DataSheeT - enpirion(R) power solutions EN6362QI 6A PowerSoC Step-Down DC-DC Switching Converter with Integrated Inductor DESCRIPTION FEATURES The EN6362QI is an Intel(R) Enpirion(R) Power System on a Chip (PowerSoC) DC-DC converter with an integrated inductor, PWM controller, MOSFETs and compensation to provide the smallest solution size in an 8x8x3mm 56 pin QFN module. It offers very high efficiency and is able to provide 6A continuous output current with no de-rating. The EN6362QI also provides excellent line and load regulation over temperature. The EN6362QI is specifically designed to meet the precise voltage and fast transient requirements of high-performance, low-power processor, DSP, FPGA, memory boards and system level applications in distributed power architecture. * High Efficiency (Up to 96%) Other features include precision enable threshold, pre-bias monotonic start-up, and programmable soft-start. The device's advanced circuit techniques, ultra-high switching frequency, and proprietary integrated inductor technology deliver high-quality, ultra-compact DC-DC conversion. * RoHS Compliant, MSL Level 3, 260C Reflow Intel Enpirion integrated inductor solution significantly helps to reduce noise. The complete power converter solution enhances productivity by offering greatly simplified board design, layout and manufacturing requirements. All Enpirion products are RoHS compliant and lead-free manufacturing environment compatible. * Industrial automation, servers, storage, adapter cards, wireless base stations, test and measurement, and embedded computing. * Space constrained applications that require the highest power density. * Noise sensitive applications. VOUT VIN EN AVIN * 1.5% VFB Accuracy * Optimized Total Solution Size (160 mm2) * Precision Enable Threshold for Sequencing * Programmable Soft-Start * Pin compatible with the EN6382QI (8A) * Thermal, Over-Current, Short Circuit, Reverse Current Limit and Under-Voltage Protections APPLICATIONS * Point of Load Regulation for FPGAs, ASICs Processors, DSPs, and Distributed Power Architectures 2x 47F 1206 EN6362QI SS PGND AGND FQADJ CA R1 ENABLE PGND Efficiency vs Output Current 100 95 RA VFB 15nF * Input Voltage Range (3.0V to 6.5V) VOUT 10 2x 22F 1206 * Up to 6A Continuous Operating Current RB RFQADJ EFFICIENCY (%) PVIN * Excellent Ripple and EMI Performance 90 85 80 VOUT = 1V VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V 75 70 65 60 0 Figure 1: Simplified Applications Circuit 1 2 3 4 OUTPUT CURRENT (A) 5 6 Figure 2: Efficiency at VIN = 5V Page 1 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI ORDERING INFORMATION Part Number Package Markings TJ Rating Package Description EN6362QI EN6362QI -40C to +125C 56-pin (8mm x 8mm x 3mm) QFN EVB-EN6362QI EN6362QI QFN Evaluation Board Packing and Marking Information: https://www.intel.com/content/www/us/en/programmable/support/quality-and-reliability/packing.html NC NC NC NC NC(SW) NC(SW) NC(SW) NC(SW) PGOOD VSENSE SS FQADJ AGND AVIN 56 55 54 53 52 51 50 49 48 47 46 45 44 43 PIN FUNCTIONS NC 1 42 VFB NC 2 41 ENABLE NC 3 40 BGND NC 4 39 VDDB NC 5 38 NC NC 6 37 NC 36 PVIN 35 PVIN 34 PVIN 33 PVIN 60 NC 57 PGND NC 7 NC 8 NC 9 NC 10 NC 11 32 PVIN NC 12 31 PVIN NC 13 30 PVIN NC 14 29 PVIN 59 DNC (VIN) 22 23 24 25 26 27 28 NC(SW) PGND PGND PGND PGND PGND NC NC 19 VOUT 21 18 VOUT NC 17 VOUT 20 16 NC 15 VOUT 58 DNC (VOUT) Figure 3: Pin Diagram (Top View) NOTE A: NC pins are not to be electrically connected to each other or to any external signal, ground or voltage. However, they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage. NOTE B: White `dot' on top left is pin 1 indicator on top of the device package. NOTE C: Grayed-out pins are not to be soldered to the PCB. Refer to Figure 9 for the keepout diagram. Page 2 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI PIN DESCRIPTIONS PIN NAME TYPE FUNCTION 1-14, 19-22, 37-38, 53-56 NC - NO CONNECT: They must be soldered to PCB but not be electrically connected to any external signal, ground, or voltage. Failure to follow this guideline may result in device damage. (1) 15-18 VOUT Power Regulated converter output. Connect to the load and place output filter capacitor(s) between these pins and PGND pins. 23 NC(SW) - NO CONNECT (1) 24-28 PGND Power Input and output power ground. Connect these pins to the ground electrode of the input and output filter capacitors. Refer to VOUT, PVIN descriptions and Layout Recommendation for more details. 29-36 PVIN Power Input power supply. Connect to input power supply and place input filter capacitor(s) between these pins and PGND pins. 39 VDDB Power Internal regulated voltage used for the internal control circuitry. No external connection needed. 