3 T_TH2 < T < T_TH3 4 T > T_TH3 Zero-crossing PLL and delay compensation In operating mode, ST7570 needs to be synchronized with an external signal period through zero crossing detection. The user can select among two input pins for the external zero-crossing reference: Analog input (ZC_IN_A): it requires a bipolar analog input signal which is internally squared through a Schmidt Trigger comparator with symmetrical thresholds; Digital input (ZC_IN_D): it requires a 50% duty-cycle square-wave digital signal (with two levels). The desired input can be selected by accessing a dedicated management information base (MIB) object. The ST7570 embeds a phase-locked loop (PLL) to generate the internal reference based on the external zero-crossing. In case of delay due to external zero crossing coupling circuits (i.e. based on optocouplers) or to improve interoperability, it is possible to introduce compensation through a dedicated MIB object. Figure 8. Zero crossing detection =&B,1B' 3// ,QWHUQDO 5HIHUHQFH =&B,1B$ 6FKPLGW 7ULJJHU =&B,1B' FRQILJXUDWLRQ ELW 0,%REMHFW !-V Doc ID 17526 Rev 1 17/27 Power management 6 ST7570 Power management Figure 9 shows the power supply structure for the ST7570 device. The ST7570 operates from two external supply voltages: VCC (8 to 18 V) for the power amplifier and the analog section; VDDIO (3.3 or 5 V) for interface lines and digital blocks. Two internal linear regulators provide the remaining required voltages: 5 V analog front end supply: generated from the VCC voltage and connected to the VCCA pin; 1.8 V digital core supply: generated from the VDDIO voltage and connected to VDD_REG_1V8 (direct regulator output) and VDD pins. The VDD_PLL pin, supplying the internal clock PLL, must be externally connected to VDD. All supply voltages must be properly filtered to their respective ground, using external capacitors close to each supply pin, in accordance to the supply scheme depicted in Figure 9. Note that the internal regulators connected to VDD_REG_1V8 and to VCCA are not designed to supply external circuitry; their outputs are externally accessible for filtering purpose only. Figure 9. Power supply internal scheme 6## 633 0! ,$/ !&% 6##! 633! 6$$)/ $)')4! , ).4%2&!#%3 ,$/ $)')4! , #/2% '.$ 6$$?2%'?6 '.$ 6$$ 6$$?0,, ).4%2.!, 0,, 633! !-V 18/27 Doc ID 17526 Rev 1 ST7570 7 Clock management Clock management The main clock source is an 8 MHz crystal connected to the internal oscillator through XIN and XOUT pins. Both XIN and XOUT pins have a 32 pF integrated capacitor, in order to drive a crystal having a load capacitance of 16 pF with no additional components. Alternatively, an 8 MHz external clock can be directly supplied to XIN pin, leaving XOUT floating. A PLL internally connected to the output of the oscillator generates the fCLK_PHY_processor, required by the PHY processor block. fCLK_PHY_processor is then divided by two to obtain fCLK_PROT_ctrl, required by the protocol controller. 8 Functional overview The ST7570 embeds a full physical (PHY) and a medium access control (MAC) protocol layers and services compliant with the open standard IEC61334-5-1, mainly developed for smart metering applications, but suitable also for other command and control applications and remote load management. A local port (UART) is available for communication with an external host, exporting all the functions and services required to configure and control the device and its protocol stack. Below a list of the protocol layers and functions embedded in the ST7570 (Figure 10): Physical layer: implemented in the PHY processor and exporting all the primitive functions listed in the international standard document IEC61334-5-1, plus additional services for configuration, alarm management, signal and noise amplitude estimation, phase detection, statistical information; MAC layer: implemented on the protocol controller and exporting all the primitive functions listed in the international standard document IEC61334-5-1, plus additional services for configuration. Management information base (MIB): an information database with all the data required for proper configuration of the system (at both PHY and MAC layer); Host interface: all the services of the PHY, MAC and MIB are exported to an external host through the local UART port. Doc ID 17526 Rev 1 19/27 Functional overview ST7570 Figure 10. Functional overview 34 0(9 0ROCESSOR 0ROTOCOL #ONTROLLER ,OCAL 0ORT 5!24 (/34 )NTERFACE -)" 28$ 48$ 4?2%1 %XTERNAL (/34 -!# ,AYER -)" 0(9 ,AYER "2 "2 !