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EHP- B05 Series
1Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Introduction
B05 series is a high power, multi-chip device with very low
thermal resistance as a result of the PCB substrate. The series
is a surface-mount high-power device featuring high brightness
that is suitable for all kinds of lighting applications such as
general illumination, spot, signal, industrial and commercial lighting.
Features Applications
Robust package with high lumens
ESD protection up to 8KV
Soldering method: SMT
Moisture Sensitivity Level: 3
RoHS compliant
ANSI binning
Reliability testing conforms to IESNA
LM80 Lumen maintenance test method
General Lighting
Spot Lighting
Signal and Symbol Luminaries for
orientation marker lights (e.g. steps,
exit ways, etc.)
Industrial Lighting
Commercial Lighting
EHP-B05 series
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Table of Contents
Table of Contents… … ...… … … … … … … … … … … .… … … … … … … … … … … … … … .… … … … … ...2
Product Nomenclature & Materials… … … … … … … … … … … … … … … … … … … … .… ...................3
Maximum Rating & JEDEC Moisture Sensitivity… … .… … … .… … … … … … … … … … … … … ..… … 4
PN of the B05 series… … … … … … … … … … … .… … … … .… … .… … … .… … … … … … .… … … … … 5
PN of the B05 series：Color LEDs… … … … … … … .… … ...… … … … … ...… … … … … … … … … … .6
Product Binning & Forward Voltage Bins… … … … … … … … … … … … … … … … … … … … ....7
White Bin Structure & Cool-White Bin Structure… … … … .… … … … … … … … … … … … .… … ......8
Cool-White Bin Coordinates… … … … … … … … … … … … ..… … … … … … … … … … … … … … … … ..9
Neutral-White Bin Structure & Neutral-White Bin Coordinates… … … … … … … … ..… … … … ..… ..10
Warm-White Bin Structure & Warm-White Bin Coordinates… … … … … … … … … ...… … … … … 12
Dimensions … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … … ......13
Wavelength Characteristics Curves… … … … … … … … … … … … … … … … … … … … … … … … … ...15
Typical Light Output Characteristics vs Solder Pad Temperature… … … … … … … … … … ............16
Typical Forward Voltage vs Solder Pad Temperature… … … … … … … … … … ............16
Typical Electrical Characteristics… … … … … … … … … … … … … … … … ..… … … … … … … … … … ..17
Typical Relative Luminous Flux vs Forward Current… … … … … … … … … … … … … … … … … ...… 17
Typical CCT Shift Characteristics vs Forward Current… … … … … … … … … … … … … … … … … … 18
Current Derating Curves………………………………………………………………………………..19
Typical Radiation Pattern… … … … … … … … … … … … … … … … … … … … … … … … .… … … … … .20
Label explanation & Reel dimensions … … … … … … … … … … … … … … … … … … … … ....… … ...21
Carrier Tape Dimensions: Loaded quantity & Moisture Resistant Packaging… … … … … … … … . 22
Reliability Data … … … … … … … ..… … … … … … … … … … … … … … … … … … … … … … .......23
Precautions For Use… … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … ..… ..24
Revision History… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … ..… … 27
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EHP- B05 Series
3Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Product Nomenclature
The product name is designated as below:
EHP-B05MLG/GT04H-P05/50K/R11/TR
Designation:
EHP-B05=Family name
MLG = Lambertian
GT =Color Code [1]
0 _ H = Quantity of the chip [2]
P05 =Power Consumption[3]
50K = Color bin or CCT bin
R11 = min. luminous flux (lm) or radiation power (mW) performance
TR = Tape and Reel
Notes
1. Code of wavelength of the chip:
Symbol Color Dominant wavelength range/Peak wavelength/CCT
RB Royal Blue 445~460nm
UB Ultra Blue 460~470nm
SUG Green 520~540nm
UY Amber 580~595nm
USO Ultra Red-Orange 610~620nm
SUR Super ultra-Red 620~635nm
GRB RGB full color SUR+SUG+UB
GT White, CRI Min 70 4745-7050K
LM Warm White, CRI Min 70 2580-4745K
KT White, CRI Min 80 4745-7050K
KM Warm White, CRI Min 80 2580-4745K
2. Quantity of the chip:
Symbol Description
2 2 chips
4 4 chips
6 6 chips
8 8 chips
3. Consume the power:
Symbol Description
P05 5W
P07 7W
P10 10W
Materials
Items Description
Substrate PCB with Metal Heat Sink
Housing Heat resistant polymer
Encapsulating Resin Silicone resin
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Maximum Ratings
Parameter Symbol Ratings Unit
DC Forward Current(1) IF800 mA
DC Pulse Current(2) IPF 1400 mA
ESD Sensitivity ESD 8000 V
Junction Temperature(3) Tj125 °C
Operating Temperature(4)(5) Top. -40 ~ +85 °C
Storage Temperature Tstge. -40 ~ +100 °C
Junction To Heat-Sink Thermal Resistance Rth 7 °C /W
Max. Solder Pad Temperature TSol 260 °C
Max. Allowable Reflow Cycles n/a 2 cycles
Notes:
