(Ta=25˚C)
IF50 mA
IFM 1A
V
R6V
P75mW
V
CEO 35 V
VECO 6V
I
C20 mA
PC75 mW
Topr ˚C
Tstg ˚C
±0.15
±0.2
±0.3
Outline DimensionsFeatures
Applications
Absolute Maximum Ratings
(Unit : mm)
1. Compact type
2. Snap-in mounting type
1. Copiers
2. Laser beam printers
3. Facsimiles
Rating UnitParameter Symbol
InputOutput
Forward current
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Peak forward current
*1
*Unspecified tolerances shall be
as follows.
*
( ) : Connector dimensions for reference
Tolerance Dimension(d)
Storage temperature
Operating temperature
- 40 to + 85
GP1S73P/GP1S74P
GP1S73P/GP1S74P
Compact Photointerrupter
with Connector
3. 3 kinds of mounting plate thickness
- 25 to + 85
*1 Pulse width 100µs, Duty ratio=0.01
*2 The connector should be plugged in/out at normal temperature.
d < 5.0
5.0<= d < 15.0
15.0 <= d
±0.15
±0.2
±0.3
1 Collector
3 Anode
2 GND
Internal Connection Diagram (Both GP1S73P/GP1S74P)
(Applicable plate thickness : 1.0, 1.2 and 1.6 mm)
GP1S73P
GP1S74P ( 6.8 )
JAPAN AMP made
connector 175487-3
(Case surface)
13.6
(Sensor center)
( 2.3 )
7.25.61.1
0.6
0.2
2.3
4.3 4.3 6.8±1
5.0
2.4
( 5.8 )
3.2
1.1
2.3
5.4
6.9
9.9
11.4
14.0
16.8
0.7 17.0
1.6 4.7
2-0.92-0.5
4.0
2-0.5 ±0.1
(Slit)
( 7.8 )
SHARP
74
JAPAN
8.0
1 Collector
2 GND
3 Anode
( 6.8 )
JAPAN AMP made
connector 175487-3
(Case surface)
13.6
(Sensor center)
(2.3 )
7.25.61.1
0.6
0.2
2.3
4.3 4.3 6.8 ±1
5.0
2.4
(5.8 )
3.2
1.1
2.3
5.4
6.9
9.9
11.4
14.0
16.81.2
0.75 17.0
1.6 4.7
2-0.92-0.5
4.0
2-0.5 ±0.1
(Slit)
( 7.8 )
SHARP
73
JAPAN
8.0
1 Collector
2 GND
3 Anode
*Unspecified tolerances shall be
as follows.
*
( ) : Connector dimensions for reference
Tolerance Dimension(d)
d < 5.0
5.0<= d < 15.0
15.0 <= d
■
■
■■
■
VF- 1.2 1.4 V
VFM -V
I
R--10µA
I
CEO - 1 100 nA
IC0.5 - 15 mA
VCE(sat)-- V
t
r-315µs
t
f-420µs
(Ta=25˚C)
IF= 20mA
IFM =0.5A
VR=3V
VCE = 20V
VCE = 5V, IF= 20mA
IF= 40mA, IC= 0.5mA
VCE = 2V, IC= 2mA
RL= 100 Ω
- 25 0 25 50 100
0
10
20
30
40
50
60
- 25 0 25 50 75 100
0
20
40
60
80
75
20 55252
50
100
200
500
1000
2000
10-2 10-1
75 85
1
Ta= 25˚C
Electro-optical Characteristics
Fig. 1 Forward Current vs. Ambient
Temperature Fig. 2 Collector Power Dissipation vs.
