DATA SHEET
ICS843441AG REVISION A MAY 18, 2011 1 ©2011 Integrated Device Technology, Inc.
FemtoClock® SAS/SATA Clock Generator ICS843441
General Description
The ICS843441 is a low jitter, high performance clock generator. The
ICS843441 is designed for use in applications using the SAS and
SATA interconnect. The ICS843441 uses an external, 25MHz,
parallel resonant crystal to generate four selectable output
frequencies: 75MHz, 100MHz, 150MHz, and 300MHz. This silicon
based approach provides excellent frequency stability and reliability.
The ICS843441 features down and center spread spectrum (SSC)
clocking techniques.
Additional Ordering Information
Features
Designed for use in SAS, SAS-2, and SATA systems
Center (±0.33%) Spread Spectrum Clocking (SSC)
Down (-0.30% or -0.60%) SSC
Better frequency stability than SAW oscillators
One differential 3.3V LVPECL output
Crystal oscillator interface designed for 25MHz
(CL = 18pF) frequency
External fundamental crystal frequency ensures high reliability
and low aging
Selectable output frequencies: 75MHz, 100MHz, 150MHz,
300MHz
Output frequency is tunable with external capacitors
RMS phase jitter: 1.33ps (typical)
3.3V operating supply
0°C to 70°C ambient operating temperature
Industrial temperature available upon request
Available in lead-free (RoHS 6) package
Part/Order Number Package Output Frequency
(MHz)
843441AG 16 TSSOP 75, 100, 150, 300
843441AM-75 8 SOIC 75
843441AM-100 8 SOIC 100
843441AM-150 8 SOIC 150
843441AM-300 8 SOIC 300
Block Diagrams
FemtoClock
PLL
OSC
nPLL_SEL
1
0
25MHz
XTAL
XTAL_IN
XTAL_OUT
00 = 75MHz
01 = 100MHz
10 = 150MHz
(default)
11 = 300MHz
Q
nQ
SSC_SEL(1:0)
F_ S E L( 1: 0)
SSC Output
Control Logic
16- Lead TSSOP
FemtoClock
PLL
OSC
25MHz
XTAL
XTAL_IN
XTAL_OUT
Q
nQ
SSC_SEL(1:0) SSC Output
Control Logic
8 - Lead SOIC
Pulldown
Pullup : Pulldown
Pulldown:Pulldown
Pulldown:Pulldown
Pin Assignments
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
nc
SSC_SEL0
XTAL_IN
XTAL_OUT
VEE F_SEL1
nPLL_SEL
nQ
Q
VCC
F_SEL0
V
CC
SSC_SEL1
VEE
nc
nc
ICS843441
16-Lead TSSOP
4.4mm x 5.0mm x 0.925mm package body
G Package
Top View
ICS843441
8-Lead SOIC, 150 Mil
3.90mm x 4.90mm x 1.375mm package body
M Package
Top View
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 2 ©2011 Integrated Device Technology, Inc.
Table 1A. Pin Descriptions (SOIC Package)
NOTE: Pullup/Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 1B. Pin Descriptions (TSSOP Package)
NOTE: Pullup/Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Number Name Type Description
1,
2
XTAL_OUT,
XTAL_IN Input Pullup Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the output.
3,
4
SSC_SEL0,
SSC_SEL1 Input Pulldown SSC select pins. See Table 3A. LVCMOS/LVTTL interface levels.
5V
CC Power Power supply pin.
6, 7 Q, nQ Output Differential clock outputs. LVPECL interface levels.
8V
EE Power Negative supply pin.
Number Name Type Description
1, 15 VEE Power Negative supply pins.
2,
3
XTAL_OUT,
XTAL_IN Input Pullup Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the output.
4,
8
SSC_SEL0,
SSC_SEL1 Input Pulldown SSC select pins. See Table 3A. LVCMOS/LVTTL interface levels.
5, 6, 7 nc Unused No connect pins.
9, 11 VCC Power Power supply pins.
10 F_SEL0 Input Pulldown Output frequency select pin. See Table 3B. LVCMOS/LVTTL interface levels.
12, 13 Q, nQ Output Differential clock outputs. LVPECL interface levels.
14 nPLL_SEL Input Pulldown PLL Bypass pin. LVCMOS/LVTTL interface levels.