1. Maximum forward current is 1400mA (Thermal Pad = 25°C).
2. Duty cycle = 1/10@1KHz (Thermal Pad = 25°C)
3. Maximum junction temperature is 125°C for White LEDs.
4. Maximum Operating Temperature (Thermal Pad) is 85°C for White LEDs.
5.Avoid operating LEDs at maximum operating temperature exceeding 1 hour.
JEDEC Moisture Sensitivity
Floor Life Soak Requirements
Standard
Level Time
(hours) Conditions Time
(hours) Conditions
3 168H ≦30°C / 60% RH 192 (+5/-0) 30°C / 60% RH
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PN of the B05 series
The table below is a list of part numbers for the EHP-B05 5W series White LED. All parts listed match ANSI
binning standards. Bin offerings of 2700K to 6500K are listed and currently available. CRI is also listed with min
70 to 80. Typical view angle is 140°. These clearly listed binning options allow for proper design and
implementation into lighting applications.
For Example: If you order product using EHP-B05MLG/GT04H-P05/65K/R11/TR, you will get White,
EHP-B05 series LEDs at 700mA are listed below.
Color Order Code of EHP-B05
Minimum
Luminous
Flux (lm) [1]
CCT(K)
Forward
Voltage
(V)
CRI
Min
[2]
EHP-B05MLG/GT04H-P05/65K/R11/TR 400
EHP-B05MLG/GT14H-P05/65K/R12/TR 450
65K-1～65K-4 6.0 - 7.0 70
EHP-B05MLG/GT04H-P05/57K/R11/TR 400
EHP-B05MLG/GT14H-P05/57K/R12/TR 450
57K-1～57K-4 6.0 - 7.0 70
EHP-B05MLG/GT04H-P05/50K/R11/TR 400
EHP-B05MLG/GT14H-P05/50K/R12/TR 450
50K-1～50K-4 6.0 - 7.0 70
EHP-B05MLG/KM04H-P05/45K/N52/TR 350
EHP-B05MLG/KM14H-P05/45K/R11/TR 400
45K-1～45K-4 6.0 - 7.0 80
EHP-B05MLG/KM04H-P05/40K/N51/TR 325
EHP-B05MLG/KM14H-P05/40K/N52/TR 375
40K-1～40K-4 6.0 - 7.0 80
EHP-B05MLG/KM04H-P05/35K/N51/TR 300
EHP-B05MLG/KM14H-P05/35K/N52/TR 350
35K-1～35K-4 6.0 - 7.0 80
EHP-B05MLG/KM04H-P05/30K/N42/TR 275
EHP-B05MLG/KM14H-P05/30K/N51/TR 325
30K-1～30K-4 6.0 - 7.0 80
EHP-B05MLG/KM04H-P05/27K/N42/TR 275
EHP-B05MLG/KM14H-P05/27K/N51/TR 325
27K-1～27K-4 6.0 – 7.0 80
Note:
