TPS82698SIPT - Texas Instruments - Datasheet.Directory

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0.1 1 10 100 1000

Current (mA)

Efficiency (%)

TPS82693

VOUT = 2.85V

MODE = Low

G000

VIN SW

MODE

GND

VOUT

2.85 V @ 800mA

TPS82693SIP

VBAT

MODE

SELECTION

ENABLE

DC/DC Converter

GND

Product

Folder

Order

Now

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

TPS8269x High-Efficiency MicroSIP™ Step-Down Converter (Profile <1 mm)

1 Features

1• Total Solution Size < 6.7 mm2

• 95% Efficiency at 3-MHz Operation

• 23μA Quiescent Current

• High Duty-Cycle Operation

•Best in Class Load and Line Transient

• ±2% Total DC Voltage Accuracy

• Automatic PFM/PWM Mode Switching

• Low Ripple Light-Load PFM Mode

• Excellent AC Load Regulation

• Internal Soft Start, 200-µs Start-Up Time

• Integrated Active Power-Down Sequencing

(Optional)

• Current Overload and Thermal Shutdown

Protection

• Sub 1-mm Profile Solution

2 Applications

• Cell Phones, Smart-Phones

• Optical Data Modules

• Camera and Sensor Modules

• Wearable Devices

• LDO Replacement

3 Description

The TPS8269xSIP device is a complete 500 mA /

800 mA, DC/DC step-down power supply intended for

low-power applications. Included in the package are

the switching regulator, inductor and input/output

capacitors. No additional components are required to

finish the design. The TPS8269xSIP is based on a

high-frequency synchronous step-down dc-dc

converter optimized for battery-powered portable

applications. The MicroSIP™ DC/DC converter

operates at a regulated 3-MHz switching frequency

and enters the power-save mode operation at light

load currents to maintain high efficiency over the

entire load current range. The PFM mode extends the

battery life by reducing the quiescent current to 23 μA

(typical) during light load operation. For noise-

sensitive applications, the device has PWM spread

spectrum capability providing a lower noise regulated

output, as well as low noise at the input. These

features, combined with high PSRR and AC load

regulation performance, make this device suitable to

replace a linear regulator to obtain better power

conversion efficiency. The TPS8269xSIP is packaged

in a compact (2.9 mm × 2.3 mm) and low profile (1

mm) BGA package suitable for automated assembly

by standard surface mount equipment.

Device Information

ORDER NUMBER PACKAGE BODY SIZE

TPS82692SIP µSIP (8) 2,9mm × 2,3mm

TPS82693SIP µSIP (8) 2,9mm × 2,3mm

TPS826951SIP µSIP (8) 2,9mm × 2,3mm

TPS82697SIP µSIP (8) 2,9mm × 2,3mm

TPS82698SIP µSIP (8) 2,9mm × 2,3mm

Simplified Schematic Efficiency vs Output Current

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison ............................................... 4

6 Pin Configuration and Functions......................... 4

7 Specifications......................................................... 5

7.1 Absolute Maximum Ratings ...................................... 5

7.2 ESD Ratings.............................................................. 5

7.3 Recommended Operating Conditions....................... 5

7.4 Thermal Information ................................................. 5

7.5 Electrical Characteristics.......................................... 6

7.6 Typical Characteristics.............................................. 9

8 Parameter Measurement Information ................ 14

9 Detailed Description............................................ 17

9.1 Overview................................................................. 17

9.2 Functional Block Diagram....................................... 17

9.3 Feature Description................................................. 17

9.4 Device Functional Modes........................................ 18

10 Application and Implementation........................ 20

10.1 Application Information.......................................... 20

10.2 Typical Application................................................ 20

11 Power Supply Recommendations ..................... 21

12 Layout................................................................... 22

12.1 Layout Guidelines ................................................. 22

12.2 Layout Example .................................................... 22

12.3 Surface Mount Information ................................... 22

12.4 Thermal And Reliability Information...................... 23

12.5 Package Summary................................................ 24

12.6 MicroSIP™............................................................ 24

13 Device and Documentation Support................. 25

13.1 Documentation Support ........................................ 25

13.2 Related Links ........................................................ 25

13.3 Trademarks........................................................... 25

13.4 Electrostatic Discharge Caution............................ 25

13.5 Glossary................................................................ 25

14 Mechanical, Packaging, and Orderable

Information........................................................... 26

14.1 Tape and Reel Information ................................... 26

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (March 2014) to Revision C Page

• Added text to Device Comparison table for the TPS826951 device special features ........................................................... 4

• Moved Tstg spec from Handling Ratings to Absolute Maximum Ratings table....................................................................... 5

• Changed Handling Ratings table to ESD Ratings table ........................................................................................................ 5

Changes from Revision A (July 2013) to Revision B Page

• Global format to new data sheet standard ............................................................................................................................ 1

• Changed TPS82692, TPS826951 devices to production status. .......................................................................................... 4