40 BGND Power Ground for VDDB. Refer to the pin 39 description. Analog Device enable pin. A high level or floating this pin enables the device while a low level disables the device. A voltage ramp from another power converter may be applied for precision enable. Refer to Power Up Sequencing. 41 ENABLE 42 VFB Analog This is the external feedback input pin. A resistor divider connects from the output to AGND. The mid-point of the resistor divider is connected to VFB. A feed-forward capacitor (CA) and resistor (RC) are required parallel to the upper feedback resistor (RA). The output voltage regulation is based on the VFB node voltage equal to 0.600V. 43 AVIN Power Analog input voltage for the control circuits. Connect this pin to the input power supply (PVIN) at a quiet point, through a 10 resistor. 44 AGND Power The quiet ground for the control circuits. Connect to the ground plane with a via right next to the pin. 45 FQADJ Analog Frequency adjust pin. This pin must have a resistor to AGND, which sets the free running frequency of the internal oscillator. 46 SS Analog A soft-start capacitor is connected between this pin and AGND. The value of the capacitor controls the soft-start interval. Refer to Soft-Start in the Functional Description for more details. 47 VSENSE Analog This pin senses output voltage. Connect VSENSE to VOUT. 48 PGOOD Digital PGOOD is a logic level high when VOUT is within -10% to +10% of the programmed output voltage (0.9VOUT_NOM VOUT 1.1VOUT_NOM). This pin has an internal pull-up resistor to AVIN with a nominal value of 100k. Page 3 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI PIN 49-52 NAME NC (SW) TYPE FUNCTION - NO CONNECT: These pins must be soldered to PCB and can be electrically connected to each other but not to any external signal, voltage or ground. Failure to follow this guideline may result in device damage. Power Not a perimeter pin. Device thermal pad must be connected to the system GND plane for heat-sinking purposes. Refer to Layout Recommendation section. 57 PGND 58 DNC (VOUT) Power DO NOT CONNECT: Not a perimeter pin. This pin may be internally connected and must not be soldered to the PCB or connected to any external signal, voltage or ground. 59 DNC (VIN) Power DO NOT CONNECT: Not a perimeter pin. This pin may be internally connected and must not be soldered to the PCB or connected to any external signal, voltage or ground. 60 NC - Not a perimeter pin. Device mechanical pad must be soldered to the PCB to improve Board Level Reliability. This pin may be internally connected and must not be connected to any external signal, voltage or ground. (1) (1) The NC pins must be soldered to PCB but not electrically connected to each other or to any external signal, voltage, or ground. These pins may be connected internally. Failure to follow this guideline may result in device damage. ABSOLUTE MAXIMUM RATINGS CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Absolute Maximum Pin Ratings PARAMETER SYMBOL MIN MAX UNITS PVIN, AVIN, VOUT -0.3 7.0 V ENABLE, PGOOD -0.3 VIN+0.3 V VFB, SS, FQADJ -0.3 2.5 V MIN MAX UNITS +150 C +150 C +260 C Absolute Maximum Thermal Ratings PARAMETER CONDITION Maximum Operating Junction Temperature Storage Temperature Range Reflow Peak Body Temperature -65 (10 Sec) MSL3 JEDEC J-STD-020A Page 4 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI Absolute Maximum ESD Ratings PARAMETER CONDITION MIN MAX UNITS HBM (Human Body Model) 2000 V CDM (Charged Device Model) 500 V RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN MAX UNITS VIN 2.5 6.5 V Output Voltage Range VOUT 0.6 VIN - VDO (2) V Output Current Range IOUT 6 A +125 C Input Voltage Range Operating Junction Temperature TJ -40 THERMAL CHARACTERISTICS PARAMETER SYMBOL TYPICAL UNITS TSD 150 C TSDHYS 25 C Thermal Resistance: Junction to Ambient (0 LFM) (3) JA 16 C/W Thermal Resistance: Junction to Case (0 LFM) JC 1 C/W Thermal Shutdown Thermal Shutdown Hysteresis (2) VDO (dropout voltage) is defined as (ILOAD x Droput Resistance). Please refer to Electrical Characteristics Table. (3) Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for high thermal conductivity boards. Page 5 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI ELECTRICAL CHARACTERISTICS NOTE: VIN = 6.5V, Minimum and Maximum values are over operating ambient temperature range unless otherwise noted. Typical values are at TA = 25C. PARAMETER SYMBOL VFB VFB Pin Voltage VUVLOR TEST CONDITIONS TA =-40C to 85C, 3V VIN 6.5V, ILOAD = 0A to 6A TA =-40C to 105C, 3V VIN 6.5V, ILOAD = 0A to 6A MIN TYP MAX UNITS 0.591 0.600 0.609 V 0.588 0.600 0.612 V +10 nA VFB Pin Input Leakage Current IVFB VFB Pin Input Leakage Current Shut-Down Supply Current