K7D321874C-HC33000 - SAMSUNG - Datasheet.Directory

Rev. 1.0 August 2006

1Mx36 & 2Mx18 SRAM

- 1 -

K7D321874C

K7D323674C

36Mb DDR SRAM Specification

153BGA with Pb & Pb-Free

(RoHS compliant)

* Samsung Electronics reserves the right to change products or specification without notice.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-

lar applications where Product failure could result in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

Rev. 1.0 August 2006

1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

Document Title

36M DDR SYNCHRONOUS SRAM

Revision History

Rev No.

Rev. 0.0

Rev. 0.1

Rev. 0.2

Rev. 1.0

Remark

Advance

Preliminary

Final

History

Initial document.

Change AC Characteritics, Pin Capacitance, DC Characteristics

Change Samsung JEDEC Code in ID REGISTER DEFINITION

Correct Typo

Draft Data

Nov. 2005

Apr. 2006

Jun. 2006

Aug. 2006

Rev. 1.0 August 2006

1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

ORDERING INFORMATION

Organization Maximum Frequency Part Number

1Mx36

400MHz K7D323674C-H(G)1C40

375MHz K7D323674C-H(G)1C37

333MHz K7D323674C-H(G)1C33

2Mx18

400MHz K7D321874C-H(G)1C40

375MHz K7D321874C-H(G)1C37

333MHz K7D321874C-H(G)1C33

GENERAL DESCRIPTION

The K7D323674C and K7D321874C are 37,748,736 bit Synchronous Pipeline Burst Mode SRAM devices. They are organized as

1,048,576 words by 36 bits for K7D323674C and 2,097,152 words by 18 bits for K7D321874C, fabricated using Samsung's

advanced CMOS technology.

Single differential HSTL level clock, K and K are used to initiate the read/write operation and all internal operations are self-timed. At

the rising edge of K clock, all addresses and burst control inputs are registered internally. Data inputs are registered one cycle after

write addresses are asserted(Late Write), at the rising edge of K clock for single data rate (SDR) write operations and at rising and

falling edge of K clock for a double data rate (DDR) write operations.

Data outputs are updated from output registers off the rising edges of K clock for SDR read operations and off the rising and falling

edges of K clock for DDR read operations. Free running echo clocks are supported which are representative of data output access

time for all SDR and DDR operations.

The chip is operated with 1.8~2.5V power supply and is compatible with HSTL input and output. The package is 9x17(153) Ball Grid

Array balls on a 1.27mm pitch.

FEATURES

• 1Mx36 or 2Mx18 Organizations.

• 1.8~2.5V VDD/1.5V ~1.8VDDQ.

• HSTL Input and Outputs.

• Single Differential HSTL Clock.

• Synchronous Pipeline Mode of Operation with Self-Timed

Late Write.

• Free Running Active High and Active Low Echo Clock Output

Pin.

• Registered Addresses, Burst Control and Data Inputs.

• Registered Outputs.

• Double and Single Data Rate Burst Read and Write.

• Burst Count Controllable With Max Burst Length of 4

• Interleaved and Linear Burst mode support

• Bypass Operation Support

• Programmable Impedance Output Drivers.

• JTAG Boundary Scan (subset of IEEE std. 1149.1)

• 153(9x17) Ball Grid Array Package(14mmx22mm)

• No Output enable support.

Note 1. H(G) [Package type] : G-Pb Free, H-Pb

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1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

FUNCTIONAL BLOCK DIAGRAM

K,K

Memory Array

1Mx36

Data Out Data In

Advance

Control

SD/DD

Clock

Synchronous

Buffer

Internal

Clock

Generator

R/W

LD Data Output Strobe

Data Output Enable

State Machine

Strobe_out

S/A Array

2 : 1 MUX

Data In

Write Buffer

W/D

Array

Echo Clock

Output

36(or 18)x2

36(or18)x2

XDIN

CQ,CQ

36(or 18)

Select

R/W control

Output

Buffer

Write

Burst

Counter

Address

Comparator

2:1

MUX Dec.

