用途 APPLICATIONS
形名表記法 ORDERING CODE
特長 FEATURES
46
Y実装密度の向上が図れます
Yモノリシックの構造のため、信頼性が高い
Y同一形状、静電容量範囲が広い
一般積層セラミックコンデンサ
（温度補償用・Class 1）
STANDARD MULTILAYER
CERAMIC CAPACITORS
(CLASS1 : TEMPERATURE COMPENSATING
DIELECTRIC TYPE)
Y一般電子機器用
Y通信機器用（携帯電話、PHS、コードレス電話 etc.）
OPERATING TEMP. K55VJ125C
YImprove Higher Mounting Densities.
YMultilayer block structure provides higher reliability
YA wide range of capacitance values available in standard case sizes.
YGeneral electronic equipment
YCommunication equipment (portable telephones, PHS, other wireless ap-
plications, etc.)
CM0.25 pF
DM0.5 pF
FM1pF
JM5%
KM10 %
E16
T25
U50
Kメッキ品
M積層コンデンサ
1
定格電圧 hVDCi
3
端子電極
5
温度特性 hppm/Ci
7
容量許容差 個別仕様
9
F
テーピングf2mmピッチY178Bg
T
テーピングf4mmピッチY178Bg
包装
6
公称静電容量 hpFi
4
形状寸法fEIAgLPWhmmi
2
シリーズ名
10
当社管理記号
11
042(01005) 0.4P0.2
063(0201) 0.6P0.3
105(0402) 1.0P0.5
107(0603) 1.6P0.8
GW 許容差
K標準
Q標準品
例
0R5 0.5
010 1
100 10
QWスペース
CG
K150DCG、CH、CJ、CK
PG
K150DPH、PJ、PK
RG
K220DRH、RJ、RK
SG
K330DSH、SJ、SK
TG
K470DTH、TJ、TK
UG
K750DUJ、UK
S L
J350VK1000
M 30
M 60
M120
M250
G
H
J
K
FRW小数点
8
製品厚み hmmi
C0.2
P0.3
V0.5
W0.5
Z0.8
E16
T25
U50
K Plated
MMultilayer ceramic capacitor
1
Rated voltagehVDCi
3
End termination
Temperature characteristicshppm/C
i
7
Capacitance Tolerance
KStandard Products
9
F
Tapef2mm pitchY178Bg
T
Tapef4mm pitchY178Bg
Packaging
6
Nominal CapacitancehpFi
4
2
10
11
5
Dimensions fcase sizegfEIAgLPWhmm
i
CG
K150DCG、CH、CJ、CK
(C0G、C0H、C0J、C0K)
PG
K150DPH、PJ、PK
(P2H、P2J、P2K)
RG
K220DRH、RJ、RK
(R2H、R2J、R2K)
SG
K330DSH、SJ、SK
(S2H、S2J、S2K)
TG
K470DTH、TJ、TK
(T2H、T2J、T2K)
UG
K750DUJ、UK
(U2J、U2K)
S L
J350VK1000
M 30
M 60
M120
M250
2
H
2J
K
example
0R5 0.5
010 1
100 10
*R=decimal point
CM0.25 pF
DM0.5 pF
FM1pF
JM5%
KM10 %
Internal code
Q Standard Products
QWBlank space
8
Thickness[mm]
C0.2
P0.3
V0.5
W0.5
Z0.8
Series name
042(01005) 0.4P0.2
063(0201) 0.6P0.3
105(0402) 1.0P0.5
107(0603) 1.6P0.8
Special code
GWTolerance
UMK105CH101JW_FZ
1110
9
87
6
12 3 4 5
＊042TYPE, 063TYPE, 105TYPEは除く
＊Except for 042TYPE, 063TYPE, 105TYPE
外形寸法 EXTERNAL DIMENSIONS
CAPACITORS
4
47
P.48 P.78 P.80 P.86P.10
概略バリエーション AVAILABLE CAPACITANCE RANGE
温度特性
Temperature
char.(EIA)
使用温度範囲
Operating Temp. range
温度係数範囲
hppm/Ci F1
Temperature coefficient range
C K(C0K)0±250
C J(C0J)0±120
C H(C0H)0±60
C G(C0G)0±30
P K(P2K)−150±250
P J(P2J)−150±120
P H(P2H)−150±60
R K(R2K)−220±250
R J(R2J)−220±120
R H(R2H)−220±60
S K(S2K)−330±250
S J(S2J)−330±120
S H(S2H)−330±60
T K(T2K)−470±250
T J(T2J)−470±120
T H(T2H)−470±60
U K(U2K)−750±250
U J(U2J)−750±120
S L −1000〜＋350
K55VJ125C
温度特性 Temperature Characteristics
Q
区分
Item
QF2
Symbol
F1DCW公称静電容量 Nominal capacitancehpFi
F2D測定周波数 Measurement Frequency= 1M0.1MHzfCT1000pFg
1M0.1kHz fCX1000pFg
測定電圧 Measurement voltage = 0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
U400J20YCF1V27pF
U1000 30pFV
CM0.25pF V5pF
DM0.5 pF V10pF
FM1pF 6V10 pF
JM5 % 11pFV
KM10 % 11pFV
記号
Symbol
区分
Item
許容差
Tolerance
静電容量許容差 Capacitance Tolerance Symbol
TypefEIAgLW T e
GMK042 0.4M0.02 0.2M0.02 0.2M0.02 C0.1M0.03
f01005gf0.016M0.001gf0.008M0.001gf0.008M0.001gf0.004M0.001g
GMK063 0.6M0.03 0.3M0.03 0.3M0.03 P0.15M0.05
f0201gf0.024M0.001gf0.012M0.001gf0.012M0.001gf0.006M0.002g
GMK105 1.0M0.05 0.5M0.05 0.5M0.05 W, V 0.25M0.10
f0402gf0.039M0.002g
f0.020M0.002g
f0.020M0.002gf0.010M0.004g
GMK107 1.6M0.10 0.8M0.10 50.8M0.10 Z0.35M0.25
f0603gf0.063M0.004g
f0.031M0.004g
f0.031M0.004gf0.014M0.010g
F1D20Cにおける静電容量を基準。
Based on the capacitance at 20C
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
AAAAAA
Unit：mm(inch)
注Dグラフの記号は製品の厚み記号です。
Note: Letter code in shaded areas are thickness codes.