1. Luminous Flux measurement tolerance: ±10%.
2. Color Rendering Index measurement tolerance: ±2.
Color
Variant
Radiation
Pattern CRI
Min CCT Forward
Voltage
(V)
Minimum
Luminous
Flux (lm)
Cool
White Lambertian 70 65K-1 ~ 65K-2
65K-3 ~ 65K-4
6.0~6.5(O4)
6.5~7.0(O5) 400
Cool
White
6500
Cool
White
5700
Cool
White
5000
Neutral
White
4000
Neutral
White
4500
Warm
White
2700
Warm
White
3000
Warm
White
3500
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PN of the B05 series: Color LEDs
The table below is a list of part numbers for the Everlight B05 series Color LED. Standard Everlight color bins are listed
according to wavelength and represent the standard primary colors of the spectrum. Typical view angle is 140°.These
clearly listed binning options allow for proper design and implementation into lighting applications.
EHP-B05 color series LEDs at 700mA are listed below.
Color Order Code of B05
Minimum
Luminous Flux
(lm) [1]
Dominant
Wavelength
(nm)
Forward
Voltage(V)
EHP-B05MLG/SUR04H-P05/N32/TR 230 620~630 3.85~5.5
Note:
1. Luminous Flux measurement tolerance: ±10%.
2. Wavelength measurement tolerance : ±1nm
Red
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Product Binning
Luminous Intensity spec
Group Bin Minimum
Photometric Flux (lm) Maximum
Photometric Flux (lm)
31 200 225
32 225 250
41 250 275
42 275 300
51 300 350
N
52 350 400
11 400 450
12 450 500
21 500 550
22 550 600
31 600 650
32 650 700
33 700 750
41 750 800
42 800 850
43 850 925
44 925 1000
51 1000 1075
R
52 1075 1150
53 1150 1225
54 1225 1300
Note: Currently available brightness bins for White LEDs & Color LEDs are highlighted and bolded.
Forward Voltage Bins
Bin Minimum Forward
Voltage (V) Maximum Forward
Voltage (V)
V4 3.85 4.15
V5 4.15 4.5
O1 4.5 5.0
O2 5.0 5.5
O3 5.5 6.0
O4 6.0 6.5
O5 6.5 7.0
O6 7.0 7.5
O7 7.5 8.0
Notes
1. Wide forward voltage 0.3V bin structure V4 ～V5
2. Wide forward voltage 0.5V bin structure O1 ～O7
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White Bin Structure
Notes:
1. The CCT range of Warm-White varies from 2580K to 3710K
2. The CCT range of Neutral-White varies from 3710K to 4745K.
3. The CCT range of Cool-White varies from4745K to 7050K
4. Color coordinates measurement allowance : ±0.01
5. Color bins are defined at IF=350mA operation.
Cool-White Bin Structure
Chromaticity specification defined by ANSI
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Cool-White Bin Coordinates
5000K Bin CIE X CIE Y Bin CIE X CIE Y
0.346 0.369 0.338 0.362
0.345 0.356 0.337 0.349
0.353 0.362 0.345 0.356
50K-1
0.355 0.376
50K-2
0.346 0.369
Reference Range: 4745~5000K Reference Range: 5000~5310K
Bin CIE X CIE Y Bin CIE X CIE Y
0.345 0.356 0.337 0.349
0.344 0.343 0.337 0.337
0.352 0.349 0.344 0.343
50K-4
0.353 0.362
50K-3
0.345 0.356
Reference Range: 4745~5000K Reference Range: 5000~5310K
5700K Bin CIE X CIE Y Bin CIE X CIE Y
0.329 0.354 0.321 0.346
0.329 0.342 0.322 0.335
0.337 0.349 0.329 0.342
57K-1
0.338 0.362
57K-2
0.329 0.354
Reference Range: 5310~5700K Reference Range: 5700~6020K