• Changed Ordering Information table to "Device Comparison" table with cross reference to the POA at end of

document. .............................................................................................................................................................................. 4

• Moved Abs Max Ratings, Handling Ratings, Rec Oper Conditions, Thermal Info, and Elec Charactistics tables to the

Specifications section ............................................................................................................................................................ 5

• Deleted Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82692........................ 7

• Added efficiency graphs for device TPS82692 ................................................................................................................... 11

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

www.ti.com

SLVSBF8C –MARCH 2013–REVISED MAY 2015

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Changes from Original (March 2013) to Revision A Page

• Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82697.......................... 7

• Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS826951........................ 7

• Added Regulated DC Output Voltage parameters to electrical characteristics table for device TPS82698.......................... 7

• Added Power-save mode ripple voltage to electrical characteristics table for devices TPS826951, TPS82697, TPS82698 8

• Added Start-up time to electrical characteristics table for devices TPS826951, TPS82697, TPS82698............................... 8

• Added Efficiency vs Load Current Graph figure references to Table of Graphs. .................................................................. 9

• Added Transient Response Plots to Typical Characteristics for device TPS826951........................................................... 14

• Added AC Load Transient Response Plots to Typical Characteristics for devices TPS826951, TPS82698....................... 14

SIP-8

(TOP VIEW)

SIP-8

(BOTTOMVIEW)

GND

MODE

VOUT

GND

VIN

GND

VIN

GND

VOUT

MODE

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

5 Device Comparison

PART NUMBER OUTPUT VOLTAGE SPECIFIC FEATURE STATUS

TPS82692 2.2 V 800mA peak output current, spread spectrum frequency modulation Production

TPS82693 2.85 V 800mA peak output current, spread spectrum frequency modulation,

output discharge Production

TPS826951 2.5 V 800mA peak output current, spread spectrum frequency modulation,

output discharge Production

TPS82697 2.8 V 800mA peak output current Production

TPS82698 3 V 800mA peak output current, spread spectrum frequency modulation,

output discharge Production

6 Pin Configuration and Functions

8-Bump µSIP Package

Pin Functions

TERMINAL I/O DESCRIPTION

NAME NO.

VOUT A1 O Power output terminal. Apply output load between this terminal and GND.

VIN A2, A3 I The VIN terminals supply current to the TPS8269xSIP's internal regulator.

EN B2 I This is the enable terminal of the device. Connecting this terminal to ground forces the converter

into shutdown mode. Pulling this terminal to VIN enables the device. This terminal must not be left

floating and must be terminated.

MODE B1 I

This is the

mode

selection

terminal of

the device.

This

terminal

must not be

left floating

and must be

terminated. MODE = LOW: The device is operating in regulated frequency pulse width modulation mode

(PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load

currents.

MODE = HIGH: Low-noise mode enabled, regulated frequency PWM operation forced.

GND C1, C2, C3 – Ground terminal.

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

www.ti.com

SLVSBF8C –MARCH 2013–REVISED MAY 2015

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Operation above 4.8 V input voltage is not recommended over an extended period of time.

(3) All voltage values are with respect to network ground terminal.

(4) Limit to 50% Duty Cycle over Lifetime.

(5) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105°C.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Input Voltage Voltage at VIN(2)(3), SW(3) –0.3 6 V

Voltage at VOUT(3) –0.3 3.6 V

Voltage at EN, MODE (3) –0.3 VIN + 0.3 V

Peak output current, IO(4)

TPS82692,

TPS82693,

TPS826951,

TPS82697,

TPS62698

800(4) mA

Power dissipation Internally limited

Operating temperature range, TA(5) –40 85 °C

Maximum internal operating temperature, TINT(max) 125 °C

Storage temperature, Tstg –55 125

7.2 ESD Ratings VALUE UNIT

ESD Human body model (HBM) ±2000 V

Charged device model (CDM) ±1000 V

(1) Operation above 4.8 V input voltage is not recommended over an extended period of time.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT

VIN Input voltage range 2.3 4.8(1) V

IOOutput current range

TPS82692,

TPS82693

TPS826951

TPS82697,

TPS82698

800 mA

Additional output capacitance (PFM/PWM) 0 4 µF

Additional output capacitance (PWM) 0 7 µF

TAAmbient temperature –40 85 °C

TJOperating junction temperature –40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1) TPS82693/4/51/7/8/9 UNIT

SIP (8-TERMINALS)

θJA Junction-to-ambient thermal resistance 83 °C/W

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Thermal Information (continued)

THERMAL METRIC(1) TPS82693/4/51/7/8/9 UNIT

SIP (8-TERMINALS)

θJCtop Junction-to-case (top) thermal resistance 53 °C/W

θJB Junction-to-board thermal resistance - °C/W

ψJT Junction-to-top characterization parameter - °C/W

ψJB Junction-to-board characterization parameter - °C/W

θJCbot Junction-to-case (bottom) thermal resistance - °C/W

7.5 Electrical Characteristics

Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA= –40°C to 85°C;

Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT =

2.85 V, EN = 1.8 V, AUTO mode and TA= 25°C (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

IQOperating quiescent

current TPS8269x IO= 0mA. Device not switching 23 50 μA

TPS8269x IO= 0mA, PWM mode 3.5 mA

I(SD) Shutdown current TPS8269x EN = GND 0.2 7 μA

UVLO Undervoltage lockout

threshold TPS8269x 2.05 2.1 V

Protection

Thermal Shutdown TPS8269x 140 °C

Thermal Shutdown

hysteresis TPS8269x 10 °C

ILIM Peak Output Current

Limit TPS8269x 1000 mA

ISC Short Circuit Output

Current Limit TPS8269x 15 mA

ENABLE, MODE

VIH High-level input voltage

TPS8269x

1 V

VIL Low-level input voltage 0.4 V

Ilkg Input leakage current Input connected to GND or VIN 0.01 1.5 μA

OSCILLATOR

fSW Oscillator frequency TPS8269x IO= 0mA, PWM mode. TA= 25°C 2.7 3 3.3 MHz

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

www.ti.com

SLVSBF8C –MARCH 2013–REVISED MAY 2015

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Electrical Characteristics (continued)

Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA= –40°C to 85°C;

Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT =

2.85 V, EN = 1.8 V, AUTO mode and TA= 25°C (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

OUTPUT

VOUT

Regulated DC output

voltage

TPS82693

TPS82697

3.15V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

3.25V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

3.15V ≤VIN ≤5.5V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

3.25V ≤VIN ≤5.5V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

3.15V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

3.25V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

TPS826951

2.9V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

3.15V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

2.9V ≤VIN ≤5.5V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

3.15V ≤VIN ≤5.5V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

2.9V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

3.15V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

TPS82698

3.3V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

3.45V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

3.3V ≤VIN ≤5.5V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

3.45V ≤VIN ≤5.5V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

3.3V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

3.45V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

TPS82692

2.5V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

2.7V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.03×VNOM V

2.5V ≤VIN ≤5.5V, 0mA ≤IO≤500 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

2.7V ≤VIN ≤5.5V, 500mA ≤IO≤800 mA

PFM/PWM operation 0.98×VNOM VNOM 1.04×VNOM V

2.5V ≤VIN ≤4.8V, 0mA ≤IO≤500 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

2.7V ≤VIN ≤4.8V, 500mA ≤IO≤800 mA

PWM operation 0.98×VNOM VNOM 1.02×VNOM V

Line regulation VIN = VO+ 0.5V (min 3.15V) to 5.5V

IO= 200 mA 0.18 %/V

Load regulation IO= 0mA to 800 mA –0.0002 %/mA

Feedback input

resistance TPS8269x 480 kΩ

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Electrical Characteristics (continued)

Minimum and maximum values are at VIN = 2.3 V to 5.5 V, VOUT = 2.85 V, EN = 1.8 V, AUTO mode and TA= –40°C to 85°C;

Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V , VOUT =

2.85 V, EN = 1.8 V, AUTO mode and TA= 25°C (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ΔVOPower-save mode ripple

voltage

TPS82693

TPS826951

TPS82697

IO= 1mA

CO= 4.7μF X5R 6.3V 0402 30 mVPP

TPS82698

IO= 1mA

CO= 4.7μF X5R 6.3V 0402 65 mVPP

IO= 1mA

CO= 10μF X5R 6.3V 0603 25 mVPP

TPS82692 IO= 1mA

CO= 10μF X5R 6.3V 0603 22 mVPP

rDIS Discharge resistor for

power-down sequence 120 Ω

Start-up time

TPS82693

TPS826951

TPS82698

TPS82697

IO= 0mA, Time from active EN to VO200 μs

TPS82692 IO= 0mA, Time from active EN to VO160 μs

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

www.ti.com

SLVSBF8C –MARCH 2013–REVISED MAY 2015

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

7.6 Typical Characteristics Table 1. Table Of Graphs

FIGURE

ηEfficiency

vs Load current (TPS82699 VOUT = 3.2V) Figure 1,Figure 2,

Figure 3

vs Load current (TPS82693 VOUT = 2.85V) Figure 4,Figure 5,

Figure 6

vs Load current (TPS82697 VOUT = 2.8V) Figure 7,Figure 8

vs Load current (TPS826951 VOUT = 2.5V) Figure 9,Figure 10

vs Load current (TPS82698 VOUT = 3.0V) Figure 11,Figure 12

vs Input Voltage (TPS82699 VOUT = 3.2V) Figure 15

vs Input Voltage (TPS82692 VOUT = 2.2V) Figure 41,Figure 42

Peak-to-peak output ripple voltage vs Load current (TPS82699 VOUT = 3.2V) Figure 16,Figure 17

