W83194R-630 166MHZ CLOCK FOR SIS CHIPSET 1. GENERAL DESCRIPTION The W83194R-630 is a Clock Synthesizer for SiS 540/630 chipset. W83194R-630 provides all clocks required for high-speed RISC or CISC microprocessor such as AMD,Cyrix,Intel Pentium, Pentium II and also provides 16 different frequencies of CPU clocks frequency setting. All clocks are externally selectable with smooth transitions. The W83194R-630 makes SDRAM in synchronous or asynchronous frequency with CPU clocks. 2 The W83194R-630 provides I C serial bus interface to program the registers to enable or disable each clock outputs and W83194R-630 provides the 0.5%, 0.75% center type and 0~0.5% down type spread spectrum to reduce EMI. The W83194R-630 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply. High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30 pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as maintaining 50 5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide better than 0.5V /ns slew rate. 2. PRODUCT FEATURES * Supports Pentium, Pentium II, AMD and Cyrix CPUs with I C. * 3 CPU clocks * 14 SDRAM clocks for 3 DIMMs * 7 PCI synchronous clocks. * Optional single or mixed supply: (All Vdd = 3.3V) or (Other s Vdd = 3.3V, VddLCPU=2.5V) * Skew form CPU to PCI clock 1 to 4 ns, center 2.6 ns * SDRAM frequency synchronous or asynchronous to CPU clocks * Smooth frequency switch with selections from 66 to 166mhz 2 2 * I C 2-Wire serial interface and I C read back * 0.5%, 0.75%center type, 0~0.5% down type spread spectrum to reduce EMI * Programmable registers to enable/stop each output and select modes (mode as Tri-state or Normal ) * 48 MHz for USB * 24 MHz for super I/O 2 * Packaged in 48-pin SSOP -1- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 3. BLOCK DIAGRAM 48MHz PLL2 O2 24_48MHz Xin Xout XTAL OSC 2 REF(0:1) PLL1 STOP Spread Spectrum *FS(0:3) 4 *MODE SEL3.3_2.5# LATCH 14 5 PCI clock Divder POR Control Logic CPU_STOP# PCI_STOP# PD# CPUCLK(0:2) 3 CPU_STOP# STOP 7 SDRAM(0:13) PCICLK(0:6) PCI_STOP# Config. Reg. *SDATA *SCLK 4. PIN CONFIGURATION Vdd REF0X2/ *FS3 Vss Xin Xout VddP PCICLK_F/ *FS1 PCICLK1/ *FS2 PCICLK2/*MODE Vss PCICLK3 PCICLK4 PCICLK5 PCICLK6 VddP Vss SDRAM 0/CPU_STOP# SDRAM 1/PCI_STOP# VddSD SDRAM 2/PD# SDRAM 3 Vss *SDATA *SDCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 -2- REF1 VddLCPU CPUCLK_F CPUCLK0 Vss CPUCLK1 VddSD SDRAM12 SDRAM_F Vss SDRAM11 SDRAM 10 VddSD SDRAM 9 SDRAM 8 Vss SDRAM 7 SDRAM 6 VddSD SDRAM 5 SDRAM 4 VddSD 48MHz/*FS0 24_48MHz/SEL2.5_3.3# Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 5. PIN DESCRIPTION IN - Input OUT - Output I/O - Bi-directional Pin # - Active Low * - Internal 250k pull-up 5.1 Crystal I/O SYMBOL PIN I/O Xin 4 IN Xout 5 OUT FUNCTION Crystal input with internal loading capacitors and feedback resistors. Crystal output at 14.318MHz nominally. 5.2 CPU, SDRAM, PCI Clock Outputs SYMBOL PIN I/O 46 OUT 45,43 OUT SDRAM_F 40 OUT SDRAM0/CPU_STOP# 17 I/O SDRAM1/PCI_STOP# 18 I/O SDRAM2/PD# 20 I/O SDRAM[3:12] 21,28,29,31,32 ,34,35,37,38, 41 7 OUT CPUCLK_F CPUCLK [ 0:1 ] PCICLK_F/ *FS1 I/O -3- FUNCTION Low skew (< 250ps) clock outputs for host frequencies such as CPU, Chipset and Cache. VddLCPU is the supply voltage for these outputs. This pin will not be stopped by CPU_STOP# Low skew (< 250ps) clock outputs for host frequencies such as CPU, Chipset and Cache. VddLCPU is the supply voltage for