Order Now Product Folder Support & Community Tools & Software Technical Documents TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 TPS8269x High-Efficiency MicroSIPTM Step-Down Converter (Profile <1 mm) 1 Features * * * * * * * * * * * 1 * * 3 Description 2 Total Solution Size < 6.7 mm 95% Efficiency at 3-MHz Operation 23A Quiescent Current High Duty-Cycle Operation Best in Class Load and Line Transient 2% Total DC Voltage Accuracy Automatic PFM/PWM Mode Switching Low Ripple Light-Load PFM Mode Excellent AC Load Regulation Internal Soft Start, 200-s Start-Up Time Integrated Active Power-Down Sequencing (Optional) Current Overload and Thermal Shutdown Protection Sub 1-mm Profile Solution 2 Applications * * * * * Cell Phones, Smart-Phones Optical Data Modules Camera and Sensor Modules Wearable Devices LDO Replacement The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIPTM DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 A (typical) during light load operation. For noisesensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm x 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment. Device Information ORDER NUMBER PACKAGE BODY SIZE TPS82692SIP SIP (8) 2,9mm x 2,3mm TPS82693SIP SIP (8) 2,9mm x 2,3mm TPS826951SIP SIP (8) 2,9mm x 2,3mm TPS82697SIP SIP (8) 2,9mm x 2,3mm TPS82698SIP SIP (8) 2,9mm x 2,3mm . Simplified Schematic Efficiency vs Output Current TPS82693SIP 100.0 DC/DC Converter VIN SW GND FB CI ENABLE L 95.0 VOUT 2.85 V @ 800mA 90.0 CO EN MODE GND 85.0 MODE SELECTION Efficiency (%) VBAT 80.0 75.0 70.0 65.0 60.0 55.0 50.0 0.1 TPS82693 VOUT = 2.85V MODE = Low 1 10 Current (mA) 100 1000 G000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison ............................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 4 5 7.1 7.2 7.3 7.4 7.5 7.6 5 5 5 5 6 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information ................................................. Electrical Characteristics.......................................... Typical Characteristics .............................................. Parameter Measurement Information ................ 14 Detailed Description ............................................ 17 9.1 9.2 9.3 9.4 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 17 17 17 18 10 Application and Implementation........................ 20 10.1 Application Information.......................................... 20 10.2 Typical Application ................................................ 20 11 Power Supply Recommendations ..................... 21 12 Layout................................................................... 22 12.1 12.2 12.3 12.4 12.5 12.6 Layout Guidelines ................................................. Layout Example .................................................... Surface Mount Information ................................... Thermal And Reliability Information ...................... Package Summary................................................ MicroSIPTM ............................................................ 22 22 22 23 24 24 13 Device and Documentation Support ................. 25 13.1 13.2 13.3 13.4 13.5 Documentation Support ........................................ Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 25 14 Mechanical, Packaging, and Orderable Information ........................................................... 26 14.1 Tape and Reel Information ................................... 26 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (March 2014) to Revision C Page * Added text to Device Comparison table for the TPS826951 device special features ........................................................... 4 * Moved Tstg spec from Handling Ratings to Absolute Maximum Ratings table ....................................................................... 5 * Changed Handling Ratings table to ESD Ratings table ........................................................................................................ 5 Changes from Revision A (July 2013) to Revision B Page * Global format to new data sheet standard ............................................................................................................................ 1 * Changed TPS82692, TPS826951 devices to production status. .......................................................................................... 4 * Changed Ordering Information table to "Device Comparison" table with cross reference to the POA at end of document. .............................................................................................................................................................................. 4 * Moved Abs Max Ratings, Handling Ratings, Rec Oper Conditions, Thermal Info, and Elec Charactistics tables to the Specifications section ............................................................................................................................................................ 5 * Deleted Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82692 ........................ 7 * Added efficiency graphs for device TPS82692 ................................................................................................................... 