VODC output voltage vs Load Current (TPS82699 VOUT = 3.2V) Figure 18

vs Load Current (TPS82693 VOUT = 2.85V) Figure 19,Figure 20

Load transient response TPS82699 VOUT = 3.2V Figure 28,Figure 29,

Figure 30

TPS826951 VOUT = 2.5V Figure 31,Figure 32

AC load transient response TPS82699 VOUT = 3.2V Figure 33,Figure 34,

Figure 35,Figure 36

TPS826951 VOUT = 2.5V Figure 37,Figure 38,

Figure 39,Figure 40

TPS82698 VOUT = 3.0V Figure 41,Figure 42,

Figure 43

PFM/PWM boundaries vs Input voltage (TPS82699 VOUT = 3.2V) Figure 21

IQQuiescent current vs Input voltage Figure 22

fsPWM switching frequency vs Input voltage (TPS82699 VOUT = 3.2V) Figure 23

Start-up (TPS82699 VOUT = 3.2V) Figure 24,Figure 25

Shut-Down Figure 26

Figure 1. TPS82699 Efficiency vs Load Current Figure 2. TPS82699 Efficiency vs Load Current

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V (PFM/PWM)

VIN = 3.2V (PFM/PWM)

VIN = 3.6V (PFM/PWM)

VIN = 4.2V (PFM/PWM)

VIN = 4.5V (PFM/PWM)

VIN = 3.6V (PWM)

TPS62697

VOUT = 2.8V

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V

VIN = 3.2V

VIN = 3.6V

VIN = 4.2V

VIN = 4.5VMODE = High

TPS62697

VOUT = 2.8V

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V (PFM/PWM)

VIN = 3.2V (PFM/PWM)

VIN = 3.6V (PFM/PWM)

VIN = 4.2V (PFM/PWM)

VIN = 4.5V (PFM/PWM)

VIN = 3.6V (PWM)

TPS82693

VOUT = 2.85V

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V

VIN = 3.2V

VIN = 3.6V

VIN = 4.2V

VIN = 4.5VMODE = High

TPS82693

VOUT = 2.85V

G000

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V

VIN = 3.2V

VIN = 3.6V

VIN = 4.2V

VIN = 4.5VMODE = Low

TPS82693

VOUT = 2.85V

G000

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Typical Characteristics (continued)

Figure 3. TPS82699 Efficiency vs Load Current Figure 4. TPS82693 Efficiency vs Load Current

Figure 5. TPS82693 Efficiency vs Load Current Figure 6. TPS82693 Efficiency vs Load Current

Figure 7. Efficiency vs Load Current Forced PWM

Operation For Device TPS82697 Figure 8. Efficiency vs Load Current Forced PWM

Operation For Device TPS82697

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 2.9V

VIN = 3.1V

VIN = 3.4V

VIN = 3.6V

VIN = 3.8V

VIN = 4.2V

VIN = 4.5V

TPS82692

VOUT = 2.2V

MODE = Low

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 2.9V

VIN = 3.1V

VIN = 3.4V

VIN = 3.6V

VIN = 3.8V

VIN = 4.2V

VIN = 4.5V MODE = High

TPS82692

VOUT = 2.2V

G000

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V

VIN = 3.3V

VIN = 3.6V

VIN = 3.8V

VIN = 4.0V

VIN = 4.2V

VIN = 4.8V

TPS82698

VOUT = 3.0V

MODE = Low

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 3.1V

VIN = 3.3V

VIN = 3.6V

VIN = 3.8V

VIN = 4.0V

VIN = 4.2V

VIN = 4.8VMODE = High

TPS82698

VOUT = 3.0V

G000

40.0

50.0

60.0

70.0

80.0

90.0

100.0

0.1 1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 2.9V

VIN = 3.1V

VIN = 3.4V

VIN = 3.6V

VIN = 3.8V

VIN = 4.2V

VIN = 4.5V

TPS626951

VOUT = 2.5V

MODE = Low

G000

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

1 10 100 1000

Current (mA)

Efficiency (%)

VIN = 2.9V

VIN = 3.1V

VIN = 3.4V

VIN = 3.6V

VIN = 3.8V

VIN = 4.2V

VIN = 4.5VMODE = High

TPS626951

VOUT = 2.5V

G000

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

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Typical Characteristics (continued)

Figure 9. Efficiency vs Load Current PFM/PWM Operation

For Device TPS826951 Figure 10. Efficiency vs Load Current Forced PWM

Operation For Device TPS826951

Figure 11. Efficiency vs Load Current PFM/PWM Operation

For Device TPS82698 Figure 12. Efficiency vs Load Current Forced PWM

Operation For Device TPS82698

Figure 13. Efficiency vs Load Current PFM/PWM Operation

For Device TPS82692 Figure 14. Efficiency vs Load Current PWM Operation For

Device TPS82692

2.79

2.80

2.81

2.82

2.83

2.85

2.86

2.87

2.88

2.89

2.90

2.91

2.92

2.93

0.1 1 10 100 1000

Current (mA)

Voltage (V)