these outputs. SDRAM clock outputs which have syn. or asyn. frequencies as CPU clocks. This pin will not be stopped by CPU_STOP# SDRAM clock outputs which have syn. or asyn. frequencies as CPU clocks. CPU_STOP# input pin when MODE=0. SDRAM clock outputs which have syn. or asyn. frequencies as CPU clocks. PCI_STOP# input pin when MODE=0. SDRAM clock outputs which have syn. or asyn. frequencies as CPU clocks. PD# input pin when MODE=0. SDRAM clock outputs which have syn. or asyn. frequencies as CPU clocks. Latched input for FS1 at initial power up for H/W selecting the output frequency of CPU, SDRAM and PCI clocks. Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY PCICLK 1/ *FS2 8 I/O PCICLK 2/ *MODE 9 I/O 11,12,13,14 OUT PCICLK [ 3:6 ] PCI free-running clock during normal operation. Latched input for FS2 at initial power up for H/W selecting the output frequency of CPU, SDRAM and PCI clocks. PCI clock during normal operation. Latched input for MODE at initial power up for input selection of CPU_STOP#, PCI_STOP# and PD#. When MODE=1, the above pins are SDRAM clock outputs. When MODE=0, the pins are inputs ACPI pins. PCI clock during normal operation. Low skew (< 250ps) PCI clock outputs. 5.3 I2C Control Interface SYMBOL PIN I/O FUNCTION 2 *SDATA 23 I/O Serial data of I C 2-wire control interface *SDCLK 24 IN Serial clock of I C 2-wire control interface 2 5.4 Fixed Frequency Outputs SYMBOL PIN I/O FUNCTION REF0X2 / *FS3 2 I/O REF1 48 I/O 24_48MHz/ SEL2.5_3.3# 25 I/O 3.3V, 14.318MHz reference clock output . Internal 250k pull-up. Latched input for FS3 at initial power up for H/W selecting the output frequency of CPU, SDRAM and PCI clocks. 3.3V or 2.5V by VddLCPU, 14.318MHz reference clock output. SEL2.5_3.3# controls the Vdd of CPU. If logic 0 at power on, VddLCPU=3.3V. If logic 1, VddLCPU=2.5 24MHz or 48MHz selected by I2C for Super I/O. 48MHz / *FS0 26 I/O -4- Internal 250k pull-up. Latched input for FS0 at initial power up for H/W selecting the output frequency of CPU, SDRAM and PCI clocks. 48MHz output for USB during normal operation. Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 5.5 Power Pins SYMBOL PIN Vdd VddLCPU FUNCTION 1 47 Power supply for REF0 crystal and core logic. Power supply for REF1, CPUCLK_F and CPUCLK[0:1], either 2.5V or 3.3V. 6,15 Power supply for PCI outputs. 19,27,30,36,42 Power supply for SDRAM and 48/24NHz outputs. 3,10,16,22,33,39,44 Circuit Ground. VddP VddSD Vss 6. FREQUENCY SELECTION BY HARDWARE FS3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 FS2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 FS1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 FS0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 CPU (MHz) 66.8 100.2 122 133.6 66.8 100.2 100.2 133.6 66.8 97 97 95.2 95.2 112 96.2 166 SDRAM (MHz) 100.2 100.2 122 100.2 116.9 133.6 150.3 133.6 66.8 97 129.3 95.2 126.6 112 96.2 166 PCI (MHz) 33.4 33.4 30.5 33.4 33.4 33.4 33.4 33.4 33.4 32.3 32.3 31.7 31.7 37.3 32.1 33.3 REF (MHz) IOAPIC 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 7. SEL3.3_2.5# BUFFER SELECTION SEL3.3_2.5# ( Pin 25 ) Input Level 1 0 CPU Operate at VDDLCPU = 2.5V VDDLCPU = 3.3V -5- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 8. FUNCTION DESCRIPTION 2 8.1 2-WIRE I C CONTROL INTERFACE The clock generator is a slave I2C component which can be read back the data stored in the latches for verification. All