HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002. 02.18
Page No. : 1/3
H2584 HSMC Product Specification
H2584
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The H2584 is designed for use in low voltage and low dropout
regulator applications.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temper ature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ..................................................................................... 65 W
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -20 V
VCEO Collector to Emitter Voltage..................................................................................... -15 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ........................................................................................................... -10 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
*BVCEO -15 - - V IC=-100mA
ICBO - - -10 uA VCB=-20V
ICEO - - -20 uA VCE=-15V
IEBO - - -2 mA VEB=-5V
*VCE(sat) - - -1.5 V IC=-10A, IB=-10mA
VBE(on) - - -2 V IC=-5A, VCE=-1.7V
*hFE1 2 - 60 K IC=-500mA, VCE=-1.7V
*hFE2 1 15 60 K IC=-10A, VCE=-1.7V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
TO-220
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002. 02.18
Page No. : 2/3
H2584 HSMC Product Specification
Characteristics Curve
Curren t Gain & Collect or Cur ren t
1
10
100
1000
10000
100000
1 10 100 1000 10000
Collector Curren t-I
C
(mA)
hFE
hFE @ V
CE
=1.7V
25
o
C
75
o
C
125
o
C
Satur ation Volta ge & C ollect or Cur rent
100
1000
10000
1000 10000
Collector Curren t-I
C
(mA)
Sat u r ation Volt ag e ( mV)
V
CE(sat)
@ I
C
=1000I
B
125
o
C
75
o
C
25
o
C
Satur ation Volta ge & C ollect or Curren t
100
1000
10000
1 10 100 1000 10000
Collec tor Current- I
C
(mA)
O N Volt age ( m V)
V
BE(ON)
@ V
CE
=1.7V
25
o
C
75
o
C
125
o
C
Switching Time & Collector Current
0.01
0.10
1.00
10.00
110
Collector Current (A)
Switch ing Times (us)...
V
CC
=25V, I
C
=250I
B1
=-250I
B2
Tf
Tstg
Ton
Capa citance & Rever se-Biased Voltage
10
100
1000
0.1 1 10 100
Re ver se-Biased Voltag e ( V)
Capacitan ce ( p F)
Cob
Safe Operating Area
1
10
100
1000
10000
100000
1 10 100
Forwar d Vol t age ( V)
Collect o r Cu rr e nt- I
C
(mA)
P
T
=1ms
P
T
=100ms
P
T
=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002. 02.18
Page No. : 3/3
H2584 HSMC Product Specification
TO-220AB Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Allo y; solder plati ng
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its produc ts without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any cons equence of cust om er product design, infringement of patents, or applicat ion assistance.
Head Office And Factory:
Head Office (Hi-Sincerit y Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Tai wan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Park Hsi n-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax: 886-3-5982931
AB
E
G
IK
M
OP
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Pac k age
HSMC Package Code: E
Marking:
HSMC Logo
Part Number
Date Code
Product Series
Rank