www.yageo.com
DISCRETE CERAMICS
2003 Apr 06 Rev.3
DA
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ARV342
1%
Convex type array chip resistors
size 4 × 0402
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 2 www.yageo.com
FEATURES
Reduced size of final equipment
Low assembly costs
Higher component and equipment
reliability.
APPLICATIONS
Camcorders
Hand held measuring equipment
Car telephones
Computer
Portable radio, CD and cassette
players.
DESCRIPTION
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected
by a resistive paste which is applied
to the top surface of the substrate.
The composition of the paste is
adjusted to give the approximate
resistance required and the value is
trimmed to within tolerance, by laser
cutting of this resistive layer.
The resistive layer is covered with a
protective coating. Finally, external
end terminations are added. For
ease of soldering the outer layer of
these end terminations is a lead-tin
alloy.
QUICK REFERENCE DATA
DESCRIPTION VALUE
Resistance range 10 to 1 M; E96 series
Resistance tolerance ±1%
Temperature coefficient ≤±300 × 106/K
Absolute maximum at Tamb = 70 °C 0.063 W
Maximum permissible voltage 50 V (DC or RMS)
Operating temperature range 55 to +125 °C
Climatic category (IEC 60068) 55/155/56
Basic specification IEC 60115-8
ORDERING INFORMATION
Table 1 Ordering code indicating resistor type and packing
ORDERING CODE 2350 023 …..
PAPER TAPE ON REEL
TYPE
5000 units 10000 units
ARV342 1…. 2….
Ordering code (12NC)
The resistors have a 12-digit
ordering code starting with
2350 023.
The subsequent first digit
indicates the resistor type and
packing; see Table 1.
The remaining 4 digits indicate the
resistance value:
The first 3 digits indicate the
resistance valu e.
The last digit indicates the
resistance decade in
accordance with Table 2.
Table 2 Last digit of 12NC
RESISTANCE LAST DIGIT
10 to 91 9
100 to 910 1
1 to 9.1 k 2
10 to 91 k 3
100 to 910 k 4
1 M 5
ORDERING EXAMPLE
The ordering code of an ARV342
convex type array chip resistor,
value 1000 , supplied on paper
tape of 5000 units per reel is:
2350 023 110002.
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 3 www.yageo.com
FUNCTIONAL DESCRI PTI ON
Product characterization
Standard values of nominal
resistance are taken from the E96
series for resistors with a tolera nce
of ±1%.The values of the E96 series
are in accordance with
“IEC publication 60063”.
Limiting values
TYPE LIMITING
VOLTAGE(1)
(V)
LIMITING
POWER
(W)
ARV342 50 0.063
Note
1. This is the maximum voltage that
may be continuously applied to
the resistor element, see
“IEC publication 60115-8”.
DERATING
The power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
70 10050
00
50
100
155
CCB412
55 T
amb
(°C)
P
max
(%P
rated
)
Fig.1 Maximum dissipation (Pmax) in percentage of rated power as a
function of the ambient temperature (Tamb).
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 4 www.yageo.com
MECHANICAL DATA
Mass per 100 units
TYPE MASS
(g)
ARV342 0.30
Marking
There is no marking on the product;
the product is marked on request.
PACKAGE MARKING
The packing is marked and includes
resistance value, tolerance,
catalogue number, quantity,
production period, batch number and
source code.
CCB257
A
a
a
H2
H1
T
W
P
L
B
G
132465
Outlines
Table 3 Physical dimensions; see Fig.2
SYMBOL VALUE TOL. UNIT
L 2.00
±0.10 mm
W 1.00
±0.10 mm
T 0.45 ±0.10 mm
A 0.20
±0.10 mm
B 0.20
±0.10 mm
P 0.50
±0.10 mm
G 0.30 ±0.10 mm
H1 0.30 ±0.10 mm
H2 0.20 ±0.10 mm
Fig.2 Outlines.
For dimensions see Table 3.
Details of cross section ‘a’ to ‘a’:
1 = Substrate.
2 = Protective layer.
3 = Resistor.
4 = Inner termination.
5 = Nickel layer.
6 = Outer termination.