ISD Power Supply Current with ENABLE=0 0.7 mA Under Voltage Lockout (VIN Rising) VUVLOR Voltage Above Which UVLO is Not Asserted 2.3 V Under Voltage Lockout (VIN Falling) VUVLOF Voltage Below Which UVLO is Asserted 2.0 V Drop Out Voltage VDO VIN = 3V, VOUT set 3.3V, ILOAD = 6A, 100% duty cycle 210 450 mV Drop Out Resistance RDO Input to Output Resistance 35 75 m Over Current Trip Level IOCP Sourcing Current 8 14 17 A Switching Frequency FSW RFQADJ = 6.98k, VIN = 5V 0.9 1.2 1.5 MHz Range of Output Voltage as a Fraction of Programmed Value. PGOOD is Asserted. (4) 87 90 93 % 107 112 113 % 0.2 V Power Good Low Power Good High Range of Output Voltage as a Fraction of Programmed Value. -10 PGOOD is Asserted. (4) VPGOOD Logic Level Low With 4mA Current Sink into PGOOD Pin VPGOOD Logic Level High VIN V PGOOD Internal pullup resistor 100 k Page 6 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI PARAMETER Soft Start Current SYMBOL ISS TEST CONDITIONS MIN TYP MAX UNITS Soft start current generator towards GND 6.5 9 11.5 A 3.0V VIN 6.5V; 1.08 1.12 1.16 V 0.95 1.01 1.07 V ENABLE Logic Level VENABLE DISABLE Logic Level VDISABLE ENABLE hysteresis VEN_Hyst 110 mV Pull-up EN resistor REN_UP 190 k REN_DWN 110 k TOTP 150 C OTPHYST 25 C Pull-down EN resistor OTP level OTP hysteresis (4) After crossing the PGOOD threshold level, there is a 70 s (at 1.2 MHz) delay before PGOOD is de-asserted. Page 7 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI TYPICAL PERFORMANCE CURVES Efficiency vs Output Current 100 95 85 EFFICIENCY (%) 80 75 70 65 VOUT = 1V 60 VOUT = 1.2V 55 VOUT = 1.8V 50 1 2 3 4 5 VOUT = 1V VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V 0 6 1 5 6 1.5 FREQUENCY (MHz) EFFICIENCY (%) 4 Frequency vs RFQADJ Efficiency vs Output Current VIN = 3.3V VIN = 5V VIN = 5.5V 1 0.5 0 1 2 3 4 5 4 6 9 OUTPUT CURRENT (A) 0 1 2 3 4 OUTPUT CURRENT (A) 5 6 14 RFQADJ (k) 19 Efficiency, Power Loss vs Output Current 100 EFFICIENCY (%) 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 POWER LOSS (W) Efficiency, Power Loss vs Output Current EFFICIENCY (%) 100 90 80 70 60 50 40 30 20 10 0 3 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 100 95 90 85 80 75 70 65 60 55 50 45 40 2 1 90 0.9 80 0.8 70 0.7 60 0.6 50 0.5 40 0.4 30 0.3 20 0.2 10 0.1 0 POWER LOSS (W) EFFICIENCY (%) 90 0 Efficiency vs Output Current 100 95 90 85 80 75 70 65 60 55 50 45 40 0 0 1 2 3 4 OUTPUT CURRENT (A) 5 6 Page 8 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI 80 0.8 70 0.7 60 0.6 50 0.5 40 0.4 30 0.3 20 0.2 10 0.1 0 0 2 4 OUTPUT CURRENT (A) 100 90 80 70 60 50 40 30 20 10 0 0 6 1.001 Load = 0A Load = 3A 0.997 Load = 6A 0.995 0.993 0.991 CONDITIONS VOUT = 1.0V 0.989 3.0 3.5 4.0 4.5 5.0 5.5 6.0 1 2 3 4 5 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 6 OUTPUT CURRENT (A) Output voltage vs Input Voltage 0.999 Efficiency, Power Loss vs Output Current EFFICIENCY (%) 0.9 0 OUTPUT VOLTAGE (V) 1 90 OUTPUT VOLTAGE (V) EFFICIENCY (%) 100 POWER LOSS (W) Efficiency, Power Loss vs Output Current POWER LOSS (W) TYPICAL PERFORMANCE CURVES (CONTINUED) 6.5 INPUT VOLTAGE (V) Output voltage vs Output Current 1.000 0.999 0.998 0.997 0.996 0.995 VIN = 3.3V 0.994 VIN = 5.5V 0.993 0 2 4 OUTPUT CURRENT (A) 6 No Thermal Derating GUARANTEED LOAD (A) 8 7 6 5 4 3 2 CONDITIONS VIN = 3V to 6.5V VOUT = 0.6V to 3.3V 1 0 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE(C) Page 9 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI TYPICAL PERFORMANCE CHARACTERISTICS Page 10 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) Page 11 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI FUNCTIONAL BLOCK DIAGRAM VSENSE PVIN UVLO VDDB PRE-BIAS OTP LDO CURRENT LIMIT BGND P-DRIVER NC(SW) VOUT FQADJ RAMP PWM COMP + N-DRIVER PGND P COMPENSATION NETWORK 190k AVIN + 110k ENABLE VFB ERROR AMP EN COMP POWER GOOD 100k AVIN A SS PGOOD AVIN SOFT START MINIMUM DETECTOR Bandgap Reference AVIN A AGND Figure 4: Functional Block Diagram Page 12 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI FUNCTIONAL DESCRIPTION Synchronous DC-DC Step-Down PowerSoC The EN6362QI is a synchronous buck power supply with integrated power MOSFET switches and integrated inductor. The switching supply uses voltage mode control and a low noise PWM topology. The nominal input voltage range is 3.0 - 6.5 volts. The output voltage is programmed using an external resistor divider network. The feedback control loop incorporates a Type IV voltage mode control design. Type IV voltage mode control maximizes control loop bandwidth and maintains excellent phase margin to improve transient performance. Although the EN6362QI is guaranteed to support up to 6A continuous output current operation over the full ambient temperature