16 F_SEL1 Input Pullup Output frequency select pin. See Table 3B. LVCMOS/LVTTL interface levels.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
CIN Input Capacitance 4pF
RPULLDOWN Input Pulldown Resistor 51 k
RPULLUP Input Pullup Resistor 51 k
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 3 ©2011 Integrated Device Technology, Inc.
Function Tables
Table 3A. SSC_SEL[1:0] Function Table
Table 3B. F_SEL[1:0] Function Table
Table 3B applicable only for 16 Lead TSSOP package.
Inputs
ModeSSC_SEL1 SSC_SEL0
0 (default) 0 (default) SSC Off
0 1 0.60% Down-spread
1 0 0.30% Down-spread
1 1 0.33% Center-spread
Inputs
Output Frequency (MHz)F_SEL1 F_SEL0
00 75
01 100
1 (default) 0 (default) 150
11 300
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 4 ©2011 Integrated Device Technology, Inc.
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Table 4B. LVCMOS/LVTTL DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Table 4C. LVPECL DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
NOTE 1: Output termination with 50 to VCC – 2V.
Item Rating
Supply Voltage, VCC 4.6V
Inputs, VI, (LVCMOS)
XTAL_IN
Other Inputs
0V to VCC
-0.5V to VCC + 0.5V
Outputs, IO
Continuos Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
16 Lead TSSOP
8 Lead SOIC
81.2°C/W (0 mps)
96.0°C/W (0 lfpm)
Storage Temperature, TSTG -65°C to 150°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VCC Power Supply Voltage 3.135 3.3 3.465 V
IEE Power Supply Current 66 mA
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL Input Low Voltage -0.3 0.8 V
IIH
Input
High Current
F_SEL1 VCC = VIN = 3.465V 5 µA
SSC_SEL[0:1],
F_SEL0, nPLL_SEL VCC = VIN = 3.465V 150 µA
IIL
Input
Low Current
F_SEL1 VCC = 3.465V, VIN = 0V -150 µA
SSC_SEL[0:1],
F_SEL0, nPLL_SEL VCC = 3.465V, VIN = 0V -5 µA
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VOH Output High Voltage; NOTE 1 VCC – 1.4 VCC – 0.9 V
VOL Output Low Voltage; NOTE 1 VCC – 2.0 VCC – 1.7 V
VSWING Peak-to-Peak Output Voltage Swing 0.6 0.9 V
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 5 ©2011 Integrated Device Technology, Inc.
AC Electrical Characteristics
Table 5. AC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
NOTE: Using a 25MHz, 18pF quartz crystal.
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions.
NOTE 1: Please refer to the Phase Noise plots.
NOTE 2: Refer to Application Section for peak-to-peak jitter calculations.
NOTE 3: Tested per JEDEC 65B.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fOUT Output Frequency
F_SEL(1:0) = 00 75 MHz
F_SEL(1:0) = 01 100 MHz
F_SEL(1:0) = 10 150 MHz
F_SEL(1:0) = 11 300 MHz
tjit(Ø) RMS Phase Jitter
(Random); NOTE 1
75MHz,
Integration Range: 12kHz – 20 MHz 1.33 ps
100MHz,
Integration Range: 12kHz – 20MHz 1.39 ps
150MHz,
Integration Range: 12kHz – 20MHz 1.36 ps
300MHz,
Integration Range: 12kHz – 20MHz 1.37 ps
tjit(per) Period Jitter, RMS;
NOTE 2, 3
75MHz, SSC Off 4.15 ps
100MHz, SSC Off 4.05 ps
150MHz, SSC Off 4.15 ps
300MHz, SSC Off 4.25 ps
tjit(cc) Cycle-to-Cycle Jitter:
NOTE 3
75MHz, SSC Off 31 ps
100MHz, SSC Off 31 ps
150MHz, SSC Off 31 ps
300MHz, SSC Off 31 ps
tR / tFOutput Rise/Fall Time 20% to 80% 200 700 ps
odc Output Duty Cycle 45 55 %
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 6 ©2011 Integrated Device Technology, Inc.
Typical Phase Noise at 100MHz
NOTE: Measured on Aeroflex PN9000
Noise Power dBc
Hz
Offset Frequency (Hz)
100MHz
RMS Phase Jitter (Random)
12kHz to 20MHz = 1.39ps (typical)
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 7 ©2011 Integrated Device Technology, Inc.
