MS5803-30BA Miniature 30 bar Module * * * * * * * * * * * High resolution module, 0.5 mbar Fast conversion down to 1 ms Low power, 1 A (standby < 0.15 A) Integrated digital pressure sensor (24 bit ADC) Supply voltage 1.8 to 3.6 V Operating range: 0 to 30 bar, -40 to +85 C 2 I C and SPI interface (Mode 0, 3) No external components (Internal oscillator) Excellent long term stability Hermetically sealable for outdoor devices High Endurance (HE version) DESCRIPTION The MS5803-30BA is a new generation of high resolution pressure sensors with SPI and I2C bus interface. The MS5803-30A HE is the high endurance pad technology version of the MS5803-30BA pressure sensor module. It is optimized for depth measurement systems with a water depth resolution of 2.5cm and below. The sensor module includes a high linear pressure sensor and an ultra low power 24 bit ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation of a depth measurement systems and thermometer function without any additional sensor. The MS5803-30BA can be interfaced to any microcontroller. The communication protocol is simple, without the need to programming internal registers in the device. The gel protection and antimagnetic stainless steel cap make the module water resistant. This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland's proven experience and know-how in high volume manufacturing of pressure modules have been widely used for over a decade. This sensing principle employed leads to very low hysteresis and high stability of both pressure and temperature signal. FEATURES FIELD OF APPLICATION TECHNICAL DATA Mobile water depth measurements systems Diving computers Adventure or multi-mode watches High endurance pad technology (HE version) Sensor Performances (VDD = 3 V) Pressure VDD PS Meas. MUX SENSOR CSB Digital Interface +IN -IN PGA ADC Sensor Interface IC SDI/SDA SCLK Memory (PROM) 128 bits SGND GND Max Unit 0 30 bar ADC 24 2.5 / 1.5 / 1 / 0.75 / 0.5 bit Accuracy 0C to +40C, 0 to 6 bar (2) Accuracy -40C to + 85C 0 to 6 bar (2) +50 mbar -100 +100 mbar Long term stability Temperature Min Range -40 Resolution Accuracy mbar -50 0.5 / 1.1 / 2.1 / 4.1 / 8.22 -50 Response time SDO dig. Filter Typ Range Resolution (1) FUNCTIONAL BLOCK DIAGRAM Min Typ Max +85 <0.01 -0.8 ms mbar/yr Unit C C +0.8 C Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096 (2) With autozero at one pressure point DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 1/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure Maximum Soldering Temperature Symbol VDD TS Pmax Conditions Tmax Min. -0.3 -40 ISO 6425 Max +4.0 +125 50 Unit V C bar 40 sec max 250 C -4 +4 kV -100 +100 mA Typ. 3.0 +25 12.5 6.3 3.2 1.7 0.9 1.4 0.02 Max 3.6 +85 Unit V C Typ. 24 8.22 4.13 2.08 1.06 0.54 Max Human Body Model JEDEC standard No 78 ESD rating Latch up Typ. ELECTRICAL CHARACTERISTICS Parameter Operating Supply voltage Operating Temperature Symbol VDD T Conditions Min. 1.8 -40 OSR Supply current (1 sample per sec.) IDD Peak supply current Standby supply current VDD Capacitor 4096 2048 1024 512 256 during conversion at 25C From VDD to GND 100 Conditions Min. A 0.14 mA A nF ANALOG DIGITAL CONVERTER (ADC) Parameter Output Word Symbol OSR Conversion time DA5803-30BA_007 000058031759 ECN2319 tc 4096 2048 1024 512 256 ww.meas-spec.com 2/18 7.40 3.72 1.88 0.95 0.48 9.04 4.54 2.28 1.17 0.60 Unit bit ms August. 25, 2014 MS5803-30BA Miniature 30 bar Module PERFORMANCE SPECIFICATIONS (CONTINUED) PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25C UNLESS OTHERWISE NOTED) Parameter Operating Pressure Range Absolute Accuracy, Temperature range 0 ... 40 C Absolute Accuracy, Temperature range -40 ... 85 C Maximum error with supply voltage (1) Long-term stability Conditions Prange Full Accuracy 0 ... 6 bar 0 ... 20 bar 0 ... 30 bar 0 ... 6 bar 0 ... 20 bar 0 ... 30 bar Min. 0 -50 -100 -250 -100 -200 -400 VDD = 1.8 V ... 