Ambient Temperature
Parameter Symbol MIN. TYP. MAX. UnitConditions
Input
Output
Transfer
characteristics
Peak forward voltage
Reverse current
Dark current
Collector-emitter saturation voltage
Response time Rise time
Fall time
Forward current I F (mA)
Collector power dissipation P C (mW)
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Peak forward current I FM (mA)
Duty ratio
Pulse width<=100µs
0.4
GP1S73P/GP1S74P
3.0 4.0
100
Fig. 3 Peak Forward Current vs. Duty Ratio Fig. 4 Forward Current vs. Forward Voltage
Forward current I F (mA)
Forward voltage VF (V)
15
Forward voltage
Collector current
85
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
1
2
5
10
20
50
0˚C
100
200
500
1000
Ta= 85˚C
50˚C 25˚C
- 25˚C
■
Collector current Ic (mA)
Collector current Ic (mA)
Collector-emitter saturation voltage V
CE(sat )
(V)
Ambient temperature Ta (˚C)
Fig. 5 Collector Current vs. Forward Current
Collector current Ic (mA)
Forward current I F (mA)Collector-emitter voltage VCE (V)
Fig. 7 Collector Current vs. Ambient
temperature
Ambient temperature Ta (˚C)
Fig. 8 Collector-emitter Saturation Voltage
vs. Ambient Temperature
Fig. 6 Collector Current vs. Collector-emitter
Voltage
Fig. 9 Response Time vs. Load Resistance
10%
90%
RD
VCC
RL
tdtr
tstf
Test Circuit for Response Time
Input
Input Output Output
Response time (µs)
Road resistance R L (kΩ)
GP1S73P/GP1S74P
0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10
0.1
0.2
0.5
1
2
5
10
20
50
100
ts
tdtr
tf
VCE=2V
I
C
= 2mA
Ta= 25˚C
- 25 0 25 50 75 100
0
0.05
0.10
0.15
0.20
0.25 IF= 40mA
IC= 0.5mA
- 25 0 25 50 75 100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0 IF= 20mA
VCE=5V
012345678910
0
3
4
6
8
10 Ta= 25˚C
10mA
20mA
30mA
IF= 50mA
40mA
01020304050
0
2
4
6
8
10 VCE=5V
Ta= 25˚C
10 -6
10 -7
10 -8
10 -9
10 -10 0 255075100
2
5
2
5
2
5
2
5
-25
V
CE
= 20V
Dark current I CEO (A)
Ambient temperature Ta (˚C)
Fig. 10 Frequency Characteristics
Frequency f (Hz)
Voltage gain AV (dB)
Fig. 11 Dark Current vs. Ambient Temperature
Relative collector current (%)
Relative collector current (%)
Shield distance L (mm) Shield distance L (mm)
GP1S73P/GP1S74P
2
0
5525252
10kΩ1kΩ100Ω
103104105106
RL=
-20
-15
-10
-5
V
CE=2V
I
C
= 2mA
Ta= 25˚C
Fig. 12 Detecting Position Characteristics (1) Fig. 13 Detecting Position Characteristics (2)
12345
10
20
30
40
50
60
70
80
90
100 Ta= 25˚C
VCC =5V
Shield plate
L
Sensor
12345
10
20
30
40
50
60
70
80
90
100 Ta= 25˚C
VCC=5V
L
Shield plate
Sensor
GP1S73P/GP1S74P
Recommended Mounting Hole Drawing(Dimensions shown are recommended values.
Use the photointerrupters after checking the mounting strength and others on an actual machine.)
(Precautions for Operation)
1) In this product, the PWB is fixed with a hook, and cleaning solvent may remain inside the case;
therefore, dip cleaning or ultrasonic cleaning are prohibited.
2) Remove dust or stains, using an air blower or a soft cloth moistened in cleaning solvent.
However, do not perform the above cleaning using a soft cloth with solvent in the marking portion.
In this case, use only the following type of cleaning solvent for wiping off;
Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
When the cleaning solvents except for specified materials are used, please contact us.
As for other general precautions, please refer to the chapter "Precautions for Use".
7.7
7.5 7.5
7.5
(Unit : mm)
17
8-R0.1±0.18 -R0.1±0.1
Plate thickness : 1.6 mm
17
17
66
3.53.5
7.5
Plate thickness : 1.0 mmPlate thickness : 1.2 mm
8-R0.1±0.1
General mounting type
7.7
7.5 7.5
7.5
17
Plate thickness : 1.6 mm
17
17
66
3.53.5
7.5
Plate thickness : 1.0 mmPlate thickness : 1.2 mm
Reverse insertion
preventive type
12 -R0.1±0.112 -R0.1±0.1 12 -R0.1±0.1
2.42.4 2.4 2.4 2.4 2.4
1.
It is recommended to mount the photointerrupters on the shear droop surface (punch side) of the mounting plate (metal plate).
2.
Mounting workability, shaking after mounting and mounting strength depend on the corner radius of the mounting plate and state of punching.
Determine the mounting hole dimensions after check on an actual machine.
3. General dimensional tolerances shall be ± 0.1 mm.
■
●
115
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
