AMMP-6546
18 to 40 GHz GaAs MMIC Sub-Harmonic Mixer
In SMT Package
Data Sheet
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A) : 30V
ESD Human Body Model (Class 0) :100V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Description
Avagos AMMP-6546 is an easy-to-use broadband sub-
harmonic mixer, with the LO injected at half of the
frequency of that required by a conventional mixer.
AMMP-6546 is similar to AMMP-6545 except that the
layout is a mirror image designed to ease integration into
transmitter or receiver designs. The MMIC includes an 180°
balanced diode based mixer. The MMIC is fabricated using
PHEMT technology. The surface mount package allows
elimination of chip & wire” assembly for lower cost. This
MMIC is a cost e ective alternative to multi-chip solution
that have higher loss and complex assembly.
Applications
Microwave radio systems
Satellite VSAT, DBS up/down link
LMDS & Pt-Pt mmW long haul
Broadband wireless access (including 802.16 and
802.20 WiMax)
WLL and MMDS loops
Package Diagram
Features
RF Frequency : 18-40 GHz
LO Frequency : 9-20 GHz
IF Frequency : DC-3.5 GHz
5x5 mm Surface Mount Package
Suitable for Up and Down Conversion
Diode Mixer
Typical Performance at RF= 21GHz
Conversion Loss : 11 dB
IIP3 : +12 dBm
2LO-R Leakage : -44 dBm
2LO-I Leakage : -61 dBm
Typical Performance at RF= 23GHz
Conversion Loss : 10 dB
IIP3 : +11.7 dBm
2LO-R Leakage : -40 dBm
2LO-I Leakage : -64 dBm
Typical Performance at RF= 26GHz
Conversion Loss : 11 dB
IIP3 : +11.8 dBm
2LO-R Leakage : -42 dBm
2LO-I Leakage : -60 dBm
Functional Block Diagram
123
756
4
8LO RF
NCNC NC
NCNC IF
PIN
1
2
3
4
5
6
7
8
FUNCTION
NC
NC
NC
RF
IF
NC
NC
LO
7 6 5
1 2 3
48 x2
LO
NC NC NC
NC NC IF
RF
TOP VIEW
PACKAGE BASE: GND
Note: MSL Rating - Level 2A
RoHS-Exemption
Please refer to hazardous substances table on page 5.
2
Electrical Speci cations
1. Small/Large -signal data measured in a fully de-embedded test  xture form TA = 25°C.
2. Pre-assembly into package performance veri ed 100% on-wafer per AMMC-6522 published speci cations.
3. This nal package part performance is veri ed by a functional test correlated to actual performance at one or more
frequencies.
4. Speci cations are derived from measurements in a 50 Ω test environment. Aspects of the ampli er performance may
be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Гopt)
matching.
5. NF is measure on-wafer. Additional bond wires (-0.2nH) at Input could improve NF at some frequencies.
Table 1. RF Electrical Characteristics [1,2]
TA=25°C, Zo=50 Ω, LO=+15dBm, IF=2GHz
Parameter
RF=21GHz, LO=11.5GHz RF=23GHz, LO=12.5GHz RF=26GHz, LO=14GHz
UnitMin Typ Max Min Typ Max Min Typ Max
Conversion Loss, CL 11 12 10 12 11 12 dB
Input Third Order Intercept, IIP3 11 12 10.5 11.7 8.5 11.8 dB
2LO-R Leakage, 2LO-R -44 -35 -40 -35 -42 -30 dBm
2LO-I Leakage, 2LO-I -61 -52.5 -64 -51.7 -60 -54 dBm
RF=18-30GHz, LO=15-20GHz RF=30-40GHz, LO=15-20GHz
L-R Leakage, L-R -30 -35 dB
L-I Leakage, L-I -35 -30 dB
Note:
1. Production RF tested at 21, 23 and 26 GHz in up-converter con guration at Low Side LO.
2. All tested parameters are guaranteed with the following measurement accuracy:
RF=21GHz: ±1 dBm for RF-leakage, ±2.0 dBm for IF-leakage, ±0.5dB for Conversion Loss, ±0.5 dBm for IIP3
RF=23GHz: ±1 dBm for RF-leakage, ±2.5 dBm for IF-leakage, ±0.5dB for Conversion Loss, ±0.5 dBm for IIP3
RF=26GHz: ±1 dBm for RF-leakage, ±2.5 dBm for IF-leakage, ±0.5dB for Conversion Loss, ±0.5 dBm for IIP3
Table 2. Recommended Operating Range
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal
Resistance at backside temperature (Tb) = 25°C calculated from measured data.