VIN = 3.1V

VIN = 3.2V

VIN = 3.3V

VIN = 3.6V

VIN = 4.5V

VOUT = 2.85V

MODE = Low

G000

2.79

2.80

2.81

2.82

2.83

2.85

2.86

0.1 1 10 100 1000

Current (mA)

Voltage (V)

VIN = 3.1V

VIN = 3.2V

VIN = 3.3V

VIN = 3.6V

VIN = 4.5V

VOUT = 2.85V

MODE = High

G000

3.104

3.136

3.168

3.200

3.232

3.264

0.1 1 10 100 1000

Current (mA)

Voltage (V)

VIN = 3.3V

VIN = 3.4V

VIN = 3.6V

VIN = 3.9V

VIN = 4.2V

VIN = 4.8V

VOUT = 3.2V

MODE = High

G000

TPS82692

TPS82693

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Typical Characteristics (continued)

Figure 15. TPS82699 Efficiency vs Input Voltage Figure 16. TPS82699 Peak-To-Peak Output Ripple Voltage

vs Load Current

Figure 17. TPS82699 Peak-To-Peak Output Ripple Voltage

vs Load Current Figure 18. TPS82699 DC Output Voltage vs Load Current

Figure 19. TPS82693 DC Output Voltage vs Load Current Figure 20. TPS82693dc Output Voltage vs Load Current

MODE = Low

V = 3.6 V,

V = 3.2V,

R = 39R

MODE = Low

V = 3.6 V,

V = 3.2V,

Load = 0mA

MODE = Low

V = 3.6 V,

V = 3.2V,

I = 0mA

PFM to PWM

Mode Change

PWM to PFM

Mode Change Always PFM

Always PWM

3.0 3.5 4.0 4.5 5.0

Supply Voltage (V)

Quiescent Current (µA)

T = −40C

T = +25C

T = +85C

G000

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Typical Characteristics (continued)

Figure 21. TPS82699 PFM/PWM Boundaries Figure 22. Quiescent Current vs Input Voltage

Figure 23. TPS82699 PWM Switching Frequency vs Input

Voltage Figure 24. TPS82699 Start-Up

Figure 25. TPS82699 Start-Up Figure 26. TPS82699 Shutdown

MODE = Low

V = 3.6 V, V = 2.5V

10mA to 400mA Load Step

MODE = Low

V = 3.45 V, V = 3.2V

10mA to 400mA Load Step

MODE = Low

V = 4.2 V, V = 3.2V

10mA to 400mA Load Step

MODE = Low

V = 3.6 V, V = 3.2V

10mA to 400mA Load Step

VIN SW

MODE

GND

TPS8269XSIP

VBAT

MODE

SELECTION

ENABLE

DC/DC Converter

GND

VOUT

TPS82692

TPS82693

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8 Parameter Measurement Information

Figure 27. Circuit

Figure 28. TPS8269 Load Transient Response In

PFM/PWM Operation Figure 29. TPS82699 Load Transient Response In

PFM/PWM Operation

Figure 30. TPS82699 Load Transient Response In

PFM/PWM Operation Figure 31. TPS826951 Load Transient Response In

PFM/PWM Operation

MODE = Low

V = 3.6 V,

V = 2.5 V

5mA to 500mA Load Sweep

MODE = Low

V = 3.45 V,

V = 3.2 V

5mA to 500mA Load Sweep

MODE = Low

V = 3.45 V,

V = 3.2 V

5mA to 350mA Load Sweep

MODE = Low

V = 3.6 V,

V = 3.2 V

5mA to 500mA Load Sweep

MODE = Low

V = 2.9 V, V = 2.5V

10mA to 400mA Load Step

MODE = Low

V = 3.6 V,

V = 3.2 V

5mA to 350mA Load Sweep

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Parameter Measurement Information (continued)

Figure 32. TPS826951 Load Transient Response In

PFM/PWM Operation Figure 33. TPS82699 AC Load Transient Response

Figure 34. TPS82699 AC Load Transient Response Figure 35. TPS82699 AC Load Transient Response

Figure 36. TPS82699 AC Load Transient Response Figure 37. TPS826951 AC Load Transient Response

MODE = Low

V = 3.3 V,

V = 3.0 V

5mA to 500mA Load Sweep

MODE = Low

V = 3.4 V,

V = 3.0 V

5mA to 800mA Load Sweep

MODE = Low

V = 3.6 V,

V = 2.5 V

5mA to 800mA Load Sweep

MODE = Low

V = 3.6 V,

V = 3.0 V

5mA to 800mA Load Sweep

MODE = Low

V = 2.9 V,

V = 2.5 V

5mA to 500mA Load Sweep

MODE = Low

V = 3.6 V,

V = 2.5 V

5mA to 800mA Load Sweep

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

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Parameter Measurement Information (continued)

Figure 38. TPS826951 AC Load Transient Response Figure 39. TPS826951 AC Load Transient Response

Figure 40. TPS826951 AC Load Transient Response Figure 41. TPS82698 AC Load Transient Response

