Datasheet
Product structureSilicon monolithic integrated circuitThis product is not designed protection against radioactive rays
.
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TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ2211114001
www.rohm.com
AC/DC Drivers
Quasi-Resonant Control type
DC/DC Converter IC
BM1Q011FJ
General Description
The quasi-resonant controller typed AC/DC converter IC
BM1Q011FJ provides an optimum system for all products
that include an electrical outlet. Quasi-resonant operation
enables soft switching and helps to keep EMI low.
With MOSFET for switching and current detection
resistors as external devices, a higher degree of design
freedom is achieved.
This IC built in HV starter circuit, it contributes to low
consumption power and high speed start.
Because the burst mode is built-in and IC consumption
current is low, stand-by power becomes very low.
Because BM1Q011FJ series built-in soft-start, burst mode,
over current limiter which is cycle-by-cycle, over load
protection, over voltage protection, CS Open Protection
and so on, BM1Q011FJ are highly safety.
Key Specifications
Operating Power Supply Voltage Range:
: VCC8.9V to 26.0V
VH to 600V
Operating Current: Normal0.60mA (Typ.)
Burst 0.35mA(Typ.)
Max frequency: 120kHz(Typ.)
Operate temperature range: -40 to +85
Typical Application Circuit
Features
Quasi-resonant method
Built-in 650V tolerate start circuit
Low power at the light load (burst operation)
Maximum frequency control (120kHz)
Frequency reduction function
AC voltage correction function
VCC pin : under voltage protection
VCC pin : over voltage protection
Over-current protection (cycle-by-cycle)
Output driver 12V clamp circuits
Soft start function
ZT trigger mask function
Over Load protection [Auto-restart]
CS pin open protection [Auto-restart]
Package
SOP-J7S 6.00mm × 4.90mm × 1.65mm
(Typ.) (Typ.) (Typ.)
Applications
Air conditioner, AC adapters, TV such as the products
which need the outlet.
Figure 1. Application Circuit
2/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Absolute Maximum RatingsTa=25C
Item Symbol Rating Unit Condition
Input voltage range 1 Vmax1 -0.3 ~ 30 V VCC
Input voltage range 2 Vmax2 -0.3 ~ 6.5 V FB, CS
Input voltage range 3 Vmax3 -0.3 ~ 7.0 V ZT
Input voltage range 4 Vmax4 -0.3 ~ 15 V OUT
Input voltage range 5 Vmax5 -0.3 ~ 650 V VH
OUT pin out peak current1 IOH -0.5 A
OUT pin out peak current2 IOL 1.0 A
ZT pin current1 ISZT1 -3.0 mA
ZT pin current2 ISZT2 3.0 mA
CS pin current1 ISCS1 -0.45 mA Sink current
Allowable dissipation Pd 0.675 (Note1) W
Operating temperature Topr -40 +85 oC
Max junction temperature Tjmax 150 oC
Storage temperature range Tstr -55 +150 oC
(Note1) When mounted on 70 mm × 70 mm × 1.6 mm (glass epoxy on single-layer substrate).
Reduce to 5.4 mW/C when Ta = 25C or above.
Operating ConditionsTa=25C
Parameter Symbol Rating Unit Conditions
Power supply voltage range 1 VCC 8.926.0 V VCC
Power supply voltage range 2 VH 80600 V VH
Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter Symbol Specifications Unit Conditions
MIN TYP MAX
Circuit current
Circuit current (ON)1 ION1 - 600 1000 uA
FB=2.0V
(Switching operation)
Circuit current (ON)2 ION2 - 350 450 uA
FB=0.5V
(Switching OFF)
Circuit current(OFF) IOFF - - 25 uA
VCC=12V , VH: open
VCC UVLO = disable
VH pin starter
VH Start current 1 ISTART1 0.400 0.700 1.000 mA VCC= 0V
VH Start current 2 ISTART2 1.00 3.00 6.00 mA VCC=10V
VH OFF current ISTART3 - 10 20 uA
After releasing VCCUVLO
VH pin current
VH start current switched voltage VSC 0.400 0.800 1.400 V VCC pin
VCC pin protection
VCC UVLO voltage1 VUVLO1 12.50 13.50 14.50 V VCC rise
VCC UVLO voltage2 VUVLO2 7.50 8.20 8.90 V VCC fall
VCC UVLO hysteresis VUVLO3 - 5.30 - V VUVLO3= VUVLO1-VUVLO2
VCC charge start voltage VCHG1 7.70 8.70 9.70 V Starter circuit
VCC charge end voltage VCHG2 12.00 13.00 14.00 V Stop voltage from VCHG1
VCC OVP voltage1 VOVP1 26.00 27.50 29.00 V VCC rise
VCC OVP voltage2 VOVP2 - 23.50 - V VCC fall
VCC OVP hysteresis VOVP3 - 4.00 - V
OUT pin
OUT pin H voltage VOUTH 10.5 12.5 14.5 V IO=-20mA, VCC=15V
OUT pin L voltage VOUTL - - 0.30 V IO=+20mA
