TLP3547,TLP3547F Photocouplers Photorelay TLP3547,TLP3547F 1. Applications * Mechanical relay replacements * Factory Automation (FA) * Programmable Logic Controllers (PLCs) * Measuring Instruments * ATE (Automatic Test Equipment) 2. General The TLP3547 and TLP3547F photorelay consist of a photo MOSFET optically coupled to an infrared light emitting diode. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3547 and TLP3547F make it suitable for power line control applications. 3. Features (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 60 V (min) (3) Trigger LED current: 5.0 mA (max) (4) ON-state current: 5 A (max) (A connection) (5) ON-state resistance: 50 m (max) (A connection) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 4. Mechanical Parameters 7.62-mm Pitch TLP3547 10.16-mm Pitch TLP3547F Unit Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Characteristics Start of commercial production (c)2016 Toshiba Corporation 1 2016-05 2017-04-20 Rev.2.0 TLP3547,TLP3547F 5. Packaging (Note) TLP3547 TLP3547(LF1,TP1) 11-10C401S 11-10C4S TLP3547F 11-10C405S TLP3547F(LF4,TP4) 11-10C402S Note: TLP3547(LF5,TP5) 11-10C404S Through-hole type: TLP3547, TLP3547F Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. Pin Assignment 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: Drain 6: Source 7: Source 8: Drain (c)2016 Toshiba Corporation 2 2017-04-20 Rev.2.0 TLP3547,TLP3547F 7. Internal Circuit 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Note Rating Unit IF 30 mA Input forward current derating (Ta 25 ) IF/Ta -0.3 mA/ Input forward current (pulsed) (100 s pulse, 100 pps) IFP 1 A Input reverse voltage VR 5 V Input power dissipation PD 50 mW PD/Ta -0.5 mW/ Tj 125 60 V 5 A Input power dissipation derating (Ta 25 ) Junction temperature Detector OFF-state output terminal voltage VOFF ON-state current (A connection) ION (Note 1) ON-state current (B connection) 5 ON-state current (C connection) ION ON-state current derating (A connection) (Ta 25 ) ON-state current derating (B connection) (Ta 25 ) ON-state current derating (C connection) ON-state current (pulsed) -50 mA/ -50 (Ta 25 ) ION/Ta -100 IONP 15 PO 750 mW (Ta 25 ) PO/Ta -7.5 mW/ Junction temperature Common Storage temperature Operating temperature Tj 125 Tstg -55 to 125 Topr -40 to 85 (10 s) Tsol 260 AC, 60 s, R.H. 60 % BVS Lead soldering temperature Isolation voltage (Note 1) (t = 100 ms, duty = 1/10) Output power dissipation Output power dissipation derating ION/Ta 10 (Note 2) 2500 A Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: For an application circuit example, see Chapter 14.2. Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. (c)2016 Toshiba Corporation 3 2017-04-20 Rev.2.0 TLP3547,TLP3547F 9. Recommended Operating Conditions (Note) Characteristics Symbol Supply voltage Min Typ. Max VDD 48 V IF 5 25 mA Input forward current Note Unit ON-state current (A connection) ION 5 A Operating temperature Topr -40 85 Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. 10. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Note Test Condition Min Typ. Max Unit Input forward voltage VF IF = 10 mA 1.50 1.64 1.80 V Input reverse current IR VR = 5 V 10 A Ct Input capacitance Detector OFF-state current Output capacitance V = 0 V, f = 1 MHz 70 pF IOFF VOFF = 60 V 0.01 1 A COFF V = 0 V, f = 1 MHz 850 pF 11. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Trigger LED current IFT ION = 1 A Return LED current IFC IOFF = 1 A ON-state resistance (A connection) RON Min Typ. Max Unit mA 0.28 5.0 0.01 0.19 (Note 1) ION = 1 A, IF = 5 mA, t < 1 s 22 50 ON-state resistance (B connection) ION = 1 A, IF = 2 mA, t < 1 s 25 m ON-state resistance (C connection) ION = 1 A, IF = 2 mA, t < 1 s 25 Min Typ. Max Unit 0.8 pF 5x1010 1014 Vrms Note 1: For an application circuit example, see Chapter 14.2. 12. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. 60 % Isolation voltage BVS (Note 1) AC, 60 s 2500 AC, 1 s in oil 5000 DC, 60 s in oil 5000 Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 13. Switching Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Turn-on time tON Turn-off time tOFF Note Test Condition See Fig. 13.1. RL = 200 , VDD = 20 V, IF = 5 mA Min Typ. Max Unit 2.5 5.0 ms 0.1 1.0 Fig. 13.1 Switching Time Test Circuit and Waveform (c)2016 Toshiba Corporation 4 2017-04-20 Rev.2.0 TLP3547,TLP3547F 14. Characteristics Curves and Circuit Connections 14.1. Characteristics Curves (Note) Fig. 14.1.1 IF - Ta Fig. 14.1.2 ION - Ta Fig. 14.1.3 IF - VF Fig. 14.1.4 ION - VON Fig. 14.1.5 RON - Ta Fig. 14.1.6 IFT - Ta (c)2016 Toshiba Corporation 5 2017-04-20 Rev.2.0 TLP3547,TLP3547F Fig. 14.1.7 tON, tOFF - IF Fig. 14.1.8 tON, tOFF - Ta Fig. 14.1.9 IOFF - Ta Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2016 Toshiba Corporation 6 2017-04-20 Rev.2.0 TLP3547,TLP3547F 14.2. Circuit Connections Fig. 14.2.1 A Connection Fig. 14.2.2 B Connection Fig. 14.2.3 C Connection (c)2016 Toshiba Corporation 7 2017-04-20 Rev.2.0 TLP3547,TLP3547F 15. Soldering and Storage 15.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 15.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used * When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 15.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2016 Toshiba Corporation 8 2017-04-20 Rev.2.0 TLP3547,TLP3547F 16. Land Pattern Dimensions (for reference only) (Unit: mm) TLP3547 TLP3547F Fig. 16.1 Lead forming and taping option (LF1), (TP1), (LF5), (TP5) Fig. 16.2 Lead forming and taping option (LF4), (TP4) 17. Marking TLP3547 TLP3547F 18. Ordering Information (Example of Item Name) Item Name Packaging (Note 1) Packing (MOQ) TLP3547(F(O TH Magazine (50 pcs) TLP3547(LF1,F(O LF1 Magazine (50 pcs) TLP3547(LF5,F(O LF5 Magazine (50 pcs) TLP3547(TP1,F(O TP1 Tape and reel (1500 pcs) TLP3547(TP5,F(O TP5 Tape and reel (1500 pcs) TLP3547F(F(O TH, Wide forming Magazine (50 pcs) TLP3547F(LF4,F(O LF4, Wide forming Magazine (50 pcs) TLP3547F(TP4,F(O TP4, Wide forming Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount (c)2016 Toshiba Corporation 9 2017-04-20 Rev.2.0 TLP3547,TLP3547F Package Dimensions Unit: mm TLP3547 Weight: 0.54 g (typ.) Package Name(s) TOSHIBA: 11-10C4S (c)2016 Toshiba Corporation 10 2017-04-20 Rev.2.0 TLP3547,TLP3547F Package Dimensions Unit: mm TLP3547(LF1,TP1) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C401S (c)2016 Toshiba Corporation 11 2017-04-20 Rev.2.0 TLP3547,TLP3547F Package Dimensions Unit: mm TLP3547(LF5,TP5) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C405S (c)2016 Toshiba Corporation 12 2017-04-20 Rev.2.0 TLP3547,TLP3547F Package Dimensions Unit: mm TLP3547F Weight: 0.54 g (typ.) Package Name(s) TOSHIBA: 11-10C402S (c)2016 Toshiba Corporation 13 2017-04-20 Rev.2.0 TLP3547,TLP3547F Package Dimensions Unit: mm TLP3547F(LF4,TP4) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C404S (c)2016 Toshiba Corporation 14 2017-04-20 Rev.2.0 TLP3547,TLP3547F RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2016 Toshiba Corporation 15 2017-04-20 Rev.2.0