CGTemp.char. RGSGTGUGUGSL CGUGSL
WV 16V25V16V 50V50V
[pF]
[pF 3digits]
、
GP、TG、
RGSG
063
042
105 107Type
CG
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
0R5
010
1R5
020
030
040
050
060
070
080
090
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
V
ZZ
Z
W
WWWW
C
P
P
Z
VV
48
アイテム一覧 PART NUMBERS
EHS
(Environmental
Hazardous
Substances)
EHS
(Environmental
Hazardous
Substances)
042TYPE
Class 1
EMK04 2 Q0R5GC
EMK04 2 Q010GC
EMK04 2 Q1R5GC
EMK04 2 Q020GC
EMK04 2 Q030GC
EMK04 2 Q040GC
EMK04 2 Q050GC
EMK04 2 Q060GC
EMK04 2 Q070GC
EMK04 2 Q080GC
EMK04 2 Q090GC
EMK04 2 Q100GC
EMK04 2 Q120GC
EMK04 2 Q150GC
定格電圧
Rated
Voltage
(DC)
形 名
Ordering code
温度特性
Temperature characteristics (EIA)
公称静電
容 量
Capacitance
[pF]
静電容量
許 容差
Capacitance
tolerance
[%]
厚み
Thicknees
[mm]
(inch)
CK
(C0K)
CJ
(C0J)
CH
(C0H)
CG
(C0G)
PK
(P2K)
PJ
(P2J)
PH
(P2H)
RK
(R2K)
RJ
(R2J)
RH
(R2H)
SK
(S2K)
SJ
(S2J)
SH
(S2H)
TK
(T2K)
TJ
(T2J)
TH
(T2H)
UK
(U2K)
UJ
(U2J)
SL
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
±0.25pF
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±0.5pF
±0.5pF
±1pF
±5%
±10%
0.2M0.02
(0.008M0.001)
16V
063TYPE
Class 1
TMK0 6 3 Q0R5GP
TMK0 6 3 Q010GP
TMK0 6 3 Q1R5GP
TMK0 6 3 Q020GP
TMK0 6 3 Q030GP
TMK0 6 3 Q040GP
TMK0 6 3 Q050GP
TMK0 6 3 Q060GP
TMK0 6 3 Q070GP
TMK0 6 3 Q080GP
TMK0 6 3 Q090GP
TMK0 6 3 Q100GP
TMK0 6 3 Q120GP
TMK0 6 3 Q150GP
TMK063 CH180GP
TMK063 CH220GP
TMK063 CH270GP
TMK063 CH330GP
TMK063 CH390GP
TMK063 CH470GP
TMK063 CH560GP
TMK063 CH680GP
TMK063 CH820GP
TMK063 CH101GP
定格電圧
Rated
Voltage
(DC)
形 名
Ordering code
温度特性
Temperature characteristics (EIA)
公称静電
容 量
Capacitance
[pF]
静電容量
許 容差
Capacitance
tolerance
[%]
厚み
Thicknees
[mm]
(inch)
CK
(C0K)
CJ
(C0J)
CH
(C0H)
CG
(C0G)
PK
(P2K)
PJ
(P2J)
PH
(P2H)
RK
(R2K)
RJ
(R2J)
RH
(R2H)
SK
(S2K)
SJ
(S2J)
SH
(S2H)
TK
(T2K)
TJ
(T2J)
TH
(T2H)
UK
(U2K)
UJ
(U2J)
SL
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
±0.25pF
●
●
●
●
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±0.5pF
±0.5pF
±1pF
±5%
±10%
0.3M0.03
(0.012M0.001)
25V
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
QPleasespecifythetemperaturecharacteristicscodeandGthecapacitancetolerancecode.
