HLMP-Yxxx
T-1 (3 mm) AlInGaP LED Lamps
Data Sheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications. The optical
design is balanced to yield superior light output and wide
viewing angles. Several intensity choices are available in
each color for increased design exibility.
Applications
x Status indicator
x Backlighting front panels
x Light pipe sources
x Lighted switches
Features
x High luminous intensity output
x Low power consumption
x Choice of bright colors
– Deep Red
– Red
– Red-Orange
– Orange
– Amber
– Green
x High eciency
x Versatile mounting on PCB or panel
x I.C. Compatible/low current requirement
x Popular T-1 diameter package
x Reliable and rugged
x RoHS compliant
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
5.2
0.205
TYP
0.45 x 0.4
(0.018 x 0.016)
CATHODE
3.8
0.15
3.5
0.138
3.1 ± 0.2
0.122 ± 0.008
4.1 ± 0.2
0.161 ± 0.008
24.0
0.945
(MIN)
1.0
0.04
(MAX) 1.0
0.04
(MIN)
2.54
0.1
Package Dimension
2
Selection Guide
Color Part Number Package Description
Luminous Intensity, Iv (mcd) @ 20 mA Viewing Angle,
2T½ (°)Min. Typ. Max.
Deep Red HLMP-Y651-G00xx Untinted, Non-diused 140 300 45
Red HLMP-Y601-J00xx Untinted, Non-diused 240 680
Red-Orange HLMP-Y951-K00xx Untinted, Non-diused 310 680
Yellow Orange HLMP-Y901-J00xx Untinted, Non-diused 240 680
HLMP-Y902-J00xx Tinted, Non-diused 240 680
Amber HLMP-Y701-G00xx Untinted, Non-diused 140 400
Green HLMP-Y802-F00xx Tinted, Non-diused 110 240
Part Numbering System
Maximum IV Bin Options
0: Open (no max. limit)
Others: Please refer to the IV Bin Table
Minimum IV Bin Options
Please refer to the IV Bin Table
Color Bin Options
0: Full Color Bin Distribution
Mechanical Options
00: Bulk
HLMP - Y x x x - x x x xx
3
Absolute Maximum Ratings at TA = 25°C
Parameter HLMP-Yxxx Units
DC Forward Current 20 mA
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
60 mA
Reverse Voltage (IR = 100PA) 5V
Junction Temperature 110 °C
Power Dissipation 48 mW
Storage Temperature Range -40 to +100 °C
Operating Temperature Range -40 to +100 °C
Solder Temperature 260°C 5 sec
Electrical /Optical Characteristic at TA = 25°C
Description Symbol Part Number Min. Typ. Max. Units Test Conditions
Peak Wavelength OPEAK HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
652
633
622
611
595
575
nm Measurement at peak
Dominant Wavelength OdHLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
635.0
620.0
610.0
599.5
582.0
564.5
638.0
627.0
615.0
605.0
592.0
572.0
646.0
635.0
620.0
610.5
597.0
576.5
nm Note 1
Spectrum Half Width 'O HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
15
15
17
17
15
11
nm
Forward Voltage VFHLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
2.0
2.0
2.0
2.0
2.0
2.1
2.2
2.2
2.2
2.4
2.2
2.4
VI
F = 20mA
(Figure 1)
Notes:
1. The dominant wavelength, Od, is derived from the Chromaticity Diagram and represents the color of the lamp.
4
Figure 1. Forward Current vs. Forward Voltage. Figure 2. Relative Luminous Intensity vs. Forward Current.
Figure 3. Ambient Temperature vs. Maximum DC Forward Current. Figure 4. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y651, HLMP-Y601, HLMP-Y951 and HLMP-Y701.
Figure 5. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y90x and HLMP-Y80x.
Figure 6. Wavelength vs. Relative Luminous Intensity.
0
2
4
6
8
10
12
14
16
18
20
00.511.5 2 2.5
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
GREEN
DEEP RED, RED
RED-ORANGE, AMBER
YELLOW-ORANGE
0
0.2
0.4
0.6
0.8
1
05101520
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
0
0.25
0.5
0.75
1
-90 -60 -300 306090
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.25
0.5
0.75
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
5
10
15
20
25
0102030405060708090100 110
AMBIENT TEMPERATURE - °C
FORWARD CURRENT - mA
5
Intensity Bin Limits
Bin
Intensity Range (mcd)
Min. Max.
F 110.0 140.0
G 140.0 180.0
H 180.0 240.0
J 240.0 310.0
K 310.0 400.0
L 400.0 520.0
M 520.0 680.0
N 680.0 880.0
P 880.0 1150.0
Q 1150 1500
Tolerance for each bin limit is 15%.
Color Bin Limits Table
Color Category #
Lambda (nm)
Min. Max.
Red-Orange 1 610.5 613.5
2 613.5 616.5
3 616.5 619.5
Yellow-
Orange
2 599.5 602.0
3 602.0 604.5
4 604.5 607.5
5 607.5 610.5
Amber 1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
7 594.5 597.0
Green 2 573.5 576.5
3 570.5 573.5
4 567.5 570.5
5 564.5 567.5
Tolerance for each bin limit is ±1.0 nm.
Precautions:
Assembly method:
This product is not meant for auto-insertion.
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
x If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
x During lead forming, the leads should be bent at a
point at least 3mm from the base of the lens. Do not
use the base of the lead frame as a fulcrum during
forming. Lead forming must be done before soldering
at normal temperature.
x It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
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Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1664EN - March 25, 2011
Avago’s products and software are not specically designed, manufactured or authorized for sale as
parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
Figure 7. Recommended wave soldering prole.
Precautions: (cont.)
Soldering Conditions:
x Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
x The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
x Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
x Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
x If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
x Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
x Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
x Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
x Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
030 40 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin fl-ux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
TEMPERATURE (°C)
1020 70
60
50 80
mechanical force.