TL7726 HEX CLAMPING CIRCUITS SLAS078C - SEPTEMBER 1993 - REVISED JULY 1999 D D D D D D D OR P PACKAGE (TOP VIEW) Protects Against Latch-Up 25-mA Current Sink in Active State Less Than 1-mW Dissipation in Standby Condition Ideal for Applications in Environments Where Large Transient Spikes Occur Stable Operation for All Values of Capacitive Load No Output Overshoot GND CLAMP CLAMP CLAMP 1 8 2 7 3 6 4 5 REF CLAMP CLAMP CLAMP description The TL7726 consists of six identical clamping circuits that monitor an input voltage with respect to a reference value, REF. For an input voltage (VI) in the range of GND to < REF, the clamping circuits present a very high impedance to ground, drawing current of less than 10 A. The clamping circuits are active for VI < GND or VI > REF when they have a very low impedance and can sink up to 25 mA. These characteristics make the TL7726 ideal as protection devices for CMOS semiconductor devices in environments where there are large positive or negative transients to protect analog-to-digital converters in automotive or industrial systems. The use of clamping circuits provides a safeguard against potential latch-up. The TL7726C is characterized for operation over the temperature range of 0C to 70C. The TL7726I is characterized for operation over the temperature range of - 40C to 85C. The TL7726Q is characterized for operation over the temperature range of - 40C to 125C. AVAILABLE OPTIONS SOIC (D) PLASTIC DIP (P) TA 0C to 70C TL7726CD TL7726CP - 40C to 85C TL7726ID TL7726IP - 40C to 125C TL7726QD TL7726QP The D package is available taped and reeled. Add the suffix R to the device type (i.e., TL7726CDR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 TL7726 HEX CLAMPING CIRCUITS SLAS078C - SEPTEMBER 1993 - REVISED JULY 1999 absolute maximum ratings over operating free-air temperature (unless otherwise noted) Reference voltage, Vref . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Clamping current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Package thermal impedance, JA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can impact reliability. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions MIN MAX 4.5 5.5 Reference voltage, Vref VI Vref VI GND Input clamping current current, IIK 25 - 25 TL7726C Operating free-air temperature range, TA 0 70 TL7726I - 40 85 TL7726Q - 40 125 UNIT V mA C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK + VIK - Positive clamp voltage IZ Reference current II TEST CONDITIONS II = 20 mA II = 20 mA Negative clamp voltage MIN TYP Vref - 200 Vref = 5 V Vref - 50 mV VI Vref GND VI 50 mV Input current 50 mV VI Vref - 50 mV MAX UNIT Vref + 200 0 mV 60 A 25 mV 10 A - 10 -1 1 All typical values are at TA = 25C. switching characteristics specified at TA = 25C PARAMETER ts 2 Settling time TEST CONDITIONS VI(system) = 13 V,, Measured at 10% to 90%, POST OFFICE BOX 655303 RI = 600 ,, See Figure 1 * DALLAS, TEXAS 75265 MIN tt < 1 s, , MAX 30 UNIT s TL7726 HEX CLAMPING CIRCUITS SLAS078C - SEPTEMBER 1993 - REVISED JULY 1999 PARAMETER MEASUREMENT INFORMATION VCC = 5 V REF 600 VI(system) CLAMP TL7726 GND TEST CIRCUIT 90% 13 V VIK 0V VI(system) VIK + 95% 5% VIK - 10% - 13 V ts tt tt INPUT WAVEFORM ts CLAMP WAVEFORM Figure 1. Switching Characteristics 100 mA 25 mA 10 mA 1 mA II 100 A 10 A 1 A VIK- Vref - 50 mV - VI VI 50 mV VIK+ - 1 A - 10 A II - 100 A - 1 mA - 10 mA - 25 mA - 100 mA GND Vref Figure 2. Tolerance Band for Clamping Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 TL7726 HEX CLAMPING CIRCUITS SLAS078C - SEPTEMBER 1993 - REVISED JULY 1999 APPLICATION INFORMATION VCC = 5 V VI(system) (input signal) 10 k II(system) VI II Device to Be Protected, e.g., A/D Converter, Microprocessor, etc. IZ 1/6 TL7726 Vref Example: If II >> II(system), i.e., VI(system) > Vref + 200 mV where: II(system) = Input current to the device being protected VI(system) = Input voltage to the device being protected then the maximum input voltage VI(system)max = Vref + IImax(10k) = 5 V + 25 mA(10k) = 5 V + 250 V = 255 V Figure 3. Typical Application 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TL7726CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL7726CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL7726ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL7726IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL7726QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TL7726QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TL7726QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL7726QP ACTIVE PDIP P 8 TBD Call TI Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TL7726CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL7726IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL7726QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL7726CDR SOIC D 8 2500 340.5 338.1 20.6 TL7726IDR SOIC D 8 2500 340.5 338.1 20.6 TL7726QDR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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