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
QPleasespecifythetemperaturecharacteristicscodeandGthecapacitancetolerancecode.
CAPACITORS
4
49
アイテム一覧 PART NUMBERS
105TYPE
Class 1
UMK10 5 Q0R5GW
UMK10 5 Q010GW
UMK10 5 Q1R5GW
UMK10 5 Q020GW
UMK10 5 Q030GW
UMK10 5 Q040GW
UMK10 5 Q050GW
UMK10 5 Q060GW
UMK10 5 Q070GW
UMK10 5 Q080GW
UMK10 5 Q090GW
UMK10 5 Q100GW
UMK10 5 Q120GW
UMK10 5 Q150GW
UMK10 5 Q180GW
UMK10 5 Q220GV
UMK10 5 Q270GV
UMK10 5 Q330GV
UMK10 5 Q390GV
UMK10 5 Q470GV
UMK10 5 Q560GV
UMK10 5 Q680GV
UMK10 5 Q820GV
UMK10 5 Q101GV
UMK10 5 Q121GV
UMK10 5 Q151GV
UMK10 5 Q181GV
UMK10 5 Q221GV
UMK10 5 Q271GV
UMK10 5 Q331GV
UMK105 SL121GV
UMK105 SL151GV
UMK105 SL181GV
UMK105 SL221GV
UMK105 SL271GV
UMK105 SL331GV
定格電圧
Rated
Voltage
(DC)
形 名
Ordering code
温度特性
Temperature characteristics (EIA)
公称静電
容 量
Capacitance
[pF]
静電容量
許
容差
Capacitance
tolerance
[%]
厚み
Thicknees
[mm]
(inch)
CK
(C0K)
CJ
(C0J)
CH
(C0H)
CG
(C0G)
PK
(P2K)
PJ
(P2J)
PH
(P2H)
RK
(R2K)
RJ
(R2J)
RH
(R2H)
SK
(S2K)
SJ
(S2J)
SH
(S2H)
TK
(T2K)
TJ
(T2J)
TH
(T2H)
UK
(U2K)
UJ
(U2J)
SL
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
120
150
180
220
270
330
±0.25pF
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±0.5pF
±0.5pF
±1pF
±5%
±10%
0.5M0.05
(0.020M0.002)
50V
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
QPleasespecifythetemperaturecharacteristicscodeandGthecapacitancetolerancecode.
105TYPE
Class 1
EMK10 5 Q0R5BW
EMK10 5 Q010BW
EMK10 5 Q1R2BW
EMK10 5 Q1R5BW
EMK10 5 Q1R8BW
EMK10 5 Q2R2 JW
EMK10 5 Q2R7 JW
EMK10 5 Q3R3 JW
EMK10 5 Q3R9 JW
EMK10 5 Q4R7 JW
EMK10 5 Q5R6 JW
EMK10 5 Q6R8 JW
EMK10 5 Q8R2 JW
EMK10 5 Q100JW
EMK10 5 Q120JW
EMK10 5 Q150JW
EMK10 5 Q180JW
EMK10 5 Q200JW
定格電圧
Rated
Voltage
(DC)
形
名
Ordering code
温
度特性
Temperature characteristics (EIA)
公称静電
容
量
Capacitance
[pF]
静電容量
許 容
差
Capacitance
tolerance
[%]
厚
み
Thicknees
[mm]
(inch)
CK
(C0K)
CJ
(C0J)
CH
(C0H)
CG
(C0G)
PK
(P2K)
PJ
(P2J)
PH
(P2H)
RK
(R2K)
RJ
(R2J)
RH
(R2H)
SK
(S2K)
SJ
(S2J)
SH
(S2H)
TK
(T2K)
TJ
(T2J)
TH
(T2H)
UK
(U2K)
UJ
(U2J)
SL
0.5
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
20
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±0.1pF
±5%
0.5M0.05
(0.020M0.002)
16V
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
QPleasespecifythetemperaturecharacteristicscodeandGthecapacitancetolerancecode.