3.6 V OSR 4096 2048 1024 512 256 Resolution RMS Typ. Max 30 +50 +100 +250 +100 +200 +400 Unit bar mbar mbar +/-50 mbar -50 0.5 0.75 1 1.5 2.5 mbar/yr mbar (1) With autozero at 3V point TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25C UNLESS OTHERWISE NOTED) Parameter Absolute Accuracy Maximum error with supply voltage(1) Conditions 0 ...10 bar -20..85C -40..85C VDD = 1.8 V ... 3.6 V OSR Resolution RMS Min. -0.8 -2.0 -4.0 4096 2048 1024 512 256 Typ. Max +0.8 +2.0 +4.0 Unit C +/-0.5 C 0.002 0.003 0.005 0.008 0.012 C (1) With autozero at 3V point DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 3/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PERFORMANCE SPECIFICATIONS (CONTINUED) DIGITAL INPUTS (PS, CSB, DIN, SCLK, SDA, SCL) Parameter Serial data clock Serial data clock Input high voltage Input low voltage Input leakage current CS low to first SCLK rising CS low from last SCLK falling Symbol SCLK SCL VIH VIL Ileak25C tCSL tCSH Conditions SPI protocol I2C protocol Pins CSB Min. Typ. Max 20 400 100% VDD 20% VDD 0.15 Unit MHz kHz V V A ns ns Typ. Max 100% VDD 20% VDD Unit V V pF 80% VDD 0% VDD at 25c 21 21 DIGITAL OUTPUTS (DOUT, SDA, SCL) Parameter Output high voltage Output low voltage Load capacitance DA5803-30BA_007 000058031759 ECN2319 Symbol VOH VOL CLOAD Conditions Isource = 0.6 mA Isink = 0.6 mA Min. 80% VDD 0% VDD 16 ww.meas-spec.com 4/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PERFORMANCE CHARACTERISTICS PRESSURE ERROR VS PRESSURE AND TEMPERATURE Pressure accuracy vs temperature Typical Absolute pressure accuracy with 2nd order compensation Typical 300.0 300.00 200.00 85 100.00 25 0.00 -40 -100.00 -200.00 Pressure error [mbar] 400.00 Pressure error [mbar] 30000mbar 2nd order 400.0 500.00 200.0 14000 mbar 2nd order 100.0 0.0 30000 mbar 1st order -100.0 -200.0 -300.00 -300.0 -400.00 14000mbar 1st order -400.0 -500.00 0 5000 10000 15000 20000 Pressure [mbar] 25000 -40 30000 -20 0 20 40 60 80 Temperature [C] TEMPERATURE ERROR VS TEMPERATURE Temperature accuracy vs temperature Typical Temperature error [C] 10.0 30000mbar 2nd order 8.0 6.0 1000 mbar 2nd order 4.0 30000mbar 1st order 2.0 0.0 1000 mbar 1st order -2.0 -40 -20 0 40 20 60 80 Temperature [C] PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY Pressure error vs supply voltage at 25C Typical Temperature error vs supply voltage at 25C Typical 50.0 0.5 1000 mbar 10.0 4000 mbar 6000 mbar -10.0 14000 mabr -30.0 -50.0 Temperature error [C] Pressure error [mbar] 30.0 0.3 1000 mbar 0.1 4000 mbar 6000 mbar -0.1 14000 mbar -0.3 -0.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 1.8 Supply Voltage [V] DA5803-30BA_007 000058031759 ECN2319 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Supply Voltage [V] ww.meas-spec.com 5/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module FUNCTIONAL DESCRIPTION VDD PS Meas. MUX SENSOR CSB +IN Digital Interface PGA -IN ADC SDI / SDA SDO dig. Filter SCLK / SCL Memory (PROM) 128 bits Sensor Interface IC SGND GND Figure 1: Block diagram of MS5803-30BA GENERAL The MS5803-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5803-30BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 128-bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. The 2 coefficients W0 and W7 are for factory configuration and CRC. SERIAL INTERFACE 2 The MS5803-30BA has built in two types of serial interfaces: SPI and I C. Pulling the Protocol Select pin PS to 2 low selects the SPI protocol, pulling PS to high activates the I C bus protocol. Pin PS Mode High Low IC SPI 2 Pins used SDA, SCL, CSB SDI, SDO, SCLK, CSB SPI MODE The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise performance from the module is obtained when the SPI bus is quiet and without communication to other devices during the ADC conversion in progress. DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 6/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module 2 I C MODE The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta). 