LMH6639
LMH6639 190MHz Rail-to-Rail Output Amplifier with Disable
Literature Number: SNOS989F
LMH6639
October 4, 2010
190MHz Rail-to-Rail Output Amplifier with Disable
General Description
The LMH6639 is a voltage feedback operational amplifier with
a rail-to-rail output drive capability of 110mA. Employing
National’s patented VIP10 process, the LMH6639 delivers a
bandwidth of 190MHz at a current consumption of only
3.6mA. An input common mode voltage range extending to
0.2V below the V and to within 1V of V+, makes the LMH6639
a true single supply op-amp. The output voltage range ex-
tends to within 30mV of either supply rail providing the user
with a dynamic range that is especially desirable in low volt-
age applications.
The LMH6639 offers a slew rate of 172V/μs resulting in a full
power bandwidth of approximately 28MHz. The LMH6639 al-
so offers protection for the input transistors by using two anti-
parallel diodes and a series resistor connected across the
inputs. The TON value of 83nsec combined with a settling time
of 33nsec makes this device ideally suited for multiplexing
applications (see application note for details). Careful atten-
tion has been paid to ensure device stability under all oper-
ating voltages and modes. The result is a very well behaved
frequency response characteristic for any gain setting includ-
ing +1, and excellent specifications for driving video cables
including harmonic distortion of −60dBc, differential gain of
0.12% and differential phase of 0.045°
Features
(VS = 5V, Typical values unless specified)
Supply current (no load) 3.6mA
Supply current (off mode) 400μA
Output resistance (closed loop 1MHz) 0.186Ω
−3dB BW (AV = 1) 190MHz
Settling time 33nsec
Input common mode voltage −0.2V to 4V
Output voltage swing 40mV from rails
Linear output current 110mA
Total harmonic distortion −60dBc
Fully characterized for 3V, 5V and ±5V
No output phase reversal with CMVR exceeded
Excellent overdrive recovery
Off Isolation 1MHz −70dB
Differential Gain 0.12%
Differential Phase 0.045°
Applications
Active filters
CD/DVD ROM
ADC buffer amplifier
Portable video
Current sense buffer
20030246
FIGURE 1. Typical Single Supply Schematic
© 2010 National Semiconductor Corporation 200302 www.national.com
LMH6639 190MHz Rail-to-Rail Output Amplifier with Disable
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Tolerance 2KV (Note 2)
200V (Note 9)
VIN Differential ±2.5V
Input Current ±10mA
Supply Voltage (V+ – V)13.5V
Voltage at Input/Output pins V+ +0.8V, V −0.8V
Storage Temperature Range −65°C to +150°C
Junction Temperature (Note 4) +150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
Operating Ratings (Note 1)
Supply Voltage (V+ to V)3V to 12V
Operating Temperature Range (Note 4) −40°C to +85°C
Package Thermal Resistance (θJA) (Note 4)
SOT23-6 265°C/W
SOIC-8 190°C/W
3V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 3V, V = 0V, VO = VCM = V+/2, and RL = 2k to V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
BW −3dB BW AV = +1 120 170 MHz
AV = −1 63
BW0.1dB 0.1dB Gain Flatness RF = 2.65k , RL = 1kΩ, 16.4 MHz
FPBW Full Power Bandwidth AV = +1, VOUT = 2VPP, −1dB
V+ = 1.8V, V = 1.2V
21 MHz
GBW Gain Bandwidth product AV = +1 83 MHz
enInput-Referred Voltage Noise RF = 33kf = 10kHz 19 nV/
f = 1MHz 16