EHS
(Environmental
Hazardous
Substances)
EHS
(Environmental
Hazardous
Substances)
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
50
アイテム一覧 PART NUMBERS
107TYPE
Class 1
UMK107
Q
0R5
G
Z
UMK107
Q
010
G
Z
UMK107
Q
1R5
G
Z
UMK107
Q
020
G
Z
UMK107
Q
030
G
Z
UMK107
Q
040
G
Z
UMK107
Q
050
G
Z
UMK107
Q
060
G
Z
UMK107
Q
070
G
Z
UMK107
Q
080
G
Z
UMK107
Q
090
G
Z
UMK107
Q
100
G
Z
UMK107
Q
120
G
Z
UMK107
Q
150
G
Z
UMK107
Q
180
G
Z
UMK107
Q
220
G
Z
UMK107
Q
270
G
Z
UMK107
Q
330
G
Z
UMK107
Q
390
G
Z
UMK107
Q
470
G
Z
UMK107
Q
560
G
Z
UMK107
Q
680
G
Z
UMK107
Q
820
G
Z
UMK107
Q
101
G
Z
UMK107
Q
121
G
Z
UMK107
Q
151
G
Z
UMK107
Q
181
G
Z
UMK107
Q
221
G
Z
UMK107
Q
271
G
Z
UMK107
Q
331
G
Z
UMK107
Q
391
G
Z
UMK107
Q
471
G
Z
UMK107
Q
561
G
Z
UMK107
Q
681
G
Z
UMK107
Q
821
G
Z
UMK107
Q
102
G
Z
定格電圧
Rated
Voltage
(DC)
形 名
Ordering code
温度特性
Temperature characteristics (EIA)
静電容量
許容差
Capacitance
tolerance
[%]
厚み
Thicknees
[mm]
(inch)
CK
(C0K)
CJ
(C0J)
CH
(C0H)
CG
(C0G)
PK
(P2K)
PJ
(P2J)
PH
(P2H)
RK
(R2K)
RJ
(R2J)
RH
(R2H)
SK
(S2K)
SJ
(S2J)
SH
(S2H)
TK
(T2K)
TJ
(T2J)
TH
(T2H)
UK
(U2K)
UJ
(U2J)
公称静電
容 量
Capacitance
[pF]
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
±
0.25pF
●
●
●
●
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±
0.5pF
±
0.5pF
±
1pF
±
5%
±
10%
0.8
M
0.10
(0.031
M
0.004)
50V
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
QPleasespecifythetemperaturecharacteristicscodeandGthecapacitancetolerancecode.
EHS
(Environmental
Hazardous
Substances)
78
V, W
W
A
A
Z
B
D
G
D
D
D
F
G
L
D
F
H
N
M
C
Y
0.8
f
0.031
g
0.6
f
0.024
g
0.85
f
0.033
g
1.25
f
0.049
g
0.85
f
0.033
g
0.85
f
0.033
g
0.85
f
0.033
g
0.85
f
0.033
g
1.15
f
0.045
g
1.15
f
0.045
g
1.5
f
0.059
g
1.9
f
0.075
g
2.0max
f
0.079
g
2.5
f
0.098
g
0.2
f
0.008
g
0.3
f
0.012
g
0.3
f
0.012
g
0.45
f
0.018
g
0.5
f
0.020
g
0.45
f
0.018
g
0.8
f
0.031
g
0.8
f
0.031
g
0.6
f
0.024
g
0.45
f
0.018
g
0.85
f
0.033
g
1.25
f
0.049
g
0.85
f
0.033
g
0.85
f
0.033
g
0.85
f
0.033
g
1.15
f
0.045
g
1.25
f
0.049
g
1.6
f
0.063
g
0.85
f
0.033
g
1.15
f
0.045
g
1.5
f
0.059
g
1.9
f
0.075
g
2.0max
f
0.079
g
2.5
f
0.098
g
1.9
f
0.075
g
2.5
f
0.098
g
3.2
f
0.125
g
1.25
f
0.049
g
1.6
f
0.063
g
0.5
f
0.020
g
0.8
f
0.031
g
G
MK105
f
0402
g
G
VK105
f
0402
g
G
MK107
f
0603
g
G
2K110
f
0504
g
G
MK212
f
0805
g
G
4K212
f
0805
g
G
2K212
f
0805
g
G
MK316
f
1206
g
G
MK325
f
1210
g
標準数量
[
pcs
]
F袋づめ梱包
Bulk packaging
1000
mm
f
inch
g
code
Fテーピング梱包
Taped packaging
標準数量
Standard
quantity
[
pcs
]
製品厚み
Thickness
形式f
EIA
g
Type
P
P
K
V, W
W
G
MK063
f
0201
g
G
2K096
f
0302
g
G
MK042
f
01005
g
G
MK105
f
0402
g
G
VK105
f
0402
g
mm
f
inch
g
code
製品厚み
Thickness
形式f
EIA
g
Type
E
E
E
E
15000
15000
10000
10000
標準数量
Standard quantity
[
pcs
]
紙テープ
paper
エンボステープ
Embossed tape
A
Z
B
A
K
D
G
D
D
D
F
G
L
D
F
H
N
Y
M
G
MK107
f
0603
g
G
2K110
f
0504
g
G
MK212
f
0805
g
G
4K212
f
0805
g
G
2K212
f
0805
g
G
MK316
f
1206
g
G
MK325
f
1210
g
G
MK432
f
1812
g
E
E
3000
E
E
E
3000
2000
2000
2000
1000
500
500
4000K
E
4000
E
4000
E
4000
E
4000
4000
E
4000
4000
4000
E
E
E
E
E
E
E
Y
M
U
梱包 PACKAGING
2テーピング材質 Taping material
UnitDmm finchg
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according
to dimensions 0402, 0603, 0805.(inch)
3バルクカセット Bulk Cassette
1最小受注単位数 Minimum Quantity
CAPACITORS
4
79
梱包 PACKAGING
3テーピング寸法 Taping dimensions
紙テープ Paper Tape（8mm幅）f0.315inches wideg
UnitDmmfinchg
UnitDmmfinchg
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip cavity
Insertion Pitch
Tape Thickness
ABFKT
3.7M0.2 4.9M0.2 8.0M0.1
0.6max.