2 The sensor responds on the same pin SDA which is bidirectional for the I C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In 2 2 I C-Mode the complement of the pin CSB (Chip Select) represents the LSB of the I C address. It is possible to 2 use two sensors with two different addresses on the I C bus. The pin CSB shall be connected to VDD or GND (do not leave unconnected!). Pin CSB Address (7 bits) High Low 0x76 (1110110 b) 0x77 (1110111 b) COMMANDS The MS5803-30BA has only five basic commands: 1. Reset 2. Read PROM (128 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24 bit pressure / temperature) Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the PROM read command using the a2, a1 and a0 bits. Bit number Bit name Command byte 0 1 2 PRM COV - 3 Typ 4 5 6 7 Ad2/ Ad1/ Ad0/ Stop Os2 Os1 Os0 Command Reset Convert D1 (OSR=256) Convert D1 (OSR=512) Convert D1 (OSR=1024) Convert D1 (OSR=2048) Convert D1 (OSR=4096) Convert D2 (OSR=256) Convert D2 (OSR=512) Convert D2 (OSR=1024) Convert D2 (OSR=2048) Convert D2 (OSR=4096) ADC Read PROM Read 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 1 1 1 1 1 0 0 1 0 0 0 0 1 0 0 0 0 1 0 Ad2 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 hex value 1 0 0 1 1 0 0 0 1 1 0 0 Ad1 1 0 1 0 1 0 0 1 0 1 0 0 Ad0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x1E 0x40 0x42 0x44 0x46 0x48 0x50 0x52 0x54 0x56 0x58 0x00 0xA0 to 0xAE Figure 2: Command structure DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 7/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PRESSURE AND TEMPERATURE CALCULATION Start Maximum values for calculation results: PMIN = 0mbar PMAX = 30bar TMIN = -40C TMAX = 85C TREF = 20C Convert calibration datadata into coefficients (see bit pattern W1 to W4) Read calibration (factory calibrated) from of PROM Variable Description | Equation Recommended variable type Size [1] [bit] min max Example / Typical 29112 Value C1 Pressure sensitivity | SENST1 unsigned int 16 16 0 65535 C2 Pressure offset | OFFT1 unsigned int 16 16 0 65535 26814 C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 0 65535 19125 17865 C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 0 65535 C5 Reference temperature | TREF unsigned int 16 16 0 65535 32057 C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 0 65535 31305 Read digitalpressure pressure and and temperature data Read digital temperature data D1 Digital pressure value unsigned int 32 24 0 16777216 4944364 D2 Digital temperature value unsigned int 32 24 0 16777216 8198974 -7618 Calculate temperature dT Difference between actual and reference temperature [2] dT = D2 - TREF = D2 - C5 * 2 8 signed int 32 25 -16776960 16777216 TEMP Actual temperature (-40...85C with 0.01C resolution) TEMP = 20C + dT * TEMPSENS = 2000 + dT * C6 / 223 signed int 32 41 -4000 8500 1971 = 19.71 C Calculate temperature compensated compensated pressure Calculate temperature pressure OFF Offset at actual temperature [3] OFF = OFFT1 + TCO * dT = C2 * 216 + (C4 * dT ) / 27 signed int 64 41 -8589672450 12884705280 1756219057 SENS Sensitivity at actual temperature [4] SENS = SENST1 + TCS * dT = C1 * 2 15 + (C3 * dT ) / 28 signed int 64 41 -4294836225 6442352640 953372897 P Temperature compensated pressure (0...30bar with 0.1mbar resolution) P = D1 * SENS - OFF = (D1 * SENS / 2 21 - OFF) / 2 13 signed int 32 58 0 300000 59998 = 5999.8 mbar Display pressure and temperature value Notes [1] [2] [3] [4] Maximal size of intermediate result during evaluation of variable min and max have to be defined min and max have to be defined min and max have to be defined Figure 3: Flow chart for pressure and temperature reading and software compensation. DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 8/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module SECOND ORDER