20(or 21) 18(or 19)

18(or 19)20(or 21)

(Burst Write

SA[0:20]( or SA[0:21])

(2Mx18)

(2 stage)

(Burst Address)

Address)

PIN DESCRIPTION

Pin Name Pin Description Pin Name Pin Description

K, K Differential Clocks TCK JTAG Test Clock

SA Synchronous Address Input TMS JTAG Test Mode Select

SA0, SA1 Synchronous Burst Address Input (SA0 = LSB) TDI JTAG Test Data Input

DQ Synchronous Data I/O TDO JTAG Test Data Output

CQ, CQ Differential Output Echo Clocks VREF HSTL Input Reference Voltage

B1 Load External Address VDD Power Supply

B2 Burst R/W Enable VDDQ Output Power Supply

B3 Single/Double Data Selection VSS GND

LBO Linear Burst Order NC No Connection

ZQ Output Driver Impedance Control Input

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K7D321874C

K7D323674C

PACKAGE PIN CONFIGURATIONS(TOP VIEW)

K7D323674C(1Mx36)

123456789

AVSS VDDQ SA SA ZQ SA SA VDDQ VSS

BDQ DQ SA VSS B1VSS SA DQ DQ

CVSS VDDQ SA SA SA SA SA VDDQ VSS

DDQ DQ SA Vss(5) VDD Vss(6) SA DQ DQ

EVSS VDDQ VSS VDD VREF VDD VSS VDDQ VSS

FDQ CQ DQ VDD VDD VDD DQ CQ DQ

GVSS VDDQ VSS VSS KVSS VSS VDDQ VSS

HDQ DQ DQ VDD K VDD DQ DQ DQ

JVSS VDDQ VSS VDD VDD VDD VSS VDDQ VSS

KDQ DQ DQ VSS B2VSS DQ DQ DQ

LVSS VDDQ VSS LBO B3MODE(7) VSS VDDQ VSS

MDQ CQ DQ VDD VDD VDD DQ CQ DQ

NVSS VDDQ VSS VDD VREF VDD VSS VDDQ VSS

PDQ DQ NC*VSS VDD(2) VSS SA DQ DQ

RVSS VDDQ VDD(4) SA SA1SA VDD(3) VDDQ VSS

TDQ DQ SA VSS SA0VSS SA DQ DQ

UVSS VDDQ TMS TDI TCK TDO NC VDDQ VSS

K7D321874C(2Mx18)

(1) Variable address see "Variable address assignment table"

(2) Variable address see "Variable address assignment table"

(3) Variable address see "Variable address assignment table"

(4) Variable address see "Variable address assignment table"

(5) Variable address see "Variable address assignment table"

(6) Variable address see "Variable address assignment table"

(7) Internally NC

123456789

AVSS VDDQ SA SA ZQ SA SA VDDQ VSS

BNC DQ SA VSS B1VSS SA NC DQ

CVSS VDDQ SA SA SA SA SA VDDQ VSS

DDQ NC SA Vss(5) VDD Vss(6) SA DQ NC

EVSS VDDQ VSS VDD VREF VDD VSS VDDQ VSS

FNC CQ NC VDD VDD VDD DQ NC DQ

GVSS VDDQ VSS VSS KVSS VSS VDDQ VSS

HDQ NC DQ VDD K VDD NC DQ NC

JVSS VDDQ VSS VDD VDD VDD VSS VDDQ VSS

KNC DQ NC VSS B2VSS DQ NC DQ

LVSS VDDQ VSS LBO B3MODE(7) VSS VDDQ VSS

MDQ NC DQ VDD VDD VDD NC CQ NC

NVSS VDDQ VSS VDD VREF VDD VSS VDDQ VSS

PNC DQ SA VSS VDD(2) VSS SA NC DQ

RVSS VDDQ VDD(4) SA SA1SA VDD(3) VDDQ VSS

TDQ NC SA VSS SA0VSS SA DQ NC

UVSS VDDQ TMS TDI TCK TDO NC VDDQ VSS

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K7D321874C

K7D323674C

VARIABLE ADDRESS ASSIGNMENT TABLE

NOTE : - SRAM density definition beyond 144Mb will include the parity bits.