OUT pin Pull-down resistor RPDOUT 75 100 125 k
3/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
IC control unit Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter Symbol Specifications Unit Conditions
MIN TYP MAX
[ DC/DC converter unitTurn-off]
Pull-up resistor of FB pin RFB 22.5 30.0 37.5 k
CS over current voltage 1A Vlim1A 0.475 0.500 0.525 V FB=2.2V (ACSNSL)
CS over current voltage 1B Vlim1B 0.310 0.350 0.390 V FB=2.2V (ACSNSH)
CS over current voltage 2A Vlim2A - 0.125 - V FB=0.5V (ACSNSL)
CS over current voltage 2B Vlim2B - 0.088 - V FB=0.5V (ACSNSH)
Voltage gain1
VFB/VCS AVCS1 3.40 4.00 4.60 V/V ACSNSL
Voltage gain 2
VFB/VCS AVCS2 4.86 5.71 6.57 V/V ACSNSH
ZT current switched CS 1 IZT1 0.93 1.00 1.07 mA
ZT current switched CS 2 IZT2 0.82 0.90 0.98 mA
ZT current hysteresis
switched CS voltage IZTHYS - 0.10 - mA
CS Leading Edge Blanking time TLEB - 0.250 - us
Turn-off time TOFF - 0.150 - us
Minimum ON width Tmin - 0.400 - us TLEBTOFF
Maximum ON width Tma
x
30.0 39.0 50.7 us
[ DC/DC converter unitTurn-on]
ZT input current 1 IZT1 4 14 24 uA OUT=L, ZT=4.65V
ZT input current 2 IZT2 6 16 26 uA OUT=L, ZT=5.00V
ZT input current 3 IZT3 8 18 28 uA OUT=L, ZT=5.35V
Max frequency 1 FSW1 108 120 132 kHz FB=2.0V
Max frequency 2 FSW2 - 30 - kHz FB=0.5V
Frequency reduction start
voltage VFBSW1 1.10 1.25 1.40 V
Frequency reduction end voltage VFBSW2 0.42 0.50 0.58 V
ZT comparator voltage1 VZT1 60 100 140 mV ZT fall
ZT comparator voltage2 VZT2 120 200 280 mV ZT rise
ZT trigger mask time TZTMASK - 0.6 - us
In OUT H ->L,
prevent noise
ZT trigger Timeout1 TZTOUT1 10.5 15.0 19.5 us Without bottom detection
ZT trigger Timeout2 TZTOUT2 3.5 5.0 6.5 us Count from final ZT trigger
[DC/DC protection ]
Soft start time1 TSS1 0.35 0.50 0.65 ms
Soft start time 2 TSS2 0.70 1.00 1.30 ms
Soft start time 3 TSS3 1.40 2.00 2.60 ms
Soft start time 4 TSS4 2.80 4.00 5.20 ms
FB Burst voltage VBURST 0.42 0.50 0.58 V
FB OLP voltage a VFOLP1A 2.6 2.8 3.0 V FBOLP detectFB rise
FB OLP voltage b VFOLP1B - 2.6 - V FBOLP detectFB fall
FB OLP detection timer TFOLP 44.8 64 83.2 ms
FBOLP stop timer TOLPST 358 512 666 ms
Latch mask time TLATCH 50 100 200 ms
* Definition of ACSNS (L : ZT current < IZT1 H : ZT current > IZT1)
4/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Pin Configuration
Table 1 Input-Output PIN Function
NO. Pin Name I/O Function ESD Diode
VCC GND
1 ZT I Zero current detect pin -
2 FB I Feedback signal input pin
3 CS I Primary current sensing pin
4 GND I/O GND pin -
5 OUT O External MOS drive pin
6 VCC I/O Power supply pin -
7 VH I Starter circuit pin -
External Dimensions
Figure 2. SOP-J7 package external dimensions
I/O Equivalent Circuit Diagram
Figure 3. I/O Equivalent Circuit Diagram
(TOP VIEW)
VH
OUT
ZT
FB
CS
GND
VCC
2
1
4
3
7
5
6
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Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Block Diagram
OSC
OSC
Figure 4. Block Diagram
6/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Description of Blocks
(1-1) Starter Circuit VH pin7pin
The IC builds in starter circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed
starting. The operating current is shown in Figure 6. After starting the IC, the idling current ISTART3typ=10uA flows
from VH voltage. The loss by the idling current is shown below.
ex) power consumption of starter circuit only
Vac=100V Power100V*2*10uA=1.41mW
Vac=240V Power240V*2*10uA=3.38mW
Starting time is decided by VH current and VCC pin capacitor value. The reference value of starting time is shown in
Figure 7.
For example, VCC pin is charged within about 0.1 sec at CVCC=10uF. When the VCC pin is shorted to GND, the
current of ISTART1 flows to (shown in Figure 6). When the VH pin is shorted to GND, the large current flows from VH
line to GND. To prevent this, it is needed to insert the resistor (5k~60k) for limiting current between the VH line and
the VH pin. When VH pin is shorted to GND, the power of VH2/RVH is applied to this resistor, so please decide the
resistor value depending on specifications after having confirmed allowable electricity.