GMK432f1812g
f0.146M0.008gf0.193M0.008gf0.315M0.004g
4.0max.
f0.024max.gf0.157max.g
エンボステープ Embossed tape（8mm幅）f0.315inches wideg
UnitDmmfinchg
4リーダー部／空部 Leader and Blank portion
160mm以上
f
6.3inches or more
g
引き出し方向
Direction of tape feed
100mm以上
f3.94inches or moreg
400mm以上
f15.7inches or moreg
5リール寸法 Reel size
6トップテープ強度 Top Tape Strength
トップテープのはがし力は下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of the
arrow as illustrated below.
エンボステープ Embossed tape（12mm幅）f0.472inches wideg
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip cavity
Insertion Pitch
Tape Thickness
ABFKT
GMK212f0805g1.65M0.252.4M0.2
f0.065M0.008gf0.094M0.008g
GMK316f1206g2.0M0.2 3.6M0.2 4.0M0.1
2.5max. 0.6max
f0.079M0.008gf0.142M0.008gf0.157M0.004g
f0.098max.gf0.024max.g
GMK325f1210g2.8M0.2 3.6M0.2
3.4max.
f0.110M0.008gf0.142M0.008g
f0.134max.g
Type チップ挿入部 挿入ピッチ テープ厚み
fEIAgChip Cavity
Insertion Pitch
Tape Thickness
ABFT
GMK042f01005g0.25M0.04 0.45M0.04 2.0M0.04 0.45max.
f0.010M0.002gf0.018M0.002gf0.079M0.002gf
0.018max.g
GMK063f0201g0.37M0.06 0.67M0.06 52.0M0.05 0.45max.
f0.016M0.002gf0.027M0.002gf0.079M0.002gf
0.018max.g
G2K096f0302g0.72M0.1 1.02M0.1 52.0M0.05
0.6max.(0.024max)
f0.028M0.004gf0.040M0.004gf0.079M0.002g
0.45max.(0.018max)
GMK105f0402g0.65M0.151.15M0.1552.0M0.05 0.8max.
GVK105f0402g
f0.026M0.004gf0.045M0.004gf0.079M0.002gf
0.031max.g
GMK107f0603g1.0M0.2 1.8M0.2 4.0M0.1 1.1max.
f0.039M0.008gf0.071M0.008gf0.157M0.004gf0.043max.g
G2K110f0504g1.15M0.2 1.55M0.2 4.0M0.1 1.0max.
f0.045M0.008gf0.061M0.008gf0.157M0.004gf0.039max.g
GMK212f0805g1.65M0.252.4M0.2
G4K212f0805g
f0.065M0.008gf0.094M0.008g
4.0M0.1 1.1max.
G2K212f0805g
f0.157M0.004gf0.043max.g
GMK316f1206g2.0M0.2 3.6M0.2
f0.079M0.008gf0.142M0.008g
CAPACITORS
4
81
B: M10%, M20%
FD %
B: 2.5% max.
(50V, 25V)
F: 5.0% max.
(50V, 25V)
BDM10L
fK25V85Cg
FD L
fK25V85Cg
BfX7RgDM15L
FfY5VgD L
RELIABILITY DATA 1/3
Item Temperature Compensating (Class 1)
Standard
Specified Value
Test Methods and RemarksHigh Permitivity (Class 2)
High ValueStandard Note1
K55 to J125C
K55 to J125C
50VDC,25VDC,
16VDC
No breakdown or dam-
age
10000 ME min.
0.5 to 5 pF: M0.25 pF
1 to 10pF: M0.5 pF
5 to 10 pF: M1 pF
11 pF or over: M 5%
M10%
105TYPERQ, SQ, TQ, UQ only
0.5〜2pF
: M
0.1pF
2.2〜20pF
: M
5
%
Under 30 pF
: QU400 + 20C
30 pF or over : QU1000
C= Nominal capacitance
CKD0M250
CJD0M120
CHD0M60
CGD0M30
PKDK150M250
PJDK150M120
PHDK150M60
RKDK220M250
RJDK220M120
RHDK220M60
SKDK330M250
SJDK330M120
SHDK330M60
TKDK470M250
TJDK470M120
THDK470M60
UKDK750M250
UJDK750M120
SLD
+350 to -1000 (ppm/C)
Appearance:
No abnormality
Capacitance change:
Within M5% or M0.5 pF,
whichever is larger.
BDK55 to J125C
FDK25 to J85C
BDK55 to J125C
FDK25 to J85C
50VDC,25VDC
K25 to J85C
K25 to J85C
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC
16VDC
50VDC
No abnormality No breakdown or damage
500 MEAF. or 10000 ME., whichever is the
smaller.