range (thermal design), the peak current supported before reaching OCP is substantially higher, exceeding 10A. The operating switching frequency can be adjusted by an external resistor between 0.7MHz and 1.7MHz. The high switching frequency enables the use of small-size input and output capacitors. EN6362QI electrical features at a glance: * Precision Enable Threshold * Soft-Start * Pre-bias Start-Up * Resistor Programmable Switching Frequency * Power Good * Over-Current/Short Circuit Protection * Reverse Current Limit (RCL) * Thermal Shutdown (OTP) with Hysteresis * Under-Voltage Lockout Precision Enable The ENABLE threshold is a precision analog voltage rather than a digital logic threshold. A precision voltage reference and a comparator circuit are kept powered up even when ENABLE is de-asserted. The narrow voltage gap between ENABLE Logic Low and ENABLE Logic High (about 100mV hysteresis) allows the device to turn on at a precise enable voltage level. The precise enable threshold, in conjunction with the proper choice of soft-start capacitors allows accurate sequencing for multiple power supplies. ENABLE has a 2ms lockout time that prevents the device from re-enabling immediately after it has been disabled. Soft-Start The SS pin, in conjunction with a small external capacitor between this pin and AGND provides the soft-start function, designed to limit in-rush current during start-up. When the part is enabled, soft-start (SS) current generator charges the SS capacitor in a linear manner. As long as the SS voltage level is smaller than the feedback reference (about 0.6V) the SS voltage is used as feedback reference, ensuring a linear increase of the output voltage. Once the voltage on the SS capacitor reaches 0.6V, the minimum detector Figure 4 will select the bandgap reference as target, while the voltage across the SS capacitor will continue ramping up until it reaches about 1.5V. As the SS voltage slew rate depends on the SS capacitor, so does the output voltage. The rise time is defined as the time needed by the output voltage to go from zero to 95% of the programmed value. The rise time (tRISE) is given by the following equation: Page 13 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI tRISE [ms] = Css [nF] x 0.065 The recommended range for the value of the SS capacitor is between 10nF and 100nF. Pre-Bias Start-up The EN6362QI supports startup into a pre-biased load. A proprietary circuit ensures the output voltage rises up from the pre-bias value to the programmed output voltage. Start-up is guaranteed to be monotonic for pre-bias voltages in the range of 20% to 75% of the programmed output voltage with a minimum pre-bias voltage of 300mV. Outside of the 20% to 75% range, the output voltage rise will not be monotonic. For this feature to work properly, the EN6362QI must be enabled after VIN ramped up. Resistor Programmable Frequency The operation of the EN6362QI can be optimized by a proper choice of the RFQADJ resistor. If high efficiency is the most important factor, then a lower switching frequency should be selected. If a better transient response is the most important factor, a higher switching frequency should be selected. The typical Frequency vs RFQADJ relationship over the suggested range of RFQADJ is shown in the typical performance curves. PGOOD Operation The PGOOD pin is used only to signal whether the output voltage is within the specified range. The PGOOD signal is asserted high when the rising output voltage exceeds 92% of the programmed output voltage. If the output voltage falls outside the range (roughly 90% to 110%), PGOOD remains asserted for the de-glitch time (about 70s at 1.2MHz switching frequency). After the de-glitch time, PGOOD is de-asserted. PGOOD is also de-asserted if the output voltage exceeds 110% of the programmed output voltage. Over Current Protection The current level is sensed through the High Side Switch. The OCP trip point is nominally set around 14A average current. When the sensed current exceeds the current limit level, both power FETs are turned off for the rest of the switching cycle. If for the next cycle the over-current condition is removed, the PWM operation will resume. In the event the OCP circuit trips at least 8 consecutive PWM cycles, the device enters a hiccup mode; the device is disabled for about 27ms and restarted with a normal soft-start. This cycle can continue indefinitely as long as the over current condition persists. Over Temperature Protection Temperature sensing circuits in the controller will disable operation when the junction temperature exceeds approximately 150C. Once the junction temperature drops by approximatively 25C, the converter will resume