Bin CIE X CIE Y Bin CIE X CIE Y
0.329 0.342 0.322 0.335
0.329 0.331 0.322 0.324
0.337 0.337 0.329 0.331
57K-4
0.337 0.349
57K-3
0.329 0.342
Reference Range: 5310~5700K Reference Range: 5700~6020K
6500K Bin CIE X CIE Y Bin CIE X CIE Y
0.312 0.339 0.303 0.330
0.313 0.329 0.305 0.321
0.321 0.337 0.313 0.329
65K-1
0.321 0.348
65K-2
0.312 0.339
Reference Range: 6020~6500K Reference Range: 6500~7050K
Bin CIE X CIE Y Bin CIE X CIE Y
0.313 0.329 0.305 0.321
0.315 0.319 0.307 0.311
0.322 0.326 0.315 0.319
65K-4
0.321 0.337
65K-3
0.313 0.329
Reference Range: 6020~6500K Reference Range: 6500~7050K
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Neutral-White Bin Structure
Neutral-White Bin Coordinates
4000K Bin CIE X CIE Y Bin CIE X CIE Y
0.387 0.396 0.374 0.387
0.383 0.380 0.370 0.373
0.395 0.388 0.383 0.380
40K-1
0.401 0.404
40K-2
0.387 0.396
Reference Range: 3710~4000K Reference Range: 4000~4260K
Bin CIE X CIE Y Bin CIE X CIE Y
0.383 0.380 0.370 0.373
0.378 0.365 0.367 0.358
0.390 0.372 0.378 0.365
40K-4
0.395 0.388
40K-3
0.383 0.380
Reference Range: 3710~4000K Reference Range: 4000~4260K
4500K Bin CIE X CIE Y Bin CIE X CIE Y
0.364 0.381 0.355 0.374
0.362 0.366 0.353 0.360
0.370 0.373 0.362 0.366
45K-1
0.374 0.387
45K-2
0.364 0.381
Reference Range: 4260~4500K Reference Range: 4500~4745K
Bin CIE X CIE Y Bin CIE X CIE Y
0.362 0.366 0.353 0.360
0.359 0.352 0.351 0.347
0.367 0.358 0.359 0.352
45K-4
0.370 0.373
45K-3
0.362 0.366
Reference Range: 4260~4500K Reference Range: 4500~4745K
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Warm-White Bin Structure
Warm-White Bin Coordinates
2700K Bin CIE X CIE Y Bin CIE X CIE Y
0.469 0.429 0.456 0.426
0.459 0.410 0.447 0.408
0.470 0.413 0.459 0.410
27K-1
0.481 0.432
27K-2
0.469 0.429
Reference Range: 2580~2700K Reference Range: 2700~2870K
Bin CIE X CIE Y Bin CIE X CIE Y
0.459 0.410 0.447 0.408
0.448 0.392 0.437 0.389
0.459 0.394 0.448 0.392
27K-4
0.470 0.413
27K-3
0.459 0.410
Reference Range: 2580~2700K Reference Range: 2700~2870K
3000K Bin CIE X CIE Y Bin CIE X CIE Y
0.443 0.421 0.430 0.417
0.435 0.403 0.422 0.399
0.447 0.408 0.435 0.403
30K-1
0.456 0.426
30K-2
0.443 0.421
Reference Range: 2870~3000K Reference Range: 3000~3220K
Bin CIE X CIE Y Bin CIE X CIE Y
0.435 0.403 0.422 0.399
0.426 0.385 0.415 0.381
0.437 0.389 0.426 0.385
30K-4
0.447 0.408
30K-3
0.435 0.403
Reference Range: 2870~3000K Reference Range: 3000~3220K
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3500K Bin CIE X CIE Y Bin CIE X CIE Y
0.415 0.409 0.400 0.402
0.408 0.392 0.394 0.385
0.422 0.399 0.408 0.392
35K-1
0.430 0.417
35K-2
0.415 0.409
Reference Range: 3220~3500K Reference Range: 3500~3710K
Bin CIE X CIE Y Bin CIE X CIE Y
0.408 0.392 0.394 0.385
0.402 0.375 0.389 0.369
0.415 0.381 0.402 0.375
35K-4
0.422 0.399
35K-3
0.408 0.392
Reference Range: 3220~3500K Reference Range: 3500~3710K
Note: Currently available typical CCT ranges are 3000K, 5700K, and 6500K CCT
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Dimensions
Notes.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ± 0.25mm.