Note 5
0.5 to 2 pF : M0.1 pF
2.2 to 5.1 pF : M5%
Refer to detailed speci-
fication
CHD0M60
RHDK220M60
fppm/Cg
Appearance:
No abnormality
Capacitance change:
WithinM0.5 pF
Appearance:
No abnormality
Capacitance change:
B, BJDWithin M12.5%
FDWithin M30%
High Frequency Type
1.Operating Temperature
Range
2.Storage Temperature
Range
3.Rated Voltage
4.Withstanding Voltage
Between terminals
5.Insulation Resistance
6.Capacitance (Tolerance)
7.
Q or Tangent of Loss Angle
(tan d)
8.Temperature
Characteristic
of Capacitance
9.Resistance to Flexure of
Substrate
(Without
voltage
application)
Multilayer Ceramic Capacitor Chips
BDM10L、M20L
FDK20LNJ80L
BD2.5L max.
FD7L max.
Note 4
BDM10L
fK25VJ85Cg
FDJ30LNK80L
fK25VJ85Cg
BfX7R、X5Rg：
M15L
FfY5Vg：
J22LNK82L
J80
K20
J30
K80
According to JIS C 5102 clause 7.12.
Temperature compensating:
Measurement of capacitance at 20C and 85C shall be made
to calculate temperature characteristic by the following
equation.
(C - C )
P 10 (ppm/C)
C P QT
High permitivity:
Change of maximum capacitance deviation in step 1 to 5
Temperature at step 1: +20C
Temperature at step 2: minimum operating temperature
Temperature at step 3: +20C (Reference temperature)
Temperature at step 4: maximum operating temperature
Temperature at step 5: +20C
Reference temperature for X7R, X5R, Y5U and Y5V shall be +25C
High Capacitance Type BJfX7RgDK55〜J125C,BJfX5RgDK55〜J85C
EfY5UgDK30〜J85C, FfY5VgDK30〜J85C
High Capacitance Type BJfX7RgDK55〜J125C,BJfX5RgDK55〜J85C
EfY5UgDK30〜J85C, FfY5VgDK30〜J85C
J22
K82
20
85 20 6
Warp: 1mm
Testing board: glass epoxy-resin substrate
Thickness: 1.6mm (063 TYPE : 0.8mm)
The measurement shall be made with board in the bent position.
Applied voltage: Rated voltageP3 (Class 1)
Rated voltageP2.5 (Class 2)
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max. (Class 1,2)
Applied voltage: Rated voltage
Duration: 60M5 sec.
Charge/discharge current: 50mA max.
Measuring frequencyD
Class1D1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D1ｋHzM10%fCT10AFg
120HzM10HzfCX10AFg
Measuring voltageD
Note 4 Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D1M0.2VrmsfCT10AFg
0.5M0.1VrmsfCX10AFg
Bias application: None
Multilayer:
Measuring frequencyD
Class1D1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D1ｋHzM10%fCT10AFg
120HzM10HzfCX10AFg
Measuring voltageD
Note 4 Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D1M0.2VrmsfCT10AFg
0.5M0.1VrmsfCX10AFg
Bias application: None
High-Frequency-Multilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
CAPACITORS
4
83
RELIABILITY DATA 2/3
10.Body Strength
11.Adhesion of Electrode
12.Solderability
13.Resistance to soldering
14.Thermal shock
15.Damp Heat (steady state)
No mechanical dam-
age.
Appearance: No abnor-
mality
Capacitance change:
Within M2.5%
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M0.25pF
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M0.5pF,
Insulation resistance:
1000 ME min.
Appearance: No abnormality
Capacitance change: Within M7.5% (B, BJ)
Within M20% (F)
tan d: Initial value Note 4
Insulation resistance: Initial value
Withstanding voltage (between terminals): No
abnormality
Appearance: No abnormality
Capacitance change: Within M7.5% (B, BJ)
Within M20% (F)
tan d: Initial value Note 4
Insulation resistance: Initial value
Withstanding voltage (between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M2.5% or
M0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M2.5% or
M0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
(between terminals): No
abnormality
Appearance: No abnor-
mality
Capacitance change:
Within M5% or M0.5pF,
whichever is larger.
Q:
CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
C＜10 pF : QU200 +
10C
C: Nominal capacitance
Insulation resistance:
1000 ME min.
No separation or indication of separation of electrode.
At least 95% of terminal electrode is covered by new solder.
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance: 50
MEAF or 1000 ME
whichever is smaller.
Note 5
Appearance: No abnor-
mality
Capacitance change:
BJ:Within M12.5%
Note 4
tan d:
BJ: 5.0% max.
F: 11.0% max.
Insulation resistance:
50 MEAF or 1000 ME
whichever is smaller.
Note 5
High Frequency Multilayer:
Applied force: 5N
Duration: 10 sec.
Applied force: 5N
Duration: 30M5 sec.
Solder temperature: 230M5C
Duration: 4M1 sec.
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Solder temperature: 270M5C
Duration: 3M0.5 sec.
Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min.
150 to 200C, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the stan-
dard condition after the test.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Conditions for 1 cycle:
Step 1: Minimum operating temperature C 30M3 min.
Step 2: Room temperature 2 to 3 min.