Figure 5. Starter Block Diagram
Figure 6. Start-up Current vs. VCC Voltage Figure 7. Start-up Timeexample
*The start up current is flown from VH pin (7Pin).
VCC Capacitor value [uF]
VCC Capacitor value – startup time
Start time
[
ms
]
+
-
VCCUVLO
VCC
Cvcc
VH
FUSE
+
-
Diode
Bridge
SW1
AC
Input
7
6
Rvh
7/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
Figure 8 shows operation waveform of start-up.
Secondary
output
Switing
VH
Voltage
VCC(5pin)
VH input
current
ABC
VUVLO1
ISTART1
ISTART3
ISTART2
Set voltage
VSC
D
Figure 8. Start-up Waveform
A: By inserting to outlet, the VH voltage applies. From this moment, charging to VCC pin starts from the VH pin through
starter circuit. At the time, due to VCC < VSC (typ=0.8V), VH input current is limited to ISTART1 by the VCC pin short
protection function.
B: Because of VCC voltage > VSC (typ=0.8V), VCC short protection is released and the current of the VH input current
waveform flows from VH pin.
C: Because of VCC voltage > VUVLO1 (typ=13.5V), the start-up circuit stops and VH input current is limited to ISTART3
(typ=10uA) only. Furthermore, for starting switching operation secondary output starts to rise however the VCC pin
voltage lowers because the Secondary output is low yet. The falling rate of the VCC is determined by the VCC pin
capacitance, the consumption current of the IC and the load current that flows from the VCC pin. (V/t = Cvcc/Icc)
D: Because secondary output has risen to specific voltage, the VCC pin is applied from the auxiliary winding and VCC
voltage is stabilized.
8/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
(1-2) a case without using VH pin
This IC is also possible to start by connecting the start-up resistor to the VCC pin in the open start-up circuit (650V
breakdown voltage) of the VH pin. The structure that does not use the recharge function is shown in Figure 9.At
start-up (before VCC VULO released), please be careful to set the start-up resistor Rstart shown in Figure 9, because
the consumption current IOFF (Max=25uA) flows from VCC pin (6pin).
Figure 9. Application Circuit without using the VH pin
How to set the start-up resistance
Start-up resistor Rstart shown in Figure 9 is necessary for the IC to start if you do not use the VH pin. If the value of
Rstart is small, the standby power is increased and the start-up time becomes shorter. Adversely, if the value of Rstart
is big, the standby power is reduced and start-up time becomes longer. When the VCC voltage=12V, the standby
current IOFF is 25μA (max) and the VCC UVLO voltage VUVLO1 is 14.5V (max).
ex The example of start-up resistor Rstart setting
Rstart = (VH min - VUVLO1max) / IOFFmax
In Vac=100V, if margin is -30%, VH min=100×2×0.7=99V
VUVLO1max=14.5V, so Rstart = (99-14.5) / 25μA3.38M
For an example, with a sufficient margin to 3.38M, the Rstart is set to 2.0M.In case of AC100V, Power consumption
in Rstart is below.
Pd (Rstart) = (VH-VCC)2/Rstart = (141V-14.5V) 2/2.0M = 8.00mW
Pd in using start-up resistor is more than in using VH pin. However, about the value of VCC pin capacitance and VCC
start-up resistor, please confirm by performing the evaluation of the actual application.
Rstart
9/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
(2) Start Sequence (Soft start, Light load operation, Auto recovery in over load protection)
The start sequence of IC is shown in Figure 10. About each detail, explain in each section.
Figure 10. Start Sequence Time Chart
A: The voltage is applied to the Input voltage VH pin (7pin).
B : VCC pin (6pin) voltage rise, when VCCVUVLO1typ=13.5V, IC starts operating. In the case that protection
function is normal condition, the IC starts switching operation. Then the VCC pin voltage drops absolutely by the
VCC pin consumption current. In case of the VCC< VCHG1 (typ =8.7V), the starting circuit operates and charges the
VCC. After starting to charge, it lasts charging until VCC> VCHG1 (typ =13.0V)
C: The IC has a soft start function which regulates the voltage level at the CS pin to prevent a rise in voltage and
current.
D: When the switching operation starts, the secondary output voltage VOUT rises. After starting switching, it is
necessary to set the output voltage to stable the due output voltage within the TFOLP (typ=64ms) period.
E: At light load condition, the burst operation starts for keeping power consumption low.
F: When it is heavy load, FB pin voltage (2pin) is larger than VFOLP1A (typ=2.8V), because output voltage is down.G:
When the condition that FB pin (2pin) voltage is more than VFOLP1A (typ=2.8V) continues for T FOLP (64ms typ), the
switching is stopped by the over load protection for TOLPST (typ=512ms). When the FB pin (2pin) voltage becomes to
be lower than VFOLP1B, the timer internal the IC T FOLP (64ms typ) is reset.
H: When VCC voltage (6pin) is less than VCHG1 (typ=8.7V), the starter circuit starts to operate and charge the VCC pin
(6pin) .
I : When VCC voltage (6pin) is more than VCHG2 (typ =13.0V), the starter circuit stops to charge to the VCC pin (6pin).
J: Same as F.