Density Ball 5C

(1)

Ball 5P

(2)

Ball 7R

(3)

Ball 3R

(4)

Ball 4D

(5)

Ball 6D

(6)

32 Mb SA VDD VDD VDD Vss Vss

64 Mb SA SA VDD VDD Vss Vss

144 Mb NC SA SA SA Vss Vss

288 Mb SA SA SA SA Vss Vss

576 Mb NC SA SA SA SA SA

1152 Mb SA SA SA SA SA SA

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1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

Read Operation(Single and Double)

During SDR read operations, addresses and controls are registered at the first rising edge of K clock and then the internal array is

read between first and second rising edges of K clock. Data outputs are updated from output registers off the second rising edge of

K clock. During DDR read operations, addresses and controls are registered at the first rising edge of K clock, and then the internal

array is read twice between first and second rising edges of K clock. Data outputs are updated from output registers sequentially by

burst order off the second rising and falling edge of K clock.

Interleave and linear burst operation is controlled by LBO pin and the burst count is controllable with the maximum burst length of 4.

To avoid data contention,at least two NOP operations are required between the last read and the first write operation.

Write Operation(Late Write)

During SDR write operations, addresses and controls are registered at the first rising edge of K clock and data inputs are registered

at the following rising edge of K clock. During DDR write operations, addresses and controls are registered at the first rising edge of

K clock and data inputs are registered twice at the following rising and falling edge of K clock. Write addresses and data inputs are

stored in the data in registers until the next write operation, and only at the next write operation are data inputs fully written into

SRAM array.

Echo clock operation

Free running type of Echo clocks are generated from K clock regardless of read, write and NOP operations. They will stop operation

only when K clock is in the stop mode.

Echo clocks are designed to represent data output access time and this allows the echo clocks to be used as reference to capture

data outputs.

Bypass Read Operation

Bypass read operation occurs when the last write operation is followed by a read operation where write and read addresses are

identical. For this case, data outputs are from the data in registers instead of SRAM array.

Programmable Impedance Output Driver

This HSTL Late Write SRAM has been designed with programmable impedance output buffers. The SRAMs output buffer imped-

ance can be adjusted to match the system data bus impedance, by connecting a external resistor (RQ) between the ZQ pin of the

SRAM and VSS. The value of RQ must be five times the value of the intended line impedance driven by the SRAM. For example, a

250Ω resistor will give an output buffer impedance of 50Ω. The allowable range of RQ is from 175Ω to 350Ω. Internal circuits evaluate

and periodically adjust the output buffer impedance, as the impedance is affected by drifts in supply voltage and temperature. One

evaluation occurs every 32 clock cycles, with each evaluation moving the output buffer impedance level only one step at a time

toward the optimum level. Impedance updates occur when the SRAM is in High-Z state, and thus are triggered by write and deselect

operations. Updates will also be triggered with G HIGH initiated High-Z state, providing the specified G setup and hold times are met.

Impedance match is not instantaneous upon power-up. In order to guarantee optimum output driver impedance, the SRAM requires

a minimum number of non-read cycles (1,024) after power-up. The output buffers can also be programmed in a minimum impedance

configuration by connecting ZQ to VSS or VDDQ.

Power-Up/Power-Down Supply Voltage Sequencing

The following power-up supply voltage application is recommended: VSS, VDD, VDDQ, VREF, then VIN. VDD and VDDQ can be applied

simultaneously, as long as VDDQ does not exceed VDD by more than 0.5V during power-up. The following power-down supply voltage

removal sequence is recommended: VIN, VREF, VDDQ, VDD, VSS. VDD and VDDQ can be removed simultaneously, as long as VDDQ

does not exceed VDD by more than 0.5V during power-down.

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1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

TRUTH TABLE

NOTE : - B(Both) is DIN in write cycle and DOUT in read cycle. Byte write function is not supported. X means "Don't Care".

- K & K are complementary.