-V 8.1 References Additional information regarding the PHY and MAC layers, the MIB and the HOST interface, including a detailed description of all services, extended functionalities and commands can be found in the following documents: 20/27 1. ST7570 user manual, www.st.com 2. International standard CEI-IEC-61334-5-1 Doc ID 17526 Rev 1 ST7570 9 Physical layer Physical layer The ST7570 embeds a IEC-61334-5-1 PHY layer based on the S-FSK (spread FSK) modulation technique. 9.1 S-FSK principles The S-FSK modulation technique is aimed at strengthening the classical FSK by adding higher robustness against narrow-band interferers typical of a spread-spectrum approach. Non-return-to-zero (NRZ) coding is used to map the binary data "0" or "1" to sinusoidal carriers at frequencies f0 and f1 (Figure 11). Figure 11. S-FSK waveform (time domain) The absolute frequency deviation |f0 - f1| is at least 10 kHz, in order to reduce the probability that a narrow-band interferer could corrupt both carriers at the same time. f0 and f1 can be set at any value up to 148.5 kHz. Figure 12. S-FSK waveform (frequency domain) _I I _!N+] I Doc ID 17526 Rev 1 I !-V 21/27 Physical layer 9.2 ST7570 Bit timing The data communication is synchronized to the mains zero-crossing through an internal PLL. The bit time is dynamically adapted in order to have always 24 or 48 bits in each mains cycle, according to the desired configuration (Figure 13). The resulting bit-rate is thus dependent on the instantaneous mains frequency. With a nominal frequency of 50 Hz, the resulting bit-rate is 1200 bps in the case of 24 bit/mains cycle, while 2400 bps in the case of 48 bit/mains cycle. Figure 13. Bit timing -AINS CYCLE -AINS WAVEFORM (Z OR (Z :ERO CROSSING :ERO CROSSING BITMAINS CYCLE BITS AT (Z BITS AT (Z BITMAINS CYCLE BITS AT (Z BITS AT (Z !-V 22/27 Doc ID 17526 Rev 1 ST7570 9.3 Physical layer Frame structure at physical level The frame at physical level is compliant with the IEC61334-5-1 and is composed of 45 bytes (360 bits) as follows: 2 byte preamble (PRE) (AAAAh); 2 byte start subframe delimiter (SSD) (54C7h); 38 byte physical service data unit (P_sdu); 3 byte for pause or alarm; The bytes are sent from the most significant byte (MSB) to the least significant byte (LSB). Bits within the byte are packed with the same order. Figure 14. Physical frame format E\WHV E\WHV E\WHV ELW 3UHDPEOH 35( 6WDUW6XEIUDPH 'HOLPLWHU 3BVGX 3DXVH$ODUP 66' 3+<)UDPH !-V 9.4 Frame timing and time-slot synchronization IEC61334-5-1 protocol specifies a master-slave network with time-division medium access: in order to properly communicate, all the nodes belonging to a network must share the same "slot synchronization". The time division is fixed through the use of time-slot, corresponding to a physical frame length consisting of 45 bytes (i.e. 360 bits) with a total duration equal to: 15 mains cycles, at the 1200 bps operating speed (at 50 Hz); 7.5 mains cycles, at the 2400 bps operating speed (at 50 Hz). The slot synchronization is first achieved by the master (i.e. ST7570 modem in 'Client' mode) setting the time-slot starting at the mains zero-crossing instant. The frames transmitted by the master will enable the slot synchronization of all other slave nodes (i.e. ST7570 working in 'Server' mode): the reception of the sequence composed by PRE and SSD will allow all the 'Server' modems to align their time-slots to the Client's time-slot. Doc ID 17526 Rev 1 23/27 Package mechanical data 10 ST7570 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. The ST7570 is hosted in a 48 pin thermally enhanced very thin fine pitch quad flat package no lead (VFQFPN) with exposed pad, which allows the device dissipating the heat that is generated by the operation of the two linear regulators and the power amplifier. A mechanical drawing of the VFQFPN48 package is included in Figure 15. Table 9. VFQFPN48 (7 x 7 x 1.0 mm) package mechanical data (mm) Dim. Min. Typ. Max. 0.80 0.90 1.00 A1 0.02 0.05 A2 0.65 1.00 A3 0.25 A b 0.18 0.23 0.30 D 6.85 7.00 7.15 D2 4.95 5.10 5.25 E 6.85 7.00 7.15 E2 4.95 5.10 5.25 e 0.45 0.50 0.55 L 0.30 0.40 0.50 ddd 24/27 0.08 Doc ID 17526 Rev 1 ST7570 Package mechanical data Figure 15. VFQFPN48 (7 x 7 x 1.0 mm) package outline Doc ID 17526 Rev 1 25/27 Revision history 11 ST7570 Revision history Table 10. 26/27 Document revision history Date Revision 27-May-2010 1 Changes Initial release. Doc ID 17526 Rev 1 ST7570 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17526 Rev 1 27/27