Step 3: Maximum operating temperature C 30M3 min.
Step 4: Room temperature 2 to 3 min.
Number of cycles: 5 times
Recovery after the test: 24M2 hrs (Class 1)
48M4 hrs (Class 2)
Item Temperature Compensating (Class 1)
Standard
Test Methods and RemarksHigh Permittivity (Class 2)
High ValueStandard Note1High Frequency Type
Specified Value
MultilayerD
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Temperature: 40M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
Multilayer Ceramic Capacitor Chips
+24
K
0
+24
K
0
J
0
K
3
K
0
J
3
（01005, 0201, 0302 TYPE 2N）
CAPACITORS
4
85
RELIABILITY DATA 3/3
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature: 40M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max. (Class 1,2)
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg
85M2C (Class 2: BJ,F)
Duration: 1000 hrs
Applied voltage: Rated voltageP2 Note 6
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
As for Ni product, thermal treatment shall be performed
prior to the recovery.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 125M3C (Class 1)
Duration: 1000 hrs
Applied voltage: Rated voltageP2
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
16.Loading under Damp Heat
17.Loading at High Tempera-
ture
Appearance: No abnor-
mality
Capacitance change:
CT2 pF: Within M0.4 pF
CX2 pF: Within M0.75
pF
CD Nominal capaci-
tance
Insulation resistance:
500 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Insulation resistance:
1000 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M7.5% or
M0.75pF, whichever is
larger.
Q: CU30 pF: QU200
C＜30 pF: QU100 +
10C/3
CD Nominal capaci-
tance
Insulation resistance:
500 ME min.
Appearance: No abnor-
mality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Q: CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
C＜10 pF: QU200 +
10C
CD Nominal
capacitance
Insulation resistance:
1000 ME min.
Appearance: No abnor-
mality
Capacitance change:
BJDWithinM12.5L
FDWithinM30L
Note 4
tandD
BJD5.0Lmax.
FD11Lmax.
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJDWithinM12.5L
WithinM20LFF
WithinM25LFF
FDWithinM30L
Note 4
tandD
BJD5.0Lmax.
FD11Lmax.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
Note 5
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Note 5
Appearance: No abnor-
mality
Capacitance change:
B: Within M12.5%
F: Within M30%
Note 4
tan d:
B: 4.0% max.
F: 7.5% max.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
Note 5
Item Temperature Compensating (Class 1)
Standard
Specified Value
Test Methods and RemarksHigh Permittivity (Class 2)
High ValueStandard Note1High Frequency Type
+24
K
0
+24
K
0
+48
K
0
+48
K
0
Multilayer Ceramic Capacitor Chips
Note 1 :For 105 type, specified in "High value".
Note 2 :Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3 :
Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6 :Some of the parts are applicable in rated voltageP1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
PRECAUTIONS
CAPACITORS
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Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
1.Circuit Design Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the two
peak voltages should be lower than the rated value of the ca-
pacitor chosen. For a circuit where both an AC and a pulse
voltage may be present, the sum of their peak voltages should
also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time is
present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.flarger fillets which extend above the component end
terminationsg
Examples of improper pattern designs are also shown.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
2.PCB Design Pattern configurations
(Design of Land-patterns)
1. When capacitors are mounted on a PCB, the amount of sol-
der used (size of fillet) can directly affect capacitor performance.
Therefore, the following items must be carefully considered in
the design of solder land patterns:
(1) The amount of solder applied can affect the ability of chips
to withstand mechanical stresses which may lead to break-
ing or cracking. Therefore, when designing land-patterns
it is necessary to consider the appropriate size and con-
figuration of the solder pads which in turn determines the
amount of solder necessary to form the fillets.
(2) When more than one part is jointly soldered onto the same
land or pad, the pad must be designed so that each
component's soldering point is separated by solder-re-
sist.
Recommended land dimensions for wave-soldering (unit: mm)
Recommended land dimensions for reflow-soldering (unit: mm)
Type 107 212 316 325
1.6 2.0 3.2 3.2
0.8 51.25 1.6 2.5
A0.8V1.0 1.0V1.4 1.8V2.5 1.8V2.5
B0.5V0.8 0.8V1.5 0.8V1.7 0.8V1.7
C0.6V0.8 0.9V1.2 1.2V1.6 1.8V2.5
L
W
Size
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore,
please take proper precautions when designing land-patterns.
Size L
W
Size
L
W
Type
212（2 circuits） 110（2 circuits） 096（2 circuits）
2.0 1.37 0.9
1.25 1.0 0.6
a0.5V0.6 0.35V0.45 0.25V0.35
b0.5V0.6 0.55V0.65 0.15V0.25
c0.5V0.6 0.3V0.4 0.15V0.25
d 1.0 0.64 0.45
Type 042 063 105 107 212 316 325 432
0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15V0.25 0.20V0.30 0.45V0.55
0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5
B
0.10V0.20 0.20V0.30 0.40V0.50
0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8
C
0.15V0.30 0.25V0.40 0.45V0.55
0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5
Size
L
W
Type
212（4 circuits）
2.0
1.25
a0.5V0.6
b0.5V0.6
c0.2V0.3
d0.5
PRECAUTIONS
CAPACITORS
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(2) Examples of good and bad solder application2.PCB Design
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be
located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended Recommended
Deflection of
the board
Pattern configurations
(Capacitor layout on panelized [breakaway] PC boards)
1. After capacitors have been mounted on the boards, chips can
be subjected to mechanical stresses in subsequent manufac-
turing processes (PCB cutting, board inspection, mounting of
additional parts, assembly into the chassis, wave soldering
the reflow soldered boards etc.) For this reason, planning
pattern configurations and the position of SMD capacitors
should be carefully performed to minimize stress.