KB1 B2 B3 DQ Operation

↑H L X Hi-Z No Operation, Pipeline High-Z

↑L H H DOUT Load Address, Single Read

↑LHL

DOUT Load Address, Double Read

↑L L H DIN Load Address, Single Write

↑L L L DIN Load Address, Double Write

↑H H X B Increment Address, Continue

4 Burst Operation for Interleaved Burst (LBO = VDDQ)

NOTE : - For Interleave Burst LBO = VDDQ is recommended. If LBO = VDD, it must not exceed 2.63V.

Interleaved Burst Mode Case 1 Case 2 Case 3 Case 4

A1A0A1A0A1A0A1A0

First Address

Fourth Address

BURST SEQUENCE TABLE

4 Burst Operation for Linear Burst (LBO = VSS)

Linear Burst Mode Case 1 Case 2 Case 3 Case 4

A1A0A1A0A1A0A1A0

First Address

Fourth Address

OUTPUT TRISTATE TRUTH TABLE

KOperation DQ (n) DQ (n+1)

↑Write (B2=L) X High-Z

↑Deselect (NOP) (B1=H, B2=L) X High-Z

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K7D321874C

K7D323674C

NOTE :

1. State transitions ; B1 =(Load Address), B1=(Increment Address, Continue)

B2 =(Read), B2 =(Write)

B3 =(Single Data Rate), B3 =(Double Data Rate)

BUS CYCLE STATE DIAGRAM

LOAD

NEW ADDRESS

INCREMENT

ADDRESS

INCREMENT

ADDRESS

INCREMENT

ADDRESS

INCREMENT

ADDRESS

READ

SDR

WRITE

SDR

READ

DDR

WRITE

DDR

, B

B1, B2

NO OP

POWER

, B

B1, B2

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K7D321874C

K7D323674C

RECOMMENDED DC OPERATING CONDITIONS

NOTE :1. These are DC test criteria. DC design criteria is VREF±50mV. The AC VIH/VIL levels are defined separately for measuring

timing parameters.

2. VIH (Max)DC=VDDQ+0.3, VIH (Max)AC=2.6V (2.1V for DQs) (pulse width ≤ 20% of cycle time).

3. VIL (Min)DC=-0.3V, VIL (Min)AC=-1.0V (-0.5V for DQs) (pulse width ≤ 20% of cycle time).

Parameter Symbol Min Typ Max Unit Note

Core Power Supply Voltage VDD 1.7 2.5 2.6 V

Output Power Supply Voltage VDDQ 1.4 1.5 1.9 V

Input High Level Voltage VIH VREF+0.1 - VDDQ+0.3 V 1, 2

Input Low Level Voltage VIL -0.3 - VREF-0.1 V 1, 3

Input Reference Voltage VREF 0.68 0.75 1.0 V

ABSOLUTE MAXIMUM RATINGS

NOTE : Power Dissipation Capability will be dependent upon package characteristics and use environment. See enclosed thermal impedance data.

Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Parameter Symbol Value Unit

Core Supply Voltage Relative to VSS VDD -0.5 to 3.13 V

Output Supply Voltage Relative to VSS VDDQ -0.5 to 2.3 V

Voltage on any pin Relative to VSS VIN -0.5 to VDDQ+0.5 (2.3V MAX)V

Output Short-Circuit Current(per I/O) IOUT 25 mA

Storage Temperature TSTR -55 to 125 °C

Maximum Junction Temperature TJ110 °C

Maximum Power Dissipation PD3.0 W

DC CHARACTERISTICS

NOTE :1. Minimum cycle. IOUT=0mA.

2. 50% read cycles.

3. |IOH|=(VDDQ/2)/(RQ/5)±15% @VOH=VDDQ/2 for 175Ω ≤ RQ ≤ 300Ω.

4. |IOL|=(VDDQ/2)/(RQ/5)±15% @VOL=VDDQ/2 for 175Ω ≤ RQ ≤ 300Ω.