proceeding bytes must be sent to change one of the control bytes. The 2-wire control interface allows each clock output individually enabled or disabled. On power up, the W83194R-630 initializes with default register settings, and then it ptional to use the 2-wire control interface. The SDATA signal only changes when the SDCLK signal is low, and is stable when SDCLK is high during normal data transfer. There are only two exceptions. One is a high-to-low transition on SDATA while SDCLK is high used to indicate the beginning of a data transfer cycle. The other is a low-to-high transition on SDATA while SDCLK is high used to indicate the end of a data transfer cycle. Data is always sent as complete 8-bit bytes followed by an acknowledge generated. Byte writing starts with a start condition followed by 7-bit slave address [1101 0010], command code checking [0000 0000], and byte count checking. After successful reception of each byte, an acknowledge (low) on the SDATA wire will be generated by the clock chip. Controller can start to 2 write to internal I C registers after the string of data. The sequence order is as follows: 2 Bytes sequence order for I C controller : Clock Address A(6:0) & R/W Ack 8 bits dummy Command code Ack 8 bits dummy Byte count Ack Byte0,1,2... until Stop Set R/W to 1 when read back the data sequence is as follows, [1101 0011] : Clock Address A(6:0) & R/W Ack Byte 0 Ack Byte 1 Ack Byte2, 3, 4... until Stop 8.2 SERIAL CONTROL REGISTERS The Pin column lists the affected pin number and the @PowerUp column gives the state at true power up. Registers are set to the values shown only on true power up. "Command Code" byte and "Byte Count" byte must be sent following the acknowledge of the Address Byte. Although the data (bits) in these two bytes are considered "don't care", they must be sent and will be acknowledge. After that, the below described sequence (Register 0, Register 1, Register 2, ....) will be valid and acknowledged. -6- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY Frequency table by I2C SSEL3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 SSEL2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 SSEL1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 SSEL0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 CPU (MHz) 66.8 100.2 122 133.6 66.8 100.2 100.2 133.6 66.8 97 97 95.2 95.2 112 96.2 166 SDRAM (MHz) 100.2 100.2 122 100.2 116.9 133.6 150.3 133.6 66.8 97 129.3 95.2 126.6 112 96.2 166 PCI (MHz) REF (MHz) IOAPIC 33.4 33.4 30.5 33.4 33.4 33.4 33.4 33.4 33.4 32.3 32.3 31.7 31.7 37.3 32.1 33.3 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 14.318 8.2.1 Register 0: CPU Frequency Select Register (default = 0) Bit @PowerUp Pin 7 0 - 6 5 4 3 0 0 0 0 - 2 1 0 0 - 0 0 - Description 0 = 0.5% Center type Spread Spectrum Modulation 1 = 0.75% Center type Spread Spectrum Modulation 2 SSEL2 (for frequency table selection by software via I C) 2 SSEL1 (for frequency table selection by software via I C) 2 SSEL0 (for frequency table selection by software via I C) 0 = Selection by hardware 2 1 = Selection by software I C - Bit 2, 6:4 2 SSEL3 (for frequency table selection by software via I C) 0 = Normal 1 = Spread Spectrum enabled 0 = Running 1 = Tristate all outputs -7- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 8.2.2 Register 1 : CPU Clock Register (1 = Active, 0 = Inactive) Bit @PowerUp Pin 7 6 5 x 1 1 - Description Latched FS2# Reserved 0 = 0.5% down type spread, overrides Byte0-bit7. 