Parameter Measurement Information
3.3V LVPECL Output Load AC Test Circuit
Output Rise/Fall Time
Cycle-to-Cycle Jitter
RMS Phase Jitter
Output Duty Cycle/Pulse Width/Period
RMS Period Jitter, Peak-to-Peak
SCOPE
Qx
nQx
LVPECL
VEE
VCC
2V
-1.3V ± 0.165V
20%
80% 80%
20%
tRtF
VSWING
nQ
Q
tcycle n tcycle n+1
tjit(cc) =
|
tcycle n – tcycle n+1
|
1000 Cycles
nQ
Q
Offset Frequency
f1f2
Phase Noise Plot
RMS Jitter = Area Under Curve Defined by the Offset Frequency Markers
Noise Power
tPW
tPERIOD
tPW
tPERIOD
odc = x 100%
nQ
Q
VOH
VREF
VOL
Mean Period
(First edge after trigger)
10,000 cycles
Reference Point
(Trigger Edge)
Histogram
t jit (pk-pk)
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 8 ©2011 Integrated Device Technology, Inc.
Applications Information
Recommendations for Unused Input Pins
Inputs:
LVCMOS Control Pins
All control pins have internal pullups and pulldowns; additional
resistance is not required but can be added for additional protection.
A 1k resistor can be used.
Overdriving the XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 1A. The XTAL_OUT pin can be left floating. The
maximum amplitude of the input signal should not exceed 2V and the
input edge rate can be as slow as 10ns. This configuration requires
that the output impedance of the driver (Ro) plus the series
resistance (Rs) equals the transmission line impedance. In addition,
matched termination at the crystal input will attenuate the signal in
half. This can be done in one of two ways. First, R1 and R2 in parallel
should equal the transmission line impedance. For most 50
applications, R1 and R2 can be 100. This can also be
accomplished by removing R1 and making R2 50. By overdriving
the crystal oscillator, the device will be functional, but note, the device
performance is guaranteed by using a quartz crystal.
Figure 1A. General Diagram for LVCMOS Driver to XTAL Input Interface
Figure 1B. General Diagram for LVPECL Driver to XTAL Input Interface
VCC XTAL_OUT
XTAL_IN
R1
100
R2
100
Zo = 50 ohmsRs
Ro
Zo = Ro + Rs
C1
.1uf
LVCMOS Driver
XTA L _ O U T
XTA L _ I N
Zo = 50 ohms C2
.1uf
LVPECL Driver
Zo = 50 ohms
R1
50
R2
50
R3
50
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 9 ©2011 Integrated Device Technology, Inc.
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
The differential outputs are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50
transmission lines. Matched impedance techniques should be used
to maximize operating frequency and minimize signal distortion.
Figures 2A and 2B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and clock
component process variations.
Figure 2A. 3.3V LVPECL Output Termination Figure 2B. 3.3V LVPECL Output Termination
3.3V
VCC - 2V
R1
50
R2
50
RTT
Zo = 50
Zo = 50
+
_
RTT = * Zo
1
((VOH + VOL) / (VCC – 2)) – 2
3.3V
LVPECL Input
R1
84
R2
84
3.3V
R3
125
R4
125
Zo = 50
Zo = 50
LVPECL Input
3.3V
3.3V
+
_
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 10 ©2011 Integrated Device Technology, Inc.
Schematic Example
Figure 3 shows an example of ICS843441 application schematic. In
this example, the device is operated at VCC = 3.3V. An 18pF parallel
resonant 25MHz crystal is used. The load capacitance C1 = 27pF
and C2 = 27pF are recommended for frequency accuracy.
Depending on the parasitics of the printed circuit board layout, these
values might require a slight adjustment to optimize the frequency
accuracy. Crystals with other load capacitance specifications can be
used. This will required adjusting C1 and C2.
As with any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance,
power supply isolation is required. The ICS843441 provides separate
power supplies to isolate noise from coupling into the internal PLL.
In order to achieve the best possible filtering, it is recommended that
the placement of the filter components be on the device side of the
PCB as close to the power pins as possible. If space is limited, the
0.1µF capacitor in each power pin filter should be placed on the
device side of the PCB and the other components can be placed on
the opposite side.
Power supply filter recommendations are a general guideline to be
used for reducing external noise from coupling into the devices. The
filter performance is designed for wide range of noise frequencies.
This low-pass filter starts to attenuate noise at approximately 10kHz.
If a specific frequency noise component is known, such as switching
power supply frequencies, it is recommended that component values
be adjusted and if required, additional filtering be added. Additionally,
good general design practices for power plane voltage stability
suggests adding bulk capacitances in the local area of all devices.