Parameter Symbol Min Max Unit Note

Average Power Supply Operating Current(x36)

(Cycle time = tKHKH min)

IDD40

IDD37

IDD33

700

650

600

mA 1,2

Average Power Supply Operating Current(x18)

(Cycle time = tKHKH min)

IDD40

IDD37

IDD33

650

600

550

mA 1,2

Stop Clock Standby Current

(VIN=VDD-0.2V or 0.2V fixed, K=Low, K=High) ISB1 - 300 mA 1

Input Leakage Current

(VIN=VSS or VDDQ)ILI -3 3 µA

Output Leakage Current

(VOUT=VSS or VDDQ)ILO -5 5 µA

Output High Voltage(Programmable Impedance Mode) VOH1 VDDQ/2 VDDQ V3

Output Low Voltage(Programmable Impedance Mode) VOL1 VSS VDDQ/2 V 4

Output High Voltage(IOH=-0.1mA) VOH2 VDDQ-0.2 VDDQ V

Output Low Voltage(IOL=0.1mA) VOL2 VSS 0.2 V

Rev. 1.0 August 2006

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K7D321874C

K7D323674C

PIN CAPACITANCE

NOTE : Periodically sampled and not 100% tested.(TA=25°C, f=500MHz)

Parameter Symbol Test Condition TYP Max Unit

Input Capacitance CIN VIN=0V - 4 pF

Data Output Capacitance COUT VOUT=0V - 5 pF

AC TEST CONDITIONS(TA=0 to 70°C, VDD=2.37 -2.63V, VDDQ=1.5V)

Parameter Symbol Value Unit Note

Input High/Low Level VIH/VIL 1.25/0.25 V -

Input Reference Level VREF 0.75 V -

Input Rise/Fall Time TR/TF0.5/0.5 ns -

Output Timing Reference Level 0.75 V -

Clock Input Timing Reference Level Cross Point V -

Output Load See Below -

AC INPUT CHARACTERISTICS

Parameter Symbol Min Max Unit Note

AC Input Logic High VIH (AC) VREF + 0.4 V -

AC Input Logic Low VIL (AC) VREF - 0.4 V -

Clock Input Differential Voltage VDIF (AC) 0.8 V -

VREF Peak-to-Peak AC Voltage VREF (AC) 5% VREF (DC) V -

VIH(AC)

VREF

VIL(AC)

AC INPUT DEFINITION

Setup

Time

Hold

Time

DIF

(AC)

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K7D321874C

K7D323674C

AC TIMING CHARACTERISTICS

Notes: 1. The maximum cycle time must be limited to guarantee AC timing specification.

2. This parameter is guaranteed by design, and may not be tested at values shown in the table.

3. This parameter refers to CQ and CQ rising and falling edges.

4. K and K Clocks must be used differentially to meet AC timing specifications.

PARAMETER SYMBOL -40 -37 -33 UNITS NOTES

MIN MAX MIN MAX MIN MAX

Clock

Clock Cycle Time tKHKH 2.50 2.67 3.00 ns 1

Clock High Pulse Width tKHKL 1.15 1.25 1.40 ns

Clock Low Pulse Width tKLKH 1.15 1.25 1.40 ns

Setup Times

Address Setup Time tAVKH 0.30 0.33 0.35 ns

Control(B1,B2,B3) Setup Time tBVKH 0.30 0.33 0.35 ns

Data Setup Time tDVKX 0.20 0.25 0.30 ns 2

Hold Times

Address Hold Time tKHAX 0.30 0.33 0.35 ns

Control(B1,B2,B3) Hold Time tKHBX 0.30 0.33 0.35 ns

Data Hold Time tKXDX 0.20 0.25 0.30 ns 2

Output Times

Echo Clock High Pulse Width tCHCL tKHKL-0.1 tKHKL+0.1 tKHKL-0.1 tKHKL+0.1 tKHKL-0.1 tKHKL+0.1 ns 2

Echo Clock Low Pulse Width tCLCH tKLKH-0.1 tKLKH+0.1 tKLKH-0.1 tKLKH+0.1 tKLKH-0.1 tKLKH+0.1 ns 2

