©
1993
DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD4722
Document No. S12199EJ3V0DS00 (3rd edition)
(Previous No. IC-3280)
Date Published January 1997 N
Printed in Japan
RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V
The
µ
PD4722 is a high-breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232-E
standard. The internal DC/DC converter can switch between multiple voltages, allowing it to operate with a single +3.3
V or +5 V power supply. It also provides standby function.
This IC incorporates 4 driver circuits and 4 receiver circuits. An RS-232 interface circuit can be easily configured
by connecting 5 capacitors externally.
FEATURES
• Conforms to EIA/TIA-232-E (former name, RS-232C) standards
• Selectable +3.3 V/+5 V single power supply (selected by VCHA pin)
• By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times, the driver
output is in a high-impedance state.
• Even in the standby mode, 2 receiver circuits can operate as inverters without hysteresis width.
The other 2 circuits are fixed at a high level.
ORDERING INFORMATION
Part number Package
µ
PD4722GS-GJG 30-pin plastic SSOP (300 mil)
2
µ
PD4722
BLOCK DIAGRAM/PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
D
IN1
D
IN2
D
IN3
D
IN4
R
OUT1
R
OUT2
R
OUT3
R
OUT4
STBY
V
CHA
EN
D
OUT1
D
OUT2
D
OUT3
D
OUT4
R
IN1
R
IN2
R
IN3
R
IN4
V
DD
C
1
+
V
CC
C
1
–
C
5
+
GND
C
5
–
C
4
+
GND
C
4
–
V
SS
+10 V
C
3
C
1
C
5
–10 V
+C
2
C
4
+
+
+
Note 4 300 Ω
300 Ω
300 Ω
300 Ω
5.5 kΩ
5.5 kΩ
5.5 kΩ
5.5 kΩ
+3.3 V
or
+5 V
+
Note 1.VDD and VSS are output pins stepped up internally. These pins should not be loaded directly.
2. Capacitors C1 to C5 with a breakdown voltage of 20 V or higher are recommended. And it is
recommended to insert the capacitor that is 0.1
µ
F to 1
µ
F between VCC and GND.
3. If VCHA is kept low level (in 5 V mode), capacitor C5 is not necessary.
4. The pull-up resistors at driver input are active resistors.
3
µ
PD4722
Truth Table
Driver
STBY DIN DOUT Remarks
L×Z Standby mode (DC/DC converter is stopped)
H L H Space level output
H H L Mark level output
Receiver
STBY EN RIN ROUT Remarks
R3 to R4R1 to R2R3 to R4R1 to R2
LL×× H H Standby mode 1 (DC/DC converter is stopped)
LHL×HH
Standby mode 2 (DC/DC converter is stopped, R3
and R4 are operated)
LHH×LH
Standby mode 2 (DC/DC converter is stopped, R3
and R4 are operated)
H×L H Mark level input
H×H L Space level input
3 V ↔ 5 V switchingNote 5
VCHA Operating mode
L 5 V mode (double step-up)
H 3 V mode (3 times step-up)
H: high-level, L: low-level, Z: high-impedance, ×: H or L
Note 5. When switching VCHA, standby mode must be selected (STBY = L).
4
µ
PD4722
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter Symbol Ratings Unit
Supply Voltage (VCHA = L) VCC –0.5 to +7.0 V
Supply Voltage (VCHA = H) VCC –0.5 to +4.5 V
Driver Input Voltage DIN –0.5 to VCC +0.5 V
Receiver Input Voltage RIN –30.0 to +30.0 V
Control Input Voltage (STBY, VCHA, EN) VIN –0.5 to VCC +0.5 V
Driver Output Voltage DOUT –25.0 to +25.0Note 6 V
Receiver Output Voltage ROUT –0.5 to VCC +0.5 V
Input Current (DIN, STBY, VCHA, EN) IIN ±20.0 mA
Operating Ambient Temperature TA–40 to +85 °C
Storage Temperature Tstg –55 to + 150 °C
Total Power Dissipation PT0.5 W
Note 6. Pulse width = 1 ms, duty = 10 % MAX.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage (VCHA = L, 5 V mode) VCC 4.5 5.0 5.5 V
Supply Voltage (VCHA = H, 3 V mode) VCC 3.0 3.3 3.6 V
High-Level Input Voltage (DIN)VIH 2.0 VCC V
Low-Level Input Voltage (DIN)VIL 0 0.8 V
High-Level Input Voltage (STBY, VCHA, EN) VIH 2.4 VCC V
Low-Level Input Voltage (STBY, VCHA, EN) VIL 0 0.6 V
Receiver Input Voltage RIN –30 +30 V
Operating Ambient Temperature TA–40 +85 °C
Capacitance of External Capacitor Note 7 0.47 4.7
µ
F
Note 7. In low temperature (below 0 ˚C), the capacitance of electrolytic capacitor becomes lower. Therefore,
set higher values when using in low temperature.
