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Apr. 20, 2004 V.1
Chip Resistor Surface Mount
5
7
SERIES
RC
0201 (Pb Free)
TEST PROCEDURE REQUIREMENTS
Formula
Temperature Coefficient
of Resistance (T.C.R.)
At +25/–55 °C
and +25/+125 °C
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Refer to table 2
Thermal Shoc
At –65 (+0/–10) °C for 2 minutes and at +125 (+10/–0) °C for 2
minutes; 25 cycles
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
Low Temperature
Operation
At –65 (+0/–5) °C for 1 hour; RCWV applied for 45 (+5/–0) minutes ±(0.5%+0.05 Ω) for 1% tol .
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Short Time Overload 2.5 × RCWV applied for 5 seconds at room temperature ±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
No visible damage
Insulation Resistance RCOV for 1 minute
Type RC0201
Voltage (DC) 50 V
≥10 GΩ
Dielectric Withstand
Voltage
Maximun voltage (Vrms) applied for
1 minute
Type RC0201
Voltage (AC) 50 Vrms
No breakdown or flashover
Resistance to Soldering
Heat
Unmounted chips; 260 ±5 °C for 10 ±1 seconds
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Life At 70±2 °C for 1,000 hours; RCWV applied for 1.5 hours on and 0.5
hour off
±(1%+0.05 Ω) for 1% tol.
±(3%+0.05 Ω) for 5% tol.
Solderability Solder bath at 245±3 °C
Dipping time: 2±0.5 seconds
Well tinned (≥95% covered)
No visible damage
TESTS AND REQUIREMENTS
Table 6 Test condition, method and requirements
R2–R1
R1(t2–t1)