operation with a normal soft-start. Input Under-Voltage Lock-Out When the rising input voltage is below the required voltage level (VUVLOR), switching is inhibited; the lock-out threshold has hysteresis to prevent chatter, thus when the device is operating around the UVLO limit, the input voltage has to fall below the lower threshold (VUVLOF) for the device to stop switching. Page 14 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI Reverse Current Limit protection In order to prevent excessive current buildup in the low side MOSFET, a Reverse Current Limit protection is used; if the Low side MOSFET is kept on during two full PWM cycles, the output will be left floating for the next three cycles. This is an effective method of protecting the low side MOSFET against Over-Current during boostback. APPLICATION INFORMATION Output Voltage Programming and loop Compensation The EN6362QI output voltage is programmed using a simple resistor divider network. A phase lead capacitor plus a resistor are required for stabilizing the loop. Figure 5 shows the required components and the equations to calculate their values. The EN6362QI output voltage is determined by resistor divider between VOUT and AGND with the midpoint going to VFB. During steady state operation, the voltage presented at the VFB pin is equal to the internal voltage reference. Most of EN6362QI compensation network is integrated; however, a phase lead capacitor and a resistor are required in parallel with the upper resistor of the external feedback network. Total compensation is optimized for use with two 47F output capacitors and will result in a wide loop bandwidth and excellent load transient performance for most applications. Additional capacitance may be placed beyond the voltage sensing point outside the control loop. Voltage mode operation provides high noise immunity at light load. In some cases, modifications to the compensation or output capacitance may be required to optimize device performance such as transient response, ripple, or hold-up time. The EN6362QI provides the capability to modify the control loop response to allow for customization for such applications. A simulation model is available upon request. VOUT CA RA RC VFB RB A Figure 5: External Feedback/Compensation Network Page 15 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI The feedback and compensation network values depend on the input voltage and output voltage. The external feedback and compensation network values can be calculated using the equations below. = 294 = x - where VFB = 0.6V RA & RB value must be rounded to closest standard value Table 1: Recommended Compensation Values VIN (V) Vout (V) RA (k) CA (pF) RC (k) All VIN 1.8 294 10 15 4.5 <1.8 294 10 15 <4.5 <1.8 294 22 20.5 Table 1 shows the recommended values for the compensation components. The output voltage should be sensed close to the most distant capacitor from the local output decoupling. All components from the compensation network must be placed as close as possible to the EN6362QI, and the output-voltage-feedback, low-impedance trace should go directly to the controller, keeping the high impedance VFB trace as short as possible. In order to keep the feedback signal as clean as possible, it is recommended to connect RB directly to the AGND pin, rather than going through the GND plane. Compensation and Transient Response The EN6362QI uses an enhanced type III voltage mode control architecture. Most of the compensation is internal, which simplifies the design. In some applications, improved transient performance may be desired with additional output capacitors (COUT). In such an instance, the phase-lead capacitor (CA) can be adjusted depending on the total output capacitance. Using Table 1 as the reference for CA, if COUT is increased, then the CA should also be increased. The relationship is linearly shown below: COUT +100F CA +10pF As COUT increases and the CA value is adjusted, the device bandwidth will reach its optimization level (at around 1/10th of the switching frequency). As shown in Table 1, the recommended C A value is lower for the input voltage 4.5V than the input voltage < 4.5V. This is to ensure that the loop bandwidth is not over extended due to the increased gain at the higher input voltage range. The CA value may be extrapolated for other input voltages. The limitation for adjusting the compensation is based on diminished return. Further adjustments by increasing COUT and increasing CA may not yield better transient response or in some situations cause lower gain and phase margin. Over compensating with excessive output capacitance may also cause the device to trigger current limit on startup due to the energy