HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6716 Issued Date : 1996.02.01 Revised Date : 2002.02.18 Page No. : 1/3 H2584 PNP EPITAXIAL PLANAR TRANSISTOR Description The H2584 is designed for use in low voltage and low dropout regulator applications. Absolute Maximum Ratings TO-220 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 65 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -20 V VCEO Collector to Emitter Voltage..................................................................................... -15 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current ........................................................................................................... -10 A Characteristics (Ta=25C) Symbol *BVCEO ICBO ICEO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 Min. -15 2 1 Typ. 15 Max. -10 -20 -2 -1.5 -2 60 60 Unit V uA uA mA V V K K Test Conditions IC=-100mA VCB=-20V VCE=-15V VEB=-5V IC=-10A, IB=-10mA IC=-5A, VCE=-1.7V IC=-500mA, VCE=-1.7V IC=-10A, VCE=-1.7V *Pulse Test: Pulse Width 380us, Duty Cycle2% H2584 HSMC Product Specification HI-SINCERITY Spec. No. : HE6716 Issued Date : 1996.02.01 Revised Date : 2002.02.18 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 10000 100000 1000 Saturation Voltage (mV) 10000 o hFE 125 C o 75 C 100 o 25 C o 75 C o 125 C 1000 o 25 C VCE(sat) @ IC=1000IB 10 hFE @ VCE=1.7V 1 1 10 100 1000 100 1000 10000 Collector Current-IC (mA) Saturation Voltage & Collector Current Switching Time & Collector Current 10.00 10000 VCC=25V, IC=250IB1=-250IB2 Switching Times (us)... VBE(ON) @ VCE=1.7V ON Voltage (mV) 10000 Collector Current-IC (mA) o 25 C 1000 o 75 C o 125 C 100 Tstg 1.00 Tf Ton 0.10 0.01 1 10 100 1000 10000 1 Collector Current-IC (mA) 10 Collector Current (A) Capacitance & Reverse-Biased Voltage Safe Operating Area 1000 100000 100 Collector Current-IC (mA) Capacitance (pF) 10000 Cob PT=1ms PT=100ms 1000 PT=1s 100 10 10 1 0.1 1 10 Reverse-Biased Voltage (V) H2584 100 1 10 100 Forward Voltage (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6716 Issued Date : 1996.02.01 Revised Date : 2002.02.18 Page No. : 3/3 MICROELECTRONICS CORP. TO-220AB Dimension Marking: B A D E C HSMC Logo Part Number Date Code Product Series Rank H K M I Style: Pin 1.Base 2.Collector 3.Emitter 3 G N 2 1 4 P O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 DIM A B C D E G H Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H2584 HSMC Product Specification