Clock Crossing to Echo Clock tKXCH 1.0 2.5 1.0 2.5 1.0 2.5 ns 3

Clock Crossing to Echo Clock tKXCL 1.0 2.5 1.0 2.5 1.0 2.5 ns 3

Echo Clock High to Output Valid tKHQV 0.20 0.20 0.20 ns

Echo Clock Low to Output Valid tCLQV 0.20 0.20 0.20 ns

Echo Clock High to Output Hold tCHQX -0.20 -0.20 -0.20 ns

Echo Clock Low to Output Hold tCLQX -0.20 -0.20 -0.20 ns

Echo Clock High to Output High-Z tCHQZ 0.20 0.20 0.20 ns

Echo Clock High to Output Low-Z tCHLZ -0.20 -0.20 -0.20 ns

50Ω

AC TEST OUTPUT LOAD

25Ω5pF

0.75V

5pF

0.75V

50Ω

0.75V

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K7D321874C

K7D323674C

NOP CONTINUE

AVKH

KHAX

NOP

12 3456781012

READ

(burst of 4)

READ

(burst of 2)

READ

(burst of 4)

NOP WRITE

CONTINUE

WRITE

(burst of 4)

READ

CONTINUE

READ

(burst of 4)

CONTINUE

READ

BVKH

KHBX

CHQZ

KXCH

CHLZ

CHQV

CHQX

DVKH

KHDX

KHKH

UNDEFINED

DON’T CARE

NOTE

1. Q01 refers to output from address A. Q02 refers to output from the next internal burst address following A, etc.

2. Outputs are disabled(High-Z) one clock cycle after NOP detected or after no pending data requests are present.

3. Doing more than one Read Continue or Write Continue will cause the address to wrap around.

TIMING WAVEFORMS FOR DOUBLE DATA RATE CYCLES

(Burst Length=4, 2)

CLQV

CLQX

KXCL

CHCL

CLCH

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1Mx36 & 2Mx18 SRAM

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K7D321874C

K7D323674C

TIMING WAVEFORMS FOR SINGLE DATA RATE CYCLES

NOTE :

1. Q01 refers to output from address A0. Q02 refers to output from the next internal burst address following A0, etc.

2. Outputs are disabled(High-Z) one clock cycle after NOP detected or after no pending data requests are present.

3. This devices supports cycle lengths of 1, 2, 4. Continue(B1=HIGH, B2=HIGH, B3=X) up to three times following a B1 operation. Any further

Continue assertions constitute invalid operations.

4. This device will have an address wraparound if further Continues are applied.

NOP CONTINUE

KHKH

AVKH

KHAX

NOP

1 2 3 4 5 6 7 8 10 1211

READ

(burst of 2)

READ

(burst of 4)

NOP WRITE

CONTINUE

WRITE

(burst of 2)

READ

CONTINUE

READ

CONTINUE

READ

CONTINUE

READ

BVKH

KHBX

CHQZ

KXCH

CHLZ

CHQV

CHQX

DVKH

KHDX

KLKH

UNDEFINED

DON’T CARE

KHKL

(Burst Length=4, 2, 1)

(burst of 1)

CHCL

CLCH

KXCL

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K7D321874C

K7D323674C

IEEE 1149.1 TEST ACCESS PORT AND BOUNDARY SCAN-JTAG

TAP Controller State Diagram

JTAG Block Diagram

SRAM

CORE

BYPASS Reg.

Identification Reg.

Instruction Reg.

Control Signals

TAP Controller

TDO

TDI

TMS

TCK

Test Logic Reset

Run Test Idle

Select DR

Capture DR

Shift DR

Exit1 DR

Pause DR

Exit2 DR

Update DR

Select IR

Capture IR

Shift IR

Exit1 IR

Pause IR

Exit2 IR

Update IR

The SRAM provides a limited set of IEEE standard 1149.1 JTAG functions. This is to test the connectivity during manufacturing

between SRAM, printed circuit board and other components. Internal data is not driven out of SRAM under JTAG control. In conform-

ance with IEEE 1149.1, the SRAM contains a TAP controller, Instruction Register, Bypass Register and ID register. The TAP control-

ler has a standard 16-state machine that resets internally upon power-up, therefore, TRST signal is not required. It is possible to use

this device without utilizing the TAP. To disable the TAP controller without interfacing with normal operation of the SRAM, TCK must

be tied to VSS to preclude mid level input. TMS and TDI are designed so an undriven input will produce a response identical to the

application of a logic 1, and therefore can be left unconnected. But they may also be tied to VDD through a resistor. TDO should be left

unconnected.