TEMPERATURE COMPENSATION No Yes TEMP<20C Low temperature Low temperature High temperature T2 = 3 dT2 / 233 T2 = 7 dT2 / 237 OFF2 = 1 (TEMP - 2000) / 2 SENS2 = 0 2 OFF2 = 3 (TEMP - 2000) / 2 2 3 SENS2 = 5 (TEMP - 2000) / 2 2 Yes 1 4 No TEMP<-15C Low temperature Very low temperature OFF2 = OFF2 + 7 (TEMP + 1500) 2 SENS2 = SENS2 + 4 (TEMP + 1500) 2 Calculate pressure and temperature TEMP = TEMP - T2 OFF = OFF - OFF2 SENS = SENS - SENS2 Figure 4: Flow chart for pressure and temperature to the optimum accuracy. DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 9/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module SPI INTERFACE RESET SEQUENCE The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown condition Figure 5: Reset command sequence SPI (mode 0) 0 1 2 3 4 5 6 7 SCLK CSB SDI 2.8ms RELOAD SDO PS Figure 6: Reset command sequence SPI (mode 3) DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 10/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. 0 1 2 3 4 5 6 7 SCLK CSB SDI 8.22ms ADC CONVERSION SDO PS Figure 7: Conversion out sequence, Typ=d1, OSR = 4096 Figure 8: ADC Read sequence PROM READ SEQUENCE The read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. Figure 9: PROM Read sequence, address = 011 (Coefficient 3). DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 11/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module I2C INTERFACE COMMANDS 2 Each I C communication message starts with the start condition and it is ended with the stop condition. The MS5803-30BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does 2 not have a microcontroller inside, the commands for I C and SPI are quite similar. RESET SEQUENCE The reset can be sent at any time except when the power on did not work it could be possible that the acknowledge blocks the SDA. When SDA is blocked by an undefined state the only way to get the MS5803-30BA to work is to send a power on reset. 1 1 1 0 1 1 CSB 0 0 0 0 0 1 1 1 1 0 0 command Device Address A P S Device Address W A cmd byte From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge 2 Figure 10: I C Reset Command CONVERSION SEQUENCE A conversion can be started by sending the command to MS5803-30BA. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when an acknowledge appears from the MS5803-30BA, you may then send 24 SCLK cycles to get all result bits. Every 8 bit the system waits for an acknowledge signal. 1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge 2 Figure 11: I C Command to initiate a pressure conversion (OSR=4096, typ=D1) 1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge 2 Figure 12: I C ADC read sequence 2 Figure 13: I C pressure response (D1) on 24 bit from MS5803-30BA DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 12/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PROM READ SEQUENCE The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. 2 Figure 14: I C Command to read memory address= 011 (Coefficient 3) 2 Figure 15: I C answer from MS5803-30BA CYCLIC REDUNDANCY CHECK (CRC) MS5803-30BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The application note AN520 describes in detail CRC-4 code used. A d d 0 1 2 3 4 5 6 7 D B 1 5 D B 1 4 D B 1 3 D B 1 2 D B 1 1 D D D D D D D D D D D B B B B B B B B B B B 1 9 8 7 6 5 4 3 2 1 0 0 16 bit reserved for manufacturer Coefficient 1 (16 bit unsigned) Coefficient 2 (16 bit unsigned) Coefficient 3 (16 bit unsigned) Coefficient 4 (16 bit unsigned) Coefficient 5 (16 bit unsigned) Coefficient 6 (16 bit unsigned) CRC Figure 16: Memory PROM mapping DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 13/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module APPLICATION CIRCUIT The MS5803-30BA is a circuit that can be used in conjunction with a microcontroller in mobile depth-meter applications. It is designed for low-voltage systems with a supply voltage of 3 V. MS5803-30BA MS5803-30BA 2 