EC3500ETTSY-12.000M - Ecliptek Corporation

RoHS

EC3500ETTSY-12.000M

EC35 00 ET TS Y -12.000M

Series

RoHS Compliant (Pb-free) 5.0V 4 Pad 3.2mm x 5mm

Ceramic SMD HCMOS/TTL Oscillator

Frequency Tolerance/Stability

±100ppm Maximum

Operating Temperature Range

-40°C to +85°C

Duty Cycle

50 ±10(%)

Nominal Frequency

12.000MHz

Load Drive Capability

High Drive

Pin 1 Connection

Tri-State (High Impedance)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 12.000MHz

Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C,

Shock, and Vibration)

Operating Temperature Range -40°C to +85°C

Supply Voltage 5.0Vdc ±10%

Input Current 20mA Maximum (No Load)

Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, Vdd-0.5Vdc Minimum with HCMOS Load (IOH = -16mA)

Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA)

Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform)

Duty Cycle 50 ±10(%) (Measured at 50% of waveform)

Load Drive Capability High Drive (10TTL Load or 50pF HCMOS Load Maximum)

Output Logic Type CMOS

Pin 1 Connection Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High

Impedance)

Standby Current 10µA Maximum (Disabled Output: High Impedance)

RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency)

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Flammability UL94-V0

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Mechanical Shock MIL-STD-883, Method 2002, Condition B

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010, Condition B

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 1 of 6

EC3500ETTSY-12.000M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

3.20

±0.20

5.00

±0.20

1.3

MAX 2.20

±0.15

1.20

±0.20

(x4)

1.00 ±0.20 (x4) 1.20 ±0.20

2.54

±0.15

MARKING

ORIENTATION

PIN CONNECTION

1 Tri-State

2 Case Ground

3 Output

4 Supply Voltage

LINE MARKING

1E12.000

E=Ecliptek Designator

2XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

1.14

1.0

1.2 (X4)

1.4 (X4)

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EC3500ETTSY-12.000M

OUTPUT DISABLE

(HIGH IMPEDANCE

STATE)

OUTPUT WAVEFORM & TIMING DIAGRAM

VOH

VOL

80% or 2.4VDC

50% or 1.4VDC

20% or 0.4VDC

Fall

Time

Rise

Time TW

Duty Cycle (%) = TW/T x 100

VIH

VIL

tPLZ tPZL

CLOCK OUTPUT TRI-STATE INPUT

Supply

Voltage

(VDD)

Test Circuit for TTL Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply Voltage

Meter

Current

Meter

0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

(Note 4)

Power

Supply

Oscilloscope Frequency

Counter

Probe

(Note 2)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.

Note 5: All diodes are MMBD7000, MMBD914, or equivalent.

Table 1: RL Resistance Value and CL Capacitance

Value Vs. Output Load Drive Capability

Output Load

Drive Capability RL Value

(Ohms) CL Value

(pF)

10TTL

5TTL

2TTL

10LSTTL

1TTL

390

780

1100

2000

2200

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EC3500ETTSY-12.000M

Supply

Voltage

(VDD)

Test Circuit for CMOS Output

Output

No Connect

or Tri-State

Ground

+ +

Power

Supply 0.01µF

(Note 1) 0.1µF

(Note 1) CL

(Note 3)

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and VDD pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.

Voltage

Meter

Current

Meter

Oscilloscope Frequency

Counter

Probe

(Note 2)

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T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EC3500ETTSY-12.000M

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

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T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EC3500ETTSY-12.000M

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 2/17/2010 | Page 6 of 6