JTAG Instruction Coding

NOTE :

1. Places DQs in Hi-Z in order to sample all input data regardless of other

SRAM inputs. Input terminators are switched off.

2. TDI is sampled as an input to the first ID register to allow for the serial

shift of the external TDI data.

3. Bypass register is initiated to VSS when BYPASS instruction is

invoked.

The Bypass Register also holds serially loaded TDI when exiting the

Shift DR states.

4. SAMPLE instruction dose not places DQs in Hi-Z.

5. PRIVATE1 and PRIVATE2 are reserved for the exclusive use of SAM-

SUNG. This instruction should not be used.

IR2 IR1 IR0 Instruction TDO Output Notes

0 0 0 EXTEST Boundary Scan Register 1

0 0 1 IDCODE Identification Register 2

0 1 0 SAMPLE-Z Boundary Scan Register 1

0 1 1 PRIVATE3 Bypass Register 3,5

1 0 0 SAMPLE Boundary Scan Register 4

1 0 1 PRIVATE2 Bypass Register 3,5

1 1 0 PRIVATE1 Bypass Register 3,5

1 1 1 BYPASS Bypass Register 3

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K7D321874C

K7D323674C

BOUNDARY SCAN EXIT ORDER(x36)

* Reserved for Mode Pin

15P VDD(2) 38 5C SA

25RSA

139 4A SA

35TSA

040 4C SA

46RSA 41 4D VSS(2

57TSA 42 3A SA

67RV

DD(2) 43 3B SA

77PSA 44 3C SA

88TDQ1 45 3D SA

99TDQ2 46 2B DQ19

10 8P DQ10 47 1B DQ20

11 7M DQ0 48 2D DQ28

12 9P DQ12 49 3F DQ18

13 8M CQ(3) 50 1D DQ30

14 9M DQ3 51 2F CQ(3)

15 7K DQ9 52 1F DQ21

16 8K DQ11 53 3H DQ27

17 9K DQ13 54 2H DQ29

18 6L MODE 55 1H DQ31

19 5H K 56 5A ZQ(1)

20 5G K 57 5B B1

21 9H DQ4 58 5K B2

22 8H DQ6 59 5L B3

23 7H DQ8 60 4L LBO

24 9F DQ14 61 1K DQ22

25 8F CQ(3) 62 2K DQ24

26 9D DQ5 63 3K DQ26

27 7F DQ17 64 1M DQ32

28 8D DQ7 65 2M CQ(3)

29 9B DQ15 66 1P DQ23

30 8B DQ16 67 3M DQ35

31 7D SA 68 2P DQ25

32 7C SA 69 1T DQ33

33 7B SA 70 2T DQ34

34 7A SA 71 3R VDD(2)

35 6D VSS(2) 72 3T SA

36 6C SA 73 4R SA

37 6A SA 74 7U NC

BOUNDARY SCAN EXIT ORDER(x18)

* Reserved for Mode Pin

15PVDD(2) 28 5C SA

25RSA

129 4A SA

35TSA

030 4C SA

46RSA 31 4D VSS(2)

57TSA 32 3A SA

67RV

DD(2) 33 3B SA

77PSA 34 3C SA

88TDQ1 35 3D SA

36 2B DQ10

99PDQ2

10 8M CQ(3) 37 1D DQ11

38 2F CQ(3)

11 7K DQ0

39 3H DQ9

12 9K DQ3

13 6L MODE 40 1H DQ12

14 5H K 41 5A ZQ(1)

15 5G K 42 5B B1

43 5K B2

16 8H DQ6 44 5L B3

45 4L LBO

17 9F DQ4

46 2K DQ15

18 7F DQ8 47 1M DQ13

19 8D DQ7

20 9B DQ5

48 3M DQ17

21 7D SA 49 2P DQ16

22 7C SA 50 1T DQ14

23 7B SA 51 3P SA

24 7A SA 52 3R VDD(2)