Figure 42. TPS82698 AC Load Transient Response Figure 43. TPS82698 AC Load Transient Response

Gate Driver

Anti

Shoot-Through

Power Save Mode

Feedback Divider

Frequency

Control

GND

Soft-Start

EN VIN

Current Limit

Detect

Undervoltage

Lockout

Bias Supply

Bandgap

Thermal

Shutdown

Negative Inductor

Current Detect

VIN

MODE

V = 0.8 V

RE F

VREF

1µH

4.7µF

Switching

VOUT

DC/DC CONVERTER 4.7µF

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9 Detailed Description

9.1 Overview

The TPS8269xSIP is a standalone synchronous step-down converter operating at a regulated 3-MHz frequency

pulse width modulation (PWM) at moderate to heavy load currents (up to 500 mA / 800mA output current). At

light load currents, the TPS8269xSIP's converter operates in power-save mode with pulse frequency modulation

(PFM).

The converter uses a unique frequency locked ring oscillating modulator to achieve best-in-class load and line

response. One key advantage of the non-linear architecture is that there is no traditional feedback loop. The loop

response to change in VOis essentially instantaneous, which explains the transient response. Although this type

of operation normally results in a switching frequency that varies with input voltage and load current, an internal

frequency lock loop (FLL) holds the switching frequency constant over a large range of operating conditions.

Combined with best in class load and line transient response characteristics, the low quiescent current of the

device (ca. 23μA) allows to maintain high efficiency at light load, while preserving fast transient response for

applications requiring tight output regulation.

The TPS8269xSIP integrates an input current limit to protect the device against heavy load or short circuits and

features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages.

9.2 Functional Block Diagram

9.3 Feature Description

9.3.1 Power-Save Mode

If the load current decreases, the converter will enter power save mode operation automatically. During power-

save mode the converter operates in discontinuous current (DCM) with a minimum of one pulse, which produces

low output ripple compared with other PFM architectures.

PFMModeatLightLoad

PFMRipple

PWMModeatHeavyLoad

NominalDCOutputVoltage

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Feature Description (continued)

When in power-save mode, the converter resumes its operation when the output voltage trips below the nominal

voltage. It ramps up the output voltage with a minimum of one pulse and goes into power-save mode when the

output voltage is within its regulation limits again.

PFM mode is left and PWM operation is entered as the output current can no longer be supported in PFM mode.

As a consequence, the DC output voltage is typically positioned ca. 1.5% above the nominal output voltage and

the transition between PFM and PWM is seamless.

Figure 44. Operation In PFM Mode And Transfer To PWM Mode

9.3.2 Mode Selection

The MODE terminal allows to select the operating mode of the device. Connecting this terminal to GND enables

the automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode

at moderate to heavy loads and in the PFM mode during light loads, which maintains high efficiency over a wide

load current range.

Pulling the MODE terminal high forces the converter to operate in the PWM mode even at light load currents.

The advantage is that the converter operates with a fixed frequency that allows simple filtering of the switching

frequency for noise-sensitive applications. In this mode, the efficiency is lower compared to the power-save

mode during light loads.

For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This

allows efficient power management by adjusting the operation of the converter to the specific system

requirements.

9.3.3 Soft Start

The TPS8269xSIP has an internal soft-start circuit that limits the inrush current during start-up. This limits input

voltage drops when a battery or a high-impedance power source is connected to the input of the MicroSIPTM

converter.

The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a

function of the output voltage. This mode of operation continues for approximately 100μs after enable. Should the

output voltage not have reached its target value by that time, such as in the case of heavy load, the soft-start

transitions to a second mode of operation.

If the output voltage has raised above 0.5V (approximately), the converter increases the input current limit

thereby enabling the power supply to come-up properly. The start-up time mainly depends on the capacitance

present at the output node and load current.

9.4 Device Functional Modes

9.4.1 Low Dropout, 100% Duty Cycle Operation

The device starts to enter 100% duty cycle mode once input and output voltage come close together. In order to

maintain the output voltage, the DC/DC converter's high-side MOSFET is turned on 100% for one or more

cycles.

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Device Functional Modes (continued)

With further decreasing VIN the high-side switch is constantly turned on, thereby providing a low input-to-output

voltage difference. This is particularly useful in battery-powered applications to achieve longest operation time by

taking full advantage of the whole battery voltage range.

9.4.2 Enable

The TPS8269xSIP device starts operation when EN is set high and starts up with the soft start as previously

described. For proper operation, the EN terminal must be terminated and must not be left floating.

Pulling the EN terminal low forces the device into shutdown. In this mode, all internal circuits are turned off and

VIN current reduces to the device leakage current, typically a few hundred nano amps.

The TPS8269xSIP device can actively discharge the output capacitor when it turns off (See Device Comparison

table). The integrated discharge resistor has a typical resistance of 100 Ω. The required time to ramp-down the

output voltage depends on the load current and the capacitance present at the output node.