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Forward Voltage vs Forward Current,
T
soldering
=
25
º
C
Wavelength Characteristics
For Cool-White, @ Soldering Pad Temperature = 25℃
For Neutral-White, @ Soldering Pad Temperature = 25℃
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For Warm-White, @ Soldering Pad Temperature = 25℃
For Red, @ Soldering Pad Temperature = 25℃
400 450 500 550 600 650
700
0.0
0.2
0.4
0.6
0.8
1.0
Relative Apectral Power Distribution
Wavelengh(nm)
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Typical Light Output Characteristic
vs. Soldering Pad Temperature
Cool-White, Neutral-White, Warm-White for 700mA Drive Current
0 10 20 30 40 50 60 70 80 90 100
0.80
0.85
0.90
0.95
1.00
1.05
1.10
Relative Luminous Flux
Soldering Pad Temperature
(
C
)
Typical Forward Voltage vs. Soldering Pad Temperature
@ 700mA Drive Current
20 30 40 50 60 70 80 90 100
5.9
6.0
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Forward Voltage(V)
Soldering Pad Temperature
(
C
)
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Typical Electrical Characteristics
For Cool-White, Neutral-White, Warm-White
@ Soldering Pad Temperature = 25℃
0 200 400 600 800 1000 1200 1400
5.0
5.5
6.0
6.5
7.0
7.5
Forward Voltage(V)
Forward Current(mA)
Typical Relative Luminous Flux vs. Forward Current
For Cool-White, Neutral-White, Warm-White
@ Soldering Pad Temperature = 25℃
0 200 400 600 800 1000 1200 1400
0.0
0.4
0.8
1.2
1.6
2.0
Relative Luminous Intensity
Forward Current(mA)
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For Red LEDs
@ Soldering Pad Temperature = 25℃
0 200 400 600 800 1000
0.0
0.4
0.8
1.2
1.6
Relative Luminous Intensity
Forward Current(mA)
Typical CCT Shift Characteristics vs. Forward Current
For Cool-White @ Soldering Pad Temperature = 25℃
0 200 400 600 800 1000 1200 1400
5500
5750
6000
6250
6500
Corelated Color Temperature(K)
Forward Current(mA)
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For Warm-White @ Soldering Pad Temperature = 25℃
0 200 400 600 800 1000 1200 1400
2900
3000
3100
3200
Corelated Color Temperature(K)
Forward Current(mA)
Current Derating Curves
Current Derating Curve for 700mA Drive Current
Cool-White, Neutral-White, Warm-White
0 20 40 60 80 100 120
0
200
400
600
800
1000
Forward Current (mA)
Soldering Pad Temperature (C)
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Typical Radiation Pattern
-80 -60 -40 -20 0 20 40 60 80
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Relative Luminous Intensity
Degree (2)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
.
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Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ±0.1mm.
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EHP- B05 Series
22 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Carrier Tape Dimensions: Loaded quantity 300 PCS per reel
Note.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ±0.1mm.
Moisture Resistant Packaging
Aluminum moistue-proof bag
Label
Desiccant
Label
Label Aluminum moisture-proof bag Desiccant Label
LifecyclePhase:
Revision : 4
Expired Period: Forever
Release Date:2013-04-01 16:49:04.0
DATASHEET
EHP- B05 Series
23 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Reliability Data
(EHP-B05 Series-5W)
Stress Test Stress Condition Stress Duration
Reflow Tsol=260℃, 10sec, 6min 3 times
Thermal Shock
H：＋100℃20min.
'∫ 20sec.
'L：－10℃ 20min.
500 Cycles
Power Temperature Cycle
H：＋100℃ 15min.
'∫ 5min.
'L：－ 40℃ 15min.
