SLOS099E - OCTOBER 1983 - REVISED MAY 2004 D Low Noise D No External Components Required D Replace Chopper Amplifiers at a Lower D D D OR P PACKAGE (TOP VIEW) OFFSET N1 IN- IN+ VCC- Cost Wide Input-Voltage Range . . . 0 to 14 V Typ Wide Supply-Voltage Range . . . 3 V to 18 V 1 8 2 7 3 6 4 5 OFFSET N2 VCC+ OUT NC NC -No internal connection description/ordering information These devices offer low offset and long-term stability by means of a low-noise, chopperless, bipolar-input-transistor amplifier circuit. For most applications, external components are not required for offset nulling and frequency compensation. The true differential input, with a wide input-voltage range and outstanding common-mode rejection, provides maximum flexibility and performance in high-noise environments and in noninverting applications. Low bias currents and extremely high input impedances are maintained over the entire temperature range. The OP07 is unsurpassed for low-noise, high-accuracy amplification of very-low-level signals. These devices are characterized for operation from 0C to 70C. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE TA PDIP (P) 0C to 70C SOIC (D) TOP-SIDE MARKING Tube of 50 OP07CP OP07CP Tube of 50 OP07DP OP07DP Tube of 75 OP07CD Reel of 2500 OP07CDR Tube of 75 OP07DD Reel of 2500 OP07DDR OP07C OP07D Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. symbol OFFSET N1 IN+ IN- OFFSET N2 1 3 2 + 6 OUT - 8 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" #$ # % & ## '($ # ) # "( "# ) "" $ POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLOS099E - OCTOBER 1983 - REVISED MAY 2004 schematic 7 OFFSET N1 OFFSET N2 1 8 6 IN+ IN- VCC+ OUT 3 2 COMPONENT COUNT Resistors Transistors Capacitors 28 39 4 4 VCC- absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage: VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V VCC- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -22 V Differential input voltage (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Input voltage, VI (either input, see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, JA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC- . 2. Differential voltages are at IN+ with respect to IN-. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or to either power supply. 5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Selecting the maximum of 150C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLOS099E - OCTOBER 1983 - REVISED MAY 2004 recommended operating conditions VCC VIC Supply voltage TA Operating free-air temperature VCC = 15 V Common-mode input voltage POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MIN MAX UNIT V 3 18 -13 13 V 0 70 C 3 4 8 100 25C 25C 25C Peak output voltage Large-signal differential voltage amplification Unity-gain bandwidth Input resistance Common-mode rejection ratio Supply-voltage sensitivity (VIO/VCC) Power dissipation VOM AVD B1 ri CMRR POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 kSVS PD RS = 50 RL = 2 k 25C 0C to 70C 25C 0C to 70C 0C to 70C 25C 97 0.4 100 120 100 4 80 10 7 120 120 33 0.6 400 400 400 8 150 51 32 50 13 94 94 7 0.4 100 120 11 11.5 12 13 4 80 10 7 106 110 31 0.6 400 400 400 12.6 12 12.8 13 13.5 14 18 3 2 12 1.6 8 150 51 32 50 14 12 50 8 6 2.5 250 150 MAX mW V/V V/V dB M MHz V/mV V V pA/C nA pA/C nA mV V/mo V/C V V UNIT All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise noted. NOTE 7: Since long-term drift cannot be measured on the individual devices prior to shipment, this specification is not intended to be a warranty. It is an engineering estimate of the averaged trend line of drift versus time over extended periods after the first 30 days of operation. VO = 0, No load VCC = 3 V, VO = 0, No load VCC = 3 V to 18 V, RS = 50 VIC = 13 V, VO = 10 V, 25C 12.6 11 RL 2 k VCC = 3 V, VO = 0.5 V, RL 500 k 12 0C to 70C 13 12.8 RL 1 k 12 11.5 RL 2 k 25C 25 C RL 10 k 13.5 13 0C to 70C Common-mode input voltge range VICR 14 13 25C 18 9 2.2 0C to 70C 0C to 70C 50 7 12 1.8 8 25C 1.6 0C to 70C 0C to 70C 4 0.8 4 0.8 0.7 85 60 TYP OP07D 25C 6 MIN 25C 1.8 250 150 MAX 0.5 0.5 85 60 TYP OP07C 0.4 0C to 70C 0C to 70C 25C MIN Temperature coefficient of input bias current Input bias current IIB See Figure 1 RS = 50 RS = 50 TA a I IB Temperature coefficient of input offset current a I IO RS = 20 k, Offset adjustment range Input offset current See Note 6 Long-term drift of input offset voltage IIO VO = 0, Temperature coefficient of input offset voltage a V IO VO = 0, Input offset voltage TEST CONDITIONS VIO PARAMETER electrical characteristics at specified free-air temperature, VCC = 15 V (unless otherwise noted) *+ * * SLOS099E - OCTOBER 1983 - REVISED MAY 2004 SLOS099E - OCTOBER 1983 - REVISED MAY 2004 operating characteristics, VCC = 15 V, TA = 25C OP07C OP07D TYP TYP f = 10 Hz 10.5 10.5 f = 100 Hz 10.2 10.3 TEST CONDITIONS PARAMETER Vn Equivalent input noise voltage 9.8 9.8 VN(PP) Peak-to-peak equivalent input noise voltage f = 0.1 Hz to 10 Hz 0.38 0.38 f = 10 Hz 0.35 0.35 In Equivalent input noise current f = 100 Hz 0.15 0.15 f = 1 kHz 0.13 0.13 IN(PP) Peak-to-peak equivalent input noise current 15 15 f = 1 kHz f = 0.1 Hz to 10 Hz SR Slew rate RL 2 k 0.3 0.3 All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise noted. UNIT nV/Hz V pA/Hz pA V/s APPLICATION INFORMATION 20 k VCC+ OFFSET N1 1 IN+ IN- 3 2 OFFSET N2 8 + 7 6 OUT - 4 VCC- Figure 1. Input Offset-Voltage Null Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp OP-07DPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP-07DPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP-07DPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type OP07CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type OP07DD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OP07DP ACTIVE PDIP P 8 50 Pb-Free (RoHS) Addendum-Page 1 CU NIPDAU N / A for Pkg Type (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2011 Orderable Device OP07DPE4 Status (1) ACTIVE Package Type Package Drawing PDIP P Pins 8 Package Qty 50 Eco Plan (2) Pb-Free (RoHS) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OP-07DPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 OP07CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OP07DDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OP-07DPSR SO PS 8 2000 367.0 367.0 38.0 OP07CDR SOIC D 8 2500 340.5 338.1 20.6 OP07DDR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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