Concerning the wiring length between the capacitor and the IC, the shorter the better.
Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic
capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the
external capacitors.
5
µ
PD4722
ELECTRICAL SPECIFICATIONS (TOTAL)
(UNLESS OTHERWISE SPECIFIED, TA = –40 to +85 °C, C1 to C5 = 1
µ
F)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
VCC = +3.3 V, No load, RIN pin OPEN,
STBY = H
VCC = +5.0 V, No load, RIN pin OPEN,
STBY = H
VCC = +3.3 V, RL = 3 kΩ (DOUT), DIN = GND,
RIN, ROUT pin OPEN, STBY = H
VCC = +5.0 V,RL = 3 kΩ (DOUT), DIN = GND,
RIN, ROUT pin OPEN, STBY = H
VCC = +3.3 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = L, TA = 25 °C
VCC = +3.3 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = L
VCC = +5.0 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = L, TA = 25 °C
VCC = +5.0 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = L
VCC = +3.3 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = H, TA = 25 °C
VCC = +3.3 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = H
VCC = +5.0 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = H, TA = 25 °C
VCC = +5.0 V, No load, DIN and RIN pins are
OPEN, STBY = L, EN = H
High-Level Input Voltage VIH VCC = +3.0 to +5.5 V, STBY, VCHA, EN pin 2.4 V
Low-Level Input Voltage VIL VCC = +3.0 to +5.5 V, STBY, VCHA, EN pin 0.6 V
High-Level Input Current IIH VCC = +5.5 V, VI = 5.5 V, STBY, VCHA, EN pin 1
µ
A
Low-Level Input Current IIL VCC = +5.5 V, VI = 0 V, STBY, VCHA, EN pin –1
µ
A
Driver input and receiver input
VCC = +3.3 V, for GND, f = 1 MHz
Driver input and receiver input
VCC = +5.0 V, for GND, f = 1 MHz
STBY — VCHA Time tSCH VCC = +3.0 to 5.5 V, STBY ↓ → VCHA, Note 8 1
µ
s
VCHA — STBY Time tCHS VCC = +3.0 to 5.5 V, VCHA → STBY ↑, Note 8 1
µ
s
STBY — VCC Time tSC VCC = +3.0 to 5.5 V, STBY ↓ → VCC, Note 8 1
µ
s
VCC — STBY Time tCS VCC = +3.0 to 5.5 V, VCC → STBY ↑, Note 8 1
µ
s
* The TYP. values are for reference at TA = 25 °C.
10 pF
Circuit Current ICC1
12 mA
16 mA
47 mA
38 mA
Circuit Current ICC2
ICC3
Circuit Current at Standby
(Standby Mode 1)
ICC4
Circuit Current at Standby
(Standby Mode 2)
5
µ
A
10
µ
A
25
µ
A
13
µ
A
5
µ
A
10
µ
A
25
µ
A
13
µ
A
10 pF
Input Capacitance CIN
6
µ
PD4722
Output Voltage VDO
Note 8. Measuring point
ELECTRICAL SPECIFICATIONS (DRIVER)
(UNLESS OTHERWISE SPECIFIED, TA = –40 to +85 °C, C1 to C5 = 1
µ
F)
3 V mode (unless otherwise specified, VCHA = H, VCC = 3.0 to 3.6 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Low-Level Input Voltage VIL 0.8 V
High-Level Input Voltage VIH 2.0 V
Low-Level Input Current IIL VCC = +3.6 V, VI = 0 V –25
µ
A
High-Level Input Current IIH VCC = +3.6 V, VI = 3.6 V 1.0
µ
A
VCC = +3.3 V, RL = ∞, TA = 25 °C±9.5 V
VCC = +3.3 V, RL = 3 kΩ, TA = Topt ±5.0 ±6.0 V
VCC = +3.0 V, RL = 3 kΩ, TA = +25 °C±5.0 V
Output Short-Circuit Current ISC VCC = +3.3 V, for GND ±40 mA
CL = 10 pF, RL = 3 to 7 kΩ3.0 30 V/
µ
s
CL = 2 500 pF, RL = 3 to 7 kΩ3.0 30 V/
µ
s
tPHL
tPLH
VCC = VDD = VSS = 0 V
VOUT = ±2 V
Standby Output Transfer Time tDAZ RL = 3 kΩ, CL = 2 500 pF,Note 10 410
µ
s
Standby Output Transfer Time tDZA RL = 3 kΩ, CL = 2 500 pF,Note 10 13ms
Power-On Output Transfer Time tPRA RL = 3 kΩ, CL = 2 500 pF,Note 11 13ms
* The TYP. values are for reference at TA = 25 °C.