Parameter Min. Typical Max. Unit Comments
RF Frequency, RFfreq 18 40 GHz
LO Frequency, LOfreq 9 20 GHz
IF Frequency, IFfreq DC 3.5 GHz
LO Power, LO +12 +15 +22 dBm
Absolute Minimum and Maximum Ratings
Table 3. Minimum and Maximum Ratings
Parameter Min. Max. Unit Comments
RF CW Input Power, Pin +25 dB
Storage Temperature, Tstg -65 +150 °C
Maximum Assembly Temperature, Tmax 300 °C 60 second maximum
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
3
AMMP-6546 Typical Performance Curves
(T
A = +25°C, Zin=Zout=50, IF Freq = 2GHz, LO Power = +15dBm unless noted)
Figure 1. Up-conversion loss at LO = +13 to +20 dBm (high side LO) Figure 2. Up-conversion IIP3 at LO = +13 to +20 dBm (high side LO)
Figure 3. Up-conversion loss at LO = +13 to +20 dBm (low side LO) Figure 4. Up-conversion IIP3 at LO = +13 to +20 dBm (low side LO)
Figure 5. Down-conversion loss at LO = +13 to +20 dB (low side LO) Figure 6. Down-conversion IIP3 at LO = +13 to +20 dBm (low side LO)
Notes:
1. Typical values were derived using limited samples during initial product characterization and may not be representative of the overall
distribution.
UP-Convertor TYP. Performance
7
9
11
13
15
17
19
21
23
25
20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50
RF Frequency (GHz)
C.L. (dB)
UP-Convertor TYP. Performance
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50
RF Frequency (GHz)
IIP3 (dBm)
UP-Convertor TYP. Performance
7
9
11
13
15
17
19
21
23
25 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46
RF (Frequency)
C.L. (dB)
UP-Convertor TYP. Performance
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46
RF (Frequency)
IIP3 (dBm)
\
Down Convertor TYP. Performance
7
9
11
13
15
17
19
21
23
25
18 20 22 24 26 28 30 32 34 36 38 40
RF Frequency (GHz)
C.L (dB)
Down Convertor TYP. Performance
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
18 20 22 24 26 28 30 32 34 36 38 40
RF Frequency (GHz)
IIP3 (dBm)
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
LO_13dBm
LO_15dBm
LO_17dBm
LO_19dBm
LO_20dBm
4
AMMP-6546 Typical Performance Curves
(T
A = +25°C, Zin=Zout=50, IF Freq = 2GHz, LO Power = +15dBm unless noted)
Figure 7. 2*LO-R leakage at LO = +12 to +17 dBm Figure 8. 2*LO-I leakage at LO = +12 to +17 dBm
Figure 9. L-R isolation at LO = +12 to +17dBm Figure 10. L-I isolation at LO = +12 to +17dBm
Notes:
1. Typical values were derived using limited samples during initial product characterization and may not be representative of the overall
distribution.
AMMP-6546 Application and Usage
Figure 11. Simpli ed schematic of the mixer
AMMP-6546 2LO*-R Leakage (dBm)
-70
-65
-60
-55
-50
-45
-40
-35
-30
18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48
RF Frequency (GHz)
2*LO-R Leakage (dBm)
AMMP-6546 2*LO-I Leakage
-90
-85
-80
-75
-70
-65
-60
-55
-50
-45
-40
18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48
RF Frequency (GHz)
2LO*-I Leakage (dBm)
AMMP-6546 L-R Isolation
-50
-45
-40
-35
-30
-25
-20
9 101112131415161718192021222324
LO Frequency
L-R Isolation (dB)
AMMP-6546 L-I Isolation
20
25
30
35
40
45
50
9 101112131415161718192021222324
LO Frequency (GHz)
L-I Isolation (dB)
LO_12dBm
LO_13dBm
LO_14dBm
LO_15dBm
LO_16dBm
LO_17dBm
LO_12dBm
LO_13dBm
LO_14dBm
LO_15dBm
LO_16dBm
LO_17dBm
LO_12dBm
LO_13dBm
LO_14dBm
LO_15dBm
LO_16dBm
LO_17dBm
LO_12dBm
LO_13dBm
LO_14dBm
LO_15dBm
LO_16dBm
LO_17dBm
765
123
48
LO
IF
RF
LP
HP
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1662EN - July 14, 2011
Package Dimension, PCB Layout and Tape and Reel information
Please refer to Avago Technologies Application Note 5520, AMxP-xxxx production Assembly Process (Land Pattern A).
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products
Part Name
Lead
(Pb)
(Pb)
Mercury
(Hg)
Hg
Cadmium
(Cd)
Cd
Hexavalent
(Cr(VI))
Cr(VI)
Polybrominated
biphenyl (PBB)
PBB
Polybrominated
diphenylether (PBDE)
PBDE
100pF capacitor
: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006.
: indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part
exceeds the concentration limit requirement as described in SJ/T 11363-2006.
(The enterprise may further explain the technical reasons for the “x” indicated portion in the table in accordance with
the actual situations.)
SJ/T 11363-2006
SJ/T 11363-2006
“×”
Note: EU RoHS compliant under exemption clause of “lead in electronic ceramic parts (e.g. piezoelectronic devices)”
Toxic and Hazardous Substances or Elements
AMMP-6546 Part Number Ordering Information
Part Number No. of Devices Container
AMMP-6546-BLKG 10 antistatic bag
AMMP-6546-TR1G 100 7” Reel
AMMP-6546-TR2G 500 7” Reel