TLP3547,TLP3547F
1
Photocouplers Photorelay
TLP3547,TLP3547F
TLP3547,TLP3547F
TLP3547,TLP3547F
TLP3547,TLP3547F
Start of commercial production
2016-05
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Mechanical relay replacements
• Factory Automation (FA)
• Programmable Logic Controllers (PLCs)
• Measuring Instruments
• ATE (Automatic Test Equipment)
2.
2.
2.
2. General
General
General
General
The TLP3547 and TLP3547F photorelay consist of a photo MOSFET optically coupled to an infrared light emitting
diode. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current
of the TLP3547 and TLP3547F make it suitable for power line control applications.
3.
3.
3.
3. Features
Features
Features
Features
(1) Normally opened (1-Form-A)
(2) OFF-state output terminal voltage: 60 V (min)
(3) Trigger LED current: 5.0 mA (max)
(4) ON-state current: 5 A (max) (A connection)
(5) ON-state resistance: 50 mΩ (max) (A connection)
(6) Isolation voltage: 2500 Vrms (min)
(7) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
4.
4.
4.
4. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance distances
Internal isolation thickness
7.62-mm Pitch
TLP3547
7.0 (min)
7.0 (min)
0.4 (min)
10.16-mm Pitch
TLP3547F
8.0 (min)
8.0 (min)
0.4 (min)
Unit
mm
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
2
5.
5.
5.
5. Packaging (Note)
Packaging (Note)
Packaging (Note)
Packaging (Note)
TLP3547
11-10C4S
TLP3547(LF1,TP1)
11-10C401S
TLP3547(LF5,TP5)
11-10C405S
TLP3547F
11-10C402S
TLP3547F(LF4,TP4)
11-10C404S
Note: Through-hole type: TLP3547, TLP3547F
Lead forming option: (LF1), (LF4), (LF5)
Taping option: (TP1), (TP4), (TP5)
6.
6.
6.
6. Pin Assignment
Pin Assignment
Pin Assignment
Pin Assignment
1: N.C.
2: Anode
3: Cathode
4: N.C.
5: Drain
6: Source
7: Source
8: Drain
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
3
7.
7.
7.
7. Internal Circuit
Internal Circuit
Internal Circuit
Internal Circuit
8.
8.
8.
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Input power dissipation
Input power dissipation derating
Junction temperature
OFF-state output terminal voltage
ON-state current (A connection)
ON-state current (B connection)
ON-state current (C connection)
ON-state current derating (A connection)
ON-state current derating (B connection)
ON-state current derating (C connection)
ON-state current (pulsed)
Output power dissipation
Output power dissipation derating
Junction temperature
Storage temperature
Operating temperature
Lead soldering temperature
Isolation voltage
(Ta ≥ 25 )
(100 µs pulse, 100 pps)
(Ta ≥ 25 )
(Ta ≥ 25 )
(Ta ≥ 25 )
(Ta ≥ 25 )
(t = 100 ms, duty = 1/10)
(Ta ≥ 25 )
(10 s)
AC, 60 s, R.H. ≤ 60 %
Symbol
IF
∆IF/∆Ta
IFP
VR
PD
∆PD/∆Ta
Tj
VOFF
ION
ION
∆ION/∆Ta
∆ION/∆Ta
IONP
PO
∆PO/∆Ta
Tj
Tstg
Topr
Tsol
BVS
Note
(Note 1)
(Note 1)
(Note 2)
Rating
30
-0.3
1
5
50
-0.5
125
60
5
5
10
-50
-50
-100
15
750
-7.5
125
-55 to 125
-40 to 85
260
2500
Unit
mA
mA/
A
V
mW
mW/
V
A
mA/
A
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: For an application circuit example, see Chapter 14.2.
Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
4
9.
9.
9.
9. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Supply voltage
Input forward current
ON-state current (A connection)
Operating temperature
Symbol
VDD
IF
ION
Topr
Note Min
-40
Typ.
5
Max
48
25
5
85
Unit
V
mA
A
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
10.
10.
10.
10. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
OFF-state current
Output capacitance
Symbol
VF
IR
Ct
IOFF
COFF
Note Test Condition
IF = 10 mA
VR = 5 V
V = 0 V, f = 1 MHz
VOFF = 60 V
V = 0 V, f = 1 MHz
Min
1.50
Typ.
1.64
70
0.01
850
Max
1.80
10
1
Unit
V
µA
pF
µA
pF
11.
11.
11.
11. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Trigger LED current
Return LED current
ON-state resistance (A connection)
ON-state resistance (B connection)
ON-state resistance (C connection)
Symbol
IFT
IFC
RON
Note
(Note 1)
Test Condition
ION = 1 A
IOFF = 1 µA
ION = 1 A, IF = 5 mA, t < 1 s
ION = 1 A, IF = 2 mA, t < 1 s
ION = 1 A, IF = 2 mA, t < 1 s
Min
0.01
Typ.