inInput-Referred Current Noise RF = 1Mf = 10kHz 1.30 pA/
f = 1MHz 0.36
THD Total Harmonic Distortion f = 5MHz, VO = 2VPP, AV = +2,
RL = 1k to V+/2
−50 dBc
TSSettling Time VO = 2VPP, ±0.1% 37 ns
SR Slew Rate AV = −1 (Note 8) 120 167 V/μs
VOS Input Offset Voltage 1.01 5
7
mV
TC VOS Input Offset Average Drift (Note 11) 8 μV/°C
IBInput Bias Current (Note 7) −1.02 −2.6
−3.5
μA
IOS Input Offset Current 20 800
1000
nA
RIN Common Mode Input
Resistance
AV = +1, f = 1kHz, RS = 1M 6.1 M
CIN Common Mode Input
Capacitance
AV = +1, RS = 100k 1.35 pF
CMVR Input Common-Mode Voltage
Range
CMRR 50dB −0.3 −0.2
−0.1 V
1.8
1.6
2
CMRR Common Mode Rejection Ratio (Note 12) 72 93 dB
AVOL Large Signal Voltage Gain VO = 2VPP, RL = 2k to V+/2 80
76
100
dB
VO = 2VPP, RL = 150Ω to V+/2 74
70
78
www.national.com 2
LMH6639
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
VOOutput Swing
High
RL = 2k to V+/2, VID = 200mV 2.90 2.98
V
RL = 150Ω to V+/2, VID = 200mV 2.75 2.93
RL = 50Ω to V+/2, VID = 200mV 2.6 2.85
Output Swing
Low
RL = 2k to V+/2, VID = −200mV 25 75
mV
RL = 150Ω to V+/2, VID = −200mV 75 200
RL = 50Ω to V+/2, VID = −200mV 130 300
ISC Output Short Circuit Current Sourcing to V+/2, (Note 10) 50
35
120
mA
Sinking to V+/2, (Note 10) 67
40
140
IOUT Output Current VO = 0.5V from either supply 99 mA
PSRR Power Supply Rejection Ratio (Note 12) 72 96 dB
ISSupply Current (Enabled) No Load 3.5 5.6
7.5 mA
Supply Current (Disabled) 0.3 0.5
0.7
TH_SD Threshold Voltage for Shutdown
Mode
V+−1.59 V
I_SD PIN Shutdown Pin Input Current SD Pin Connect to 0V (Note 7) −13 μA
TON On Time After Shutdown 83 nsec
TOFF Off Time to Shutdown 160 nsec
ROUT Output Resistance Closed Loop RF = 10k, f = 1kHz, AV = −1 27
m
RF = 10k, f = 1MHz, AV = −1 266
5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for at TJ = 25°C, V+ = 5V, V = 0V, VO = VCM = V+/2, and RL = 2k to V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
BW −3dB BW AV = +1 130 190 MHz
AV = −1 64
BW0.1dB 0.1dB Gain Flatness RF = 2.51k, RL = 1kΩ, 16.4 MHz
FPBW Full Power Bandwidth AV = +1, VOUT = 2VPP, −1dB 28 MHz
GBW Gain Bandwidth Product AV = +1 86 MHz
enInput-Referred Voltage Noise RF = 33kf = 10kHz 19 nV/
f = 1MHz 16
inInput-Referred Current Noise RF = 1Mf = 10KHz 1.35 pA/
f = 1MHz 0.35
THD Total Harmonic Distortion f = 5MHz, VO = 2VPP, AV = +2
RL = 1k to V+/2 −60 dBc
DG Differential Gain NTSC, AV = +2
RL = 150Ω to V+/2 0.12 %
DP Differential Phase NTSC, AV = +2
RL = 150Ω to V+/2 0.045 deg
TSSettling Time VO = 2VPP, ±0.1% 33 ns
SR Slew Rate AV = −1, (Note 8) 130 172 V/µs
VOS Input Offset Voltage 1.02 5
7mV
3 www.national.com
LMH6639
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
TC VOS Input Offset Average Drift (Note 11) 8 µV/°C
IBInput Bias Current (Note 7) −1.2 −2.6
−3.25
µA
IOS Input Offset Current 20 800
1000
nA
RIN Common Mode Input
Resistance
AV = +1, f = 1kHz, RS = 1M 6.88 M
CIN Common Mode Input
Capacitance
AV = +1, RS = 100k 1.32 pF
CMVR Common-Mode Input Voltage
Range
CMRR 50dB −0.3 −0.2
−0.1 V
4 3.8
3.6
CMRR Common Mode Rejection Ratio (Note 12) 72 95 dB
AVOL Large Signal Voltage Gain VO = 4VPP
RL = 2k to V+/2
86
82
100
dB
VO = 3.75VPP
RL = 150Ω to V+/2
74
70
77
VOOutput Swing
High
RL = 2k to V+/2, VID = 200mV 4.90 4.97
V
RL = 150Ω to V+/2, VID = 200mV 4.65 4.90
RL = 50Ω to V+/2, VID = 200mV 4.40 4.77