required to charge the output up to regulation level. Due to such limitations, the recommended maximum output capacitance (C OUT_MAX) is 600F and the recommended maximum phase-lead capacitance (CA_MAX) is 47pF. Page 16 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI Input Capacitor Selection The EN6362QI has been optimized for use with two 1206 22F input capacitors. Low ESR ceramic capacitors are required with X5R or X7R dielectric formulation. Y5V or equivalent dielectric formulations must not be used, as these significantly lose capacitance over frequency, temperature and bias voltage. In some applications, lower value ceramic capacitors may be needed in parallel with the larger capacitors in order to provide high frequency decoupling. The capacitors shown in the Table 2 are typical input capacitors. Other capacitors with similar characteristics may also be used. Table 2: Recommended Input Capacitors Description MFG P/N 22F, 10V, 20%, X5R, 1206 Murata GRM31CR61A226ME19L (2 capacitors needed) Taiyo Yuden LMK316BJ226ML-T Output Capacitor Selection The EN6362QI has been optimized for use with two 1206 47F output capacitors. Low ESR, X5R or X7R ceramic capacitors are recommended as the primary choice. Y5V or equivalent dielectric formulations must not be used as these significantly lose capacitance over frequency, temperature and bias voltage. The capacitors shown in the Recommended Output Capacitors Table 3 are typical output capacitors. Other capacitors with similar characteristics may also be used. Additional bulk capacitance from 100F to 1000F may be placed beyond the voltage sensing point outside the control loop. This additional capacitance should have a minimum 6m ESR to ensure stable operation. Most tantalum capacitors will have more than 6m of ESR and may be used without special care. Adding distance in layout may help increase the ESR between the feedback sense point and the bulk capacitors. Table 3: Recommended Output Capacitors Description MFG P/N Taiyo Yuden LMK316BJ476ML-T 47F, 6.3V, 20%, X5R, 1206 Murata GRM31CR60J476ME19L (2 capacitors needed) Taiyo Yuden JMK316BJ476ML-T 10F, 6.3V, 10%, X7R, 0805 (Optional 1 capacitor in parallel with 2x47F) Murata GRM21BR70J106KE76L Taiyo Yuden JMK212B7106KG-T 47F, 10V, 20%, X5R, 1206 (2 capacitors needed) Output ripple voltage is primarily determined by the aggregate output capacitor impedance. Placing multiple capacitors in parallel reduces the impedance and hence will result in lower ripple voltage. 1 Z Total 1 1 1 ... Z1 Z 2 Zn Page 17 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI Table 4: Typical Ripple Voltages Output Capacitor Configuration Typical Output Ripple (mVp-p) 2 x 47 F <10mV 20 MHz bandwidth limit measured on Evaluation Board THERMAL CONSIDERATIONS Thermal considerations are important power supply design facts that cannot be avoided in the real world. Whenever there are power losses in a system, the heat that is generated by the power dissipation needs to be accounted for. The Enpirion PowerSoC helps alleviate some of those concerns. The Enpirion EN6362QI DC-DC converter is packaged in a 8x8x3mm 56-pin QFN package. The QFN package is constructed with copper lead frames that have exposed thermal pads. The exposed thermal pad on the package should be soldered directly on to a copper ground pad on the printed circuit board (PCB) to act as a heat sink. The recommended maximum junction temperature for continuous operation is 125C. Continuous operation above 125C may reduce long-term reliability. The device has a thermal overload protection circuit designed to turn off the device at an approximate junction temperature value of 150C. The EN6362QI is guaranteed to support the full 6A output current up to 105C ambient temperature. The following example and calculations illustrate the thermal performance of the EN6362QI. Example: VIN = 5.5V VOUT = 1.0V IOUT = 6A First calculate the output power. POUT = 1.0V x 6A = 6.0W Next, determine the input power based on the efficiency () shown in Figure 6. 