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10 Application and Implementation

10.1 Application Information

The TPS8269X devices are complete power supplies, optimized for and working within the given specification

range without additional components or design steps. Further improvements can be achieved as described

below.

10.2 Typical Application

10.2.1 Input Capacitor Selection

Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to

prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the

system.

For most applications, the input capacitor that is integrated into the TPS8269x should be sufficient. If the

application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance

to find a remedy.

The TPS8269x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable

inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN terminal. This

ringing can couple to the output and be mistaken as loop instability or can even damage the part. In this

circumstance, additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input

of the converter and the power source lead to reduce ringing that can occur between the inductance of the power

source leads and CI.

10.2.2 Output Capacitor Selection

The advanced, fast-response, voltage mode, control scheme of the TPS8269x allows the use of a tiny ceramic

output capacitor (CO). For most applications, the output capacitor integrated in the TPS8269x is sufficient.

At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the

voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output

capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup

during large load transitions.

The TPS8269x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any

additional capacitance. Adding a 4.7μF ceramic output capacitor (X7R or X5R dielectric) generally works from a

converter stability point of view, helps to minimize the output ripple voltage in PFM mode and improves the

converter's transient response under when input and output voltage are close together.

For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition),

the TPS8269xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca.

1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage

ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC

converter's output.

In applications requiring additional output bypass capacitors located close to the load, care should be taken to

ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment

with additional low value series resistance (e.g. 50 to 100mΩ) in the output path to find a remedy.

Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor

DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) …) that are temperature dependant, the

converter small and large signal behavior must be checked over the input voltage range, load current range and

temperature range.

The easiest sanity test is to evaluate, directly at the converter’s output, the following aspects:

• PFM/PWM efficiency

• PFM/PWM and forced PWM load transient response

During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or

ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase

margin.

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11 Power Supply Recommendations

The TPS8269X MicroSIP™ devices are fully featured point of load power supplies. Use information given in

Application Information to connect input and output circuitry appropriately. Even if electrical characteristics are

based on measurements up to VIN=5.5V, it is not recommended to operate at higher voltages than 4.8V

permanently.

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(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask

opening. Wider trace widths reduce device stand off and affect reliability.

(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the

intended application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue

performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.

(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste

volume control.

12 Layout

12.1 Layout Guidelines

In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined

(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the

opening size is defined by the copper pad width. Figure 45 shows the appropriate diameters for a MicroSiPTM

layout.

12.2 Layout Example

Figure 45. Recommended Land Pattern Image And Dimensions

SOLDER PAD

DEFINITIONS(1)(2)(3)(4) COPPER PAD SOLDER MASK (5)

OPENING COPPER

THICKNESS STENCIL (6)

OPENING STENCIL THICKNESS

Non-solder-mask

defined (NSMD) 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick

12.3 Surface Mount Information

The TPS8269x MicroSIP DC/DC converter uses an open frame construction that is designed for a fully

automated assembly process and that features a large surface area for pick and place operations. See the "Pick

Area" in the package drawings.

Package height and weight have been kept to a minimum thereby allowing the MicroSIP device to be handled

similarly to a 0805 component.

See JEDEC/IPC standard J-STD-20b for reflow recommendations.

T = 27°C

PWB T = 33 C

inductor °

T = 30 C

capacitor °

T = 30 C

capacitor °

T = 38°C

PWB T = 53 C

inductor °

T = 39 C

capacitor °

T = 41 C

capacitor °

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12.4 Thermal And Reliability Information

The TPS8269x output current may need to be de-rated if it is required to operate in a high ambient temperature

or deliver a large amount of continuous power. The amount of current de-rating is dependent upon the input

voltage, output power and environmental thermal conditions. Care should especially be taken in applications

where the localized PWB temperature exceeds 65°C.

The TPS8269x die and inductor temperature should be kept lower than the maximum rating of 125°C, so care

should be taken in the circuit layout to ensure good heat sinking. Sufficient cooling should be provided to ensure

reliable operation.

Three basic approaches for enhancing thermal performance are listed below:

• Improve the power dissipation capability of the PCB design.

• Improve the thermal coupling of the component to the PCB.

• Introduce airflow into the system.

To estimate the junction temperature, approximate the power dissipation within the TPS8269x by applying the

typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you

have an actual TPS8269x device or a TPS8269x evaluation module. Then calculate the internal temperature rise

of the TPS8269x above the surface of the printed circuit board by multiplying the TPS8269x power dissipation by

the thermal resistance.

The thermal resistance numbers listed in the Thermal Information table are based on modeling the MicroSIP™

package mounted on a high-K test board specified per JEDEC standard. For increased accuracy and fidelity to

the actual application, it is recommended to run a thermal image analysis of the actual system. Figure 46 and

Figure 47 are thermal images of TI’s evaluation board with readings of the temperatures at specific locations on

the device.