Output Swing
Low
RL = 2k to V+/2, VID = −200mV 25 100
mV
RL = 150Ω to V+/2, VID = −200mV 85 200
RL = 50Ω to V+/2, VID = −200mV 190 400
ISC Output Short Circuit Current Sourcing to V+/2, (Note 10) 100
79
160
mA
Sinking from V+/2, (Note 10) 120
85
190
IOUT Output Current VO = 0.5V from either supply 110 mA
PSRR Power Supply Rejection Ratio (Note 12) 72 96 dB
ISSupply Current (Enabled) No Load 3.6 5.8
8.0 mA
Supply Current (Disabled) 0.40 0.8
1.0
TH_SD Threshold Voltage for Shutdown
Mode
V+ −1.65 V
I_SD PIN Shutdown Pin Input Current SD Pin Connected to 0V (Note 7) −30 μA
TON On Time after Shutdown 83 nsec
TOFF Off Time to Shutdown 160 nsec
ROUT Output Resistance Closed Loop RF = 10k, f = 1kHz, AV = −1 29
m
RF = 10k, f = 1MHz, AV = −1 253
www.national.com 4
LMH6639
±5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for at TJ = 25°C, VSUPPLY = ±5V, VO = VCM = GND, and RL = 2k to V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
BW −3dB BW AV = +1 150 228 MHz
AV = −1 65
BW0.1dB 0.1dB Gain Flatness RF = 2.26k, RL = 1k 18 MHz
FPBW Full Power Bandwidth AV = +1, VOUT = 2VPP, −1dB 29 MHz
GBW Gain Bandwidth Product AV = +1 90 MHz
enInput-Referred Voltage Noise RF = 33kf = 10kHz 19 nV/
f = 1MHz 16
inInput-Referred Current Noise RF = 1Mf = 10kHz 1.13 pA/
f = 1MHz 0.34
THD Total Harmonic Distortion f = 5MHz, VO = 2VPP, AV = +2,
RL = 1k −71.2 dBc
DG Differential Gain NTSC, AV = +2
RL = 150Ω 0.11 %
DP Differential Phase NTSC, AV = +2
RL = 150Ω 0.053 deg
TSSettling Time VO = 2VPP, ±0.1% 33 ns
SR Slew Rate AV = −1 (Note 8) 140 200 V/µs
VOS Input Offset Voltage 1.03 5
7
mV
TC VOS Input Offset Voltage Drift (Note 11) 8 µV/°C
IBInput Bias Current (Note 7) −1.40 −2.6
−3.25
µA
IOS Input Offset Current 20 800
1000
nA
RIN Common Mode Input
Resistance
AV +1, f = 1kHz, RS = 1M 7.5 M
CIN Common Mode Input
Capacitance
AV = +1, RS = 100k 1.28 pF
CMVR Common Mode Input Voltage
Range
CMRR 50dB −5.3 −5.2
−5.1 V
3.8
3.6
4.0
CMRR Common Mode Rejection Ratio (Note 12) 72 95 dB
AVOL Large Signal Voltage Gain VO = 9VPP, RL = 2k88
84
100
dB
VO = 8VPP, RL = 150Ω 74
70
77
VOOutput Swing
High
RL = 2k, VID = 200mV 4.85 4.96
V
RL = 150Ω, VID = 200mV 4.55 4.80
RL = 50Ω, VID = 200mV 3.60 4.55
Output Swing
Low
RL = 2k, VID = −200mV −4.97 −4.90
V
RL = 150Ω, VID = −200mV −4.85 −4.55
RL = 50Ω, VID = −200mV −4.65 −4.30
5 www.national.com
LMH6639
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
ISC Output Short Circuit Current Sourcing to Ground, (Note 10) 100
80
168
mA
Sinking to Ground, (Note 10) 110
85
190
IOUT Output Current VO = 0.5V from either supply 112 mA
PSRR Power Supply Rejection Ratio (Note 12) 72 96 dB
ISSupply Current (Enabled) No Load 4.18 6.5
8.5 mA
Supply Current (Disabled) 0.758 1.0
1.3
TH_SD Threshold Voltage for Shutdown
Mode
V+ − 1.67 V
I_SD PIN Shutdown Pin Input Current SD Pin Connected to −5V (Note 7) −84 μA
TON On Time after Shutdown 83 nsec
TOFF Off Time to Shutdown 160 nsec
ROUT Output Resistance Closed Loop RF = 10k, f = 1kHz, AV = −1 32
m
RF = 10k, f = 1MHz, AV = −1 226
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5k in series with 100pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
Note 5: Typical values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Positive current corresponds to current flowing into the device.