11 2 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Changes from Original (March 2013) to Revision A Page * Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82697 .......................... 7 * Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS826951 ........................ 7 * Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82698 .......................... 7 * Added Power-save mode ripple voltage to electrical characteristics table for devices TPS826951, TPS82697, TPS82698 8 * Added Start-up time to electrical characteristics table for devices TPS826951, TPS82697, TPS82698............................... 8 * Added Efficiency vs Load Current Graph figure references to Table of Graphs. .................................................................. 9 * Added Transient Response Plots to Typical Characteristics for device TPS826951........................................................... 14 * Added AC Load Transient Response Plots to Typical Characteristics for devices TPS826951, TPS82698....................... 14 Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 3 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com 5 Device Comparison PART NUMBER OUTPUT VOLTAGE SPECIFIC FEATURE STATUS TPS82692 2.2 V 800mA peak output current, spread spectrum frequency modulation Production TPS82693 2.85 V 800mA peak output current, spread spectrum frequency modulation, output discharge Production TPS826951 2.5 V 800mA peak output current, spread spectrum frequency modulation, output discharge Production TPS82697 2.8 V 800mA peak output current Production TPS82698 3V 800mA peak output current, spread spectrum frequency modulation, output discharge Production 6 Pin Configuration and Functions 8-Bump SIP Package . SIP-8 (TOP VIEW) VOUT A1 A2 MODE B1 B2 GND C1 C2 A3 C3 SIP-8 (BOTTOM VIEW) VIN VIN EN EN GND GND A3 C3 A2 A1 VOUT B2 B1 MODE C2 C1 GND . . Pin Functions TERMINAL NAME VOUT NO. I/O DESCRIPTION A1 O Power output terminal. Apply output load between this terminal and GND. VIN A2, A3 I The VIN terminals supply current to the TPS8269xSIP's internal regulator. EN B2 I This is the enable terminal of the device. Connecting this terminal to ground forces the converter into shutdown mode. Pulling this terminal to VIN enables the device. This terminal must not be left floating and must be terminated. MODE B1 This is the mode selection terminal of the device. This terminal must not be I left floating and must be terminated. MODE = LOW: The device is operating in regulated frequency pulse width modulation mode (PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load currents. MODE = HIGH: Low-noise mode enabled, regulated frequency PWM operation forced. GND 4 C1, C2, C3 - Submit Documentation Feedback Ground terminal. Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Voltage at VIN (2) (3), SW (3) Input Voltage Voltage at VOUT (3) Voltage at EN, MODE Peak output current, IO (3) MIN MAX UNIT -0.3 6 V -0.3 3.6 V -0.3 VIN + 0.3 V 800 (4) mA TPS82692, TPS82693, TPS826951, TPS82697, TPS62698 (4) Power dissipation Internally limited Operating temperature range, TA (5) -40 85 Maximum internal operating temperature, TINT(max) Storage temperature, Tstg (1) (2) (3) (4) (5) C 125 -55 C 125 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Operation above 4.8 V input voltage is not recommended over an extended period of time. All voltage values are with respect to network ground terminal. Limit to 50% Duty Cycle over Lifetime. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (JA), as given by the following equation: TA(max)= TJ(max)-(JA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 105C. 7.2 ESD Ratings ESD VALUE UNIT Human body model (HBM) 2000 V Charged device model (CDM) 1000 V 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VIN IO MIN NOM MAX 2.3 (1) Input voltage range 4.8 TPS82692, TPS82693 TPS826951 TPS82697, TPS82698 Output current range Additional output capacitance (PFM/PWM) 0 Additional output capacitance (PWM) V 800 mA 4 F 7 F TA Ambient temperature -40 85 C TJ Operating junction temperature -40 125 C (1) 0 UNIT Operation above 4.8 V input voltage is not recommended over an extended period of time. 7.4 Thermal Information THERMAL METRIC (1) JA (1) Junction-to-ambient thermal resistance TPS82693/4/51/7/8/9 SIP (8-TERMINALS) 83 UNIT C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 5 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Thermal Information (continued) TPS82693/4/51/7/8/9 THERMAL METRIC (1) JCtop Junction-to-case (top) thermal resistance JB JT UNIT SIP (8-TERMINALS) 53 C/W Junction-to-board thermal resistance - C/W Junction-to-top characterization parameter - C/W JB Junction-to-board characterization parameter - C/W JCbot Junction-to-case (bottom) thermal resistance - C/W 7.5 Electrical Characteristics Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = -40C to 85C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = 25C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX 50 UNIT SUPPLY CURRENT IQ Operating quiescent current