Figure 46. V=3.6v, V=2.85v, I=400ma 80mw Power

Dissipation At Room Temp.INOUTOUT

Figure 47. V=3.6v, V=2.85v, I=800ma 330mw Power

Dissipation At Room Temp.INOUTOUT

The TPS8269x is equipped with a thermal shutdown that will inhibit power switching at high junction

temperatures. The activation threshold of this function, however, is above 125°C to avoid interfering with normal

operation. Thus, it follows that prolonged or repetitive operation under a condition in which the thermal shutdown

activates necessarily means that the components internal to the MicroSIP package are subjected to high

temperatures for prolonged or repetitive intervals, which may damage or impair the reliability of the device.

MLCC capacitor reliability/lifetime is depending on temperature and applied voltage conditions. At higher

temperatures, MLCC capacitors are subject to stronger stress. On the basis of frequently evaluated failure rates

determined at standardized test conditions, the reliability of all MLCC capacitors can be calculated for their actual

operating temperature and voltage.

TOP VIEW BOTTOM VIEW

YML

LSB

0.01

0.1

100

1000

10000

20 40 60 80 100 120 140

Capacitor Case Temperature ( °C)

Time (Thousand Hours)

VBias=5V

VBias=4.35V

VBias=3.6V

VBias=3V

G000

0.1

100

1000

10000

100000

20 40 60 80 100 120 140

Capacitor Case Temperature ( °C)

Time (Thousand Hours)

VBias=5V

VBias=4.35V

VBias=3.6V

VBias=3V

G000

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Thermal And Reliability Information (continued)

Figure 48. Capacitor Lifetime vs Capacitor Case

Temperature Figure 49. Capacitor B1 Lifetime vs Capacitor Case

Temperature

Failures caused by systematic degradation can be described by the Arrhenius model. The most critical

parameter (IR) is the Insulation Resistance (i.e. leakage current). The drop of IR below a lower limit (e.g., 1 MΩ)

is used as the failure criterion, see Figure 48.Figure 49 (B1 life) defines the capacitor lifetime based on a failure

rate reaching 1%. Note that the wear-out mechanisms occurring in the MLCC capacitors are not reversible but

cumulative over time.

12.5 Package Summary

SIP Package

Code:

• CC — Customer Code (device/voltage specific)

• YML — Y: Year, M: Month, L: Lot trace code

• LSB — L: Lot trace code, S: Site code, B: Board locator

spacing

12.6 MicroSIP™

DC/DC Module Package Dimensioning

The TPS8269x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:

spacing

• D = 2,30 ±0,05 mm

• E = 2,90 ±0,05 mm

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13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

See ONET-10G-EVM

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

TPS82692 Click here Click here Click here Click here Click here

TPS82693 Click here Click here Click here Click here Click here

TPS826951 Click here Click here Click here Click here Click here

TPS82697 Click here Click here Click here Click here Click here

TPS82698 Click here Click here Click here Click here Click here

13.3 Trademarks

MicroSIP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

Reel Width (W1)

REEL DIMENSIONS

Dimension designed to accommodate the component length

Dimension designed to accommodate the component thickness

Overall width of the carrier tape

Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

B0 W

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1 Q1

Q2 Q2

Q3 Q3Q4 Q4

Reel

Diameter

User Direction of Feed

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

SLVSBF8C –MARCH 2013–REVISED MAY 2015

www.ti.com

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

14.1 Tape and Reel Information

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width W1

(mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TPS82692SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82692SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82693SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82693SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS826951SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS826951SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82697SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82697SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82698SIPR uSIP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TPS82698SIPT uSIP SIP 8 250 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2

TAPE AND REEL BOX DIMENSIONS

Width (mm)

TPS82692

TPS82693

TPS826951

TPS82697

TPS82698

www.ti.com

SLVSBF8C –MARCH 2013–REVISED MAY 2015

Product Folder Links: TPS82692 TPS82693 TPS826951 TPS82697 TPS82698

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS82692SIPR uSIP SIP 8 3000 223 194 35

TPS82692SIPT uSIP SIP 8 250 223 194 35

TPS82693SIPR uSIP SIP 8 3000 223 194 35

TPS82693SIPT uSIP SIP 8 250 223 194 35

TPS826951SIPR uSIP SIP 8 3000 223 194 35

TPS826951SIPT uSIP SIP 8 250 223 194 35

TPS82697SIPR uSIP SIP 8 3000 223 194 35

TPS82697SIPT uSIP SIP 8 250 223 194 35

TPS82698SIPR uSIP SIP 8 3000 223 194 35

TPS82698SIPT uSIP SIP 8 250 223 194 35

PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2018

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TPS82692SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 E9

TXI692

TPS82692SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 E9

TXI692

TPS82693SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 W3

TXI693

TPS82693SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 W3

TXI693

TPS826951SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 DO

TXI695

TPS826951SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 DO

TXI695

TPS82697SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 C2

TXI697

TPS82697SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 C2

TXI697

TPS82698SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 WN

TXI698

TPS82698SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 WN

TXI698

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 30-Aug-2018

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

TPS82698SIPR TPS82698SIPT