1= Center type spread. 4 3 2 1 0 1 1 1 1 1 43 45 46 - Reserved CPUCLK2 (Active / Inactive) CPUCLK1 (Active / Inactive) CPUCLK0 (Active / Inactive) Reserved 8.2.3 Register 2: PCI Clock Register (1 = Active, 0 = Inactive) Bit @PowerUp Pin 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 14 13 12 11 9 8 7 Description Reserved PCICLK6 (Active / Inactive) PCICLK5 (Active / Inactive) PCICLK4 (Active / Inactive) PCICLK3 (Active / Inactive) PCICLK2 (Active / Inactive) PCICLK1 (Active / Inactive) PCICLK0 (Active / Inactive) 8.2.4 Register 3: Control Register (1 = Active, 0 = Inactive) Bit @PowerUp Pin 7 1 - Description 1 Pin25 24_48MHz = 24MHz 0 Pin25 24_48MHz = 48MHz 6 x - Latched FS0# 5 1 26 48MHz (Active / Inactive) 4 1 25 24-48MHz (Active / Inactive) 3 1 - Reserved 2 1 - Reserved 1 1 48 REF1 (Active / Inactive) 0 1 2 REF0X2 (Active / Inactive) -8- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 8.2.5 Register 4: SDRAM Register (1 = Active, 0 = Inactive) Bit @PowerUp Pin 7 6 5 4 3 2 1 0 1 1 1 1 x 1 x 1 41 40 38 37 X 35 X 34 Description SDRAM13 (Active / Inactive) SDRAM12 (Active / Inactive) SDRAM11 (Active / Inactive) SDRAM10 (Active / Inactive) Latched FS1# SDRAM9 (Active / Inactive) Latched FS3# SDRAM8 (Active / Inactive) 8.2.6 Register 5: SDRAM Register(1 = Active, 0 = Inactive) Bit @PowerUp Pin 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 32 31 29 28 21 20 18 17 Description SDRAM7 (Active / Inactive) SDRAM6 (Active / Inactive) SDRAM5 (Active / Inactive) SDRAM4 (Active / Inactive) SDRAM3 (Active / Inactive) SDRAM2 (Active / Inactive) SDRAM1 (Active / Inactive) SDRAM0 (Active / Inactive) 8.2.7 Register 6: Winbond Chip ID Register (Read Only) Bit @PowerUp Pin 7 6 5 4 3 2 1 0 0 1 0 1 1 0 0 1 - Description Winbond Chip ID Winbond Chip ID Winbond Chip ID Winbond Chip ID Winbond Chip ID Winbond Chip ID Winbond Chip ID Winbond Chip ID -9- Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 9.0 SPECIFICATIONS 9.1 Absolute Maximum Ratings Stresses greater than those listed in this table may cause permanent damage to the device. Precautions should be taken to avoid application of any voltage higher than the maximum rated voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd). Symbol Parameter Rating Vdd , VIN Voltage on any pin with respect to GND - 0.5 V to + 7.0 V TSTG Storage Temperature - 65C to + 150C TB Ambient Temperature - 55C to + 125C TA Operating Temperature 0C to + 70C 9.2 Electronical Characteristics---Input/Output Vddq1=Vddq2 = Vddq3 = Vddq4 =3.3V, VddL1 =VddL2= 2.5V , TA = 0C to +70C Parameter Symbol Min Input Low Voltage VIL Input High Voltage Typ Max Units Test Conditions Vss-0.3 0.8 Vdc VIH 2.0 Vdd+0.3 Vdc Input Low Current IIL -5 A No pull-up resistors Input Low Current IIL -200 A Pull-up resistros Input High Current IIH -5 Input Capacitance 5 A CIN 5 pF Logic inputs COUT 6 pF Output capacitance 45 pF Xin and Xout 100 mA CPU = 66.6 MHz CINX 27 Operating Supply Current Idd3 Power Down Supply Current Idd2 600 A Settling Time Ts 3 mS PCI = 33.3 Mhz with load - 10 - From first crossing to 1% target freq. Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY Skew TCPU-PCI 1 4 nS VT=1.5V 9.3 Electronical Characteristics of CPU Clock Vdd=2.5V +/- 5%; CL=10-20pF Parameter Symbol Min Ouput Impedance Ouput Impedance Output Low Voltage RDSP RDSN 13.5 13.5 Output High Voltage VOH Output Low Current IOL Output High Current IOH Rise/Fall Time Min Between 0.4 V and 2.0 V Rise/Fall Time Max Between 0.4 V and 2.0 V Duty Cycle Skew Jitter Typ Max Units 30 30 0.4 Ohm Ohm V IOL=1mA 2.0 V IOH=-1mA 19 MA VOL TRF(min) -27 0.4 45 MA ns 10pF Load 2.0 ns 20pF Load 55 175 250 % ps ps VT=1.25V VT=1.25V VT=1.25V TRF(max) Dt TSK Tsc-c Test Conditions 9.4 Electronical Characteristics of SDRAM Clock Vdd=3.3V +/- 5%; CL=20-30pF Parameter Ouput Impedance Ouput Impedance Output Low Voltage Symbol RDSP RDSN Output High Voltage VOH Output Low Current IOL Output High Current IOH Rise/Fall Time Min Between 0.4 V and 2.0 V Rise/Fall Time Max Between 0.4 V and 2.0 V Duty Cycle Skew Jitter Min 11 11 Units Ohm Ohm V IOL=1mA 2.4 V IOH=-1mA 35 MA VOL TRF(min) Max 30 30 0.45 -45 0.5 TRF(max) Dt TSK Tsc-c Typ 45 - 11 - Test Conditions MA ns 10pF Load 2.0 ns 20pF Load 55 250 250 % ps ps VT=1.5V VT=1.5V VT=1.5V Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 9.5 Electronical Characteristics of PCI Clock Vdd=3.3V +/- 5%; CL=10-30pF Parameter Ouput Impedance Ouput Impedance Output Low Voltage Symbol RDSP RDSN Output High Voltage VOH Output Low Current IOL Output High Current IOH Rise/Fall Time Min Between 0.4 V and 2.0 V Rise/Fall Time Max Between 0.4 V and 2.0 V Duty Cycle Skew Jitter Min 15 15 Typ Units Ohm Ohm V IOL=1mA 2.4 V IOH=-1mA 30 MA VOL TRF(min) -33 45 Test Conditions MA 0.5 TRF(max) Dt TSK Tsc-c Max 55 55 0.5 ns 10pF Load 2.0 ns 20pF Load 55 500 500 % ps ps VT=1.5V VT=1.5V VT=1.5V 9.6 Electronical Characteristics of 24/48MHz, REF Clock Vdd=3.3V +/- 5%; CL=20pF Parameter Symbol Min Ouput Impedance Ouput Impedance Output Low Voltage RDSP RDSN 20 20 Output High Voltage VOH Output Low Current IOL Output High Current IOH RiseTime TR Fall Time TF Dt TSK Tsc-c Duty Cycle Skew Jitter Typ Max Units 55 55 0.4 Ohm Ohm V IOL=1mA 2.4 V IOH=-1mA 10 MA VOL 45 - 12 - Test Conditions -23 MA 1.8 4 ns 10pF Load 1.7 4 ns 20pF Load 55 500 1000 % ps ps VT=1.5V VT=1.5V VT=1.5V Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 10. ORDERING INFORMATION Part Number Package Type Production Flow W83194R-630 48 PIN SSOP Commercial, 0C to +70C 11. HOW TO READ THE TOP MARKING W83194R-630 28051234 942GED 1st line: Winbond logo and the type number: W83194R-630 2nd line: Tracking code 2 8051234 2: wafers manufactured in Winbond FAB 2 8051234: wafer production series lot number 3rd line: Tracking code 942 G E D 942: packages made in '99, week 42 G: assembly house ID; O means OSE, G means GR E: Internal use code D: IC revision All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. - 13 - Publication Release Date: Nov. 1999 Revision 0.65 W83194R-630 PRELIMINARY 12. PACKAGE DRAWING AND DIMENSIONS Headquarters Winbond Electronics (H.K.) Ltd. No. 4, Creation Rd. III Science-Based Industrial Park Hsinchu, Taiwan TEL: 886-35-770066 FAX: 886-35-789467 www: http://www.winbond.com.tw/ Rm. 803, World Trade Square, Tower II 123 Hoi Bun Rd., Kwun Tong Kowloon, Hong Kong TEL: 852-27516023-7 FAX: 852-27552064 Winbond Electronics (North America) Corp. 2730 Orchard Parkway San Jose, CA 95134 U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd. Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 TLX: 16485 WINTPE Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sale. - 14 - Publication Release Date: Nov. 1999 Revision 0.65