K: Same as G.
Vout
Switching
VH(7pin)
VCC(6pin) 13.5V
FB(2pin)
Soft
Start
Iout
Normal Load
Light LOAD
Within 44.8ms
VCC=8.5V
Over Load
Internal REF
Pull Up
Burst mode
2.8V
ABCDEFGHIJK
64msec
64ms
10/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
(3) VCC pin (6pin) Protection Function
The IC built in VCC UVLO (Under Voltage Protection) function, VCC OVP (Over Voltage Protection) function and
VCC charge function which operates when the VCC voltage drops.VCC UVLO and VCC OVP are the function that
prevents MOSFET for switching from destroying at the VCC voltage low or high conditions. And the VCC charge
function charges in high voltage line from starting circuits and stabilize the secondary output voltage.
(3-1) VCC UVLO / VCC OVP Function
VCC UVLO is the function monitors the VCC pin voltage and switches ON/OFF of the IC. This function has a voltage
hysteresis and it is auto recovery protection type. VCC OVP is also the type. Refer to the operation figure 11. The auto
recovery protection function of this IC’s VCC OVP stops the switching when the condition that the VCC pin (6pin)
voltage is more than VOVP1 (typ=27.5V) continues for more than mask time TSTOP (typ=100us). And it restarts switching
when the condition that VCC pin (6pin) voltage is lower than VOVP2 (typ=23.5V).
Figure 11. VCC UVLO / OVP Timing Chart
A: The VH (7pin) voltage is applied, and the VCC (6pin) voltage starts rising.
B: The VCC pin (6pin) voltage > VUVLO1, the VCC UVLO function is released and DC/DC operation starts.
C: The VCC pin (6pin) voltage >VOVP1, VCCOVP detects the over-voltage in the IC.
D: When the condition that the VCC (6pin) voltage is more than VOVP1 continues for TSTOP (typ =100us), switching is
stopped by the VCCOVP function.
E: The VCC (6pin) voltage < VCHG1, the VCCOVP function is released and the operation is restarted.
F: The high voltage line VH drops.
G: The VCC voltage < VUVLO2, VCCUVLO function starts operation and the switching is stopped.
H: The high voltage line VH is applied.
I: The VCC pin (6pin) becomes more than VUVLO1 and VCCUVLO function operates.
11/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Regarding capacitor value of VCC pin
For stable operation of the IC, please set the capacitor value to 1uF or higher of the VCC pin. When the VCC
capacitor terminal is too large, the response of the VCC pin to the Secondary output is slows down. Additionally,
if the degree of the transformer coupling is low, since a large surge occurs to the VCC pin, the IC may be
destroyed. In this case, it is necessary that a resistor which is from 10 to 100 is attached to the path between
the capacitor and diode at the back of the auxiliary winding or the capacitor of the VCC pin is increased. And the
fixed number is has to be set the VCC pin surge voltage not to exceed the absolute maximum rating of the VCC
pin by evaluating the waveform of the VCC pin.
Regarding VCC OVP voltage protection setting method in case of rising Vout (secondary output)
The VCC pin voltage is determined by the transformer ratio (Np:Ns) and Vout (Secondary output). Therefore,
when the Secondary output becomes large, it is possible to protect the IC by VCCOVP. Setting method of
VCCOVP protection is shown below.
Figure 12. How to Set VCCOVP
The VCC voltage is determined by the formula below.
VCC voltage = (Vout-VFs)×Nb/Ns -VFb
(Vout: Secondary output, Nb: Number of auxiliary winding, Ns: Number of secondary winding
VFx: Secondary diode VF, VFb: auxiliary winding diode VF)
If you want to apply protection when it becomes Secondary output × 1.3, please set the number of turns to be the next
formula. 1.3 × (Vout × (Nb/Ns) - VF) > VOVP1
Because VCCOVP protection has a blanking time of TSTOP (typ = 100us), it is not detected for momentary surge noise
of the VCC pin. However, VCCOVP is detected when the VCC voltage becomes higher than VOVP1 for the period of
more than VSTOP. So it is necessary to check in application evaluation when you set VCCOVP.
Np
Nb
Ns
Vout
12/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
(3-2VCC Recharge Function
After the VCC (6pin) voltage > VUVLO1, the IC start to operate. After that, when the VCC pin voltage < VCHG1, VCC
charge function operates. Then the IC charges the VCC pin (6pin) from the VH pin through the starting circuits. This
operation prevents the IC from the VCC starting errors. After the VCC pin (6pin) is charged and rise to more than VCHG2,
the charging is stopped. This operation is shown to Figure 13.
Figure 13. VCC pin Charge Operation
A: As the VH pin voltage (7pin) rises, the VCC pin (6pin) is started to charge by the VCC charge function.
B: The VCC pin (6pin) voltage > VUVLO1, VCC UVLO function is released, VCC charge function is stopped, DC/DC
operation start.
C: The VCC pin (6pin) voltage is dropped because OUTPUT voltage is low at starting.
D: The VCC pin (6pin) voltage < VCHG1, the VCC charge function operates and VCC pin (6pin) voltage rises.