100 90 Efficiency (%) 80 70 60 50 40 30 20 10 0 0 1 2 3 4 Output Current (A) 5 6 Figure 6: Efficiency VIN =5.5V, VOUT = 1.0V Page 18 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI For VIN = 5.5V, VOUT = 1.0V at 6A, 88% = POUT / PIN = 88% = 0.88 PIN = POUT / PIN 6.0W/ 0.88 6.818W The power dissipation (PD) is the power loss in the system and can be calculated by subtracting the output power from the input power. PD = PIN - POUT 6.818W - 6.0W 0.818W With the power dissipation known, the temperature rise in the device may be estimated based on the theta JA value (JA). The JA parameter estimates how much the temperature will rise in the device for every watt of power dissipation. The EN6362QI has a JA value of 16 C /W without airflow. Determine the change in temperature (T) based on PD and JA. T = PD x JA T 0.818W x 16C/W = 13.088C 13.1C The junction temperature (TJ) of the device is approximately the ambient temperature (T A) plus the change in temperature. We assume the initial ambient temperature to be 25C. TJ = TA + T TJ 25C + 13.1C 38.1C With 0.818W dissipated into the device, the TJ will be 38.1C. The maximum operating junction temperature (TJMAX) of the device is 125C, so the device can operate at a higher ambient temperature. The maximum ambient temperature (TAMAX) allowed can be calculated. TAMAX = TJMAX - PD x JA 125C - 13.1C 111.9C The ambient temperature can actually rise by another 86.9C, bringing it to 111.9C before the device will reach TJMAX. This indicates that the EN6362QI can support the full 6A output current range up to approximately 112C ambient temperature given the input and output voltage conditions. This allows the EN6362QI to guarantee full 6A output current capability at 105C with room for margin. Note that the efficiency will be slightly lower at higher temperatures and this estimate will be slightly lower. Page 19 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI APPLICATION CIRCUITS 57 PGND 29 30 31 32 33 34 35 36 37 38 39 40 41 42 VIN Cin2 22uF/ 10V 22uF/ 10V R1 10 U1 EN6362 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VOUT Ca Ra 10pF Rc 294k 15k Cout1 Cout2 47uF/ 10V 47uF/ 10V Rb 442k Rfqadj 43 44 45 46 47 48 49 50 51 52 53 54 55 56 58 Cin1 PVIN PVIN PVIN PVIN PVIN PVIN PVIN PVIN NC NC VDDB BGND ENABLE VF B AVIN AGND FADJ SS VSENSE PGOOD SW SW SW SW NC NC NC NC NC VIN PGND 28 27 PGND 26 PGND 25 PGND 24 PGND 23 SW 22 NC 21 NC 20 NC 19 NC 18 VOUT 17 VOUT 16 VOUT 15 VOUT VOUT 0 5.49k R0 Figure 7: Engineering Schematic with Engineering Notes Page 20 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI LAYOUT RECOMMENDATIONS This layout only shows the critical components and top layer traces for minimum footprint in single-supply mode with ENABLE tied to AVIN. See Figure 7 for corresponding schematic. Figure 8: Top Layout with Critical Components Only (Top View) Recommendation 1: Input and output filter capacitors should be placed on the same side of the PCB, and as close to the EN6362QI package as possible. They should be connected to the device with very short and wide traces. Do not use thermal reliefs or spokes when connecting the capacitor pads to the respective nodes. The +V and GND traces between the capacitors and the EN6362QI should be as close to each other as possible so that the gap between the two nodes is minimized, even under the capacitors. Recommendation 2: The PGND connections for the input and output capacitors on layer 1 need to have a slit between them in order to provide some separation between input and output current loops. Recommendation 3: The system ground plane should be on the 2nd layer (below the surface layer). This ground plane should be continuous and un-interrupted. Recommendation 4: The thermal pad underneath the component must be connected to the system ground plane through as many VIAs as possible. The drill diameter of the VIAs should be 0.33mm, and the VIAs must have at least 1 oz. copper plating on the inside wall, making the finished hole size around 0.20-0.26mm. Do not use thermal reliefs or spokes to connect the VIAs to the ground plane. This connection provides the path for heat dissipation from the converter. Page 21 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI Recommendation 5: Multiple small VIAs (the same size as the thermal VIAs discussed in recommendation 4) should be used to connect ground terminal of the input capacitor and output capacitors to the system ground plane. It is preferred to put these VIAs along the edge of the GND copper closest to the +V copper. These VIAs connect the input/output filter capacitors to the GND plane, and help reduce parasitic inductances in the input and output current loops. Recommendation 6: AVIN is the power supply for the internal small-signal control circuits. It should be connected to the input voltage at a quiet point. In Figure 8 this connection is made at the input capacitor furthest from the PVIN pin and on the input source side. Avoid connecting AVIN near the PVIN pin even though it is the same node as the input ripple is higher there. Recommendation 7: The VOUT sense point should be connected at the last output filter capacitor furthest from the VOUT pins. Keep the sense trace as short as possible in order to avoid noise coupling into the control loop. Recommendation 8: Keep RA, CA, RC and RB close to the VFB pin (see Figure 8). The VFB pin is a