The schematic example focuses on functional connections and is not
configuration specific. Refer to the pin description and functional
tables in the datasheet to ensure the logic control inputs are properly
set.
Figure 3. ICS843441 Schematic Example
Optional
Y-Termination
Set Logic
Input to
'1'
C5
10uF
C2
27pF
R6
50
Zo = 50 Ohm
Logic Control Input Examples
+
-
SSC_SEL1
U1
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
VEE
XTAL_OUT
XTAL_IN
SSC_SEL0
nc
nc
nc
SSC_SEL1 VCC
F_SEL0
VCC
Q
nQ
nPLL_SEL
VEE
F_SEL1
XTAL_IN
BLM18BB221SN1
Ferrite Bead
1 2
RU1
1K
3.3V
XTAL_OUT
VCC
LVPECL Termination
F_SEL0
RD2
1K
nPLL_SEL
R2
133
Q
C3
0.1uF
To Logic
Input
pins
SSC_SEL0
R5
50
nQ
C1
27pF
R4
82.5
F_SEL1
RD1
Not Install
R7
50
R3
82.5
RU2
Not Install
+
-
Set Logic
Input to
'0'
C4
0.1uF
18pF
VCC
Zo = 50 Ohm
3.3V
R1
133
X1
25MHz
To Logic
Input
pins
C6
0.1uF
Zo = 50 Ohm
Zo = 50 Ohm
VCC
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 11 ©2011 Integrated Device Technology, Inc.
Peak-to-Peak Jitter Calculations
A standard deviation of a statistical population or data set is the
square root of its variance. A standard deviation is used to calculate
the probability of an anomaly or to predict a failure. Many times, the
term "root mean square" (RMS) is used synonymously for standard
deviation. This is accurate when referring to the square root of the
mean squared deviation of a signal from a given baseline and the
data set contains a Gaussian distribution with no deterministic
components. A low standard deviation indicates that the data set
tends to be close to the mean with little variation. A large standard
deviation indicates that the data set is spread out and has a large
variation from the mean.
A standard deviation is required when calculating peak-to-peak jitter.
Since true peak-to-peak jitter is random and unbounded, it is
important to always associate a bit error ratio (BER) when specifying
a peak-to-peak jitter limit. Without it, the specification is meaningless.
Given that a BER is application specific, many frequency timing
devices specify jitter as an RMS. This allows the peak-to-peak jitter
to be calculated for the specific application and BER requirement.
Because a standard deviation is the variation from the mean of the
data set, it is important to always calculate the peak-to-peak jitter
using the typical RMS value.
The table shows the BER with its appropriate RMS Multiplier. Once
the BER is chosen, the peak to peak jitter can be calculated by simply
multiplying the RMS multiplier with the typical RMS datasheet
specification. For example, if a 10-12 BER is required, multiply 14.260
times the typical jitter specification.
Jitter (peak-to-peak) = RMS Multiplier x RMS (typical)
This calculation is not specific to one type of Jitter classification. It
can be used to calculate BER on various types of RMS jitter. It is
important that the user understands their jitter requirement to ensure
they are calculating the correct BER for their jitter requirement.
BER RMS Multiplier
10-3 6.582
10-4 7.782
10-5 8.834
10-6 9.784
10-7 10.654
10-8 11.462
10-9 12.218
10-10 12.934
10-11 13.614
10-12 14.260
10-13 14.882
10-14 15.478
10-15 16.028
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 12 ©2011 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843441.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843441 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 66mA = 228.69mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.465V, with all outputs switching) = 228.69mW + 30mW = 258.69mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 96°C/W per Table 6B below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.259W * 96°C/W = 94.864°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6A. Thermal Resistance θJA for 16 Lead TSSOP, Forced Convection
Table 6B. Thermal Resistance θJA for 8 Lead SOIC, Forced Convection
θJA vs. Air Flow
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 81.2°C/W 73.9°C/W 70.2°C/W
θJA vs. Air Flow
Linear Feet per Second 0200500
Multi-Layer PCB, JEDEC Standard Test Boards 96°C/W 87°C/W 82°C/W
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 13 ©2011 Integrated Device Technology, Inc.
3. Calculations and Equations.
The purpose of this section is to calculate the power dissipation for the LVPECL output pair.
LVPECL output driver circuit and termination are shown in Figure 4.
Figure 4. LVPECL Driver Circuit and Termination
To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage of
VCC – 2V.