E: The VCC pin (6pin) voltage > VCHG2, the VCC charge function stops.
F: The VCC pin (6pin) voltage < VCHG1, the VCC charge function operates and VCC pin (6pin) voltage rises.
G: The VCC pin (6pin) voltage > VCHG2, the VCC charge function stops.
H: The output voltage stops stating operation and the VCC pin is charged from auxiliary winding. Then the VCC pin
(6pin) becomes to be stable.
13/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
(4) DC/DC Driver
The IC operates in PFM (Pulse Frequency Modulation) mode method. By monitoring the FB pin (2pin), ZT pin (1pin)
and CS pin(3pin), the IC supply optimum system for DC/DC operation. The IC controls ON width (Turn Off) of the
switching MOSFET by the FB pin (2pin) and CS pin (3pin). The IC also does OFF width (Turn ON) by the ZT pin (1pin).
The detail is shown below.
(4-1) QR-basic Operations
The QR basic block diagram and the basic operation are shown in Figure 14 and 15.
Figure 14. DC/DC Operation Block
OSC
14/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
Figure 15. QR Basic Operation
About Figure 15
A: The IC detects a bottom signal and outputs SET signal. Then it turns ON the MOSFET. At this moment, a noise
occurs at the CS pin because the capacitor between DRAIN and SORCE of MOSFET is discharged. This noise is
called Leading Edge. And this IC has an internal filter for this noise (Refer to (4-3)). This filter and delay time make
the minimum pulse of the IC 400ns (typ). After that, the current flows to the MOSFET and the voltage (Vcs=Rs*Ip)
applies to the CS pin.
B: If the CS pin voltage rises to more than the FB pin voltage / Gain (typ=4) or over current detection voltage VCS
(typ=0.5V), the IC outputs the RESET signal and turns OUT off.
C: It takes delay time Tondelay until the IC turn off from point B. For this time, the maximum electric power increases
depending the AC voltage. This IC has the function that restricts the increment (Refer to (4-4)).
D: The DRAIN voltage drops because the energy stocked in transformer is discharged to secondary side and there is
no energy in it. At this moment, the IC detects a bottom signal but the signal is ignored not to exceed the maximum
frequency. Then the auto vibration of the transformer Lp and MOSFET Cds (the capacitor between the DRAIN and
SORCE) starts.
E: After the specific period passes from the point A and the time which determined by the maximum frequency also
passes, the SET signal is outputs if the IC detects a bottom and turns MOSFET on.
15/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
(4-2) Determination of ON WidthTurn OFF
ON width is controlled by FB (2pin) and CS (3pin).By comparison between the FB pin voltage divided by AVcs (typ=4)
and CS pin voltage, the IC decides ON width. Besides, by comparison with Vlim1 (typ=0.5V) voltage which is
generated in the IC, the CS comparator level is changed lineally to be shown in Figure 16 (the bottom side). Then the
maximum frequency also changes. The CS pin (3pin) is shared with over current limiter circuit by pulse. The IC
changes the maximum blanking frequency and over current limiter level by the FB pin (2pin) voltage.
mode1: Burst operation
mode2: Frequency reduction operationreduce max frequency
mode3: Max frequency operation (operate at maximum frequency)
mode4: Over load operationstop the pulse operation detecting the over load condition
Figure 16. relation of the FB pin, over current limiter and maximum frequency
The ON width Ton is decided by the CS Limiter level (VCS).
.
Ton = (Lp*Vcs) / (Vin*RS)
Lp: primary inductance value, Vin: VH voltage (Figure 14), RS: Sense resistor (Figure 14)
To adjust over current limiter level, the IC switches the soft start function and over current protection at input voltage. In
this case, the value of Vlim1 and Vlim2 is changed as below.
Table 2. Over current protection voltage Detail
Soft start AC=100V AC=230V
Vlim1 Vlim2 Vlim1 Vlim2
start0.5ms 0.063V (12%) 0.016V (3%) 0.044V (10%) 0.011V (2%)
0.5ms1ms 0.125V (25%) 0.032V (6%) 0.088V (20%) 0.022V (4%)
1ms2ms 0.250V (50%) 0.063V (12%) 0.175V (40%) 0.044V (9%)
2ms4ms 0.375V (75%) 0.094V (19%) 0.263V (60%) 0.066V (13%)
4ms 0.500V (100%) 0.125V (25%) 0.350V (70%) 0.088V (18%)
*(percent) is shown the comparative related value with Vlim1typ=0.5Vin normal operation.
The reason that distinguish between AC100V and AC230V is by CS over current protection voltage switch function
which is shown to4-4.
X
Y
FB [V]
MAX Fsw[kHz]
0.5V 1.25V
30kHz
120kHz
0.0V 2.0V
mode1 mode2 mode3
2.8V
mode4
X
Y
FB [V]
0.5V0.0V 2.0V
mode1 mode2 mode3
2.8V
mode4CS  Limiter[V]
Vlim1
Vlim2
1.25V
16/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
(4-3) LEBLeading Edge Blanking Function
When a MOSFET for switching is turned ON, a surge current occurs in cause of a capacitance or rush current.