Note 8: Slew rate is the average of the rising and falling slew rates.
Note 9: Machine Model, 0 in series with 200pF.
Note 10: Short circuit test is a momentary test.
Note 11: Offset voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Note 12: f 1kHz (see typical performance Characteristics)
Connection Diagrams
SOT23-6
20030201
Top View
SOIC-8
20030202
Top View
www.national.com 6
LMH6639
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
6-Pin SOT-23 LMH6639MF A81A 1k Units Tape and Reel MF06A
LMH6639MFX 3k Units Tape and Reel
8-Pin SOIC LMH6639MA LMH6639MA Rails M08A
LMH6639MAX 2.5k Units Tape and Reel
7 www.national.com
LMH6639
Typical Performance Characteristics At TJ = 25°C, V+ = +2.5, V = −2.5V, RF = 330Ω for AV = +2, RF =
1k for AV = −1. Unless otherwise specified.
Output Sinking Saturation Voltage vs. IOUT
for Various Temperature
20030239
Output Sourcing Saturation Voltage vs. IOUT
for Various Temperature
20030237
Positive Output Saturation Voltage vs. VSUPPLY
for Various Temperature
20030233
Negative Output Saturation Voltage vs. VSUPPLY
for Various Temperature
20030234
VOUT from V+ vs. ISOURCE
20030238
VOUT from V vs. ISINK
20030236
www.national.com 8
LMH6639
IOS vs. VS for Various Temperature
20030232
VOS vs. VS for 3 Representative Units
20030245
VOS vs. VS for 3 Representative Units
20030244
VOS vs. VS for 3 Representative Units
20030243
VOS vs. VS for 3 Representative Units
20030242
ISUPPLY vs. VCM for Various Temperature
20030240
9 www.national.com
LMH6639
ISUPPLY vs. VS for Various Temperature
20030241
IB vs. VS for Various Temperature
20030235
Bandwidth for Various VS
20030206
Bandwidth for Various VS
20030205
Gain vs. Frequency Normalized
20030207
Gain vs. Frequency Normalized
20030208
www.national.com 10
LMH6639
0.1dB Gain Flatness
20030209
Gain and phase vs.
Frequency for Various Temperature
20030204
Frequency Response vs. Temperature
20030210
Harmonic Distortion
20030269
Differential Gain/Phase
20030270
On-Off Switching DC Voltage
20030211
11 www.national.com
LMH6639
On-Off Switching 10MHz
20030212
Slew Rate (Positive)
20030214
Slew Rate (Negative)
20030213
On-Off Switching of Sinewave
20030215
Power Sweep
20030216
CMRR vs. Frequency
20030218
www.national.com 12
LMH6639
PSRR vs. Frequency
20030217
Current Noise
20030220
Voltage Noise
20030219
Closed Loop Output Resistance vs. Frequency
20030221
Off Isolation
20030222
Small Signal Pulse Response (AV = +1, RL = 2k )
20030250
13 www.national.com
LMH6639
Small Signal Pulse Response (AV = −1)
20030249
Large Signal Pulse Response (RL = 2k)
20030226
Large Signal Pulse Response
20030227
Large Signal Pulse Response
20030228
www.national.com 14
LMH6639
Application Notes
INPUT AND OUTPUT TOPOLOGY
All input / output pins are protected against excessive volt-
ages by ESD diodes connected to V+ and V- rails (see Figure
2). These diodes start conducting when the input / output pin
voltage approaches 1Vbe beyond V+ or V- to protect against
over voltage. These diodes are normally reverse biased. Fur-
ther protection of the inputs is provided by the two resistors
(R in Figure 2), in conjunction with the string of anti-parallel
diodes connected between both bases of the input stage. The
combination of these resistors and diodes reduces excessive
differential input voltages approaching 2Vbe. The most com-
mon situation when this occurs is when the device is put in
shutdown and the LMH6639’s inputs no longer follow each
other. In such a case, the diodes may conduct. As a conse-
quence, input current increases, and a portion of signal may
appear at the Hi-Z output. Another possible situation for the
conduction of these diodes is when the LMH6639 is used as
a comparator (or with little or no feedback). In either case, it
is important to make sure that the subsequent current flow
through the device input pins does not violate the Absolute