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 5 www.yageo.com
TEST AND REQUIREMENTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
LCT/UCT/56 (rated temperature
range: Lower Category
Temperature, Upper Category
Temperature; damp heat, long term,
56 days). The testing also covers the
requirements specified by EIA, EIAJ
and JIS.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination no holes; clean surface;
no damage
4.17 20 (Ta) solderability unmounted chips completely immersed
for 2 ±0.5 s in a solder bath at
235 ±2 °C
good tinning
(95% covered);
no visible damage
4.18 20 (Tb) resistance to
soldering heat unmounted chips: 10 ±1 s; 260 ±5 °C no visible damage
R/R max.: ±(1% + 0.05 )
4.29 45 (Xa) component
solvent
resistance
isopropyl alcohol or H2O followed by
brushing in accordance with
“MIL 202 F”
no visible damage
applied voltage (+0/10%):
R < 10 : 0.1 V
10 R < 100 : 0.3 V
100 R < 1 k: 1 V
1 k R < 10 k: 3 V
10 k R < 100 k: 10 V
4.5 resistance
100 k R < 1 M: 25 V
R Rnom: max. ±1%
4.7 voltage proof
on insulation maximum voltage (RMS) during
1 minute, metal block method no breakdown or flashover
4.13 short time
overload room temperature; P = 6.25 × Pn;
5 s (V 2 × Vmax) R/R max.: ±(1% + 0.05 )
In Table 4 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and
60068”; a short description of the
test procedure is also given. In some
instances deviations from the IEC
recommendations were necessary
for our method of specifying.
All soldering tests are performed
with mildly activat ed flux.
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 6 www.yageo.com
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.33 bending resistors mounted on a 90 mm glass
epoxy resin PCB (FR4);
bending: 5 mm
no visible damage
R/R max.: ±(1% + 0.05 )
4.19 14 (Na) rapid change
of temperature 30 minutes at LCT and
30 minutes at UCT; 5 cycles no visible damage
R/R max.: ±(1% + 0.05 )
4.24.2 3 (Ca) damp heat
(steady state) 56 days; 40 ±2 °C; 93 +2/3% RH;
loaded with 0.01 Pn R/R max.: ±(3% + 0.1 )
4.25.1 endurance 1000 hours
+48/0 hours; 70 ±2 °C;
loaded with Pn or Vmax;
1.5 hours on and 0.5 hours off
R/R max.: ±(2% + 0.1 )
4.23.2 27 (Ba) endurance at
upper category
temperature
1000 hours +48/0 hours; 125 °C;
no load R/R max.: ±(2% + 0.1 )
4.8.4.2 temperature
coefficient at 20/LCT/20 °C and 20/UCT/20 °C: ≤±300 × 106/K
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
4.17 20 (Ta) solderability
(after ageing) 8 hours steam or 16 hours at 155 °C;
unmounted chips completely immersed
for 2 ±0.5 s in a solder bath at
235 ±2 °C
good tinning
(95% covered); no damage
4.6.1.1 insulation
resistance 50 V (DC) after 1 minute,
metal block method Rins min.: 103 M
IEC publication 60195
(measured with Quantech-equipment)
R 100 max. 0.316 µV/V (10 dB)
100 < R 1 k max. 1
µV/V (0 dB)
1 k < R 10 k max. 3
µV/V (9.54 dB)
10 k < R 100 k max. 6 µV/V (15.56 dB)
4.12 noise
100 k < R 1 M max. 10 µV/V (20 dB)
Other applicable tests
(JIS) C
5202 7.9 resistance to
damp hea t
(steady state)
1000 +48/0 hours; 40 ±2 °C;
93 +2/3% RH;
loaded with Pn or Vmax;
1.5 hours on and 0.5 hours off
R/R max.: ±(3% + 0.1 )
EIA
575 3.13 leaching unmounted chips 60 ±1 s; 260 ±5 °C good tinning; no leaching
EIA/IS
703 4.5 load humidity 1000 +48/0 hours;
85 ±2 °C; 85 ±5% RH;
loaded with 0.01 Pn or Vmax
R/R max.: ±(3% + 0.1 )
Phycomp Product specification
Convex type array chip resistors
size 4 × 0402 ARV342
1%
2003 Apr 06 Rev.3 7 www.yageo.com
REVISION HISTORY
Revision Date Change
Notification Description
Rev.2 2001 Apr 27 - - Converted to Phycomp brand
Rev.3 2003 Apr 06 - - Update company logo