Therefore, when the CS (3pin) voltage rises temporarily, an over current limiter circuit may miss detections. To prevent
miss detections, the IC build-in blanking function which mask for TLEB typ=250ns from switching the OUT pin(5pin)
from L to H. This blanking function enables to reduce noise filter of the CS pin (3pin). However, when the CS pin noise
does not converge less than 250ns, it is needed to attach RC filter to the CS pin shown in Figure 17. Then, a delay
time occurs to the CS pin detection by RC filter. Also, even if the filter in not attached, it is recommended that it is
attached an Rcs resistor to the CS pin as a surge provision. Rcs recommended resistor value is about 1k. If you
would like to filter, please adjust in Ccs for this resistor.
Figure 17. a circuit surrounding the CS pin
17/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
(4-4) CS over Current Protection Switching Function
If the input voltage (VH) becomes higher, the slope of L current raises. The switching has a constant delay time, so
the maximum allowable power increases for a constant over current limiter depending AC voltage. For this
countermeasure, this IC switches the internal over current protection function monitoring the input voltage. In case of
high voltage (AC230V), it is needed to set the over current comparator to normal 0.7 times. The IC detects by
monitoring the ZT inflow current and switching. When the MOSFET is turns ON, Va becomes minus voltage depending
on the input voltage (VH). The ZT pin (1pin) cramps near 0V internal the IC. The way to determine Rzt1, Rzt2 and Czt
is below. The block diagram is shown in Figure 18. The graph is also shown in Figure 19 and 20.
Izt1 = (VaVzt) / Rz1 Va / Rz1 = VH * Na/Np /Rz1
Rzt1 = Va / Izt1
Va: the auxiliary winding voltage (switching plus/minus) At deciding Rzt1, it should be determined from minus
voltage value, and deciding Rzt2, it should be done from plus voltage value.
Izt1: the current that flows to the ZT pin Vzt: the ZT pin voltage
As the formula, Rzt1 is has to be set to the value that is divided by 1zt (typ=1mA) for the auxiliary winding Va under
the AC voltage condition which the IC is going to switch the over current detection level. Secondly, the timing of turning
on is has to be set by Czt to operate the ZT pin bottom detection at the moment that the Drain voltage of MOSFET is
0V. Finally, Rzt2 is also has to set the maximum ZT pin voltage is around 1 to 3V for the plus voltage of the auxiliary
winding. (The noises are piled up to the ZT pin so the value of maximum voltage has been set considering a margin.)
For that, Rzt2 is calculated as below. (In the case of setting in 2V)
VZT = Va×Rzt2/(Rzt1+Rzt2) < 2V => Rzt2 < 2×Rzt1 / (Va-2)=2×Rzt1/(Na/Ns×(Vout-VFs)-2)
The auxiliary winding voltage Va has to be calculated in the plus voltage at maximum loads. In addition, the CS over
current protection switching ZT current has the hysteresis of IZTHYS (typ=0.1mA).
Figure 18. CS over Current Detection Switched ZT current block diagram
NOUT
Leading Edge
Blanking
5
3
1
6
4
2
Timer
(64ms)
FBOLP_OH
+
-
100mV
/200mV
1 shot
7V
AND
ZT Blanking
OUT(H->L)
0.60us NOUT
AND
AND PRE
Driver
POUT
FB/4
+
-
-
0.50V
CURRENT SENSE (V-V Change)
Normal : ×1.0
+
-
FBOLP_OH
Max frequency
control
0.5V
+
-
300kΩ
100kΩ
Soft Start
OR
OR
30k
+
-
SS
1ms
SS
4ms
SQ
R
NOUT
TimeOut
15 usec
5 usec
12V Clamp
Circuit
1MΩ
SS
2ms
SS
0.5ms
AND
SET
RESET
Timer stop
(512ms)
18/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
X
Y
Izt[mA]
1.0mA
CS
Limiter[V]
Vlim1
Vlim1*0.7
0.9mA
Figure 19. FB pin Voltage vs. CS pin Voltage Characteristics Figure 20 Izt Current vs Switched CS Voltage Characteristics
ex) a setting method Switching between AC100V and AC230V
AC100V: 141V±42V±30% margin
AC230V: 325V±65V±20% margin
The winding numbers of transformer are: Np = 100, Na = 15, Ns =20
According to above, when the IC switches the CS detection current between VH: 182 ~ 260V, in case of switching the
AC voltage at VH = 214V (AC150V) the minus voltage Va at MOSFET of QR turn on is calculated as below.
Va = Vin*Na / Np = 214V*15 / 100 *(-1) = -32.1
Rzt1 = Va / I
ZT = -32.1V/-1mA = 32.1k
According to this, Rzt1 is set to 33k. At this time, according to Rzt2=2×33k/(20/15×19-2)=2.83k, Rzt2 is also set to
3k. Czt is set to the value which turns on MOSFET when the Drain voltage is minimum voltage after having checked
the operation in the actual applications.