For logic high, VOUT = VOH_MAX = VCC_MAX – 0.9V
(VCC_MAX – VOH_MAX) = 0.9V
For logic low, VOUT = VOL_MAX = VCC_MAX – 1.7V
(VCC_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOH_MAX) = [(2V – (VCC_MAX – VOH_MAX))/RL] * (VCC_MAX – VOH_MAX) =
[(2V – 0.9V)/50] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOL_MAX) = [(2V – (VCC_MAX – VOL_MAX))/RL] * (VCC_MAX – VOL_MAX) =
[(2V – 1.7V)/50] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
VOUT
VCC
VCC - 2V
Q1
RL
50
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 14 ©2011 Integrated Device Technology, Inc.
Reliability Information
Table 7A. θJA vs. Air Flow Table for a 16 Lead TSSOP
Table 7B. θJA vs. Air Flow Table for a 8 Lead SOIC
Transistor Count
The transistor count for ICS843441 is: 6303
θJA vs. Air Flow
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 81.2°C/W 73.9°C/W 70.2°C/W
θJA vs. Air Flow
Linear Feet per Second 0200500
Multi-Layer PCB, JEDEC Standard Test Boards 96°C/W 87°C/W 82°C/W
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 15 ©2011 Integrated Device Technology, Inc.
Package Outline and Package Dimensions
Package Outline - G Suffix for 16-Lead TSSOP
Table 8A. Package Dimensions for 16 Lead TSSOP
Reference Document: JEDEC Publication 95, MO-153
Package Outline - M Suffix for 8 Lead SOIC
Table 8B. Package Dimensions for 8 Lead SOIC
Reference Document: JEDEC Publication 95, MS-012
All Dimensions in Millimeters
Symbol Minimum Maximum
N16
A1.20
A1 0.05 0.15
A2 0.80 1.05
b0.19 0.30
c0.09 0.20
D4.90 5.10
E6.40 Basic
E1 4.30 4.50
e0.65 Basic
L0.45 0.75
α
aaa 0.10
All Dimensions in Millimeters
Symbol Minimum Maximum
N8
A1.35 1.75
A1 0.10 0.25
B0.33 0.51
C0.19 0.25
D4.80 5.00
E3.80 4.00
e1.27 Basic
H5.80 6.20
h0.25 0.50
L0.40 1.27
α
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 16 ©2011 Integrated Device Technology, Inc.
Ordering Information
Table 9. Ordering Information
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
Part/Order Number Marking Package Shipping Packaging Temperature
843441AGLF 843441AL 16 Lead “Lead-Free” TSSOP Tube 0°C to 70°C
843441AGLFT 843441AL 16 Lead “Lead-Free” TSSOP 2500 Tape & Reel 0°C to 70°C
843441AM-75LF 3441A75L 8 Lead “Lead-Free” SOIC Tube 0°C to 70°C
843441AM-75LFT 3441A75L 8 Lead “Lead-Free” SOIC 2500 Tape & Reel 0°C to 70°C
843441AM-100LF 441A100L 8 Lead “Lead-Free” SOIC Tube 0°C to 70°C
843441AM-100LFT 441A100L 8 Lead “Lead-Free” SOIC 2500 Tape & Reel 0°C to 70°C
843441AM-150LF 441A150L 8 Lead “Lead-Free” SOIC Tube 0°C to 70°C
843441AM-150LFT 441A150L 8 Lead “Lead-Free” SOIC 2500 Tape & Reel 0°C to 70°C
843441AM-300LF 441A300L 8 Lead “Lead-Free” SOIC Tube 0°C to 70°C
843441AM-300LFT 441A300L 8 Lead “Lead-Free” SOIC 2500 Tape & Reel 0°C to 70°C
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product
for use in life support devices or critical medical instruments.
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
ICS843441AG REVISION A MAY 18, 2011 17 ©2011 Integrated Device Technology, Inc.
Revision History Sheet
Rev Table Page Description of Change Date
A T3A 3 SSC_SEL Function Table - updated Mode column. 5/18/11
ICS843441 Data Sheet FEMTOCLOCK® SAS/SATA CLOCK GENERATOR
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT
product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third
party owners.
Copyright 2011. All rights reserved.
6024 Silver Creek Valley Road
San Jose, California 95138
Sales
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
Fax: 408-284-2775
www.IDT.com/go/contactIDT
Technical Support
netcom@idt.com
+480-763-2056
We’ve Got Your Timing Solution