Propagation Delay TimeNote 9 RL = 3 kΩ, CL = 2 500 pF 2.5
µ
s
Output Resistor RO300 Ω
Slew-RateNote 9 SR
3.3 V
0.6 V
2.4 V
0.6 V
0.6 V 0.6 V
2.4 V
0.6 V
4.5 V
3.6 V
4.5 V
3.6 V
t
SCH
t
CHS
t
SCH
t
CHS
t
SC
t
CS
t
SC
t
CS
5 V
0.6 V
0 V
3.3 V
5 V
0 V
STBY
V
CHA
V
CC
3.3 V
7
µ
PD4722
5 V mode (unless otherwise specified, VCHA = L, VCC = +5.0 V ± 10 %)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Low-Level Input Voltage VIL 0.8 V
High-Level Input Voltage VIH 2.0 V
Low-Level Input Current IIL VCC = +5.5 V, VI = 0 V –40
µ
A
High-Level Input Current IIH VCC = +5.5 V, VI = 5.5 V 1.0
µ
A
VCC = +5.0 V, RL = ∞, TA = 25 °C±9.7 V
VCC = +5.0 V, RL = 3 kΩ, TA = Topt ±6.0 V
VCC = +4.5 V, RL = 3 kΩ, TA = Topt ±5.0 V
Output Short-Circuit Current ISC VCC = +5.0 V, for GND ±40 mA
CL = 10 pF, RL = 3 to 7 kΩ4.0 30 V/
µ
s
CL = 2 500 pF, RL = 3 to 7 kΩ4.0 30 V/
µ
s
tPHL
tPLH
VCC = VDD = VSS = 0 V
VOUT = ±2 V
Standby Output Transfer Time tDAZ RL = 3 kΩ, CL = 2 500 pF,Note 10 410
µ
s
Standby Output Transfer Time tDZA RL = 3 kΩ, CL = 2 500 pF,Note 10 0.5 1 ms
Power-On Output Transfer Time tPRA RL = 3 kΩ, CL = 2 500 pF,Note 12 0.5 1 ms
* The TYP. values are for reference at TA = 25 °C.
Note 9. Measuring point
Slew-RateNote 9 SR
Propagation Delay TimeNote 9 RL = 3 kΩ, CL = 2 500 pF 2
µ
s
Output Resistor RO300 Ω
Output Voltage VDO
0.8 V 2.0 V
+5 V
+3 V
–3 V
SR+ SR–
–3 V
+3 V
–5 V
t
PLH
t
PHL
V
CC
0 V
V
DO
+
V
DO
–
D
IN
D
OUT
8
µ
PD4722
Note 10. Measuring point
Note 11. Measuring point
Note 12. Measuring point
Driver outputs are indefinite during transition time (tDZA).
0.6 V
2.4 V
+5 V
–5 V
+5 V
–5 V
High-impedance
t
DAZ
t
DZA
V
CC
0 V
V
DO
+
V
DO
–
STBY
D
OUT
Driver outputs are indefinite during transition time (tPRA).
High-impedance
3.0 V
3.3 V
0 V
V
CC
V
DO
+
V
DO
–
D
OUT
+5 V
–5 V
t
PRA
Driver outputs are indefinite during transition time (tPRA).
High-impedance
4.5 V
5 V
0 V
V
CC
V
DO
+
V
DO
–
D
OUT
+5 V
–5 V
t
PRA
9
µ
PD4722
ELECTRICAL SPECIFICATIONS (RECEIVER)
(UNLESS OTHERWISE SPECIFIED, VCC = 3.0 to 5.5 V, TA = –40 to +85 °C, C1 to C 5 = 1
µ
F)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Low-Level Output Voltage VOL1 IOUT = 4 mA, STBY = H 0.4 V
High-Level Output Voltage VOH1 IOUT = –4 mA, STBY = H VCC – 0.4 V
Low-Level Output Voltage VOL2 IOUT = 4 mA, STBY = L 0.5 V
High-Level Output Voltage VOH2 IOUT = –4 mA, STBY = L VCC – 0.5 V
Propagation Delay Time tPHL RIN → ROUT, CL = 150 pF
(STBY = H) tPLH VCC = +3.0 V,Note 13
Propagation Delay Time tPHL RIN → ROUT, CL = 150 pF
(STBY = L) tPLH VCC = +3.0 V,Note 14
Propagation Delay Time tPHA EN → ROUT, CL = 150 pF
(STBY = L) tPAH VCC = +3.0 V,Note 15
Input Resistor RI3 5.5 7 kΩ
Input Pin Open Voltage VIO 0.5 V
VIH VCC = +3.0 to +5.5 V 1.7 2.3 2.7 V
VIL VCC = +3.0 to +5.5 V 0.7 1.1 1.7 V
VHVCC = +3.0 to +5.5 V (Hysteresis width) 0.5 1.2 1 .8 V
VIH VCC = +3.0 to +5.5 V, RIN3, RIN4 2.7 1.5 V
VIL VCC = +3.0 to +5.5 V, RIN3, RIN4 1.5 0.7 V
Standby Output Transfer Time tDAH Note 16 0.2 3
µ
s
VCHA = H (3 V mode)Note 16 0.6 3 ms
VCHA = L (5 V mode)Note 16 0.3 1 ms
VCHA = H (3 V mode)Note 17 13ms
VCHA = L (5 V mode)Note 18 0.5 1 ms
* The TYP. values are for reference at TA = 25 °C.