Maximum Ratings of the device. To limit the current through
the protection circuit extra series resistors can be placed. To-
gether with the build in series resistors of several hundred
ohms this extra resistors can limit the input current to a safe
number depending on the used application. Be aware of the
effect that extra series resistors may impact the switching
speed of the device. A special situation occurs when the part
is configured for a gain of +1, which means the output is di-
rectly connected to the inverting input, see Figure 3. When
the part is now placed in shutdown mode the output comes in
a high impedance state and is unable to keep the inverting
input at the same level as the non-inverting input. In many
applications the output is connected to the ground via a low
impedance resistor. When this situation occurs and there is a
DC voltage offset of more than 2 volt between the non-invert-
ing input and the output, current flows from the non-inverting
input through the series resistors R via the bypass diodes to
the output. Now the input current becomes much bigger than
expected and in many cases the source at the input cannot
deliver this current and will drop down. Be sure in this situation
that no DC current path is available from the non-inverting
input to the output pin, or from the output pin to the load re-
sistor. This DC path is drawn by a curved line and can be
broken by placing one of the capacitors CIN or COUT or both,
depending on the used application.
20030274
FIGURE 2. Input Topology
20030275
FIGURE 3. DC path while in shutdown
MULTIPLEXING 5 AND 10MHz
The LMH6639 may be used to implement a circuit which mul-
tiplexes two signals of different frequencies. Three LMH6639
high speed op-amps are used in the circuit of Figure 4 to ac-
complish the multiplexing function. Two LMH6639 are used
to provide gain for the input signals, and the third device is
used to provide output gain for the selected signal.
15 www.national.com
LMH6639
20030247
Note: Pin numbers pertain to SOIC-8 package
FIGURE 4. Multiplexer
Multiplexing signals “FREQ 1” and “FREQ 2” exhibit closed
loop non-inverting gain of +2 each based upon identical
330 resistors in the gain setting positions of IC1 and IC2.
The two multiplexing signals are combined at the input of IC3,
which is the third LMH6639. This amplifier may be used as a
unity gain buffer or may be used to set a particular gain for
the circuit.
20030248
FIGURE 5. Switching between 5 and 10MHz
1k resistors are used to set an inverting gain of −1 for IC3 in
the circuit of Figure 4. Figure 5 illustrates the waveforms pro-
duced. The upper trace shows the switching waveform used
to switch between the 5MHz and 10MHz multiplex signals.
The lower trace shows the output waveform consisting of
5MHz and 10MHz signals corresponding to the high or low
state of the switching signal.
In the circuit of Figure 4, the outputs of IC1 and IC2 are tied
together such that their output impedances are placed in par-
allel at the input of IC3. The output impedance of the disabled
amplifier is high compared both to the output impedance of
the active amplifier and the 330 gain setting resistors. The
closed loop output resistance for the LMH6639 is around
0.2. Thus the active state amplifier output impedance dom-
inates the input node to IC3, while the disabled amplifier is
assured of a high level of suppression of unwanted signals
which might be present at the output.
SHUTDOWN OPERATION
With SD pin left floating, the device enters normal operation.
However, since the SD pin has high input impedance, it is best
tied to V+ for normal operation. This will avoid inadvertent
shutdown due to capacitive pick-up from nearby nodes.
LMH6639 will typically go into shutdown when SD pin is more
than 1.7V below V+, regardless of operating supplies.