TPS8269x IO = 0mA. Device not switching 23 TPS8269x IO = 0mA, PWM mode 3.5 I(SD) Shutdown current TPS8269x EN = GND 0.2 7 A UVLO Undervoltage lockout threshold TPS8269x 2.05 2.1 V Thermal Shutdown TPS8269x 140 C Thermal Shutdown hysteresis TPS8269x 10 C ILIM Peak Output Current Limit TPS8269x 1000 mA ISC Short Circuit Output Current Limit TPS8269x 15 mA A mA Protection ENABLE, MODE VIH High-level input voltage VIL Low-level input voltage Ilkg Input leakage current 1 V TPS8269x Input connected to GND or VIN 0.4 V 0.01 1.5 A 3 3.3 MHz OSCILLATOR fSW 6 Oscillator frequency TPS8269x Submit Documentation Feedback IO = 0mA, PWM mode. TA = 25C 2.7 Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Electrical Characteristics (continued) Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = -40C to 85C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = 25C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 3.15V VIN 4.8V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 3.25V VIN 4.8V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 3.15V VIN 5.5V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 3.25V VIN 5.5V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 3.15V VIN 4.8V, 0mA IO 500 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 3.25V VIN 4.8V, 500mA IO 800 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 2.9V VIN 4.8V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 3.15V VIN 4.8V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 2.9V VIN 5.5V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 3.15V VIN 5.5V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 2.9V VIN 4.8V, 0mA IO 500 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 3.15V VIN 4.8V, 500mA IO 800 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 3.3V VIN 4.8V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 3.45V VIN 4.8V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 3.3V VIN 5.5V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 3.45V VIN 5.5V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 3.3V VIN 4.8V, 0mA IO 500 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 3.45V VIN 4.8V, 500mA IO 800 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 2.5V VIN 4.8V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 2.7V VIN 4.8V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 2.5V VIN 5.5V, 0mA IO 500 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 2.7V VIN 5.5V, 500mA IO 800 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 2.5V VIN 4.8V, 0mA IO 500 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 2.7V VIN 4.8V, 500mA IO 800 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V OUTPUT TPS82693 TPS82697 Regulated DC output voltage TPS826951 VOUT TPS82698 TPS82692 Line regulation VIN = VO + 0.5V (min 3.15V) to 5.5V IO = 200 mA Load regulation IO = 0mA to 800 mA Feedback input resistance TPS8269x Copyright (c) 2013-2015, Texas Instruments Incorporated 0.18 %/V -0.0002 %/mA 480 k Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 7 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Electrical Characteristics (continued) Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = -40C to 85C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA = 25C (unless otherwise noted). PARAMETER TEST CONDITIONS TPS82693 TPS826951 TPS82697 VO Power-save mode ripple voltage TPS82698 TPS82692 rDIS 8 TYP MAX UNIT IO = 1mA CO = 4.7F X5R 6.3V 0402 30 mVPP IO = 1mA CO = 4.7F X5R 6.3V 0402 65 mVPP IO = 1mA CO = 10F X5R 6.3V 0603 25 mVPP IO = 1mA CO = 10F X5R 6.3V 0603 22 mVPP 120 Discharge resistor for power-down sequence Start-up time MIN TPS82693 TPS826951 TPS82698 TPS82697 IO = 0mA, Time from active EN to VO 200 s TPS82692 IO = 0mA, Time from active EN to VO 160 s Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 7.6 Typical Characteristics Table 1. Table Of Graphs FIGURE Efficiency Peak-to-peak output ripple voltage VO DC output voltage Load transient response AC load transient response vs Load current (TPS82699 VOUT = 3.2V) Figure 1, Figure 2, Figure 3 vs Load current (TPS82693 VOUT = 2.85V) Figure 4, Figure 5, Figure 6 vs Load current (TPS82697 VOUT = 2.8V) Figure 7, Figure 8 vs Load current (TPS826951 VOUT = 2.5V) Figure 9, Figure 10 vs Load current (TPS82698 VOUT = 3.0V) Figure 11, Figure 12 vs Input Voltage (TPS82699 VOUT = 3.2V) Figure 15 vs Input Voltage (TPS82692 VOUT = 2.2V) Figure 41, Figure 42 vs Load current (TPS82699 VOUT = 3.2V) Figure 16, Figure 17 vs Load Current (TPS82699 VOUT = 3.2V) Figure 18 vs Load Current (TPS82693 VOUT = 2.85V) Figure 19, Figure 20 TPS82699 VOUT = 3.2V Figure 28, Figure 29, Figure 30 TPS826951 VOUT = 2.5V Figure 31, Figure 32 TPS82699 VOUT = 3.2V Figure 33, Figure 34, Figure 35, Figure 36 TPS826951 VOUT = 2.5V Figure 37, Figure 38, Figure 39, Figure 40 TPS82698 VOUT = 3.0V Figure 41, Figure 42, Figure 43 PFM/PWM boundaries vs Input voltage (TPS82699 VOUT = 3.2V) Figure 21 IQ Quiescent current vs Input voltage Figure 22 fs PWM switching frequency vs Input voltage (TPS82699 VOUT = 3.2V) Figure 23 Start-up Shut-Down Figure 1. TPS82699 Efficiency vs Load Current Copyright (c) 