0.28
0.19
22
Max
5.0
50
25
25
Unit
mA
mΩ
Note 1: For an application circuit example, see Chapter 14.2.
12.
12.
12.
12. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60 %
AC, 60 s
AC, 1 s in oil
DC, 60 s in oil
Min
5×1010
2500
Typ.
0.8
1014
5000
5000
Max
Unit
pF
Ω
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
13.
13.
13.
13. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Turn-on time
Turn-off time
Symbol
tON
tOFF
Note Test Condition
See Fig. 13.1.
RL = 200 Ω, VDD = 20 V, IF = 5 mA
Min
Typ.
2.5
0.1
Max
5.0
1.0
Unit
ms
Fig.
Fig.
Fig.
Fig. 13.1
13.1
13.1
13.1 Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
5
14.
14.
14.
14. Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
14.1.
14.1.
14.1.
14.1. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 14.1.1
14.1.1
14.1.1
14.1.1 I
I
I
IF
F
F
F - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 14.1.2
14.1.2
14.1.2
14.1.2 I
I
I
ION
ON
ON
ON - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 14.1.3
14.1.3
14.1.3
14.1.3 I
I
I
IF
F
F
F - V
- V
- V
- VF
F
F
FFig.
Fig.
Fig.
Fig. 14.1.4
14.1.4
14.1.4
14.1.4 I
I
I
ION
ON
ON
ON - V
- V
- V
- VON
ON
ON
ON
Fig.
Fig.
Fig.
Fig. 14.1.5
14.1.5
14.1.5
14.1.5 R
R
R
RON
ON
ON
ON - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 14.1.6
14.1.6
14.1.6
14.1.6 I
I
I
IFT
FT
FT
FT - T
- T
- T
- Ta
a
a
a
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
6
Fig.
Fig.
Fig.
Fig. 14.1.7
14.1.7
14.1.7
14.1.7 t
t
t
tON
ON
ON
ON, t
, t
, t
, tOFF
OFF
OFF
OFF - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 14.1.8
14.1.8
14.1.8
14.1.8 t
t
t
tON
ON
ON
ON, t
, t
, t
, tOFF
OFF
OFF
OFF - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 14.1.9
14.1.9
14.1.9
14.1.9 I
I
I
IOFF
OFF
OFF
OFF - T
- T
- T
- Ta
a
a
a
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
7
14.2.
14.2.
14.2.
14.2. Circuit Connections
Circuit Connections
Circuit Connections
Circuit Connections
Fig.
Fig.
Fig.
Fig. 14.2.1
14.2.1
14.2.1
14.2.1 A Connection
A Connection
A Connection
A Connection Fig.
Fig.
Fig.
Fig. 14.2.2
14.2.2
14.2.2
14.2.2 B Connection
B Connection
B Connection
B Connection
Fig.
Fig.
Fig.
Fig. 14.2.3
14.2.3
14.2.3
14.2.3 C Connection
C Connection
C Connection
C Connection
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
8
15.
15.
15.
15. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
15.1.
15.1.
15.1.
15.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 15.1.1
15.1.1
15.1.1
15.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
15.2.
15.2.
15.2.
15.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
9
16.
16.
16.
16. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
(Unit: mm)
TLP3547
Fig.
Fig.
Fig.
Fig. 16.1
16.1
16.1
16.1 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF1), (TP1), (LF5), (TP5)
TLP3547F
Fig.
Fig.
Fig.
Fig. 16.2
16.2
16.2
16.2 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF4), (TP4)
17.
17.
17.
17. Marking
Marking
Marking
Marking
TLP3547 TLP3547F
18.
18.
18.
18. Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Item Name
TLP3547(F(O
TLP3547(LF1,F(O
TLP3547(LF5,F(O
TLP3547(TP1,F(O
TLP3547(TP5,F(O
TLP3547F(F(O
TLP3547F(LF4,F(O
TLP3547F(TP4,F(O
Packaging (Note 1)
TH
LF1
LF5
TP1
TP5
TH, Wide forming
LF4, Wide forming
TP4, Wide forming
Packing (MOQ)
Magazine (50 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1000 pcs)
Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
10
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP3547
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C4S
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
11
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP3547(LF1,TP1)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C401S
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
12
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP3547(LF5,TP5)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C405S
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
13
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP3547F
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C402S
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
14
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP3547F(LF4,TP4)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C404S
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
TLP3547,TLP3547F
15
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2017-04-20
Rev.2.0
©2016 Toshiba Corporation