X
Y
VH[V]
214V
CS
Limiter[V]
Vlim1
Vlim1*0.7
192V
Figure 21 CS switching example VH voltage CS voltage characteristics
(4-5) Determination of OFF WidthTurn on
The OFF width is controlled at the ZT pin. While the switching is OFF, the IC supplies the electric power which is
stored at coils to the secondary output capacitor. After supplying, the DRAIN pin is drops because the current doesn’t
flow to the secondary side. For that, the voltage of auxiliary winding side also drops. The voltage divided by Rzt1 and
Rzt2 applies to the ZT pin (1pin). If the voltage level drops to less than VZT1 (typ =100mV), the IC turns on the OUT pin.
To detection the zero current at the ZT pin (1pin), Czt, Rzt1 and Rzt2 makes time constant. However, the bottom
time is adjusted by Czt because Rzt1 and Rzt2 needs to be set by the AC voltage correct function (4-3).
Toff1=Ls/(Vout+VF)*Is (Toff1 : transformer discharge timeLs : secondary inductance Vout : Secondary output
VFsecondary diode forward voltageIssecondary peak current
For that, switching frequency is calculated below:
switching frequency=1 / {transformer charge and discharge time(Ton+Toff1) + (bottom-1/2) × resonant time }
resonance time = 1 / (2×π×Lp×Cds)
Lp: primary inductance , MOSFET D-S capacitor : Cds
Because a frequency reduction range in light load is restricted shown in Figure 16, bottom detection operates by the
frequency which is lower than max frequency function in Figure 16.Additionally, the ZT trigger mask function (4-6) and
a ZT timeout function (4-7) are built in IC.
19/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
(4-6) ZT Trigger Mask FunctionFigure 22
When switching is set from ON to OFF, superposition of noise may occur at the ZT pin. Then, the ZT comparator and ZTOVP
comparator are masked for the TZTMASK time to prevent ZT comparator operation errors. In addition, taking a surge withstand
pressure into consideration, the ZT voltage set by resistor divided is has to be set within 3V for the auxiliary winding voltage.
Figure 22 ZT Trigger Mask Function
A: DC/DC OFF=>ON
B: DC/DC ON=>OFF then the surge noise occurs to ZT pin.
C: Since a noise occurs to ZT pin, the IC masks ZT comparator and ZTOVP comparator detection for TZTMASK time.
(4-7-1) ZT Timeout Function1 Figure 23
When the ZT pin voltage is not higher than VZT2 (typ=200mV) for TZTOUT1 (typ=15us) such as start or low output voltage or ZT
pin short, the IC turns on MOSFET by force.
(4-7-2) ZT Timeout Function2 Figure 23
After ZT comparator detects bottom, when the IC does not detect next bottom within TZTOUT2typ =5us, it turns on MOSFET by
force. After ZT comparator detects bottom at once, the function operates. For that, it does not operate at start or at low output
voltage. When the IC is not able to detect bottom by decreasing auxiliary winding voltage, the function operates.
Figure 23 ZT Timeout Function
A: At starting up, the IC starts to operate by ZT timeout function1 because of ZT=0V.
B: MOSFET turns ON.
C: MOSFET turns OFF.
D: ZT voltage is lower than VZT2 (typ=200mV) by ZT dump decreasing.
E: MOSFET turns ON by ZT timeout fucntion2 after TZT2 (typ=5us) from D point.
F: ZT voltage is lower than VZT2 (typ=200mV) by ZT dump decreasing.
G: MOSFET turns ON by ZT timeout fucntion2 after TZT2 (typ=5us) from F point.
H: ZT pin is short to GND.
I : MOSFET turns ON by ZT timeout function1 after TZTOUT1 (typ=15us).
20/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
(5) Soft Start Sequence
Normally, when the AC voltage is applied, a large current flows to raise the output voltage. This IC has a built-in soft
start function to prevent the output voltage and current from large change. This function is reset when the VCC pin
(6pin) drops to less than VUVLO2 (typ=8.2V), and it performs at next applying. It operates as below after starting up.
(Refer to the article of (4)-1 turn off.)
start 0.5ms => Set CS limiter to 12.5% of normal operation.
0.5ms1ms => Set CS limiter to 25% of normal operation.
1ms2ms => Set CS limiter to 50% of normal operation.
2ms4ms => Set CS limiter to 75% of normal operation.
4ms => normal operation
(6) CS (3pin) Open Protection
If the CS (3pin) is open, to prevent the OUT pin from making a error, the IC builds in the CS (3pin) open protection.
When the CS (3pin) is open, the OUT pin (5pin) switching is stopped by the function. (This is auto-recovery)
NOUT
Leading
Edge
Blanking
5
OUT
CS
RS
3
PRE
Driver
POUT
CURRENT SENSE
(V-V Change)
Normal : ×1.0
FBOLP_OH
SQ
R
VREF(4V)
1MΩ
VCCOVP
AND
AND
Timeout
OR
Bottom det
Figure 24. CS Open Protection
21/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
(8) OUTPUT Over Load ProtectionFB OLP comparator
The over load protection is the function that monitors the condition of the secondary output current’s over load and fixes the
OUT pin (5pin) to Low at an over load condition. At a over load condition, there is no current in a photocoupler so the FB pin
(2pin) rise to near 3.7V. When the condition continues for TFOLP typ =64ms, the IC judges this is over load state and the OUT
pin (5pin) is fixed to L. If the FB pin (2pin) drops to VFOLP1B (typ =2.6V) within TFOLP (typ =64ms) from the moment that its voltage
becomes higher VFOLP1A (typ =2.8V), the over load protection timer is reset. At starting up, the FB pin starts to operate from
more than VFOLP1A (typ =2.8V) voltage because it is pull-up by a resistor to internal voltage. For this reason, the starting up time
of the secondary output voltage is has to be set within TFOLP (typ =64ms) from starting up.
After detecting the over load condition, the IC is stopped for TOLPST (typ =512ms) and the IC operates auto-recovery. At this
moment, the IC operates soft start. At stopping, although the VCC voltage drops, the VCC pin voltage keeps more than VUVLO2
because it is charged from starting circuits.
VCC
VUVLO1
VUVLO2
VCHG1
Switching
FB VFOLP1A
64ms 64ms
512ms
VH charge
chargecharge
512ms
VCHG2
ABC
DEFGH
Figure 25. Over Load Protection: Auto-recovery
A: When FB voltage is over VFOLP1A, FBOLP comparator detects an over load state.
B: When the state A continues for TFOLP (typ=64ms), the IC stops switching by over load protection.
C: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC (6pin) voltage is lower than
VCHG, VCC re-charge function operates and the VCC (6pin) voltage is up.
D: When the VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
E: It passes for TOLPST (typ =512ms) from B, the IC starts switching with soft start.
F: When over load state continues, the FB (2pin) voltage is over VFOLP1A. When it passes for TFOLP (typ=64ms) from E,
the IC stops switching.
G: During stopping switching by over load protection, the VCC (6pin) voltage drops. When the VCC (6pin) voltage is
lower than VCHG, VCC re-charge function operates and the VCC (6pin) voltage is up.
H: When the VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
(9) OUT (5pin) Voltage Clamp Function
For the purpose which protects the external MOSFET, H level of the OUT (5pin) is clamped to VOUTH (typ=12.5V). It
prevents gate destruction of MOSFET by raising the VCC (6pin) voltage. (Refer to Figure 23) The OUT (5pin) is
pulled-down RPDOUT (typ=100k).
NOUT
5
PRE
Driver
POUT
12V Clamp
Circuit
6
3
Figure 26. OUT (5pin) Construction
22/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Operation Mode of Protection Circuit
Operation mode of protection functions are shown in table3.
Table 3. Operation Mode of Protection Circuit
Item Protection mode
VCC Under Voltage Locked Out Auto recovery
VCC Over Voltage Protection Auto recovery (with 100us timer)
FB Over Load Protection Auto recovery (delay: 64ms, stop: 512ms)
CS Open Protection Auto recovery
ZT Over Voltage Protection -
VCC Charge Protection Auto recovery
Power Dissipation
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 85 or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)
Figure 27. SOP-J8 Thermal Abatement Characteristics
0
100
200
300
400
500
600
700
800
900
1000
0 25 50 75 100 125 150
Ta[]
Pd[mW]
23/26
Datasheet
Datasheet
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TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
Operational Notes
(1) Absolute maximum ratings
Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are
exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular
mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a
fuse should be investigated.
(2) Power supply and ground lines
In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there
are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in
the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes
and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in
addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be
problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems
with the characteristics of the capacitor to be used before determining constants.
(3) Ground potential
The ground pin’s potential should be set to the minimum potential in relation to the operation mode.
(4) Pin shorting and attachment errors
When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment
errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin
and a power supply line, or between ground lines.
(5) Operation in strong magnetic fields
Note with caution that these products may become damaged when used in a strong magnetic field.
(6) Input pins
In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic
elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.
Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage
that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no
power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied
to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical
characteristics.
(7) External capacitors
When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal
capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining
constants.
(8) Thermal design
The thermal design should fully consider allowable dissipation (Pd) under actual use conditions.
Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.
(9) Rush current
In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern
wires, and how they are laid out.
(10) Handling of test pins and unused pins
Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the
descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.
(11) Document contents
Documents such as application notes are design documents used when designing applications, and as such their
contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for
external parts.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
24/26
Datasheet
Datasheet
BM1Q011FJ
TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
Ordering Information
B M 1 Q 0 1 1 F J - E 2
Product name
Package
Packaging and
forming specification
E2: Embossed tape and reel
Marking Diagram
Line-Up
Marking Name Package Order name
1Q011 SOP-J7S BM1Q011FJ-E2
LOT No.
1PIN MARK
1Q011
Part Number Marking
25/26
Datasheet
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TSZ02201-0F1F0A200180-1-2
21.Jan.2016 Rev.001
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TSZ2211115001
Physical Dimension, Tape and Reel Information
Package Name SOP-J7S
26/26
Datasheet
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© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001
Revision History
Date Revision Changes
21.Jun.2016 001 New Release
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
USA
EU
CLASS
CLASSb
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Datasheet
Part Number bm1q011fj
Package SOP-J7S
Unit Quantity 2500
Minimum Package Quantity 2500
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
bm1q011fj - Web Page
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