IF= 300 mA , 2min on/off
500 Cycles
High Temperature/Humidity
Storage Ta=85℃ , RH=85% 1000hours
High Temperature/Humidity
Operation Ta=85℃ , RH=85% , IF=400mA 1000hours
Low Temperature Operation
Life
Ta= -40℃, IF=700mA 1000hours
High Temperature Operation
Life #1
Ta=25℃, IF=700mA 1000hours
High Temperature Operation
Life #2 Ta=55℃, IF=700mA 1000hours
High Temperature Operation
Life #3 Ta=85℃, IF=400mA 1000hours
High Temperature Storage Ta= 110℃1000hours
Low Temperature Storage Ta= -40℃1000hours
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<30%
*VF: FORWARD VOLTAGE DIFFERENCE<20%
LifecyclePhase:
Revision : 4
Expired Period: Forever
Release Date:2013-04-01 16:49:04.0
DATASHEET
EHP- B05 Series
24 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Precautions For Use
1. Over-current-Protection
Thought the EHP-B05 series has an ESD protection mechanism, customer must not use the
device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts
may cause significant current changes and may cause failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use
ii. Before the package is opened: The LEDs should be stored at temperatures 30℃or less
and humidity 50% or less.
iii. LEDs may be stored for 6 months. When the storage time has reached more than 6 months,
LEDs should be stored in a sealed container filled with Nitrogen gas.
iv. After the package is opened: The LEDs should be stored at temperatures under 30℃or less
and humidity 30% or less.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at
60±5℃ for 24 hours.
3. Thermal Management
i. For maintaining high flux output and achieving maximum reliability, EHP-B05 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) with proper thermal
connection to dissipate approximately 5W of thermal energy under 700mA operation.
ii. Special thermal designs are also recommended to take into account outer heat sink design,
such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive
adhesive, etc.
iii. Sufficient thermal management must be implemented, or the die junction temperature may
exceed the limit and LED lifetime will decrease critically.
Recommend
:
Max TSlug = 70℃
LifecyclePhase:
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Release Date:2013-04-01 16:49:04.0
DATASHEET
EHP- B05 Series
25 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
4. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening of LED
lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
T
weezers
When handling the product, do not apply
direct pressure to the optical surface.
Do not touch the resin with tweezers to
avoid scratching or other damage the
optical surface.
Pick and Place Nozzle for Surface
Mount Assembly.
During Module Assembly
Avoid directly contacting with nozzle. Do not stack the modules together, it
could damage the resin or scratch the
lens.
LifecyclePhase:
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Release Date:2013-04-01 16:49:04.0
DATASHEET
EHP- B05 Series
26 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
5. Reflow Soldering Process
a. EHP-B05 series are suitable for SMT process
b. Curing of glue in oven according to standard operation flow processes.
0
50
100
150
200
250
300
Temperature
Time
ts
Preheat time
tp
TL
Profile Feature Parameter
Ramp-UP Rate 2-3 ℃/S
Preheat Temperature 150-200℃
Preheat Time(ts) 60~120s
Liquid Temperature(TL)217℃
Time above TL60-90s
Peak Temperature(TP)260±5℃(Varied with the solder material)
Peak Time(tp) Max 20s
Ramp-Down Rate 3-5 ℃/S
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
LifecyclePhase:
Revision : 4
Expired Period: Forever
Release Date:2013-04-01 16:49:04.0
DATASHEET
EHP- B05 Series
27 Copyright © 2011, Everlight All Rights Reserved. Release Date: 03.19.2013. Issue No: DHE-0001726 www.everlight.com
Revision History
Current version：2013/03/19
Previous version：2011/12/30
Device No.： DHE-0001726
Rev. Ver. ：4
Page Subjects(major change in previous version) Date of change
9Revised Cool-White Bin 5700K Coordinates 2011/12/30
5
16
17
P05.Revised Typ.CRI 75 White LEDs & Typ.CRI 85 White
LEDs(Added Higher Level Products)
P16.Revised Typ. Light Output Characteristic vs. Solder
Pad Temperature
P17.Add Typical Relative Forward Voltage vs. Solder Pad
Temperature
2012/03/15
6EHP-B05 color series LEDs : Red LED 2013/03/19