Items
Component
placement close
to the chassis
Not recommended Recommended
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount
of mechanical stresses given will vary depending on capacitor layout. The example
below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on
the capacitors can vary according to the method used. The following methods are
listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting
procedure.
Technical considerationsStages Precautions
Mixed mounting
of SMD and
leaded
components
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
PRECAUTIONS
CAPACITORS
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3.Considerations for auto-
matic placement
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capaci-
tors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerationsStages Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
supporting pins or back-up pins should be used under the PC board. The following dia-
grams show some typical examples of good pick-up nozzle placement:
Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
1. Some adhesives may cause reduced insulation resistance. The difference between the
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
to the board may adversely affect component placement, so the following precautions
should be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting &
solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 V120 Am
c Adhesives should not contact the pad
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period. There-
fore, it is imperative to consult the manufacturer of the adhe-
sives on proper usage and amounts of adhesive to use.
Precautions on the use of Multilayer Ceramic Capacitors
PRECAUTIONS
CAPACITORS
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4. Soldering Selection of Flux
1. Since flux may have a significant effect on the performance of
capacitors, it is necessary to verify the following conditions
prior to use;
(1)Flux used should be with less than or equal to 0.1 wt%
(equivelent to chroline) of halogenated content. Flux hav-
ing a strong acidity content should not be applied.
(2)When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
(3)When using water-soluble flux, special care should be taken
to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. are specified in accor-
dance with the following recommended conditions.
And please contact us about peak temperature when you use
lead-free paste.
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, or highly acidic flux is used, an excessive amount of residue after soldering may
lead to corrosion of the terminal electrodes or degradation of insulation resistance on
the surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
1-1. Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol-
dering.
Cooling: The temperature difference between the components and cleaning process should
not be greater than 100C.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
Recommended conditions for soldering
[Reflow soldering]
Temperature profile
2. Because excessive dwell times can detrimentally affect solderability, soldering dura-
tion should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick-
ness of the capacitor, as shown below:
Capacitor
PC board
Solder
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow solder-
ing only.
Peak 260C max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be reflow soldering for 2 times.
TemperaturefCg
300
200
100
0
Preheating
150C
60 sec min
Gradually
cooling
Heating above 230C
40 sec max
fPb free solderingg
Peak 260C max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
TemperaturefCg
300
200
100
0
Gradually
cooling
Preheating
150C
120 sec min
fPb free solderingg
PRECAUTIONS
CAPACITORS
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[Hand soldering]
Temperature profile
5.Cleaning Cleaning conditions
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning (e.g. to
remove soldering flux or other materials from the production
process.)
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
1. The use of inappropriate solutions can cause foreign substances such as flux residue to
adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra-
dation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally
affect the performance of the capacitors.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of
the PC board which may lead to the cracking of the capacitor or the soldered portion, or
decrease the terminal electrodes' strength. Thus the following conditions should be
carefully checked;
Ultrasonic output Below 20 W/b
Ultrasonic frequency Below 40 kHz
Ultrasonic washing period 5 min. or less
4. Soldering
6.Post cleaning processes 1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the harden-
ing period or while left under normal storage conditions result-
ing in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechani-
cal shocks.
(1)If ceramic capacitors are dropped onto the floor or a hard
surface, they should not be used.
(2)When handling the mounted boards, be careful that the
mounted components do not come in contact with or bump
against other boards or components.
7.Handling
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
f※⊿ＴT190Cf3216Type maxg, ⊿ＴT130Cf3225
Type mingg
※It is recommended to use 20W soldering iron and
the tip is 1B or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
TemperaturefCg
400
300
200
100
0
Gradually
cooling
350C max
3 sec max
60 sec min
⊿Ｔ
fPb free solderingg
PRECAUTIONS
CAPACITORS
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8.Storage conditions Storage
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible.
YRecommended conditions
Ambient temperature Below 40C
Humidity Below 70% RH
The ambient temperature must be kept below 30C. Even un-
der ideal storage conditions capacitor electrode solderability
decreases as time passes, so should be used within 6 months
from the time of delivery.
YCeramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
(type 2 &3) will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150C for 1hour will return the capacitance to its initial level.
1. If the parts are stored in a high temperature and humidity environment, problems such
as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place. For this reason, components should be used
within 6 months from the time of delivery. If exceeding the above period, please check
solderability before using the capacitors.
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