25 6D VSS(2) 53 3T SA

26 6C SA 54 4R SA

27 6A SA 55 7U NC

NOTE :

1. This pin is place holder for higher density. TDO will be low for VSS and high for VDD

SCAN REGISTER DEFINITION

Part Instruction Register Bypass Register ID Register Boundary Scan

1M x 36 3 bits 1 bits 32 bits 74 bits

2M x 18 3 bits 1 bits 32 bits 55 bits

Rev. 1.0 August 2006

1Mx36 & 2Mx18 SRAM

- 17

K7D321874C

K7D323674C

JTAG DC OPERATING CONDITIONS

NOTE : 1. The input level of SRAM pin is to follow the SRAM DC specification.

Parameter Symbol Min Typ Max Unit Note

Power Supply Voltage VDD 1.7 2.5 2.6 V

Input High Level VIH 0.65*VDD -VDD+0.3 V

Input Low Level VIL -0.3 - 0.35*VDD V

Output High Voltage(IOH=-2mA) VOH 0.75*VDD -VDD V

Output Low Voltage(IOL=2mA) VOL VSS - 0.25*VDD V

JTAG AC Characteristics

Parameter Symbol Min Max Unit Note

TCK Cycle Time tCHCH 50 - ns

TCK High Pulse Width tCHCL 20 - ns

TCK Low Pulse Width tCLCH 20 - ns

TMS Input Setup Time tMVCH 5-ns

TMS Input Hold Time tCHMX 5-ns

TDI Input Setup Time tDVCH 5-ns

TDI Input Hold Time tCHDX 5-ns

Clock Low to Output Valid tCLQV 010ns

JTAG AC TEST CONDITIONS

NOTE : 1. See SRAM AC test output load on page 5.

Parameter Symbol Min Unit Note

Input High/Low Level VIH/VIL VDD/0.0 V

Input Rise/Fall Time TR/TF 1.0/1.0 ns

Input and Output Timing Reference Level VDD/2 V 1

JTAG TIMING DIAGRAM

TCK

TMS

TDI

TDO

tCHCH tCHCL tCLCH

tMVCH tCHMX

tDVCH tCHDX

tCLQV

ID REGISTER DEFINITION

Part Revision Number

(31:28)

Part Configuration

(27:18)

Vendor Definition

(17:12)

Samsung JEDEC Code

(11: 1)

Start Bit

(0)

1M x 36 0000 01000 00100 XXXXXX 00011001110 1

2M x 18 0000 01001 00011 XXXXXX 00011001110 1

Rev. 1.0 August 2006

1Mx36 & 2Mx18 SRAM

- 18

K7D321874C

K7D323674C

153 BGA PACKAGE THERMAL CHARACTERISTICS

NOTE : 1. Junction temperature can be calculated by : TJ = TA + PD x Theta_JA.

Parameter Symbol Thermal Resistance Unit Note

Junction to Ambient(at still air) Theta_JA 19.5 °C/W

Junction to Case Theta_JC 0.9 °C/W

Junction to Board Theta_JB 6.9 °C/W

NOTE :

1. All Dimensions are in Millimeters.

2. Solder Ball to PCS Offset : 0.10 MAX.

3. PCB to Cavity Offset : 0.10 MAX.

153 BGA PACKAGE DIMENSIONS

1.27

7654321

0.050

BCDEFGHJKLMNPRTUA

1.27

0.050

∅

BOTTOM VIEW

0.3/0.012MAX 153-∅0.030 ±0.006

14.00 ±0.10

0.551 ±0.004

22.00 ±0.10

0.866 ±0.004

12.50 ±0.10

0.492 ±0.004

0.60 ±0.10

0.024 ±0.004

20.50 ±0.10

0.807 ±0.004

0.56 ±0.04

0.022 ±0.002

0.90 ±0.10

0.035 ±0.004

2.21

0.087

TOP VIEW

0.006

0.15 MAX

0.75 ±0.15

MAX