2013-2015, Texas Instruments Incorporated Figure 24, Figure 25 (TPS82699 VOUT = 3.2V) Figure 26 Figure 2. TPS82699 Efficiency vs Load Current Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 9 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Typical Characteristics (continued) 100.0 TPS82693 VOUT = 2.85V Efficiency (%) 90.0 80.0 70.0 VIN = 3.1V VIN = 3.2V VIN = 3.6V VIN = 4.2V VIN = 4.5V MODE = Low 60.0 0.1 90.0 90.0 80.0 80.0 70.0 70.0 60.0 60.0 Efficiency (%) Efficiency (%) 100.0 30.0 1000 TPS82693 VOUT = 2.85V 50.0 40.0 30.0 VIN = 3.1V (PFM/PWM) VIN = 3.2V (PFM/PWM) VIN = 3.6V (PFM/PWM) VIN = 4.2V (PFM/PWM) VIN = 4.5V (PFM/PWM) VIN = 3.6V (PWM) 20.0 10.0 100 Figure 4. TPS82693 Efficiency vs Load Current 100.0 40.0 10 Current (mA) G000 Figure 3. TPS82699 Efficiency vs Load Current 50.0 1 TPS82693 VOUT = 2.85V 0.0 0.1 1 10 Current (mA) 100 VIN = 3.1V VIN = 3.2V VIN = 3.6V VIN = 4.2V VIN = 4.5V 20.0 10.0 MODE = High 0.0 1000 1 10 100 1000 Current (mA) G000 G000 Figure 6. TPS82693 Efficiency vs Load Current 100.0 100.0 90.0 90.0 80.0 80.0 70.0 70.0 60.0 60.0 Efficiency (%) Efficiency (%) Figure 5. TPS82693 Efficiency vs Load Current 50.0 40.0 30.0 0.0 0.1 50.0 40.0 30.0 VIN = 3.1V (PFM/PWM) VIN = 3.2V (PFM/PWM) VIN = 3.6V (PFM/PWM) VIN = 4.2V (PFM/PWM) VIN = 4.5V (PFM/PWM) VIN = 3.6V (PWM) 20.0 10.0 TPS62697 VOUT = 2.8V TPS62697 VOUT = 2.8V 1 10 Current (mA) 100 VIN = 3.1V VIN = 3.2V VIN = 3.6V VIN = 4.2V VIN = 4.5V 20.0 10.0 MODE = High 1000 0.0 1 10 100 G000 Figure 7. Efficiency vs Load Current Forced PWM Operation For Device TPS82697 10 Submit Documentation Feedback 1000 Current (mA) G000 Figure 8. Efficiency vs Load Current Forced PWM Operation For Device TPS82697 Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Typical Characteristics (continued) 100.0 100.0 TPS626951 VOUT = 2.5V 90.0 90.0 80.0 70.0 Efficiency (%) Efficiency (%) 80.0 70.0 60.0 50.0 40.0 0.1 VIN = 2.9V VIN = 3.1V VIN = 3.4V VIN = 3.6V VIN = 3.8V VIN = 4.2V VIN = 4.5V TPS626951 VOUT = 2.5V MODE = Low 1 10 Current (mA) 100 60.0 50.0 40.0 VIN = 2.9V VIN = 3.1V VIN = 3.4V VIN = 3.6V VIN = 3.8V VIN = 4.2V VIN = 4.5V 30.0 20.0 10.0 MODE = High 0.0 1000 1 10 100 1000 Current (mA) G000 Figure 9. Efficiency vs Load Current PFM/PWM Operation For Device TPS826951 G000 Figure 10. Efficiency vs Load Current Forced PWM Operation For Device TPS826951 100.0 100.0 TPS82698 VOUT = 3.0V 90.0 90.0 80.0 70.0 Efficiency (%) Efficiency (%) 80.0 70.0 60.0 50.0 40.0 0.1 VIN = 3.1V VIN = 3.3V VIN = 3.6V VIN = 3.8V VIN = 4.0V VIN = 4.2V VIN = 4.8V TPS82698 VOUT = 3.0V MODE = Low 1 10 Current (mA) 100 60.0 50.0 40.0 VIN = 3.1V VIN = 3.3V VIN = 3.6V VIN = 3.8V VIN = 4.0V VIN = 4.2V VIN = 4.8V 30.0 20.0 10.0 MODE = High 0.0 1000 1 10 100 1000 Current (mA) G000 Figure 11. Efficiency vs Load Current PFM/PWM Operation For Device TPS82698 G000 Figure 12. Efficiency vs Load Current Forced PWM Operation For Device TPS82698 100.0 100.0 TPS82692 VOUT = 2.2V 90.0 90.0 80.0 70.0 Efficiency (%) Efficiency (%) 80.0 70.0 60.0 50.0 40.0 0.1 VIN = 2.9V VIN = 3.1V VIN = 3.4V VIN = 3.6V VIN = 3.8V VIN = 4.2V VIN = 4.5V TPS82692 VOUT = 2.2V MODE = Low 1 10 Current (mA) 100 60.0 50.0 40.0 VIN = 2.9V VIN = 3.1V VIN = 3.4V VIN = 3.6V VIN = 3.8V VIN = 4.2V VIN = 4.5V 30.0 20.0 10.0 MODE = High 1000 0.0 1 10 100 Figure 13. Efficiency vs Load Current PFM/PWM Operation For Device TPS82692 Copyright (c) 2013-2015, Texas Instruments Incorporated 1000 Current (mA) G000 G000 Figure 14. Efficiency vs Load Current PWM Operation For Device TPS82692 Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 11 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Typical Characteristics (continued) Figure 15. TPS82699 Efficiency vs Input Voltage Figure 16. TPS82699 Peak-To-Peak Output Ripple Voltage vs Load Current 3.264 VOUT = 3.2V MODE = High Voltage (V) 3.232 3.200 3.168 3.136 3.104 0.1 Figure 17. TPS82699 Peak-To-Peak Output Ripple Voltage vs Load Current VIN = 3.3V VIN = 3.4V VIN = 3.6V VIN = 3.9V VIN = 4.2V VIN = 4.8V 1 10 Current (mA) 100 1000 G000 Figure 18. TPS82699 DC Output Voltage vs Load Current 2.93 VOUT = 2.85V MODE = Low 2.92 VOUT = 2.85V MODE = High 2.86 2.91 2.90 2.85 2.89 2.83 Voltage (V) Voltage (V) 2.88 2.87 2.86 2.82 2.85 2.83 2.82 2.81 2.80 2.79 0.1 2.81 VIN = 3.1V VIN = 3.2V VIN = 3.3V VIN = 3.6V VIN = 4.5V 1 2.80 10 Current (mA) 100 1000 2.79 0.1 VIN = 3.1V VIN = 3.2V VIN = 3.3V VIN = 3.6V VIN = 4.5V 1 10 Current (mA) G000 Figure 19. TPS82693 DC Output Voltage vs Load Current 12 Submit Documentation Feedback 100 1000 G000 Figure 20. TPS82693dc Output Voltage vs Load Current Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Typical Characteristics (continued) 50 45 Always PWM Quiescent Current (A) 40 PFM to PWM Mode Change PWM to PFM Mode Change Always PFM 35 30 25 20 15 10 T = -40C T = +25C T = +85C 5 0 3.0 3.5 4.0 Supply Voltage (V) 4.5 5.0 G000 Figure 21. TPS82699 PFM/PWM Boundaries Figure 22. Quiescent Current vs Input Voltage VI = 3.6 V, VO = 3.2V, IO = 0mA MODE = Low Figure 23. TPS82699 PWM Switching Frequency vs Input Voltage Figure 24. TPS82699 Start-Up VI = 3.6 V, VO = 3.2V, Load = 0mA VI = 3.6 V, VO = 3.2V, RL = 39R MODE = Low MODE = Low Figure 25. TPS82699 Start-Up Copyright (c) 2013-2015, Texas Instruments Incorporated Figure 26. TPS82699 Shutdown Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 13 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com 8 Parameter Measurement Information TPS8269XSIP DC/DC Converter VBAT L VIN SW GND FB VOUT CI ENABLE CO EN MODE SELECTION MODE GND Figure 27. Circuit VI = 4.2 V, VO = 3.2V VI = 3.6 V, VO = 3.2V 10mA to 400mA Load Step 10mA to 400mA Load Step MODE = Low MODE = Low Figure 28. TPS8269 Load Transient Response In PFM/PWM Operation Figure 29. TPS82699 Load Transient Response In PFM/PWM Operation VI = 3.6 V, VO = 2.5V VI = 3.45 V, VO = 3.2V 10mA to 400mA Load Step 10mA to 400mA Load Step MODE = Low MODE = Low Figure 30. TPS82699 Load Transient Response In PFM/PWM Operation 14 Submit Documentation Feedback Figure 31. TPS826951 Load Transient Response In PFM/PWM Operation Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Parameter Measurement Information (continued) VI = 2.9 V, VO = 2.5V VI = 3.6 V, VO = 3.2 V 10mA to 400mA Load Step 5mA to 350mA Load Sweep MODE = Low Figure 32. TPS826951 Load Transient Response In PFM/PWM Operation VI = 3.45 V, VO = 3.2 V MODE = Low Figure 33. TPS82699 AC Load Transient Response VI = 3.6 V, VO = 3.2 V 5mA to 350mA Load Sweep 5mA to 500mA Load Sweep MODE = Low Figure 34. TPS82699 AC Load Transient Response MODE = Low Figure 35. TPS82699 AC Load Transient Response VI = 3.6 V, VO = 2.5 V VI = 3.45 V, VO = 3.2 V 5mA to 500mA Load Sweep 5mA to 500mA Load Sweep MODE = Low MODE = Low Figure 36. TPS82699 AC Load Transient Response Copyright (c) 2013-2015, Texas Instruments Incorporated Figure 37. TPS826951 AC Load Transient Response Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 15 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Parameter Measurement Information (continued) VI = 2.9 V, VO = 2.5 V VI = 3.6 V, VO = 2.5 V 5mA to 500mA Load Sweep 5mA to 800mA Load Sweep MODE = Low Figure 38. TPS826951 AC Load Transient Response MODE = Low Figure 39. TPS826951 AC Load Transient Response VI = 3.6 V, VO = 3.0 V VI = 3.6 V, VO = 2.5 V 5mA to 800mA Load Sweep 5mA to 800mA Load Sweep MODE = Low MODE = Low Figure 40. TPS826951 AC Load Transient Response Figure 41. TPS82698 AC Load Transient Response VI = 3.4 V, VO = 3.0 V VI = 3.3 V, VO = 3.0 V 5mA to 800mA Load Sweep 5mA to 500mA Load Sweep MODE = Low MODE = Low Figure 42. TPS82698 AC Load Transient Response 16 Submit Documentation Feedback Figure 43. TPS82698 AC Load Transient Response Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 9 Detailed Description 9.1 Overview The TPS8269xSIP is a standalone synchronous step-down converter operating at a regulated 3-MHz frequency pulse width modulation (PWM) at moderate to heavy load currents (up to 500 mA / 800mA output current). At light load currents, the TPS8269xSIP's converter operates in power-save mode with pulse frequency modulation (PFM). The converter uses a unique frequency locked ring oscillating modulator to achieve best-in-class load and line response. One key advantage of the non-linear architecture is that there is no traditional feedback loop. The loop response to change in VO is essentially instantaneous, which explains the transient response. Although this type of operation normally results in a switching frequency that varies with input voltage and load current, an internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating conditions. Combined with best in class load and line transient response characteristics, the low quiescent current of the device (ca. 23A) allows to maintain high efficiency at light load, while preserving fast transient response for applications requiring tight output regulation. The TPS8269xSIP integrates an input current limit to protect the device against heavy load or short circuits and features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. 9.2 Functional Block Diagram MODE EN VIN CI 4.7F DC/DC CONVERTER VIN Undervoltage Lockout Bias Supply Bandgap Soft-Start V REF = 0.8 V Negative Inductor Current Detect Power Save Mode Switching Thermal Shutdown Current Limit Detect Frequency Control R1 - L Gate Driver R2 Anti Shoot-Through VREF VOUT 1H CO 4.7F + Feedback Divider GND 9.3 Feature Description 9.3.1 Power-Save Mode If the load current decreases, the converter will enter power save mode operation automatically. During powersave mode the converter operates in discontinuous current (DCM) with a minimum of one pulse, which produces low output ripple compared with other PFM architectures. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 17 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Feature Description (continued) When in power-save mode, the converter resumes its operation when the output voltage trips below the nominal voltage. It ramps up the output voltage with a minimum of one pulse and goes into power-save mode when the output voltage is within its regulation limits again. PFM mode is left and PWM operation is entered as the output current can no longer be supported in PFM mode. As a consequence, the DC output voltage is typically positioned ca. 1.5% above the nominal output voltage and the transition between PFM and PWM is seamless. PFM Mode at Light Load PFM Ripple Nominal DC Output Voltage PWM Mode at Heavy Load Figure 44. Operation In PFM Mode And Transfer To PWM Mode 9.3.2 Mode Selection The MODE terminal allows to select the operating mode of the device. Connecting this terminal to GND enables the automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at moderate to heavy loads and in the PFM mode during light loads, which maintains high efficiency over a wide load current range. Pulling the MODE terminal high forces the converter to operate in the PWM mode even at light load currents. The advantage is that the converter operates with a fixed frequency that allows simple filtering of the switching frequency for noise-sensitive applications. In this mode, the efficiency is lower compared to the power-save mode during light loads. For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This allows efficient power management by adjusting the operation of the converter to the specific system requirements. 9.3.3 Soft Start The TPS8269xSIP has an internal soft-start circuit that limits the inrush current during start-up. This limits input voltage drops when a battery or a high-impedance power source is connected to the input of the MicroSIPTM converter. The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a function of the output voltage. This mode of operation continues for approximately 100s after enable. Should the output voltage not have reached its target value by that time, such as in the case of heavy load, the soft-start transitions to a second mode of operation. If the output voltage has raised above 0.5V (approximately), the converter increases the input current limit thereby enabling the power supply to come-up properly. The start-up time mainly depends on the capacitance present at the output node and load current. 9.4 Device Functional Modes 9.4.1 Low Dropout, 100% Duty Cycle Operation The device starts to enter 100% duty cycle mode once input and output voltage come close together. In order to maintain the output voltage, the DC/DC converter's high-side MOSFET is turned on 100% for one or more cycles. 18 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 Device Functional Modes (continued) With further decreasing VIN the high-side switch is constantly turned on, thereby providing a low input-to-output voltage difference. This is particularly useful in battery-powered applications to achieve longest operation time by taking full advantage of the whole battery voltage range. 9.4.2 Enable The TPS8269xSIP device starts operation when EN is set high and starts up with the soft start as previously described. For proper operation, the EN terminal must be terminated and must not be left floating. Pulling the EN terminal low forces the device into shutdown. In this mode, all internal circuits are turned off and VIN current reduces to the device leakage current, typically a few hundred nano amps. The TPS8269xSIP device can actively discharge the output capacitor when it turns off (See Device Comparison table). The integrated discharge resistor has a typical resistance of 100 . The required time to ramp-down the output voltage depends on the load current and the capacitance present at the output node. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 19 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com 10 Application and Implementation 10.1 Application Information The TPS8269X devices are complete power supplies, optimized for and working within the given specification range without additional components or design steps. Further improvements can be achieved as described below. 10.2 Typical Application 10.2.1 Input Capacitor Selection Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the system. For most applications, the input capacitor that is integrated into the TPS8269x should be sufficient. If the application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance to find a remedy. The TPS8269x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN terminal. This ringing can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance, additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the converter and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CI. 10.2.2 Output Capacitor Selection The advanced, fast-response, voltage mode, control scheme of the TPS8269x allows the use of a tiny ceramic output capacitor (CO). For most applications, the output capacitor integrated in the TPS8269x is sufficient. At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup during large load transitions. The TPS8269x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any additional capacitance. Adding a 4.7F ceramic output capacitor (X7R or X5R dielectric) generally works from a converter stability point of view, helps to minimize the output ripple voltage in PFM mode and improves the converter's transient response under when input and output voltage are close together. For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition), the TPS8269xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca. 1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC converter's output. In applications requiring additional output bypass capacitors located close to the load, care should be taken to ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment with additional low value series resistance (e.g. 50 to 100m) in the output path to find a remedy. Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) ...) that are temperature dependant, the converter small and large signal behavior must be checked over the input voltage range, load current range and temperature range. The easiest sanity test is to evaluate, directly at the converter's output, the following aspects: * * PFM/PWM efficiency PFM/PWM and forced PWM load transient response During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or ringing that helps judge the converter's stability. Without any ringing, the loop has usually more than 45 of phase margin. 20 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 11 Power Supply Recommendations The TPS8269X MicroSIPTM devices are fully featured point of load power supplies. Use information given in Application Information to connect input and output circuitry appropriately. Even if electrical characteristics are based on measurements up to VIN=5.5V, it is not recommended to operate at higher voltages than 4.8V permanently. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 21 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com 12 Layout 12.1 Layout Guidelines In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 45 shows the appropriate diameters for a MicroSiPTM layout. 12.2 Layout Example Figure 45. Recommended Land Pattern Image And Dimensions SOLDER PAD DEFINITIONS (1) (2) (3) (4) COPPER PAD Non-solder-mask defined (NSMD) 0.30mm (1) (2) (3) (4) (5) (6) SOLDER MASK OPENING 0.360mm (5) COPPER THICKNESS STENCIL (6) OPENING STENCIL THICKNESS 1oz max (0.032mm) 0.34mm diameter 0.1mm thick Circuit traces from non-solder-mask defined PWB lands should be 75m to 100m wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application. Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 m on top of the copper circuit pattern. For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control. 12.3 Surface Mount Information The TPS8269x MicroSIP DC/DC converter uses an open frame construction that is designed for a fully automated assembly process and that features a large surface area for pick and place operations. See the "Pick Area" in the package drawings. Package height and weight have been kept to a minimum thereby allowing the MicroSIP device to be handled similarly to a 0805 component. See JEDEC/IPC standard J-STD-20b for reflow recommendations. 22 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 12.4 Thermal And Reliability Information The TPS8269x output current may need to be de-rated if it is required to operate in a high ambient temperature or deliver a large amount of continuous power. The amount of current de-rating is dependent upon the input voltage, output power and environmental thermal conditions. Care should especially be taken in applications where the localized PWB temperature exceeds 65C. The TPS8269x die and inductor temperature should be kept lower than the maximum rating of 125C, so care should be taken in the circuit layout to ensure good heat sinking. Sufficient cooling should be provided to ensure reliable operation. Three basic approaches for enhancing thermal performance are listed below: * Improve the power dissipation capability of the PCB design. * Improve the thermal coupling of the component to the PCB. * Introduce airflow into the system. To estimate the junction temperature, approximate the power dissipation within the TPS8269x by applying the typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you have an actual TPS8269x device or a TPS8269x evaluation module. Then calculate the internal temperature rise of the TPS8269x above the surface of the printed circuit board by multiplying the TPS8269x power dissipation by the thermal resistance. The thermal resistance numbers listed in the Thermal Information table are based on modeling the MicroSIPTM package mounted on a high-K test board specified per JEDEC standard. For increased accuracy and fidelity to the actual application, it is recommended to run a thermal image analysis of the actual system. Figure 46 and Figure 47 are thermal images of TI's evaluation board with readings of the temperatures at specific locations on the device. TPWB = 27C Tinductor = 33C TPWB = 38C Tinductor = 53C Tcapacitor = 30C Tcapacitor = 30C Tcapacitor = 41C Tcapacitor = 39C Figure 46. V=3.6v, V=2.85v, I=400ma 80mw Power Dissipation At Room Temp.INOUTOUT Figure 47. V=3.6v, V=2.85v, I=800ma 330mw Power Dissipation At Room Temp.INOUTOUT The TPS8269x is equipped with a thermal shutdown that will inhibit power switching at high junction temperatures. The activation threshold of this function, however, is above 125C to avoid interfering with normal operation. Thus, it follows that prolonged or repetitive operation under a condition in which the thermal shutdown activates necessarily means that the components internal to the MicroSIP package are subjected to high temperatures for prolonged or repetitive intervals, which may damage or impair the reliability of the device. MLCC capacitor reliability/lifetime is depending on temperature and applied voltage conditions. At higher temperatures, MLCC capacitors are subject to stronger stress. On the basis of frequently evaluated failure rates determined at standardized test conditions, the reliability of all MLCC capacitors can be calculated for their actual operating temperature and voltage. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 23 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com Thermal And Reliability Information (continued) 10000 100000 VBias=5V VBias=4.35V VBias=3.6V VBias=3V 10000 Time (Thousand Hours) Time (Thousand Hours) 1000 100 10 1 1000 0.1 0.01 VBias=5V VBias=4.35V VBias=3.6V VBias=3V 100 10 1 20 40 60 80 100 120 Capacitor Case Temperature ( C) 0.1 140 20 40 60 80 100 120 Capacitor Case Temperature ( C) G000 140 G000 Figure 48. Capacitor Lifetime vs Capacitor Case Temperature Figure 49. Capacitor B1 Lifetime vs Capacitor Case Temperature Failures caused by systematic degradation can be described by the Arrhenius model. The most critical parameter (IR) is the Insulation Resistance (i.e. leakage current). The drop of IR below a lower limit (e.g., 1 M) is used as the failure criterion, see Figure 48. Figure 49 (B1 life) defines the capacitor lifetime based on a failure rate reaching 1%. Note that the wear-out mechanisms occurring in the MLCC capacitors are not reversible but cumulative over time. 12.5 Package Summary SIP Package TOP VIEW A1 BOTTOM VIEW YML D CC LSB C1 C2 B1 B2 A1 A2 C3 A3 E Code: * CC -- Customer Code (device/voltage specific) * YML -- Y: Year, M: Month, L: Lot trace code * LSB -- L: Lot trace code, S: Site code, B: Board locator spacing 12.6 MicroSIPTM DC/DC Module Package Dimensioning The TPS8269x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are: spacing * D = 2,30 0,05 mm * E = 2,90 0,05 mm 24 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation See ONET-10G-EVM 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS82692 Click here Click here Click here Click here Click here TPS82693 Click here Click here Click here Click here Click here TPS826951 Click here Click here Click here Click here Click here TPS82697 Click here Click here Click here Click here Click here TPS82698 Click here Click here Click here Click here Click here 13.3 Trademarks MicroSIP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 25 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 SLVSBF8C - MARCH 2013 - REVISED MAY 2015 www.ti.com 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14.1 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants 26 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TPS82692SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82692SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82693SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82693SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS826951SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS826951SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82697SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82697SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82698SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82698SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 TPS82692, TPS82693, TPS826951 TPS82697, TPS82698 www.ti.com SLVSBF8C - MARCH 2013 - REVISED MAY 2015 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS82692SIPR uSIP SIP 8 3000 223 194 35 TPS82692SIPT uSIP SIP 8 250 223 194 35 TPS82693SIPR uSIP SIP 8 3000 223 194 35 TPS82693SIPT uSIP SIP 8 250 223 194 35 TPS826951SIPR uSIP SIP 8 3000 223 194 35 TPS826951SIPT uSIP SIP 8 250 223 194 35 TPS82697SIPR uSIP SIP 8 3000 223 194 35 TPS82697SIPT uSIP SIP 8 250 223 194 35 TPS82698SIPR uSIP SIP 8 3000 223 194 35 TPS82698SIPT uSIP SIP 8 250 223 194 35 Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698 27 PACKAGE OPTION ADDENDUM www.ti.com 30-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TPS82692SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 E9 TXI692 TPS82692SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 E9 TXI692 TPS82693SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 W3 TXI693 TPS82693SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 W3 TXI693 TPS826951SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 DO TXI695 TPS826951SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 DO TXI695 TPS82697SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 C2 TXI697 TPS82697SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 C2 TXI697 TPS82698SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 WN TXI698 TPS82698SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 WN TXI698 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 30-Aug-2018 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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