Figure 17: Typical application circuit with SPI / I C protocol communication DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 14/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module PACKAGE OUTLINE AND PIN CONFIGURATION 5 4 6 3 7 2 8 1 TOP view 8 1 7 2 6 5 3 4 Pin Name Type Function 1 SCLK I Serial data clock 2 GND G Ground 3 CSB I Chip Select (active low) 4 NC NC 5 VDD P Positive supply voltage 6 PS I Communication protocol select SPI / I2C 7 SDI/SDA I Serial data input 8 SDO O Serial data output - Figure 18: MS5803-30BA package outlines, pin configuration and description Notes: (1) Dimensions in mm (2) General tolerance 0.1 (3) Cap centering 0.15 from center of the ceramic RECOMMENDED PAD LAYOUT DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 15/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module SHIPPING PACKAGE Tube Tape & reel DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 16/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for all soldering issues. MOUNTING The MS5803-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for applications in watches and other special devices. SEALING WITH O-RINGS In products like outdoor watches the electronics must be protected against direct water or humidity. For those products the MS5803-30BA provides the possibility to seal with an O-ring. The protective cap of the MS5803-30BA is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5803-30BA is filled with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction. CLEANING The MS5803-30BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble the sensor under class 10'000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type "no-clean" shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential to ground machines and personnel properly during assembly and handling of the device. The MS5803-30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to the power supply. A minimum 100nF ceramic capacitor must be placed as close as possible to the MS5803-30BA VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 17/18 August. 25, 2014 MS5803-30BA Miniature 30 bar Module ORDERING INFORMATION Part Number / Art. Number MS580330BA01-00 MS580330BA01-50 Product MS5803-30BA Miniature Module MS5803-30BA Miniature Module T&R Delivery Form Tube Tape & Reel MS580330BA06-00 MS580330BA06-50 MS5803-30BA Miniature Module HE MS5803-30BA Miniature Module HE T&R Tube Tape & Reel FACTORY CONTACTS EUROPE MEAS Switzerland Sarl Ch. Chapons-des-Pres 11 CH-2022 Bevaix Tel: +41 32 847 9550 Fax: + 41 32 847 9569 e-mail: sales.chameas-spec.com Website: www.meas-spec.com ASIA Measurement Specialties (China), Ltd. No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen, 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 e-mail: pfg.cs.asiaameas-spec.com Website: www.meas-spec.com NORTH AMERICA Measurement Specialties 45738 Northport Loop West Fremont, CA 94538 Tel: +1 800 767 1888 Fax: +1 510 498 1578 e-mail: pfg.cs.amerameas-spec.com Website: www.meas-spec.com The information in this sheet has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of such devices any license under the patent rights to the manufacturer. Measurement Specialties, Inc. reserves the right to make changes without further notice to any product herein. Measurement Specialties, Inc. makes no warranty, representation or guarantee regarding the suitability of its product for any particular purpose, nor does Measurement Specialties, Inc. assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters must be validated for each customer application by customer's technical experts. Measurement Specialties, Inc. does not convey any license under its patent rights nor the rights of others. DA5803-30BA_007 000058031759 ECN2319 ww.meas-spec.com 18/18 August. 25, 2014 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: TE Connectivity: MS580330BA01-50 MS580330BA01-00