SEMICONDUCTOR TECHNICAL DATA The MC10H180 is a high-speed, low-power, general-purpose adder/ subtractor. It is designed to be used in special purpose adders/subtractors or in high-speed multiplier arrays. Inputs for each adder are Carry-in, Operand A, and Operand B; outputs are Sum, Sum and Carry-out. The common select inputs serve as a control line to Invert A for subtract, and a control line to Invert B. L SUFFIX CERAMIC PACKAGE CASE 620-10 * Propagation Delay, 1.8 ns Typical, Operand and Select to Output * Power Dissipation, 360 mW Typical * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible P SUFFIX PLASTIC PACKAGE CASE 648-08 FN SUFFIX PLCC CASE 775-02 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI -8.0 to 0 Vdc 0 to VEE Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 C -55 to +150 -55 to +165 C C Storage Temperature Range -- Plastic -- Ceramic LOGIC DIAGRAM 7 9 5 6 4 SELA S0 S0 SELB AO BO CIN COUT 15 2 14 1 11 10 12 SELA S1 S1 SELB A1 B1 CIN COUT ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note) 0 25 75 Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE -- 95 -- 86 -- 95 mA -- -- -- 665 515 410 -- -- -- 417 320 255 -- -- -- 417 320 255 0.5 -- 0.5 -- 0.3 -- A Input Current High Pins 4, 12 Pins 7, 9 Pins 5, 6, 10, 11 IinH Input Current Low IinL VOH High Output Voltage A -1.02 -0.84 -0.98 -0.81 -0.92 -0.735 Vdc -1.95 -1.63 -1.95 -1.63 -1.95 -1.60 Vdc High Input Voltage (1) VOL VIH -1.17 -0.84 -1.13 -0.81 -1.07 -0.735 Vdc Low Input Voltage (1) VIL -1.95 -1.48 -1.95 -1.48 -1.95 -1.45 Vdc Low Output Voltage Rise Time Fall Time tpd POSITIVE LOGIC ONLY A' = A SELA = A SELA B' = B SELB = B SELB S = CIN (A' B' + A' B') + CIN(A' B' + A' B') COUT = CINA' + CINB' + A' B' tr tf 2.4 2.2 1.6 0.7 0.7 0.4 2.5 2.3 1.7 0.8 0.8 0.4 2.8 2.6 1.8 0.5 2.0 0.5 2.1 0.5 2.2 ns 0.5 2.0 0.5 2.1 0.5 2.2 ns DIP PIN ASSIGNMENT ns 0.6 0.6 0.4 13 VCC = PIN 16 VEE = PIN 8 AC PARAMETERS Propagation Delay Operand to Output Select to Output Carry-in to Output 3 NOTES: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts. S1 1 16 S0 2 15 VCC S0 COUT 3 14 S1 CIN 4 13 A0 5 12 COUT CIN B0 6 11 A1 SELA 7 10 B1 VEE 8 9 SELB Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 2-271 REV 5 MC10H180 FUNCTION SELECT TABLE SelA H H L L Function SelB S = A plus B H L H L MOTOROLA S = A minus B S = B minus A S = 0 minus A minus B TRUTH TABLE INPUTS INPUTS FUNCTION FUNCTION SelA SelB ADD H H H H H H H H H H H H H H H H A0 B0 L L L L H H H H L L H H L L H H L H L H L H L H L H H L H L L H H L L H L H H L L L L H L H H H SUBTRACT H H H H H H H H L L L L L L L L L L L L H H H H L L H H L L H H L H L H L H L H H L L H L H H L L H H L H L L H L H L L H H L H 2-272 Cin S0 S0 Cout REVERSE SUBTRACT SelA SelB L L L L L L L L H H H H H H H H A0 B0 L L L L H H H H L L H H L L H H Cin L H L H L H L H S0 S0 Cout H L L H L H H L L H H L H L L H L H H H L L L H L L L L L L L L L L L L L L L L L L L L H H H H L L H H L L H H L H L H L H L H L H H L H L L H H L L H L H H L H H L H L H L L MECL Data DL122 -- Rev 6 MC10H180 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C 0.007 (0.180) M T L-M B Y BRK -N- U N S 0.007 (0.180) M T L-M S S N S D -L- -M- Z W 20 D 1 V 0.010 (0.250) G1 X S T L-M S N S VIEW D-D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z C H -T- SEATING PLANE F VIEW S G1 0.010 (0.250) S T L-M S 0.007 (0.180) M T L-M S N S VIEW S S N S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 -- Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L-M 2-273 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 --- MOTOROLA MC10H180 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V -A- 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. -B- C L DIM A B C D E F G H K L M N -T- K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M -A- 9 1 8 B F C L S -T- SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 5405; Denver, Colorado 80217. 1-800-441-2447 JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MOTOROLA 2-274 MC10H180/D MECL Data DL122 -- Rev 6