CPC1972 AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On State Voltage Drop Operating Voltage Ratings 800 250 3 550 Features * * * * * * * * * Load Current up to 250mArms 800VP Blocking Voltage 5mA Sensitivity Zero-Crossing Detection DC Control, AC Output Optically Isolated Low EMI and RFI Generation High Noise Immunity Flammability Rating UL 94 V-0 Applications * * * * * * * * * * Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Units VP mArms Vrms (at IL = 250 mArms) Vrms Description The CPC1972 is an AC Solid State Switch using optical coupling with dual power silicon controlled rectifier (SCR) outputs to produce an alternative to optocoupler and Triac circuits. The CPC1972 switches are robust enough to provide a blocking voltage of up to 800VP . In addition, tightly controlled zero cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750Vrms of isolation and noise immunity between the control and load circuits. As a result the CPC1972 is well suited for industrial environments where electromagnetic interference could disrupt the operation of electromechanical relays. Approvals * UL Recognized Component: File E69938 * CSA Certified Component: Certificate 1172007 Ordering Information Part Number CPC1972G CPC1972GS CPC1972GSTR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration 1 6 2 5 + LED - LED N/C DS-CPC1972-R06 www.ixysic.com 3 ZC 4 AC Load N/C AC Load 1 INTEGRATED CIRCUITS DIVISION CPC1972 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 800 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameters Output Characteristics Operating Voltage Range Load Current Continuous Peak Off State Leakage Current On-State Voltage Drop Critical Rate of Rise Holding Current Switching Speeds Turn-on Turn-off Zero-Cross Turn-On Voltage 1 Operating Frequency Load Power Factor for Guaranteed Turn-On 2 Input Characteristics Input Control Current to Activate 3 Input Voltage Drop Input Drop-out Voltage Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 2 Conditions Symbol Min Typ Max Units - VL 5 - 550 Vrms t = 10ms VL=800VP IL = 250mArms IF=5mA IL ITSM ILEAK VON dV/dt IH 5 500 - 300 250 2 1 3 - mArms AP A Vrms V/s A 1st half-cycle Subsequent half-cycle f=60Hz ton toff PF 20 0.25 5 1 - 0.5 0.5 20 500 - IF=5mA VR=5V IF VF IR 0.9 0.8 - 1.2 - 5 1.5 10 mA V V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA cycles V V Hz - Zero Cross 1st half-cycle @ <100Hz Snubber circuits may be required at low power factors. For high noise environments an LED drive current of at least 10mA is recommended. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1972 PERFORMANCE DATA* Typical LED Forward Voltage Drop (IF=5mA, TA=25C) 35 35 35 20 15 10 25 20 15 10 5 5 0 0 1.21 Device Count (N) 25 1.22 1.23 1.24 1.25 LED Forward Voltage Drop (V) Device Count (N) 25 20 15 10 5 0 1.89 25 Typical Blocking Voltage Distribution (TA=25C) 30 30 Device Count (N) Device Count (N) 30 Typical On-State Output Forward Voltage Distribution (TA=25C) 1.91 1.93 1.95 1.97 1.99 Output Voltage Drop (Vrms) 857 2.01 858 859 860 861 862 863 Blocking Voltage (VP) Typical IF for Switch Operation (TA=25C) 20 15 10 5 0 1.30 1.3 I F = 30mA I F = 20mA I F = 10mA I F = 5mA 1.2 1.1 -40 -20 0 20 40 60 Temperature (C) 80 100 120 1.60 Typical Output Voltage Drop vs. Temperature 2.4 3.1 2.1 2.8 1.8 2.5 1.5 Von (Vrms) I F = 50mA LED Current (mA) LED Forward Voltage Drop (V) 1.6 1.4 1.40 1.45 1.50 1.55 LED Current (mA) Typical IF for Switch Operation vs. Temperature Typical LED Forward Voltage Drop vs. Temperature 1.5 1.35 1.2 0.9 IL=250mArms 2.2 1.9 1.6 0.6 1.3 0.3 1.0 0.0 -40 -10 20 50 Temperature (C) 80 -40 -10 20 50 Temperature (C) 80 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1972 PERFORMANCE DATA* Typical Maximum Load Current vs. Temperature Blocking Voltage (VP) Load Current (mArms) 400 350 300 250 I F =5mA 150 100 975 0.7 950 0.6 Leakage (A) 450 200 Typical Leakage vs. Temperature (VL=800VP) Typical Blocking Voltage vs. Temperature 925 900 875 850 825 -40 -20 0 20 40 60 80 Temperature (C) 100 120 0.4 0.3 0.2 0.1 50 0 0.5 0.0 -40 -10 20 50 Temperature (C) -40 80 -10 20 50 Temperature (C) 80 Maximum Surge Current (Non-Repetitive) (TJ=50C max) Peak Surge Current (A P) 3.0 2.5 2.0 1.5 1.0 0.5 0 10 50 100 Pulse Duration (ms) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1972 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1972G / CPC1972GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1972G CPC1972GS 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1972 MECHANICAL DIMENSIONS CPC1972G 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) CPC1972GS 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 6 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1972 CPC1972GSTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1972-R06 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/20/2018