0.2
µ
s
0.1
µ
s
100 300 ns
Standby Output Transfer Time tDHA
Power-On Reset Release Time tPRA
Input Threshold
(STBY = L, EN = H)
Input Threshold (STBY = H)
10
µ
PD4722
Note 13. Measuring point
Note 14. Measuring point
Note 15. Measuring point
0.7 V 2.7 V
2.0 V 0.8 V
t
PLH
t
PHL
+3 V
0 V
–3 V
V
OH
V
OL
R
IN
R
OUT
+3 V
0 V
–3 V
V
OH
V
OL
R
IN
R
OUT
2.0 V 0.8 V
0.7 V 2.7 V
t
PLH
t
PHL
2.4 V 0.6 V
0.8 V
2.0 V
t
PHA
t
PAH
V
CC
0 V
V
OH
V
OL
EN
R
OUT
STBY = L
11
µ
PD4722
Note 16. Measuring point
Note 17. Measuring point
Note 18. Measuring point
Receiver outputs are indefinite during transition time (tDHA).
Receiver outputs are indefinite during reset release time (tPRA).
Receiver outputs are indefinite during reset release time (tPRA).
REFERENCE MATERIAL
• IC PACKAGE MANUAL (C10943X)
• NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212)
0.6 V 2.4 V
2.0 V 0.8 V
t
DAH
t
DHA
V
CC
0 V
V
OH
V
OL
STBY
R
OUT
0 V
V
OH
V
OL
3.3 V
V
CC
R
OUT
3.0 V
0.8 V
t
PRA
0 V
V
OH
V
OL
5 V
V
CC
R
OUT
4.5 V
0.8 V
t
PRA
12
µ
PD4722
RECOMMENDED SOLDERING CONDITIONS
The following conditions (See table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
under different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SMT MANUAL” (C10535E).
µ
PD4722 GS-GJG
Soldering process Soldering conditions Symbol
Peak package’s surface temperature: 230 °C or below,
Infrared ray reflow Reflow time: 30 seconds or below (210 °C or higher), IR30-00-2
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
VPS Number of reflow process: 2, VP15-00-2
Exposure limit*: None
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Wave soldering Number of flow process: 1, WS60-00-1
Exposure limit*: None
Terminal temperature: 300 °C or below,
Partial heating method Flow time: 10 seconds or below,
Exposure limit*: None
*Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”
13
µ
PD4722
PACKAGE DRAWINGS
P30GS-65-300B-1
ITEM MILLIMETERS INCHES
NOTE
Each lead centerline is located within 0.10
mm (0.004 inch) of its true position (T.P.) at
maximum material condition.
10.11 MAX.
0.51 MAX.
0.65 (T.P.)
0.30
0.125±0.075
2.0 MAX.
1.7±0.1
8.1±0.2
6.1±0.2
1.0±0.2
0.15
0.5±0.2
0.10
0.10
0.398 MAX.
0.020 MAX.
0.026 (T.P.)
0.012
0.005±0.003
0.079 MAX.
0.067±0.004
0.319±0.008
0.240±0.008
0.039
0.006
0.020
0.004
0.004
+0.008
–0.009
A
B
C
D
E
F
G
H
I
J
K
L
M
N
+0.10
–0.05
+0.10
–0.05 +0.004
–0.002
+0.004
–0.003
+0.009
–0.008
30 PIN PLASTIC SHRINK SOP (300 mil)
30
I
M
M
D
C N
K
detail of lead end
E
F
G
B
H
L
J
16
A
1 15
3°
+7°
–3°
14
µ
PD4722
[MEMO]
15
µ
PD4722
[MEMO]
16
µ
PD4722
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5