highimpedance, sensitive node. Keep the trace to this pin as short as possible. Whenever possible, connect RB directly to the AGND pin instead of going through the GND plane. The AGND should connect to the PGND at a single point from the AGND pin to the PGND plane on the 2nd layer. Recommendation 9: The layer 1 metal under the device must not be more than shown in Figure 9. See the following section regarding Exposed Metal on Bottom of Package. As with any switch-mode DC-DC converter, try not to run sensitive signal or control lines underneath the converter package on other layers. Page 22 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI DESIGN CONSIDERATIONS FOR LEAD-FRAME BASED MODULES Exposed Metal on Bottom of Package Lead-frames offer many advantages in thermal performance, in reduced electrical lead resistance, and in overall foot print. However, they do require some special considerations. In the assembly process lead frame construction requires that, for mechanical support, some of the leadframe cantilevers be exposed at the point where wire-bond or internal passives are attached. This results in several small pads being exposed on the bottom of the package, as shown in Figure 9. Only the thermal, mechanical and perimeter pads are to be mechanically or electrically connected to the PC board. The PCB top layer under the EN6362QI should be clear of any metal (copper pours, traces, or VIAs) except for the thermal and mechanical pads. The "shaded-out" area in Figure 9 represents the area that should be clear of any metal on the top layer of the PCB. Any layer 1 metal under the shaded-out area runs the risk of undesirable shorted connections even if it is covered by solder mask. The solder stencil aperture should be smaller than the PCB ground pad and mechanical pad. This will prevent excess solder causing bridging between adjacent pins or other exposed metal under the package. Figure 10 shows the recommended solder stencil drawing. Please consult https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/enpirion_soldering_guid elines.pdf Soldering Guidelines for more details and recommendations. Figure 9: Lead-Frame exposed metal (Bottom View) Shaded area highlights exposed metal that is not to be mechanically or electrically connected to the PCB. Page 23 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI PCB FOOTPRINT GUIDE Figure 10: Solder stencil drawing (Top View) The solder stencil aperture for the non-perimeter pads is shown in blue in Figure 10 and is based on Enpirion power product manufacturing specifications. Page 24 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI PACKAGE DIMENSIONS Figure 11: EN6362QI Package Dimensions Packing and Marking Information: https://www.intel.com/content/www/us/en/programmable/support/quality-andreliability/packing.html Page 25 11656 November 27, 2018 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EN6362QI REVISION HISTORY Rev Date Change(s) A Jan 2016 Introductory production datasheet B Oct 2016 C Dec 2016 D Feb 2017 E Dec 2017 F Oct 2018 * Modified pinout and pin description for pins 58-60 * Added performance characteristics and curves for line and load regulation, derating, EMI performance, load transients * Added recommendations table for compensation components * Modified Figure 6 to show efficiency curve for Vin=5.5V, Vout=1.0V and updated equations following it for =88% * Removed equation to predict to predict frequency vs Rfqadj relationship from frequency programming discussion * Modified recommended schematic and layout * Added solder stencil drawing * Formatting changes * Updated total solution size from 170 mm2 to 160 mm2 * Added pin compatibility with EN6382QI on the features list * Updated package marking on the package dimensions drawing * Modified simplified applications schematic to show AGND-PGND connection * Modified pin diagram to differentiate pins under the keepout area * Updated pin description for pins 58 and 59 * Modified typical derating curve to extend up to 105C * Modified layout recommendation * Formatting changes * Updated Layout Recommendations section * Updated Figures Numbers throughout document * Changed datasheet into Intel format WHERE TO GET MORE INFORMATION For more information about Intel(R) and Enpirion(R) PowerSoCs, visit: http://www.intel.com/enpirion (c) 2017 Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS, and STRATIX words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other marks and brands may be claimed as the property of others. Intel reserves the right to make changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. * Other marks and brands may be claimed as the property of others. Page 26 11656 November 27, 2018 Rev F