The SD pin can be driven by push-pull or open collector (open
drain) output logic. Because the LMH6639's shutdown is ref-
erenced to V+, interfacing to the shutdown logic is rather
simple, for both single and dual supply operation, with either
form of logic used. Typical configurations are shown in Figure
6 and Figure 7 below for push-pull output:
www.national.com 16
LMH6639
20030271
FIGURE 6. Shutdown Interface (Single Supply)
20030272
FIGURE 7. Shutdown Interface (Dual Supplies)
Common voltages for logic gates are +5V or +3V. To ensure
proper power on/off with these supplies, the logic should be
able to swing to 3.4V and 1.4V minimum, respectively.
LMH6639’s shutdown pin can also be easily controlled in ap-
plications where the analog and digital sections are operated
at different supplies. Figure 8 shows a configuration where a
logic output, SD, can turn the LMH6639 on and off, indepen-
dent of what supplies are used for the analog and the digital
sections:
20030273
FIGURE 8. Shutdown Interface (Single Supply, Open
Collector Logic)
The LMH6639 has an internal pull-up resistor on SD such that
if left un-connected, the device will be in normal operation.
Therefore, no pull-up resistor is needed on this pin. Another
common application is where the transistor in Figure 8 above,
would be internal to an open collector (open drain) logic gate;
the basic connections will remain the same as shown.
PCB LAYOUT CONSIDERATION AND COMPONENTS
SELECTION
Care should be taken while placing components on a PCB.
All standard rules should be followed especially the ones for
high frequency and/ or high gain designs. Input and output
pins should be separated to reduce cross-talk, especially un-
der high gain conditions. A groundplane will be helpful to
avoid oscillations. In addition, a ground plane can be used to
create micro-strip transmission lines for matching purposes.
Power supply, as well as shutdown pin de-coupling will re-
duce cross-talk and chances of oscillations.
Another important parameter in working with high speed am-
plifiers is the component values selection. Choosing high
value resistances reduces the cut-off frequency because of
the influence of parasitic capacitances. On the other hand
choosing the resistor values too low could "load down" the
nodes and will contribute to higher overall power dissipation.
Keeping resistor values at several hundreds of ohms up to
several k will offer good performance.
National Semiconductor suggests the following evaluation
boards as a guide for high frequency layout and as an aid in
device testing and characterization:
Device Package Evaluation Board
PN
LMH6639MA 8-Pin SOIC CLC730027
LMH6639MF SOT23-6 CLC730116
These free evaluation boards are shipped when a device
sample request is placed with National Semiconductor. For
normal operation, tie the SD pin to V+.
17 www.national.com
LMH6639
Physical Dimensions inches (millimeters) unless otherwise noted
6-Pin SOT23
NS Package Number MF06A
8-Pin SOIC
NS Package Number M08A
www.national.com 18
LMH6639
Notes
19 www.national.com
LMH6639
Notes
LMH6639 190MHz Rail-to-Rail Output Amplifier with Disable
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
www.national.com
Products Design Support
Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench
Audio www.national.com/audio App Notes www.national.com/appnotes
Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns
Data Converters www.national.com/adc Samples www.national.com/samples
Interface www.national.com/interface Eval Boards www.national.com/evalboards
LVDS www.national.com/lvds Packaging www.national.com/packaging
Power Management www.national.com/power Green Compliance www.national.com/quality/green
Switching Regulators www.national.com/switchers Distributors www.national.com/contacts
LDOs www.national.com/ldo Quality and Reliability www.national.com/quality
LED Lighting www.national.com/led Feedback/Support www.national.com/feedback
Voltage References www.national.com/vref Design Made Easy www.national.com/easy
PowerWise® Solutions www.national.com/powerwise Applications & Markets www.national.com/solutions
Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero
Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic
PLL/VCO www.national.com/wireless PowerWise® Design
University
www.national.com/training
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2010 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: support@nsc.com
Tel: 1-800-272-9959
National Semiconductor Europe
Technical Support Center
Email: europe.support@nsc.com
National Semiconductor Asia
Pacific Technical Support Center
Email: ap.support@nsc.com
National Semiconductor Japan
Technical Support Center
Email: jpn.feedback@nsc.com
www.national.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated