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FGMS12SR6020*A
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Data Sheet
The Tomodachi Series of non-isolated dc-dc
converters deliver exceptional electrical and thermal
performance in DOSA based footprints for
Point-of-Load converters. Operating from a
3.0Vdc-14.4Vdc input, these are the converters of
choice for Intermediate Bus Architecture (IBA) and
Distributed Power Architecture applications that
require high efficiency, tight regulation, and high
reliability in elevated temperature environments with
low airflow. The Tunable Loop™ feature allows the
user to optimize the dynamic response of the
converter to match the load with reduced amount of
output capacitance leading to savings on cost and
PWB area.
The FGMS12SR6020*A converter of the Tomodachi
Series delivers 20A of output current at a tightly
regulated programmable output voltage of 0.6Vdc to
5.5Vdc. The thermal performance of the
FGMS12SR6020*A is best-in-class: Little derating is
needed up to 85℃, under natural convection.
Applications
Intermediate Bus Architecture
Telecommunications
Data/Voice processing
Distributed Power Architecture
Computing (Servers, Workstations)
Test Equipments
Features
Compliant to RoHS EU Directive 2011/65/EU
Delivers up to 20A (110W)
High efficiency, no heatsink required
Negative and Positive ON/OFF logic
DOSA based
Small size: 20.32 x 11.43 x 8.5mm
(0.8 in x 0.45 in x 0.335 in)
Tape & reel packaging
Programmable output voltage from 0.6V to 5.5V
via external resistor
Tunable Loop™ to optimize dynamic output
voltage response
FlexibleoutputvoltagesequencingEZ‐SEQUENCE
Power Good signal
Fixed switching frequency with capability of
external synchronization
Output over-current protection (non-latching)
Over temperature protection
Remote ON/OFF
Ability to sink and source current
No minimum load required
Start up into pre-biased output
UL* 60950-1 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1 2nd
Ed.) Licensed (Pending)
ISO** 9001 and ISO 14001 certified
manufacturing facilities
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
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Data Sheet
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings may lead to degradation in performance and reliability of
the converter and may result in permanent damage.
Electrical Specifications
All specifications apply over specified input voltage, output load, and temperature range, unless otherwise
noted.
PARAMETER NOTES MIN TYP MAX UNITS
ABSOLUTE MAXIMUM RATINGS1
Input Voltage Continuous -0.3 15 Vdc
SEQ, SYNC, VS+ 7 Vdc
Operating Temperature Ambient temperature -40 85 °C
Storage Temperature -55 125 °C
Output Voltage 0.6 5.5 Vdc
PARAMETER NOTES MIN TYP MAX UNITS
INPUT CHARACTERISTICS
Operating Input Voltage Range 3.0 14.4 Vdc
Maximum Input Current Vin=4.5V to 14V, Io=Max 19 Adc
Input No Load Current, Vin=12V Vout=5.0V 134 mA
Vout=0.6V 69 mA
Input Stand-by Current Vin=12V, module disabled 16.4 mA
Inrush Transient, I2t 1 A2s
Input Reflected-Ripple Current Peak-to-peak (5Hz to 20MHz, 1uH
source impedance; Vin=0 to 14V, Io=20A 50 mAp-p
Input Ripple Rejection (120Hz) -64 dB
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Data Sheet
Electrical Specifications (Continued)
PARAMETER NOTES MIN TYP MAX UNITS
OUTPUT CHARACTERISTICS
Output Voltage Set Point (no load) With 0.1% tolerance for external resistor
used to set output voltage -1.0 +1.0 %Vout
Output Voltage Range
(Over all operating input voltage,
resistive load and temperature
conditions until end of life)
-3.0 +3.0 %Vout
Adjustment Range
(selected by an external resistor)
Some output voltages may not be
possible depending on the input voltage
– see feature description section
0.6 5.5 Vdc
Remote Sense Range 0.5 Vdc
Output Regulation (for Vo 2.5Vdc) Line (Vin = min to max) 0.4 %Vout
Load (Io = min to max) 10 mV
Output Regulation (for Vo < 2.5Vdc) Line (Vin = min to max) 5 mV
Load (Io = min to max) 10 mV
Temperature (Ta = min to max) 0.4 %Vout
Output Ripple and Noise Vin=12V, Io= min to max, Co =
0.1uF+22uF ceramic capacitors
Peak to Peak 5MHz to 20MHz bandwidth 50 100 mVp-p
RMS 5MHz to 20MHz bandwidth 20 38 mVrms
External Load Capacitance Plus full load (resistive) %
Without the Tunable Loop ESR 1m 2x47 2x47 uF
With the Tunable Loop ESR 0.15m 2x47 1,000 uF
ESR 10m 2x47 10,000 uF
Output Current Range (in either sink or source mode) 0 20 Adc
Output Current Limit Inception (Hiccup mode) Current limit does not operate in sink
mode 130 % Io-max
Output Short-Circuit Current Vo 250mV, Hiccup mode 1.4 Arms
Efficiency
Vin = 12Vdc, Ta = 25°C, Io = max Vout=5.0Vdc 95.2 %
Vout=3.3Vdc 93.8 %
Vout=2.5Vdc 92.6 %
Vout=1.8Vdc 90.4 %
Vout=1.2Vdc 87.1 %
Vout=0.6Vdc 79.2 %
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Data Sheet
Electrical Specifications (Continued)
General Specifications
Feature Specifications
PARAMETER NOTES MIN TYP MAX UNITS
Switching Frequency 500 kHz
Frequency Synchronization
Synchronization Frequency Range 425 600 kHz
High Level Input Voltage 2.0 V
Low Level Input Voltage 0.4 V
Input Current, SYNC 100 nA
Minimum Pulse Width, SYNC 100 nS
Maximum SYNC rise time 100 nS
PARAMETER NOTES MIN TYP MAX UNITS
Calculated MTBF Io = 0.8 Io-max, Ta = 40°C
Telecordia Issue 2 Method 1 Case 3 15,455,614 Hours
Weight 4.54(0.16) g (oz.)
PARAMETER NOTES MIN TYP MAX UNITS
ON/OFF Signal Interface Vin = min to max, open collector or
equivalent, Signal reference to GND
Positive Logic
Logic High (Module ON)
Input High Current 1 mA
Input High Voltage 2 Vin-max V
Logic Low (Module OFF)
Input Low Current 1 mA
Input Low Voltage -0.2 0.6 V
Negative Logic
On/Off pin is open collector/drain logic
input with external pull-up resistor;
signal reference to GND
Logic High (Module OFF)
Input High Current 1 mA
Input High Voltage 2 Vin-max V
Logic Low (Module ON)
Input Low Current 10 uA
Input Low Voltage -0.2 0.6 V
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Data Sheet
Feature Specifications (Continued)
* Over temperature Warning – Warning may not activate before alarm and unit may shutdown before warning
PARAMETER NOTES MIN TYP MAX UNITS
Turn-On Delay Time Full resistive load
with Vin (module enabled, then Vin applied) From Vin=Vin(min) to 0.1*Vout(nom) 1.2 ms
with Enable (Vin applied, then enabled) From enable to 0.1*Vout(nom) 0.8 ms
Rise Time (Full resistive load) From 0.1*Vout(nom) to 0.9*Vout(nom) 2.7 ms
Output Voltage Overshoot
Ta = 25C, Vin = min to max, Iout = min
to max, with or without external
capacitance
3.0 %Vout
Over Temperature Protection
(See Thermal Considerations section) 120 °C
Tracking Accuracy (Power-Up: 0.5V/ms) 100 mV
(Power-Down: 0.5V/ms) 100 mV
Input Under Voltage Lockout
Turn-on Threshold 3.25 Vdc
Turn-off Threshold 2.6 Vdc
Hysteresis 0.25 Vdc
Resolution of Adjustable Input Under Voltage
Threshold 500 mV
Power Good
Overvoltage threshold for PGOOD ON 108 %Vout
Overvoltage threshold for PGOOD OFF 110 %Vout
Undervoltage threshold for PGOOD ON 92 %Vout
Undervoltage threshold for PGOOD OFF 90 %Vout
Pulldown resistance of PGOOD pin 50
Sink current capability into PGOOD pin 5 mA
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Data Sheet
Design Considerations
Input Filtering
The FGMS12SR6020*A converter should be
connected to a low ac-impedance source. A highly
inductive source can affect the stability of the module.
An input capacitance must be placed directly
adjacent to the input pin of the module, to minimize
input ripple voltage and ensure module stability.
To minimize input voltage ripple, ceramic capacitors
are recommended at the input of the module. Fig-1
shows the input ripple voltage for various output
voltages at 20A of load current with 2x22uF or
3x22uF ceramic capacitors and an input of 12V.
Output Filtering
The FGMS12SR6020*A is designed for low output
ripple voltage and will meet the maximum output
ripple specification with 0.1uF ceramic and 2x47uF
ceramic capacitors at the output of the module.
However, additional output filtering may be required
by the system designer for a number of reasons.
First, there may be a need to further reduce the
output ripple and noise of the module. Second, the
dynamic response characteristics may need to be
customized to a particular load step change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional
capacitance at the output can be used. Low ESR
polymer and ceramic capacitors are recommended to
improve the dynamic response of the module. Fig-2
provides output ripple information for different
external capacitance values at various Vo and a full
load current of 20A. For stable operation of the
module, limit the capacitance to less than the
maximum output capacitance as specified in the
electrical specification table. Optimal performance of
the module can be achieved by using the Tunable
Loop™ feature described later in this data sheet.
Safety Consideration
For safety agency approval the power module must
be installed in compliance with the spacing and
separation requirements of the end-use safety
agency standards, i.e., UL 60950-1 2nd, CSA C22.2
No. 60950-1-07, DIN EN 60950-1:2006 + A11
(VDE0805 Teil 1 + A11):2009-11; EN 60950-1:2006
+ A11:2009-03.
For the converter output to be considered meeting
the requirements of safety extra-low voltage (SELV),
the input must meet SELV requirements. The power
module has extra-low voltage (ELV) outputs when all
inputs are ELV.
The Tomodachi series were tested using an external
Littelfuse 456 series fast-acting fuse rated at 30A,
100 Vdc in the ungrounded input.
Fig-1: Input ripple voltage for various output
voltages with 2x22uF or 3x22uF ceramic
capacitors at the input (20A load). Input voltage
is 12V.
Fig-2: Output ripple voltage for various output
voltages with external 2x47uF, 4x47uF, 6x47uF
or 8x47uF ceramic capacitors at the output (20A
load). Input voltage is 12V.
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Data Sheet
Feature Descriptions
Remote On/Off
The FGMS12SR6020*A power modules feature an
On/Off pin for remote On/Off operation. Two On/Off
logic options are available. In the Positive Logic
On/Off option, (device code suffix “P” - see Ordering
Information), the module turns ON during a logic High
on the On/Off pin and turns OFF during a logic Low.
With the Negative Logic On/Off option, (device code
suffix “N” - see Ordering Information), the module
turns OFF during logic High and ON during logic Low.
The On/Off signal should be always referenced to
ground. For either On/Off logic option, leaving the
On/Off pin disconnected will turn the module ON
when input voltage is present.
For positive logic modules, the circuit configuration
for using the On/Off pin is shown in Fig-3. When the
external transistor Q2 is in the OFF state, the internal
transistor Q7 is turned ON, which turn Q3 OFF, which
keeps Q6 OFF and Q5 OFF. This allows the internal
PWM #Enable signal to be pulled up by the internal
3.3V, thus turning the module ON. When transistor
Q2 is turned ON, the On/Off pin is pulled low, which
turns Q7 OFFwhichturnsQ3, Q6 and Q5 ON and the
internal PWM #Enable signal is pulled low and the
module is OFF. A suggested value for Rpullup is
20k.
For negative logic On/Off modules, the circuit
configuration is shown in Fig-4. The On/Off pin
should be pulled high with an external pull-up resistor
(suggested value for the 3V to 14V input range is
20Kohms). When transistor Q2 is in the OFF state,
the On/Off pin is pulled high, transistor Q3 is turned
ON. This turns Q6 ON, followed by Q5 turning ON
which pulls the internal ENABLE low and the module
is OFF. To turn the module ON, Q2 is turned ON
pulling the On/Off pin low, turning transistor Q3 OFF,
which keeps Q6 and Q5 OFF resulting in the PWM
Enable pin going high.
Monotonic Start-up and Shut-down
The module has monotonic start-up and shutdown
behavior for any combination of rated input voltage,
output current and operating temperature range.
Startup into Pre-biased Output
The module can start into a prebiased output as long
as the prebias voltage is 0.5V less than the set output
voltage.
Fig-3: Circuit configuration for using positive
On/Off logic.
20K
Rpullup
I
20K
ON/OFF
+
20K
3.3V
470
VIN
20K
Q7
20K
100pF
4.7K
ENABLE
100K
DLYNX MODULE
47K
Q2
+VIN
20K
GND
20K
20K
2K
ON/OFF
Q6
Q5
V
Q3
_
Fig-4: Circuit configuration for using negative
On/Off logic.
ENABLE
470
4.7K
+VIN
20K
100K
2K
100pF
_
47K
GND
Q6
20K
Q2
+
DLYNX MODULE
V
Rpullup
Q3
ON/OFF
20K
ION/OFF
3.3V
Q5
20K
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Data Sheet
Output Voltage Programming
The output voltage of the module is programmable to
any voltage from 0.6dc to 5.5Vdc by connecting a
resistor between the Trim and SIG_GND pins of the
module. Certain restrictions apply on the output
voltage set point depending on the input voltage.
These are shown in the Output Voltage vs. Input
Voltage Set Point Area plot in Fig-5. The Upper Limit
curve shows that for output voltages lower than 1V,
the input voltage must be lower than the maximum of
14.4V. The Lower Limit curve shows that for output
voltages higher than 0.6V, the input voltage needs to
be larger than the minimum of 3V.
Without an external resistor between Trim and
SIG_GND pins, the output of the module will be
0.6Vdc. To calculate the value of the trim resistor,
Rtrim for a desired output voltage, should be as per
the following equation:
Rtrim is the external resistor in kohm
Vo-req is the desired output voltage
Note that the tolerance of a trim resistor will affect the
tolerance of the output voltage. Standard 1% or 0.5%
resistors may suffice for most applications; however,
a tighter tolerance can be obtained by using two
resistors in series instead of one standard value
resistor.
Table 1 lists calculated values of RTRIM for common
output voltages. For each value of RTRIM, Table 1 also
shows the closest available standard resistor value.
Table 1: Trim Resistor Value
VO-REG [V] RTRIM [k]
0.6 Open
0.9 40
1.0 30
1.2 20
1.5 13.33
1.8 10
2.5 6.316
3.3 4.444
5.0 2.727
Remote Sense
The power module has a Remote Sense feature to
minimize the effects of distribution losses by
regulating the voltage between the SENSE pins (VS+
and VS-). The voltage drop between the SENSE pins
and the VOUT and GND pins of the module should
not exceed 0.5V.
Voltage Margining
Output voltage margining can be implemented in the
module by connecting a resistor, Rmargin-up, from
the Trim pin to the ground pin for margining-up the
output voltage and by connecting a resistor,
Rmargin-down, from the Trim pin to output pin for
margining-down. Fig-7 shows the circuit configuration
for output voltage margining.
The POL Programming Tool, available at
www.fdk.com under the Downloads section, also
calculates the values of Rmargin-up and
Rmargin-down for a specific output voltage and %
]k[
0.6)-(V
12
R
REQ-O
TRIM Ω
Fig-5: Output Voltage vs. Input Voltage Set
Point Area plot showing limits where the output
voltage can be set for different input voltages.
Fig-6: Output Voltage vs. Input Voltage Set
Point Area plot showing limits where the output
voltage can be set for different input voltages.
Caution – Do not connect SIG_GND to
GND elsewhere in the layout.
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Data Sheet
margin. Please consult your local FDK FAE for
additional details.
Output Voltage Sequencing
The power module includes a sequencing feature,
EZSEQUENCE that enables users to implement
various types of output voltage sequencing in their
applications. This is accomplished via an additional
sequencing pin. When not using the sequencing
feature, leave it unconnected.
The voltage applied to the SEQ pin should be scaled
down by the same ratio as used to scale the output
voltage down to the reference voltage of the module.
This is accomplished by an external resistive divider
connected across the sequencing voltage before it is
fed to the SEQ pin as shown in Fig-8. In addition, a
small capacitor (suggested value 100pF) should be
connected across the lower resistor R1.
For all DLynx modules, the minimum recommended
delay between the ON/OFF signal and the
sequencing signal is 10ms to ensure that the module
output is ramped up according to the sequencing
signal. This ensures that the module soft-start routine
is completed before the sequencing signal is allowed
to ramp up.
When the scaled down sequencing voltage is applied
to the SEQ pin, the output voltage tracks this voltage
until the output reaches the set-point voltage. The
final value of the sequencing voltage must be set
higher than the set-point voltage of the module. The
output voltage follows the sequencing voltage on a
one-to-one basis. By connecting multiple modules
together, multiple modules can track their output
voltages to the voltage applied on the SEQ pin.
To initiate simultaneous shutdown of the modules,
the SEQ pin voltage is lowered in a controlled
manner. The output voltage of the modules tracks the
voltages below their set-point voltages on a
one-to-one basis. A valid input voltage must be
maintained until the tracking and output voltages
reach ground potential.
Over-Current Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought
back into its specified range.
Over-Temperature Protection
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. The unit
will shut down if the over-temperature threshold of
120°C (typ) is exceeded at the thermal reference
point Tref. Once the unit goes into thermal shutdown
it will then wait to cool before attempting to restart.
Fig-7: Circuit Configuration for margining Output
Voltage.
Fig-8: Circuit showing connection of the
sequencing signal to the SEQ pin.
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Data Sheet
Input Under-Voltage Lockout (UVLO)
At input voltages below the input under-voltage
lockout limit, the module operation is disabled. The
module will begin to operate at an input voltage
above the under-voltage lockout turn-on threshold.
Synchronization
The module switching frequency can be
synchronized to a signal with an external frequency
within a specified range. Synchronization can be
done by using the external signal applied to the
SYNC pin of the module as shown in Fig-I, with the
converter being synchronized by the rising edge of
the external signal. The Electrical Specifications table
specifies the requirements of the external SYNC
signal. If the SYNC pin is not used, the module
should free run at the default switching frequency. If
synchronization is not being used, connect the
SYNC pin to GND.
Dual Layout
Identical dimensions and pin layout of Analog and
Digital Tomodachi modules permit migration from
one to the other without needing to change the layout.
In both cases the trim resistor is connected between
trim and signal ground SIG_GND. The output of the
analog module cannot be trimmed down to 0.45V
Power Good
The module provides a Power Good (PGOOD) signal
that is implemented with an open-drain output to
indicate that the output voltage is within the
regulation limits of the power module. The PGOOD
signal will be de-asserted to a low state if any
condition such as over-temperature, over-current or
loss of regulation occurs that would result in the
output voltage going ±10% outside the setpoint value.
The PGOOD terminal can be connected through a
pull-up resistor (suggested value 100K) to a source
of 5VDC or lower.
Tunable Loop™
The module has a feature that optimizes transient
response of the module called Tunable Loop™
External capacitors are usually added to the output of
the module for two reasons: to reduce output ripple
and noise (see Figure 38) and to reduce output
voltage deviations from the steady-state value in the
presence of dynamic load current changes. Adding
external capacitance however affects the voltage
control loop of the module, typically causing the loop
to slow down with sluggish response. Larger values
of external capacitance could also cause the module
to become unstable.
The Tunable Loop™ allows the user to externally
adjust the voltage control loop to match the filter
network connected to the output of the module. The
Tunable Loop™ is implemented by connecting a
series R-C between the VS+ and TRIM pins of the
module, as shown in Fig-10. This R-C allows the user
to externally adjust the voltage loop feedback
compensation of the module.
Recommended values of RTUNE and CTUNE for
different output capacitor combinations are given in
Tables 2. Table 2 shows the recommended values of
RTUNE and CTUNE for different values of ceramic output
capacitors up to 1000uF that might be needed for an
application to meet output ripple and noise
requirements. Selecting RTUNE and CTUNE according to
Table 2 will ensure stable operation of the module. In
Fig-9: External source connections to
synchronize switching frequency of the module.
Fig-10: Circuit diagram showing connection of
RTUNE and CTUNE to tune the control loop of the
module.
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Data Sheet
applications with tight output voltage limits in the
presence of dynamic current loading, additional
output capacitance will be required. Table 3 lists
recommended values of RTUNE and CTUNE in order to
meet 2% output voltage deviation limits for some
common output voltages in the presence of a 10A to
20A step change (50% of full load), with an input
voltage of 12V.
Please contact your FDK technical representative to
obtain more details of this feature as well as for
guidelines on how to select the right value of external
R-C to tune the module for best transient
performance and stable operation for other output
capacitance values.
Table 2: General recommended value of RTUNE
and CTUNE for Vin=12V and various external
ceramic capacitor combinations.
Co 2x47uF 4x47uF 6x47uF 10x47uF 20x47uF
RTUNE 330 330 270 220 180
CTUNE 47pF 560pF 1200pF 2200pF 4700pF
Table 3: Recommended values of RTUNE and
CTUNE to obtain transient deviation of 2% of Vout
for a 10A step load with Vin=12V.
Vo 5V 3.3V 2.5V 1.8V 1.2V 0.6V
Co 8x47uF
5x47uF
+
1x330uF
Polymer
2x47uF
+
2x330uF
Polymer
2x47uF
+
3x330uF
Polymer
1x47uF
+
5x330uF
Polymer
1x47uF
+
11x330uF
Polymer
RTUNE 220 220 220 220 180 180
CTUNE 1500pF 2200pF 3300pF 5600pF 10nF 47nF
△V 100mV 64mV 49mV 36mV 24mV 12mV
Note: The capacitors used in the Tunable Loop
tables are 47 μF/3 mΩ ESR ceramic and 330 μF/12
mΩ ESR polymer capacitors.
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Data Sheet
Characterization
Overview
The converter has been characterized for several
operational features, including efficiency, thermal
derating (maximum available load current as a
function of ambient temperature and airflow), ripple
and noise, transient response to load step changes,
start-up and shutdown characteristics.
Figures showing data plots and waveforms for
different output voltages are presented in the
following pages.
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should
always be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability.
The thermal data presented here is based on
physical measurements taken in a wind tunnel. The
test set-up is shown in Fig-K. The preferred airflow
direction for the module is in Fig-11.
The thermal reference points, Tref used in the
specifications are also shown in Fig-12. For reliable
operation the temperatures at these points should not
exceed 130oC. The output power of the module
should not exceed the rated power of the module
(Vo,set x Io,max).
Note that continuous operation beyond the derated
current as specified by the derating curves may lead
to degradation in performance and reliability of the
converter and may result in permanent damage.
The main heat dissipation method of this converter is
to transfer its heat to the system board. Thus, if the
temperature of the system board goes high, even
with the low ambient temperature, it may exceed the
guaranteed temperature of components.
Air
flow
x
Power Module
W
ind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Fig-11: Thermal test set-up
Fig-12: Preferred airflow direction and location
of hot-spot of the module (Tref).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 5Vo and 25°C
EFFICIENCY, (%)
70
75
80
85
90
95
100
0 5 10 15 20
Vin=7V
Vin=12V
Vin=14V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-13. Converter Efficiency versus Output Current. Fig-14. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
V
O (V) (50mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
I
O (A) (10Adiv) V
O (V) (50mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-15. Typical output ripple and noise (CO=2x47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-16. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 8x47uF,
CTune=1500pF & RTune=220 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
V
O (V) (2V/div) V
ON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
V
O (V) (2V/div) V
IN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-17. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-18. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 3.3Vo and 25°C
EFFICIENCY, (%)
70
75
80
85
90
95
100
0 5 10 15 20
Vin=4.5V
Vin=14V
Vin=12V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-19. Converter Efficiency versus Output Current. Fig-20. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (50mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (10Adiv) VO (V) (50mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-21. Typical output ripple and noise (CO=2x47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-22. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 5x47uF +1x330uF,
CTune=2200pF & RTune=220 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
VO (V) (1V/div) VON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
VO (V) (1V/div) VIN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-23. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-24. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 2.5Vo and 25°C
EFFICIENCY, (%)
70
75
80
85
90
95
100
0 5 10 15 20
Vin=4.5V Vin=14V
Vin=12V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-25. Converter Efficiency versus Output Current. Fig-26. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
V
O (V) (20mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
I
O (A) (10Adiv) VO (V) (20mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-27. Typical output ripple and noise (CO=2x47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-28. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 2x47uF +2x330uF,
CTune=3300pF & RTune=220 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
V
O (V) (1V/div) V
ON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
V
O (V) (1V/div) V
IN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-29. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-30. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 1.8Vo and 25°C
EFFICIENCY, (%)
70
75
80
85
90
95
0 5 10 15 20
Vin=3.3V
Vin=14V
Vin=12V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-31. Converter Efficiency versus Output Current. Fig-32. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
V
O (V) (20mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
I
O (A) (10Adiv) VO (V) (20mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-33. Typical output ripple and noise (CO=2X47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-34. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 2x47uF +3x330uF,
CTune=5600pF & RTune=220 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
V
O (V) (500mV/div) VON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
V
O (V) (500mV/div) VIN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-35. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-36. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 1.2Vo and 25°C
EFFICIENCY, (%)
50
55
60
65
70
75
80
85
90
95
0 5 10 15 20
Vin=3.3V
Vin=14V
Vin=12V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
2m/s
(400LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
0.5m/s
(100LFM)
NC
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-37. Converter Efficiency versus Output Current. Fig-38. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
V
O (V) (20mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
I
O (A) (10Adiv) V
O (V) (20mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-39. Typical output ripple and noise (CO=2x47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-40. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 1x47uF +5x330uF,
CTune=10nF & RTune=178 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
V
O (V) (500mV/div) VON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
V
O (V) (500mV/div) V
IN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-41. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-42. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog Tomodachi at 0.6Vo and 25°C
EFFICIENCY, (%)
50
55
60
65
70
75
80
85
90
0 5 10 15 20
Vin=3.3V
Vin=14V
Vin=12V
OUTPUT CURRENT, Io (A)
2
6
10
14
18
22
55 65 75 85 95 105
0.5m/s
(100LFM)
1.5m/s
(300LFM)
1m/s
(200LFM)
NC
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Fig-43. Converter Efficiency versus Output Current. Fig-44. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
V
O (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (10Adiv) VO (V) (10mV/div)
TIME, t (1us/div) TIME, t (20us /div)
Fig-45. Typical output ripple and noise (CO=2x47uF
ceramic, VIN = 12V, Io = Io,max, ).
Fig-46. Transient Response to Dynamic Load Change
from 50% to 100% at 12Vin, Cout= 1x47uF +11x330uF
CTune=47nF, RTune=178 ohms
OUTPUT VOLTAGE ON/OFF VOLTAGE
V
O (V) (200mV/div) VON/OFF (V) (5V/div)
OUTPUT VOLTAGE INPUT VOLTAGE
V
O (V) (200mV/div) V
IN (V) (5V/div)
TIME, t (2ms/div) TIME, t (2ms/div)
Fig-47. Typical Start-up Using On/Off Voltage (Io = Io,max). Fig-48. Typical Start-up Using Input Voltage (VIN = 12V,
Io = Io,max).
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Data Sheet
Example Application Circuit
Requirements:
Vin: 12V
Vout: 1.8V
Iout: 15A max., worst case load transient is from 10A to 15A
Vout: 1.5% of Vout (27mV) for worst case load transient
Vin, ripple 1.5% of Vin (180mV, p-p)
CI1 Decoupling cap - 1x0.047uF/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CI2 3x22uF/16V ceramic capacitor (e.g. Murata GRM32ER61C226KE20)
CI3 47uF/16V bulk electrolytic
CO1 Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CO2 N/A
CO3 3 x 330uF/6.3V Polymer (e.g. Sanyo Poscap)
CTune 4700pF ceramic capacitor (can be 1206, 0805 or 0603 size)
RTune 330 ohms SMT resistor (can be 1206, 0805 or 0603 size)
RTrim 10k SMT resistor (can be 1206, 0805 or 0603 size, recommended tolerance of 0.1%)
VS-
GND
Vin+
CI3 CO3
VOUT
VS+
GND
TRIM
CTUNE
RTUNE
RTrim
VIN
CO1
CI1
Vout+
ON/OFF
SEQ
MODULE
PGOOD
SIG_GND
SYN
CI2 CO2
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Data Sheet
Mechanical Drawing
Pin Connections
Pin # Function Pin # Function
1 ON/OFF 9 PG
2 Vin 10 SYNC*
3 SEQ 11 NC
4 GND 12 NC
5 TRIM 13 NC
6 Vout 14 GIG_GND
7 VS+ 15 NC
8 VS- 16 NC
Notes
- All dimensions are in millimeters (inches)
- Tolerances:
x.x mm 0.5 mm (x.xx in. 0.02 in.)
[unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
* If unused, connect to Ground
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Data Sheet
Recommended Pad Layout
Pin Connections
Pin # Function Pin # Function
1 ON/OFF 9 PG
2 Vin 10 SYNC*
3 SEQ 11 NC
4 GND 12 NC
5 TRIM 13 NC
6 Vout 14 GIG_GND
7 VS+ 15 NC
8 VS- 16 NC
Notes
- All dimensions are in millimeters (inches)
- Tolerances:
x.x mm 0.5 mm (x.xx in. 0.02 in.)
[unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
* If unused, connect to Ground
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Data Sheet
Packaging Detail
The 20A Analog Tomodachi modules are supplied in tape & reel as standard. Modules are shipped in quantities
of 200 modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions:
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Tape Width: 44.00 mm (1.732”)
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Data Sheet
Surface Mount Information
Pick and Place
The 20A Analog Tomodachi modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well
as safety standards, and is able to withstand reflow
temperatures of up to 300°C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 7mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on
the bottom side of a customer board. If such an
assembly is attempted, components may fall off the
module during the second reflow process.
Lead Free Soldering
The modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering
process. Failure to observe the instructions below
may result in the failure of or cause damage to the
modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture / Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). For questions regarding Land grid array
(LGA) soldering, solder volume; please contact
Lineage Power for special manufacturing process
instructions. The recommended linear reflow profile
using Sn/Ag/Cu solder is shown in Fig-49. Soldering
outside of the recommended profile requires testing
to verify results and performance.
MSL Rating
The 20A Analog Tomodachi modules have a MSL
rating of 2a.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following
conditions: < 40°C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.
The result of inadequate cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Pe r J-STD-020 Rev. C
0
50
100
150
200
250
300
Re flo w Time (Se c o nds)
Reflo w Temp (°C)
He a ting Zone
1°C/Seco nd
Pe ak Temp 260°C
* Min. Time Abo ve 235°C
1 5 S econds
*Time Above 21 7°C
60 Seconds
Cooling
Zone
Fig-49: Recommended linear reflow profile
using Sn/Ag/Cu solder.
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Data Sheet
Part Number System
Product
Series Shape Regulation Input
Voltage
Mounting
Scheme
Output
Voltage
Rated
Current
ON/OFF
Logic
Pin
Shape
FG M S 12 S R60 20 * A
Series
Name Middle S: With tracking Typ=12V Surface
Mount
0.60V
(Programmable:
See page 6)
20A N: Negative
P: Positive Standard
Cautions
NUCLEAR AND MEDICAL APPLICATIONS: FDK Corporation products are not authorized for use as critical
components in life support systems, equipment used in hazardous environments, or nuclear control systems
without the written consent of FDK Corporation.
SPECIFICATION CHANGES AND REVISIONS: Specifications are version-controlled, but are subject to
change without notice.
